TWI606501B - Processing device - Google Patents

Processing device Download PDF

Info

Publication number
TWI606501B
TWI606501B TW103111223A TW103111223A TWI606501B TW I606501 B TWI606501 B TW I606501B TW 103111223 A TW103111223 A TW 103111223A TW 103111223 A TW103111223 A TW 103111223A TW I606501 B TWI606501 B TW I606501B
Authority
TW
Taiwan
Prior art keywords
wafer
processing
semiconductor wafer
workpiece
cutting
Prior art date
Application number
TW103111223A
Other languages
English (en)
Chinese (zh)
Other versions
TW201503248A (zh
Inventor
Kazuma Sekiya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201503248A publication Critical patent/TW201503248A/zh
Application granted granted Critical
Publication of TWI606501B publication Critical patent/TWI606501B/zh

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103111223A 2013-05-17 2014-03-26 Processing device TWI606501B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013104762A JP6224350B2 (ja) 2013-05-17 2013-05-17 加工装置

Publications (2)

Publication Number Publication Date
TW201503248A TW201503248A (zh) 2015-01-16
TWI606501B true TWI606501B (zh) 2017-11-21

Family

ID=51911143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111223A TWI606501B (zh) 2013-05-17 2014-03-26 Processing device

Country Status (4)

Country Link
JP (1) JP6224350B2 (ko)
KR (1) KR20140135639A (ko)
CN (1) CN104167378B (ko)
TW (1) TWI606501B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6935168B2 (ja) * 2016-02-12 2021-09-15 株式会社ディスコ 加工装置
JP6716160B2 (ja) * 2016-05-31 2020-07-01 株式会社ディスコ 加工装置及び加工方法
JP6689542B2 (ja) * 2016-08-26 2020-04-28 株式会社ディスコ 切削装置
JP6887260B2 (ja) * 2017-02-03 2021-06-16 株式会社ディスコ 加工装置
JP6955955B2 (ja) * 2017-10-12 2021-10-27 株式会社ディスコ ウェーハの加工方法
JP7423157B2 (ja) 2020-04-30 2024-01-29 株式会社ディスコ 加工装置の管理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568836A (en) * 1979-07-03 1981-01-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacturing system for semiconductor device
JPS6092606A (ja) * 1983-10-26 1985-05-24 Nec Corp 半導体装置の製造方法
JPS62218051A (ja) * 1986-03-17 1987-09-25 Okuma Mach Works Ltd 工具識別装置
JPH04164554A (ja) * 1990-10-25 1992-06-10 Hitachi Seiko Ltd プリント基板加工装置
JPH06349691A (ja) * 1993-06-03 1994-12-22 Hitachi Ltd 半導体装置及びその製造装置と製造方法
JP2702441B2 (ja) * 1995-04-20 1998-01-21 山形日本電気株式会社 ウェーハ識別文字認識システム
JP2001291054A (ja) * 2000-04-07 2001-10-19 Nec Corp 半導体ウエハのｉｄ認識装置及びｉｄ認識ソータシステム
JP2004158768A (ja) * 2002-11-08 2004-06-03 Disco Abrasive Syst Ltd 半導体ウエーハおよびサブストレート
CN100347843C (zh) * 2005-10-24 2007-11-07 中国电子科技集团公司第四十五研究所 划片机晶圆自动识别对准方法
CN102097284A (zh) * 2009-12-15 2011-06-15 中芯国际集成电路制造(上海)有限公司 对准标记制作的管控方法及装置
JP2011253939A (ja) * 2010-06-02 2011-12-15 Sony Chemical & Information Device Corp ウエハのダイシング方法、接続方法及び接続構造体

Also Published As

Publication number Publication date
TW201503248A (zh) 2015-01-16
JP2014223708A (ja) 2014-12-04
CN104167378B (zh) 2018-06-29
JP6224350B2 (ja) 2017-11-01
KR20140135639A (ko) 2014-11-26
CN104167378A (zh) 2014-11-26

Similar Documents

Publication Publication Date Title
TWI606501B (zh) Processing device
JP6935168B2 (ja) 加工装置
TWI641036B (zh) 晶圓之加工方法
JP5389580B2 (ja) 切削装置
TWI809228B (zh) 切割裝置及使用切割裝置的晶圓加工方法
TW201639054A (zh) 加工裝置
JP6887260B2 (ja) 加工装置
TWI751354B (zh) 切割裝置及晶圓的加工方法
TW201818459A (zh) 晶圓的加工方法
TWI587440B (zh) Keep the table
TW202040715A (zh) 檢查裝置，及加工裝置
US10079166B2 (en) Processing apparatus
KR20140136875A (ko) 레이저 가공 장치
JP6004761B2 (ja) ダイシング方法
TW202129746A (zh) 切割裝置以及切割方法
JP2009064828A (ja) 加工装置
JP2007196326A (ja) 切削ブレードの切り込み確認方法
JP7408306B2 (ja) 切削装置
KR102551970B1 (ko) 절삭 장치의 셋업 방법
JP5372429B2 (ja) 板状物の分割方法
JP6105308B2 (ja) 加工装置
TW202111791A (zh) 加工裝置
JP2014154633A (ja) 加工装置
JP2006344630A (ja) 切削装置
JP2023028108A (ja) 検査装置、及び加工システム