TWI526311B - 多層樹脂薄片及其製造方法,多層樹脂薄片硬化物之製造方法及高熱傳導樹脂薄片層合體及其製造方法 - Google Patents

多層樹脂薄片及其製造方法,多層樹脂薄片硬化物之製造方法及高熱傳導樹脂薄片層合體及其製造方法 Download PDF

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TWI526311B
TWI526311B TW099133034A TW99133034A TWI526311B TW I526311 B TWI526311 B TW I526311B TW 099133034 A TW099133034 A TW 099133034A TW 99133034 A TW99133034 A TW 99133034A TW I526311 B TWI526311 B TW I526311B
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resin sheet
resin
multilayer
adhesive layer
layer
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TW099133034A
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Chinese (zh)
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TW201129475A (en
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片木秀行
竹澤由高
西山智雄
原直樹
田仲裕之
吉原謙介
上面雅義
高橋裕之
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日立化成股份有限公司
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Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040416A1 (ja) * 2009-09-29 2011-04-07 日立化成工業株式会社 樹脂組成物、樹脂シート、ならびに、樹脂硬化物およびその製造方法
JP5962514B2 (ja) * 2011-01-19 2016-08-03 日立化成株式会社 液晶性樹脂組成物、放熱材料前駆体、bステージシート、プリプレグ、放熱材料、積層板、金属基板、プリント配線板、液晶性樹脂組成物の製造方法、放熱材料前駆体の製造方法及び放熱材料の製造方法
KR20140007429A (ko) * 2011-03-31 2014-01-17 미쓰비시 가가꾸 가부시키가이샤 삼차원 집적 회로 적층체, 및 삼차원 집적 회로 적층체용 층간 충전재
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
CN105646847B (zh) * 2011-08-31 2018-01-16 日立化成株式会社 树脂组合物
KR101825259B1 (ko) * 2011-08-31 2018-02-02 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스
CN105754293A (zh) * 2011-08-31 2016-07-13 日立化成株式会社 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及半导体装置
JP5119364B1 (ja) * 2011-09-16 2013-01-16 積水化学工業株式会社 光半導体装置用白色硬化性組成物及び光半導体装置用成形体
KR101958506B1 (ko) * 2011-11-02 2019-03-14 히타치가세이가부시끼가이샤 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치
JP5928477B2 (ja) * 2011-11-02 2016-06-01 日立化成株式会社 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板
JP2013119588A (ja) * 2011-12-07 2013-06-17 Nitto Denko Corp 電子部品封止用エポキシ樹脂組成物およびそれを用いた電子部品装置
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EP3705289A4 (en) 2017-11-01 2021-08-25 Nitto Denko Corporation LAMINATE AND REINFORCEMENT FILM
WO2019176074A1 (ja) * 2018-03-15 2019-09-19 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、樹脂シート、bステージシート、cステージシート、硬化物、樹脂付金属箔、金属基板、及びパワー半導体装置
JP7135364B2 (ja) * 2018-03-23 2022-09-13 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
CN111276645A (zh) * 2020-03-23 2020-06-12 成都科成精化科技有限公司 一种锂电池铝塑膜胶粘剂的填料增强体系设计方法
CN111961386B (zh) * 2020-08-28 2021-12-21 深圳先进电子材料国际创新研究院 一种散热结构

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770150A (en) * 1980-10-21 1982-04-30 Sumitomo Deyurezu Kk Cure promoting method for resol type phenolic resin
JPS605598A (ja) * 1983-06-23 1985-01-12 松下電器産業株式会社 高熱伝導性金属ベ−スプリント基板の製造方法
JPS61154847A (ja) * 1984-12-27 1986-07-14 松下電器産業株式会社 高熱伝導性金属ベ−スプリント基板の積層方法
JPS61215056A (ja) * 1985-03-22 1986-09-24 松下電器産業株式会社 高熱伝導性金属ベ−スプリント基板の積層方法
JPH02130146A (ja) * 1988-11-11 1990-05-18 Matsushita Electric Works Ltd 電気用積層板
JPH02130144A (ja) * 1988-11-11 1990-05-18 Matsushita Electric Works Ltd 電気用積層板
JP2708821B2 (ja) * 1988-11-11 1998-02-04 松下電工株式会社 電気用積層板
JPH02130145A (ja) * 1988-11-11 1990-05-18 Matsushita Electric Works Ltd 電気用積層板
JP3428699B2 (ja) * 1993-09-24 2003-07-22 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物
US5811504A (en) * 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
JPH09302070A (ja) * 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JPH1017636A (ja) * 1996-07-03 1998-01-20 Nec Corp 難燃性熱硬化性樹脂組成物
JP3620156B2 (ja) * 1996-08-07 2005-02-16 日立化成工業株式会社 低温接着性のフィルム状接着剤、それを用いたリードフレーム及び半導体装置
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
JP2001055425A (ja) * 1999-06-10 2001-02-27 Nippon Kayaku Co Ltd レゾルシンノボラック樹脂、エポキシ樹脂組成物及びその硬化物
US7109288B2 (en) 2001-05-18 2006-09-19 Hitachi, Ltd. Cured thermosetting resin product
US20030069347A1 (en) * 2001-09-28 2003-04-10 Hideki Oishi Calcined silica particle and manufacturing method of same
JP2003137971A (ja) * 2001-11-02 2003-05-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物、プリプレグ、積層板ならびにプリント配線板
JP4745625B2 (ja) 2003-06-19 2011-08-10 住友化学株式会社 エポキシ化合物およびエポキシ樹脂硬化物
JP4619770B2 (ja) 2003-12-24 2011-01-26 住友化学株式会社 エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
TWI354002B (en) * 2003-12-24 2011-12-11 Sumitomo Chemical Co Epoxy compounds and cured epoxy resin obtained by
CN100441619C (zh) * 2004-04-30 2008-12-10 株式会社吴羽 封装用树脂组合物以及树脂封装的半导体装置
US7999042B2 (en) * 2004-06-25 2011-08-16 Intel Corporation Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
WO2006068185A1 (ja) * 2004-12-21 2006-06-29 Nippon Kayaku Kabushki Kaisha エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2006291150A (ja) * 2005-04-14 2006-10-26 Kaneka Corp 耐熱性接着シート
WO2007108087A1 (ja) * 2006-03-20 2007-09-27 Sumitomo Bakelite Co., Ltd. 絶縁樹脂層、キャリア付き絶縁樹脂層および多層プリント配線板
TW200804449A (en) * 2006-06-07 2008-01-16 Sumitomo Chemical Co Epoxy resin composition and epoxy resin hardened material
JP2008013759A (ja) 2006-06-07 2008-01-24 Sumitomo Chemical Co Ltd エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP5215605B2 (ja) * 2007-07-17 2013-06-19 ラピスセミコンダクタ株式会社 半導体装置の製造方法
KR20100059812A (ko) * 2007-09-20 2010-06-04 니폰 가야꾸 가부시끼가이샤 반도체 장치용 프라이머 수지 및 반도체 장치
WO2014115637A1 (ja) * 2013-01-22 2014-07-31 東レ株式会社 接着剤組成物、接着剤シートならびにこれらを用いた硬化物および半導体装置

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EP2484724A1 (en) 2012-08-08
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