TWI591347B - A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method - Google Patents
A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method Download PDFInfo
- Publication number
- TWI591347B TWI591347B TW102126213A TW102126213A TWI591347B TW I591347 B TWI591347 B TW I591347B TW 102126213 A TW102126213 A TW 102126213A TW 102126213 A TW102126213 A TW 102126213A TW I591347 B TWI591347 B TW I591347B
- Authority
- TW
- Taiwan
- Prior art keywords
- support
- hole
- support plate
- probe
- holes
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012165301A JP6184667B2 (ja) | 2012-07-26 | 2012-07-26 | プローブユニット、基板検査装置およびプローブユニット製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201418720A TW201418720A (zh) | 2014-05-16 |
TWI591347B true TWI591347B (zh) | 2017-07-11 |
Family
ID=49997238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102126213A TWI591347B (zh) | 2012-07-26 | 2013-07-23 | A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6184667B2 (ja) |
KR (1) | KR101979060B1 (ja) |
CN (1) | CN104508498B (ja) |
TW (1) | TWI591347B (ja) |
WO (1) | WO2014017426A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101656047B1 (ko) * | 2016-03-23 | 2016-09-09 | 주식회사 나노시스 | 기판 검사용 지그 |
WO2018021140A1 (ja) * | 2016-07-28 | 2018-02-01 | 日本電産リード株式会社 | 検査治具、これを備えた基板検査装置、及び検査治具の製造方法 |
KR101886536B1 (ko) * | 2016-12-27 | 2018-08-07 | 주식회사 텝스 | 접촉력을 조절할 수 있는 스트레이트 니들 프로브 카드 |
CN110068711B (zh) * | 2018-01-24 | 2022-04-26 | 台湾中华精测科技股份有限公司 | 探针卡装置及矩形探针 |
KR102072451B1 (ko) * | 2018-07-27 | 2020-02-04 | 주식회사 에스디에이 | 프로브카드 헤드블록 |
CN108982933A (zh) * | 2018-08-07 | 2018-12-11 | 深圳市芽庄电子有限公司 | 印制电路板测试治具 |
KR102170506B1 (ko) * | 2020-03-04 | 2020-10-28 | (주)뉴씨텍 | 기판 검사용 가동식 지그 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3505495B2 (ja) * | 2000-09-13 | 2004-03-08 | 日本電産リード株式会社 | 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法 |
KR100773732B1 (ko) * | 2006-05-09 | 2007-11-09 | 주식회사 파이컴 | 프로브 유닛 및 이를 포함하는 프로브 장치 |
KR100843224B1 (ko) * | 2007-01-04 | 2008-07-02 | 삼성전자주식회사 | 웨이퍼 테스트용 프로브 카드 |
KR100975808B1 (ko) * | 2007-04-17 | 2010-08-13 | 니혼덴산리드가부시키가이샤 | 기판검사용 치구 |
JP4965341B2 (ja) * | 2007-05-31 | 2012-07-04 | 日置電機株式会社 | プローブユニットおよび回路基板検査装置 |
JP2009008585A (ja) | 2007-06-29 | 2009-01-15 | Koyo Technos:Kk | 検査冶具および検査装置 |
JP5179301B2 (ja) * | 2008-09-09 | 2013-04-10 | 日置電機株式会社 | プローブユニットおよび検査装置 |
JP5599150B2 (ja) * | 2009-01-05 | 2014-10-01 | 東京特殊電線株式会社 | プローブユニット構造 |
JP2012078297A (ja) * | 2010-10-05 | 2012-04-19 | Tokuso Riken:Kk | ワイヤープローブ用治具並びにこれを用いた検査装置並びに検査方法 |
-
2012
- 2012-07-26 JP JP2012165301A patent/JP6184667B2/ja active Active
-
2013
- 2013-07-22 CN CN201380039590.2A patent/CN104508498B/zh active Active
- 2013-07-22 WO PCT/JP2013/069772 patent/WO2014017426A1/ja active Application Filing
- 2013-07-22 KR KR1020147031022A patent/KR101979060B1/ko active IP Right Grant
- 2013-07-23 TW TW102126213A patent/TWI591347B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2014025769A (ja) | 2014-02-06 |
KR101979060B1 (ko) | 2019-05-15 |
TW201418720A (zh) | 2014-05-16 |
CN104508498B (zh) | 2018-04-10 |
KR20150037736A (ko) | 2015-04-08 |
CN104508498A (zh) | 2015-04-08 |
JP6184667B2 (ja) | 2017-08-23 |
WO2014017426A1 (ja) | 2014-01-30 |
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