TWI587440B - Keep the table - Google Patents

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Publication number
TWI587440B
TWI587440B TW102112324A TW102112324A TWI587440B TW I587440 B TWI587440 B TW I587440B TW 102112324 A TW102112324 A TW 102112324A TW 102112324 A TW102112324 A TW 102112324A TW I587440 B TWI587440 B TW I587440B
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Taiwan
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holding
plate
annular
holding table
suction
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TW102112324A
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TW201347081A (zh
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Atsushi Komatsu
Takeshi Kitaura
Masamichi Kataoka
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Disco Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

保持台 發明領域
本發明是有關於一種用以保持晶圓等之板狀物之保持台。
發明背景
用以加工晶圓等之板狀物之研削裝置或切削裝置、雷射加工裝置等之各種加工裝置係具備有：例如，如日本特開平第5-23941號公報及日本特開2008-140832號公報所示之具有用以吸引保持板狀物之保持面之保持台(夾頭台)。
當板狀物吸引保持在保持台施以各種加工時，因板狀物被吸引保持在保持台而恐有板狀物之被保持面附著上汙垢之虞。
當板狀物之被保持面附著汙垢時，附著的汙垢恐怕會污染用以搬送板狀物之搬送單元，及污染收容加工後之板狀物之匣內部。當以一度被污染之搬送單元或匣來搬送、收容未附著汙垢之板狀物時，恐有乾淨的板狀物亦被汙垢污染之虞。
另一方面，如日本特開第2004-107606號公報所 揭示，為了容易處理被加工物，有時候會用接著劑或蠟將板狀被加工物黏著於支承板上。又，如日本特開平第5-21763號公報所揭示，藉由直接接合將被加工物黏著於支承板上之技術亦廣為利用。
先行技術文獻 專利文獻
【專利文獻1】日本特開第2004-107606號公報
【專利文獻2】日本特開平第5-21763號公報
發明概要
但，以保持台吸引保持支承板上黏著有被加工物之積層被加工物之支承板側時，有可能會弄傷支承板。即使欲再度使用有傷痕的支承板，也可能會因傷痕的大小而無法以保持台來吸引保持。
又，對黏著於有傷痕的支承板之被加工物施以加熱處理時，恐有會從傷痕為起點而支承板破損，破壞晶圓之虞。因此，由於以往係將一度使用過的支承板廢棄，而非常不經濟，故期望能夠謀求支承板再利用。
本發明係有鑑於此而作成者，其目的在於提供一種能減少吸引保持之板狀物上有汙垢附著或有傷痕的可能性之保持台。
