TWI422436B - 塗佈方法及塗佈裝置 - Google Patents

塗佈方法及塗佈裝置 Download PDF

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Publication number
TWI422436B
TWI422436B TW095119113A TW95119113A TWI422436B TW I422436 B TWI422436 B TW I422436B TW 095119113 A TW095119113 A TW 095119113A TW 95119113 A TW95119113 A TW 95119113A TW I422436 B TWI422436 B TW I422436B
Authority
TW
Taiwan
Prior art keywords
coating
substrate
linear
nozzle
coating film
Prior art date
Application number
TW095119113A
Other languages
English (en)
Chinese (zh)
Other versions
TW200711749A (en
Inventor
Naoki Fujita
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200711749A publication Critical patent/TW200711749A/zh
Application granted granted Critical
Publication of TWI422436B publication Critical patent/TWI422436B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW095119113A 2005-05-30 2006-05-30 塗佈方法及塗佈裝置 TWI422436B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005156895 2005-05-30
JP2006121556A JP4980644B2 (ja) 2005-05-30 2006-04-26 塗布方法及び塗布装置

Publications (2)

Publication Number Publication Date
TW200711749A TW200711749A (en) 2007-04-01
TWI422436B true TWI422436B (zh) 2014-01-11

Family

ID=37729284

Family Applications (2)

Application Number Title Priority Date Filing Date
TW098107118A TWI405617B (zh) 2005-05-30 2006-05-30 塗佈方法及塗佈裝置
TW095119113A TWI422436B (zh) 2005-05-30 2006-05-30 塗佈方法及塗佈裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW098107118A TWI405617B (zh) 2005-05-30 2006-05-30 塗佈方法及塗佈裝置

Country Status (4)

Country Link
JP (1) JP4980644B2 (ja)
KR (1) KR101195735B1 (ja)
CN (1) CN101685257B (ja)
TW (2) TWI405617B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927158B2 (ja) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
JP5314726B2 (ja) * 2011-03-18 2013-10-16 東京エレクトロン株式会社 塗布膜形成装置及び塗布膜形成方法
JP5578377B2 (ja) * 2011-07-29 2014-08-27 セメス株式会社 基板処理装置及び方法
JP5894278B2 (ja) * 2011-09-09 2016-03-23 エルジー イノテック カンパニー リミテッド 大面積基板の厚膜製造方法及びこれによる厚膜構造、照明装置及びこれを含む液晶表示装置
KR101827364B1 (ko) * 2011-10-13 2018-03-22 세메스 주식회사 기판 처리 장치 및 방법
CN103034061B (zh) * 2012-12-13 2016-04-27 京东方科技集团股份有限公司 一种基板的制作方法
CN105492962B (zh) * 2013-08-30 2019-07-26 武藏工业株式会社 板状层叠体的制造方法及装置
JP6231956B2 (ja) * 2014-08-11 2017-11-15 東京エレクトロン株式会社 基板処理装置
CN108700815B (zh) * 2015-12-23 2024-03-19 Asml荷兰有限公司 用于去除衬底上的光敏材料的方法
JP6713910B2 (ja) * 2016-11-11 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 現像装置、基板処理装置、現像方法および基板処理方法
JP6925746B2 (ja) * 2017-12-15 2021-08-25 住友重機械工業株式会社 膜形成装置及び膜形成方法
JP6506446B2 (ja) * 2018-05-10 2019-04-24 Ａｉメカテック株式会社 薄膜形成装置および薄膜形成方法
JP6775907B1 (ja) * 2019-08-08 2020-10-28 中外炉工業株式会社 塗布装置及び塗布方法
CN111187008B (zh) * 2020-03-12 2022-04-26 Tcl华星光电技术有限公司 玻璃基板涂布方法及玻璃基板涂布装置
CN113600440B (zh) * 2021-08-03 2022-07-29 武汉华星光电技术有限公司 显示面板的点胶方法和显示面板的点胶装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992134A (ja) * 1995-09-22 1997-04-04 Dainippon Printing Co Ltd ノズル塗布方法及び装置
JPH10156255A (ja) * 1996-11-27 1998-06-16 Tokyo Electron Ltd 塗布膜形成装置
JP2004151428A (ja) * 2002-10-31 2004-05-27 Dainippon Printing Co Ltd 機能性素子の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4192456B2 (ja) * 2001-10-22 2008-12-10 セイコーエプソン株式会社 薄膜形成方法ならびにこれを用いた薄膜構造体の製造装置、半導体装置の製造方法、および電気光学装置の製造方法
JP3966306B2 (ja) * 2002-04-16 2007-08-29 セイコーエプソン株式会社 パターンの形成方法、パターン形成装置、導電膜配線、デバイスの製造方法、電気光学装置、並びに電子機器
KR100923022B1 (ko) * 2002-06-14 2009-10-22 삼성전자주식회사 감광물질 코팅 방법 및 장치
JP2004098012A (ja) * 2002-09-12 2004-04-02 Seiko Epson Corp 薄膜形成方法、薄膜形成装置、光学素子、有機エレクトロルミネッセンス素子、半導体素子および電子機器
JP4071183B2 (ja) * 2003-09-12 2008-04-02 東京エレクトロン株式会社 塗布方法及び塗布装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992134A (ja) * 1995-09-22 1997-04-04 Dainippon Printing Co Ltd ノズル塗布方法及び装置
JPH10156255A (ja) * 1996-11-27 1998-06-16 Tokyo Electron Ltd 塗布膜形成装置
JP2004151428A (ja) * 2002-10-31 2004-05-27 Dainippon Printing Co Ltd 機能性素子の製造方法

Also Published As

Publication number Publication date
CN101685257A (zh) 2010-03-31
KR101195735B1 (ko) 2012-10-29
JP4980644B2 (ja) 2012-07-18
TW200930468A (en) 2009-07-16
CN101685257B (zh) 2012-04-25
TW200711749A (en) 2007-04-01
JP2007007639A (ja) 2007-01-18
TWI405617B (zh) 2013-08-21
KR20060124583A (ko) 2006-12-05

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