TWI560847B - Semiconductor devices and memory system - Google Patents
Semiconductor devices and memory systemInfo
- Publication number
- TWI560847B TWI560847B TW104125728A TW104125728A TWI560847B TW I560847 B TWI560847 B TW I560847B TW 104125728 A TW104125728 A TW 104125728A TW 104125728 A TW104125728 A TW 104125728A TW I560847 B TWI560847 B TW I560847B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor devices
- memory system
- memory
- semiconductor
- devices
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011058140A JP5579108B2 (ja) | 2011-03-16 | 2011-03-16 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611232A TW201611232A (zh) | 2016-03-16 |
TWI560847B true TWI560847B (en) | 2016-12-01 |
Family
ID=46814626
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106141659A TWI660485B (zh) | 2011-03-16 | 2012-02-23 | Semiconductor device |
TW109125654A TWI733539B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
TW111103509A TWI831121B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
TW104125728A TWI560847B (en) | 2011-03-16 | 2012-02-23 | Semiconductor devices and memory system |
TW108112947A TWI700809B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
TW101106090A TWI505439B (zh) | 2011-03-16 | 2012-02-23 | 半導體記憶體系統 |
TW110123423A TWI758200B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置及配線基板 |
TW105131158A TWI613789B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置及記憶體系統 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106141659A TWI660485B (zh) | 2011-03-16 | 2012-02-23 | Semiconductor device |
TW109125654A TWI733539B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
TW111103509A TWI831121B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108112947A TWI700809B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置 |
TW101106090A TWI505439B (zh) | 2011-03-16 | 2012-02-23 | 半導體記憶體系統 |
TW110123423A TWI758200B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置及配線基板 |
TW105131158A TWI613789B (zh) | 2011-03-16 | 2012-02-23 | 半導體裝置及記憶體系統 |
Country Status (4)
Country | Link |
---|---|
US (10) | US8873265B2 (zh) |
JP (1) | JP5579108B2 (zh) |
CN (4) | CN116666351A (zh) |
TW (8) | TWI660485B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5579108B2 (ja) | 2011-03-16 | 2014-08-27 | 株式会社東芝 | 半導体装置 |
WO2013146931A1 (ja) * | 2012-03-30 | 2013-10-03 | 日立化成株式会社 | 多層配線板 |
JP6039318B2 (ja) * | 2012-08-31 | 2016-12-07 | 矢崎総業株式会社 | プリント配線基板 |
JP5458206B2 (ja) * | 2013-07-12 | 2014-04-02 | 株式会社東芝 | 半導体装置 |
JP5583262B2 (ja) * | 2013-11-25 | 2014-09-03 | 株式会社東芝 | 半導体装置およびシステム |
US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
CN106663660B (zh) * | 2014-12-24 | 2019-11-05 | 瑞萨电子株式会社 | 半导体装置 |
KR102373543B1 (ko) * | 2015-04-08 | 2022-03-11 | 삼성전자주식회사 | 멀티칩 패키지에서 온도 편차를 이용하여 동작 제어하는 방법 및 장치 |
JP2017009725A (ja) * | 2015-06-19 | 2017-01-12 | ソニー株式会社 | 表示装置 |
JP6270805B2 (ja) * | 2015-12-24 | 2018-01-31 | 東芝メモリ株式会社 | 半導体装置およびシステム |
US10149377B2 (en) | 2016-06-24 | 2018-12-04 | Invensas Corporation | Stacked transmission line |
JP2020017133A (ja) * | 2018-07-26 | 2020-01-30 | キオクシア株式会社 | ストレージ装置及び制御方法 |
CN113966647A (zh) * | 2019-06-28 | 2022-01-21 | 3M创新有限公司 | 多层电路板 |
CN111935902A (zh) * | 2020-09-23 | 2020-11-13 | 歌尔股份有限公司 | 印制电路板 |
US11412610B2 (en) * | 2020-11-04 | 2022-08-09 | Juniper Networks, Inc | Apparatus, system, and method for mitigating the swiss cheese effect in high-current circuit boards |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002208670A (ja) * | 2001-01-10 | 2002-07-26 | Matsushita Electric Ind Co Ltd | 電子部品実装モジュール及び電子部品実装モジュールの基板補強方法 |
JP2007134540A (ja) * | 2005-11-11 | 2007-05-31 | Murata Mfg Co Ltd | 半導体装置およびその製造方法 |
WO2009050891A1 (ja) * | 2007-10-17 | 2009-04-23 | Panasonic Corporation | 実装構造体 |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2663649B2 (ja) * | 1989-10-16 | 1997-10-15 | 松下電器産業株式会社 | マルチチップ実装方法 |
JPH0513982A (ja) | 1991-07-02 | 1993-01-22 | Mitsubishi Electric Corp | プリント配線板 |
EP0526133B1 (en) * | 1991-07-26 | 1997-03-19 | Nec Corporation | Polyimide multilayer wiring substrate and method for manufacturing the same |
JPH07202359A (ja) | 1993-12-30 | 1995-08-04 | Sony Corp | 回路基板 |
JPH07235776A (ja) | 1994-02-24 | 1995-09-05 | Ricoh Co Ltd | 多層プリント配線基板 |
JPH08195566A (ja) | 1995-01-12 | 1996-07-30 | Hitachi Ltd | 多層型電子基板とその製造方法、及び演算処理用ボード |
JPH09260795A (ja) * | 1996-03-19 | 1997-10-03 | Tokin Corp | 電子部品実装用基板 |
JP3267148B2 (ja) | 1996-04-03 | 2002-03-18 | 富士通株式会社 | 多層プリント配線板及び携帯型無線通信装置 |
JPH1032388A (ja) | 1996-07-17 | 1998-02-03 | Fujitsu Ltd | 多層プリント基板 |
JP3805441B2 (ja) | 1996-10-18 | 2006-08-02 | 信越ポリマー株式会社 | キャリアテープ |
JP3333409B2 (ja) | 1996-11-26 | 2002-10-15 | 株式会社日立製作所 | 半導体モジュール |
JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
JPH1168313A (ja) | 1997-08-11 | 1999-03-09 | Hitachi Cable Ltd | プリント配線基板 |
JP2000133941A (ja) | 1998-10-28 | 2000-05-12 | Ibiden Co Ltd | 多層ビルドアップ配線板 |
TW535470B (en) * | 1999-08-26 | 2003-06-01 | Mitac Int Corp | Pressing method of eight-layered circuit board and the structure thereof |
US6700351B2 (en) * | 2000-02-18 | 2004-03-02 | Liebert Corporation | Modular uninterruptible power supply battery management |
JP4514327B2 (ja) | 2000-12-27 | 2010-07-28 | 京セラ株式会社 | 半導体素子収納用パッケージの包装容器 |
JP2002261402A (ja) * | 2001-03-01 | 2002-09-13 | Alps Electric Co Ltd | 電子回路ユニットの回路基板 |
JP4318417B2 (ja) * | 2001-10-05 | 2009-08-26 | ソニー株式会社 | 高周波モジュール基板装置 |
JP2003218272A (ja) * | 2002-01-25 | 2003-07-31 | Sony Corp | 高周波モジュール及びその製造方法 |
JP2003258189A (ja) | 2002-03-01 | 2003-09-12 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4024563B2 (ja) * | 2002-03-15 | 2007-12-19 | 株式会社日立製作所 | 半導体装置 |
JP4256198B2 (ja) * | 2003-04-22 | 2009-04-22 | 株式会社東芝 | データ記憶システム |
JP2004342934A (ja) | 2003-05-16 | 2004-12-02 | Sumitomo Metal Micro Devices Inc | プリント基板 |
JP2004363347A (ja) | 2003-06-05 | 2004-12-24 | Oki Electric Ind Co Ltd | 多層プリント基板 |