根據本發明，係提供一種保持台，係用以保持板 狀物之保持台，其特徵在於具有：環狀保持部，係具有保持板狀物之外周部之環狀保持面；及中央凹部，係被該環狀保持部所圍繞，又，該環狀保持部形成有：於該環狀保持面開口之吸引口；一端連通該吸引口且另一端連接到吸引源之吸引路；於該吸引口外周側之該環狀保持面開口之液體噴出口；及一端連通該液體噴出口且另一端連接到液體供給源之液體流路。
環狀保持部宜由樹脂形成。
本發明之保持台中，由於僅支承板之外周部被環狀保持部所保持，因此可減少支承板有傷痕或汙染之疑慮，可防止搬送單元或收容匣之污染並可做到支承板之再利用。
2‧‧‧切削裝置
4‧‧‧操作面板
6‧‧‧顯示單元
8‧‧‧收容匣
9‧‧‧匣升降機
10‧‧‧搬出搬入單元
11‧‧‧板狀物
11a‧‧‧矽晶圓(表面)
11c,13c‧‧‧去角部
12‧‧‧暫置區域
13‧‧‧支承板
14‧‧‧定位構件
15‧‧‧積層板狀物
16‧‧‧搬送單元
18‧‧‧保持台
20‧‧‧基座
21,25‧‧‧吸引路
25a‧‧‧吸引口
22‧‧‧環狀保持部
22a‧‧‧環狀保持面
23,27‧‧‧液體流路
27a‧‧‧液體噴出口
24‧‧‧中央凹部
26‧‧‧吸引源
28‧‧‧液體供給源
29‧‧‧液體
30‧‧‧對準單元
32‧‧‧攝像單元
34‧‧‧切削單元
36‧‧‧主軸
38‧‧‧切削刀具
40‧‧‧被加工物
42‧‧‧旋轉器洗淨單元
圖1係具有本發明之保持台之切削裝置之立體圖。
圖2係有關本發明實施型態之保持台之縱截面圖。
圖3係吸引保持著支承板之狀態之保持台的縱截面圖。
圖4係支承板所黏著之晶圓之去角部進行修整加工之狀態之部份截面側視圖。
較佳實施例之詳細說明
以下，參照圖式詳細說明本發明之實施型態。參照圖1，係顯示具有有關本發明實施型態之保持台(夾頭 台)18之切削裝置2之外觀立體圖。
於切削裝置2之前側設有操作員用以輸入加工條件等對裝置之指示之操作面板4。於裝置上部則設有可顯示給操作員之引導畫面或從攝像單元拍攝之圖像之CRT等顯示單元6。
複數片(例如25片)晶圓等之板狀被加工物係收容在收容匣8之中。收容匣8係載置於可上下移動之匣升降機9上。收容匣8之後方則配設有將切削前之被加工物從收容匣8運出並將切削後之被加工物運進收容匣8之搬出搬入單元10。
搬出搬入單元10係有夾具11，夾具11把持被加工物後，對收容匣8搬出及搬入被加工物。搬出搬入單元10係於Y軸方向上直線移動。
收容匣8與搬出搬入單元10之間則設有暫時載置搬出搬入對象之被加工物之區域的暫置區域12，暫置區域12配設有一對將被加工物置中(centering)之定位構件14。
暫置區域12近旁配設有吸附並搬送被加工物之具有迴旋臂之搬送單元16，被搬出到暫置區域12之被加工物係由搬送單元16吸附而搬送到保持台(夾頭台)18上，再由保持台18吸引保持。
保持台18係構造成可旋轉並且可於X軸方向上來回移動，保持台18之X軸方向之移動路徑上方配設有檢測被加工物之應切削區域之對準單元30。
對準單元30係包含具有拍攝被加工物表面之攝 像元件及顯微鏡之攝像單元32，根據攝像所取得之圖像，可藉由圖樣比對等圖像處理而檢測出應切削區域。攝影單元32所取得之圖像係顯示於顯示單元6。
對準單元30之左側則配設有對保持於保持台18之被加工物施行切削加工之切削單元34。切削單元34係與對準單元30構造成一體，兩者連動並於Y軸方向及Z軸方向上移動。
切削單元34係於可旋轉之主軸36前端裝有切削刀具38所構成，且可於Y軸方向及Z軸方向上移動。切削刀具38係位於攝像單元32之X軸方向之延長線上。
40係吸附切削加工結束後之被加工物，並將其搬送到旋轉器洗淨單元42之搬送單元，又，被加工物於旋轉器洗淨單元42旋轉洗淨及旋轉乾燥。
參照圖2，係顯示有關本發明實施型態之保持台18之縱截面圖。保持台18係包含有：由SUS等金屬所形成之基座(框體)20，及具有用以保持黏著於基座20上之被加工物之環狀保持面22a之環狀保持部22。又，保持台18更具有被環狀保持部圍繞之中央凹部24。
