TWI422436B - 塗佈方法及塗佈裝置 - Google Patents
塗佈方法及塗佈裝置 Download PDFInfo
- Publication number
- TWI422436B TWI422436B TW095119113A TW95119113A TWI422436B TW I422436 B TWI422436 B TW I422436B TW 095119113 A TW095119113 A TW 095119113A TW 95119113 A TW95119113 A TW 95119113A TW I422436 B TWI422436 B TW I422436B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- substrate
- linear
- nozzle
- coating film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005156895 | 2005-05-30 | ||
JP2006121556A JP4980644B2 (ja) | 2005-05-30 | 2006-04-26 | 塗布方法及び塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200711749A TW200711749A (en) | 2007-04-01 |
TWI422436B true TWI422436B (zh) | 2014-01-11 |
Family
ID=37729284
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098107118A TWI405617B (zh) | 2005-05-30 | 2006-05-30 | 塗佈方法及塗佈裝置 |
TW095119113A TWI422436B (zh) | 2005-05-30 | 2006-05-30 | 塗佈方法及塗佈裝置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098107118A TWI405617B (zh) | 2005-05-30 | 2006-05-30 | 塗佈方法及塗佈裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4980644B2 (ja) |
KR (1) | KR101195735B1 (ja) |
CN (1) | CN101685257B (ja) |
TW (2) | TWI405617B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4927158B2 (ja) * | 2009-12-25 | 2012-05-09 | 東京エレクトロン株式会社 | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
JP5314726B2 (ja) * | 2011-03-18 | 2013-10-16 | 東京エレクトロン株式会社 | 塗布膜形成装置及び塗布膜形成方法 |
JP5578377B2 (ja) * | 2011-07-29 | 2014-08-27 | セメス株式会社 | 基板処理装置及び方法 |
JP5894278B2 (ja) * | 2011-09-09 | 2016-03-23 | エルジー イノテック カンパニー リミテッド | 大面積基板の厚膜製造方法及びこれによる厚膜構造、照明装置及びこれを含む液晶表示装置 |
KR101827364B1 (ko) * | 2011-10-13 | 2018-03-22 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
CN103034061B (zh) * | 2012-12-13 | 2016-04-27 | 京东方科技集团股份有限公司 | 一种基板的制作方法 |
CN105492962B (zh) * | 2013-08-30 | 2019-07-26 | 武藏工业株式会社 | 板状层叠体的制造方法及装置 |
JP6231956B2 (ja) * | 2014-08-11 | 2017-11-15 | 東京エレクトロン株式会社 | 基板処理装置 |
CN108700815B (zh) * | 2015-12-23 | 2024-03-19 | Asml荷兰有限公司 | 用于去除衬底上的光敏材料的方法 |
JP6713910B2 (ja) * | 2016-11-11 | 2020-06-24 | 株式会社Screenホールディングス | 現像装置、基板処理装置、現像方法および基板処理方法 |
JP6925746B2 (ja) * | 2017-12-15 | 2021-08-25 | 住友重機械工業株式会社 | 膜形成装置及び膜形成方法 |
JP6506446B2 (ja) * | 2018-05-10 | 2019-04-24 | Aiメカテック株式会社 | 薄膜形成装置および薄膜形成方法 |
JP6775907B1 (ja) * | 2019-08-08 | 2020-10-28 | 中外炉工業株式会社 | 塗布装置及び塗布方法 |
CN111187008B (zh) * | 2020-03-12 | 2022-04-26 | Tcl华星光电技术有限公司 | 玻璃基板涂布方法及玻璃基板涂布装置 |
CN113600440B (zh) * | 2021-08-03 | 2022-07-29 | 武汉华星光电技术有限公司 | 显示面板的点胶方法和显示面板的点胶装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0992134A (ja) * | 1995-09-22 | 1997-04-04 | Dainippon Printing Co Ltd | ノズル塗布方法及び装置 |
JPH10156255A (ja) * | 1996-11-27 | 1998-06-16 | Tokyo Electron Ltd | 塗布膜形成装置 |
JP2004151428A (ja) * | 2002-10-31 | 2004-05-27 | Dainippon Printing Co Ltd | 機能性素子の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4192456B2 (ja) * | 2001-10-22 | 2008-12-10 | セイコーエプソン株式会社 | 薄膜形成方法ならびにこれを用いた薄膜構造体の製造装置、半導体装置の製造方法、および電気光学装置の製造方法 |
JP3966306B2 (ja) * | 2002-04-16 | 2007-08-29 | セイコーエプソン株式会社 | パターンの形成方法、パターン形成装置、導電膜配線、デバイスの製造方法、電気光学装置、並びに電子機器 |
KR100923022B1 (ko) * | 2002-06-14 | 2009-10-22 | 삼성전자주식회사 | 감광물질 코팅 방법 및 장치 |
JP2004098012A (ja) * | 2002-09-12 | 2004-04-02 | Seiko Epson Corp | 薄膜形成方法、薄膜形成装置、光学素子、有機エレクトロルミネッセンス素子、半導体素子および電子機器 |
JP4071183B2 (ja) * | 2003-09-12 | 2008-04-02 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
-
2006
- 2006-04-26 JP JP2006121556A patent/JP4980644B2/ja not_active Expired - Fee Related
- 2006-05-26 KR KR1020060047402A patent/KR101195735B1/ko not_active IP Right Cessation
- 2006-05-30 TW TW098107118A patent/TWI405617B/zh not_active IP Right Cessation
- 2006-05-30 TW TW095119113A patent/TWI422436B/zh not_active IP Right Cessation
- 2006-05-30 CN CN2009102093194A patent/CN101685257B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0992134A (ja) * | 1995-09-22 | 1997-04-04 | Dainippon Printing Co Ltd | ノズル塗布方法及び装置 |
JPH10156255A (ja) * | 1996-11-27 | 1998-06-16 | Tokyo Electron Ltd | 塗布膜形成装置 |
JP2004151428A (ja) * | 2002-10-31 | 2004-05-27 | Dainippon Printing Co Ltd | 機能性素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101685257A (zh) | 2010-03-31 |
KR101195735B1 (ko) | 2012-10-29 |
JP4980644B2 (ja) | 2012-07-18 |
TW200930468A (en) | 2009-07-16 |
CN101685257B (zh) | 2012-04-25 |
TW200711749A (en) | 2007-04-01 |
JP2007007639A (ja) | 2007-01-18 |
TWI405617B (zh) | 2013-08-21 |
KR20060124583A (ko) | 2006-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |