TWI586783B - 電子零件切斷用加熱剝離型黏著片及電子零件切斷方法 - Google Patents

電子零件切斷用加熱剝離型黏著片及電子零件切斷方法 Download PDF

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Publication number
TWI586783B
TWI586783B TW101134543A TW101134543A TWI586783B TW I586783 B TWI586783 B TW I586783B TW 101134543 A TW101134543 A TW 101134543A TW 101134543 A TW101134543 A TW 101134543A TW I586783 B TWI586783 B TW I586783B
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TW
Taiwan
Prior art keywords
heat
energy ray
peelable
layer
adhesive layer
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Application number
TW101134543A
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English (en)
Chinese (zh)
Other versions
TW201319207A (zh
Inventor
平山高正
下川大輔
木內一之
Original Assignee
日東電工股份有限公司
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Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW201319207A publication Critical patent/TW201319207A/zh
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Publication of TWI586783B publication Critical patent/TWI586783B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW101134543A 2011-09-20 2012-09-20 電子零件切斷用加熱剝離型黏著片及電子零件切斷方法 TWI586783B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011204514 2011-09-20

Publications (2)

Publication Number Publication Date
TW201319207A TW201319207A (zh) 2013-05-16
TWI586783B true TWI586783B (zh) 2017-06-11

Family

ID=47914460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134543A TWI586783B (zh) 2011-09-20 2012-09-20 電子零件切斷用加熱剝離型黏著片及電子零件切斷方法

Country Status (5)

Country Link
JP (1) JP6000958B2 (ja)
KR (1) KR101950051B1 (ja)
CN (1) CN103827241A (ja)
TW (1) TWI586783B (ja)
WO (1) WO2013042698A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6522617B2 (ja) * 2014-07-31 2019-05-29 リンテック株式会社 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
JP6545454B2 (ja) * 2014-12-09 2019-07-17 日東電工株式会社 半導体の製造に用いられる粘着シート
JP6085348B2 (ja) * 2015-01-09 2017-02-22 株式会社神戸製鋼所 高強度めっき鋼板、並びにその製造方法
JP7133355B2 (ja) * 2018-05-17 2022-09-08 日東電工株式会社 粘着シート
CN109266236B (zh) * 2018-09-18 2021-09-17 烟台德邦科技股份有限公司 一种高温减粘胶带及其制备方法
WO2020196758A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
KR20210148102A (ko) * 2019-03-28 2021-12-07 린텍 가부시키가이샤 점착 시트, 점착 시트의 제조 방법 및 반도체 장치의 제조 방법
KR20210148117A (ko) * 2019-03-28 2021-12-07 린텍 가부시키가이샤 점착 시트의 제조 방법, 반도체 장치의 제조 방법 및 점착 시트
WO2020196757A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
CN110128977B (zh) * 2019-05-14 2021-07-27 业成科技（成都）有限公司 热解黏感压胶组成物的使用方法
JP7490399B2 (ja) * 2020-03-13 2024-05-27 日東電工株式会社 再剥離粘着テープ
JP2022047610A (ja) * 2020-09-14 2022-03-25 株式会社村田製作所 電子部品素体の切断用固定部材および電子部品素体の切断方法
DE102021210563A1 (de) * 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI291983B (en) * 2000-10-18 2008-01-01 Nitto Denko Corp Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3639266A1 (de) * 1985-12-27 1987-07-02 Fsk K K Haftfolie
JPS62205180A (ja) * 1986-03-03 1987-09-09 F S K Kk 粘着シ−ト
MX174519B (es) * 1989-05-08 1994-05-23 Atd Corp Laminado adhesivo sensible a la presion
JP4107729B2 (ja) * 1998-09-16 2008-06-25 藤森工業株式会社 熱発泡型粘着剤及び粘着部材
JP2002069410A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 熱剥離性粘着剤及びそれを用いた粘着部材
JP4651805B2 (ja) * 2000-11-08 2011-03-16 日東電工株式会社 加熱剥離型粘着シート
JP4623694B2 (ja) * 2000-12-28 2011-02-02 日東電工株式会社 ダイシング用粘着シート
JP4877689B2 (ja) * 2001-08-30 2012-02-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2008024848A (ja) * 2006-07-21 2008-02-07 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型感圧接着剤、それを塗布した活性エネルギー線粘着力消失型粘着シート
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI291983B (en) * 2000-10-18 2008-01-01 Nitto Denko Corp Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same

Also Published As

Publication number Publication date
KR101950051B1 (ko) 2019-02-19
JPWO2013042698A1 (ja) 2015-03-26
KR20140068972A (ko) 2014-06-09
CN103827241A (zh) 2014-05-28
TW201319207A (zh) 2013-05-16
JP6000958B2 (ja) 2016-10-05
WO2013042698A1 (ja) 2013-03-28

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