JP2005123493A (ja) | 2003-10-20 | 2005-05-12 | Sony Corp | 配線基板及び素子実装基板 |
JP2005136232A (ja) * | 2003-10-30 | 2005-05-26 | Kyocera Corp | 配線基板 |
JP4672290B2 (ja) | 2004-06-16 | 2011-04-20 | 富士通株式会社 | 回路基板、パッケージ基板の製造方法及びパッケージ基板 |
JP2006108289A (ja) * | 2004-10-04 | 2006-04-20 | Yazaki Corp | プリント配線板 |
KR20060060596A (ko) * | 2004-11-30 | 2006-06-05 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체 기억 장치 |
US7009190B1 (en) | 2004-12-10 | 2006-03-07 | Eastman Kodak Company | Method and apparatus for capturing an image |
JP2006199300A (ja) | 2005-01-18 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子部品包装帯及びその製造方法 |
JP4237160B2 (ja) * | 2005-04-08 | 2009-03-11 | エルピーダメモリ株式会社 | 積層型半導体装置 |
JP2007149829A (ja) | 2005-11-25 | 2007-06-14 | Fujifilm Corp | 電子部品実装基板 |
JP2007311723A (ja) * | 2006-05-22 | 2007-11-29 | Furukawa Electric Co Ltd:The | 多層回路基板 |
JP2008071963A (ja) | 2006-09-14 | 2008-03-27 | Denso Corp | 多層配線基板 |
JP5046720B2 (ja) | 2006-12-22 | 2012-10-10 | 京セラ株式会社 | コイル内蔵基板 |
JP4087884B2 (ja) | 2007-03-15 | 2008-05-21 | Tdk株式会社 | 高周波モジュール |
KR100919342B1 (ko) * | 2007-09-06 | 2009-09-25 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
JP2009152282A (ja) | 2007-12-19 | 2009-07-09 | Shinko Electric Ind Co Ltd | 集合配線基板及び半導体パッケージ |
JP5161560B2 (ja) * | 2007-12-28 | 2013-03-13 | 株式会社東芝 | 半導体記憶装置 |
JP2009200101A (ja) * | 2008-02-19 | 2009-09-03 | Liquid Design Systems:Kk | 半導体チップ及び半導体装置 |
JP2009267162A (ja) * | 2008-04-25 | 2009-11-12 | Toyota Industries Corp | プリント配線板 |
JP2010079445A (ja) * | 2008-09-24 | 2010-04-08 | Toshiba Corp | Ssd装置 |
KR20100041515A (ko) | 2008-10-14 | 2010-04-22 | 삼성전자주식회사 | 제거 가능한 보조 검사단자를 갖는 솔리드 스테이트 드라이브의 검사방법 |
JP2010114137A (ja) * | 2008-11-04 | 2010-05-20 | Toshiba Corp | 多層プリント配線板 |
JP2010135418A (ja) | 2008-12-02 | 2010-06-17 | Shinko Electric Ind Co Ltd | 配線基板及び電子部品装置 |
JP2010219498A (ja) * | 2009-02-20 | 2010-09-30 | Elpida Memory Inc | 半導体装置 |
KR101037450B1 (ko) * | 2009-09-23 | 2011-05-26 | 삼성전기주식회사 | 패키지 기판 |
US8334463B2 (en) * | 2009-10-30 | 2012-12-18 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP5579108B2 (ja) * | 2011-03-16 | 2014-08-27 | 株式会社東芝 | 半導体装置 |
-
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- 2011-03-16 JP JP2011058140A patent/JP5579108B2/ja active Active
-
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- 2012-03-01 CN CN202310754750.7A patent/CN116666351A/zh active Pending
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- 2012-03-13 US US13/418,619 patent/US8873265B2/en active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002208670A (ja) * | 2001-01-10 | 2002-07-26 | Matsushita Electric Ind Co Ltd | 電子部品実装モジュール及び電子部品実装モジュールの基板補強方法 |
JP2007134540A (ja) * | 2005-11-11 | 2007-05-31 | Murata Mfg Co Ltd | 半導体装置およびその製造方法 |
WO2009050891A1 (ja) * | 2007-10-17 | 2009-04-23 | Panasonic Corporation | 実装構造体 |
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