環狀保持部22宜由導電性樹脂所形成。藉由以導電性樹脂形成環狀保持部22，可防止因靜電而汙染附著於環狀保持部22。
本實施型態之保持台18並非由樹脂形成全體，藉由基座20由SUS等金屬形成，僅環狀保持部22由樹脂形成，可確保保持台18之剛性。
基座20形成有：經由未圖示之電磁切換閥而選擇性連接於吸引源26之吸引路21，及經由未圖示之電磁切換閥而選擇性連接於液體供給源28之液體流路23。
環狀保持部22形成有：連接於基座20之吸引路21之環狀吸引路25，及連結於液體流路23之環狀液體流路27。於環狀保持部22之環狀保持面22a有連通於環狀吸引路25之環狀吸引口25a及連通於環狀液體流路27之環狀液體噴出口27a呈開口。
亦可形成於圓周方向上有間隔之複數吸引口來取代環狀吸引口25a，並配設於圓周方向上有間隔之複數液體噴出口來取代環狀液體噴出口27a。
參照圖3，係顯示以保持台18吸引保持著積層板狀物15之狀態之保持台18之縱截面圖。積層板狀物15係於支承板13上藉由接著劑接著板狀物11而形成。
支承板13係由例如不具圖樣之矽晶圓所形成，板狀物11係由例如於表面11a具有半導體元件之矽晶圓所形成。
於矽晶圓11a之外周形成有圓弧狀之去角部11c，且支承板13之外周亦形成有圓弧狀之去角部13c。支承板13亦可由玻璃形成。
參照圖4，係顯示吸引保持於支承板18之矽晶圓等板狀物11之去角部11c進行修整加工之狀態之部份截面側視圖。去角部11c之修整加工係將於箭號A方向高速旋轉之切削刀具38於具有去角部11c之板狀物11之外周部切入 預定深度，並使保持台18以低速於箭號B方向旋轉，藉此將形成於板狀物11之外周之去角部11c切下。
該修整加工宜一面由液體噴出口27a噴出純水等液體29一面實施。進行修整加工時會產生切削屑，但該切削屑會被噴出之液體29沖洗而可抑制附著於積層板狀物15及保持台18。
圖4所示之實施型態中，係顯示積層板狀物15之修整加工之進行狀態，但加工並不限定於修整加工，沿分割預定線切削板狀物11之切削加工亦可使用保持台18。又，保持台18亦可作為雷射加工裝置之保持台來利用，並於板狀物11施行雷射加工。
上述實施型態之保持台18中，由於僅支承板13之外周部由環狀保持部22吸引保持，因此可減少支承板13有傷痕或汙染之可能性，可防止搬送單元或收容匣之污染並可達到支承板13之再利用。
進而，本實施型態之保持台18並非僅限於吸引保持支承板13的情況，亦可利用於直接吸引板狀物11並施以加工的情況。
11‧‧‧板狀物
13‧‧‧支承板
11c,13c‧‧‧去角部
15‧‧‧積層板狀物
18‧‧‧保持台
20‧‧‧基座
21,25‧‧‧吸引路
22‧‧‧環狀保持部
23,27‧‧‧液體流路
24‧‧‧中央凹部
26‧‧‧吸引源
28‧‧‧液體供給源
29‧‧‧液體
34‧‧‧切削單元
38‧‧‧切削刀具
A‧‧‧箭頭方向
B‧‧‧箭頭方向

Claims (3)

  1. 一種保持台，係用以保持板狀物之保持台，其特徵在於具有：環狀保持部，係具有保持板狀物之外周部之環狀保持面；及中央凹部，係被該環狀保持部所圍繞，又，該環狀保持部形成有：於該環狀保持面開口之吸引口；一端連通該吸引口且另一端連接到吸引源之吸引路；於該吸引口外周側之該環狀保持面開口之液體噴出口；及一端連通該液體噴出口且另一端連接到液體供給源之液體流路。
  2. 如申請專利範圍第1項之保持台，其中前述環狀保持部係由樹脂所形成。
  3. 如申請專利範圍第1項之保持台，其是在加工中一面旋轉該保持台一面由該液體噴出口噴出液體，藉此抑制切削屑附著於板狀物及該環狀保持面。
TW102112324A 2012-05-10 2013-04-08 Keep the table TWI587440B (zh)

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