1378840 _ 六、發明說明： 【發明所屬之技術領域】 本發明係有關一邊吸著固定工件一邊進行雷射加工 . 的雷射加工裝置、雷射加工方法、加工控制裝置及加工控 . 制方法。 【先前技術】 就印刷基板等工件（加工對象物）的加工裝置而言，有 一種將雷射光照射至工件而進行開孔加工的雷射加工裝 _置。此種的雷射加工裝置在進行開孔加工時，一旦工件移 動，加工孔的位置便會偏掉，因此必須將工件固定在加工 台上。 就用來將工件固定在加工台上的方法而言，係有將工 件載置在加工台上所設置的吸著孔上後將吸著孔減壓的方 法。該方法係藉由在加工台上設置有複數個吸著孔而能夠 一邊防止工件的翹曲等一邊進行工件的雷射加工（參照例 Φ如專利文獻1)。 專利文獻1:日本特開2000-334593號公報 【發明内容】 (發明所欲解決之課題） 然而，在上述的習知技術中有如下的問題，亦即，在 工件的加工孔與加工台上的吸著孔重疊時的加工孔和工件 的加工孔與加工台上的吸著孔沒有重疊時的加工孔，兩者 的加工品質會有不同。就在有吸著孔的部位和沒有吸著孔 的部位會有不同加工品質的原因而言，其一是熱傳遞至工 321229修正版 1378840 件背面的方式。熱傳遞至工件背面的方式會有不同是因為 雷射加工的熱經由加工台而逸散的現象在有吸著孔的部位 和沒有吸著孔的部位有所不同之故。是故，在沒有吸著孔 的加工台上對工件進行加工時，即使所使用的加工條件（能 量、脈波數）不會使工件下面的材質破裂，但在對吸著孔上 的工件進行加工時仍會有工件下面的材質容易破裂的情 形。 % 1 是故，存在有用來使加工品質在有吸著孔的部位和沒 ® 有吸著孔的部位成為相同的加工條件的決定需要很多的時 間之問題。此外，為了使加工品質在有吸著孔的部位和沒 有吸著孔的部位成為相同，係有在吸著孔的部位減少雷射 功率而照射複數次的方法，但該方法存在有雷射加工需要 長時間之問題。 本發明乃鑒於上述情事而研創者，其目的在於獲得一 種以短時間於工件予以開孔加工相同加工品質的加工孔之 φ 雷射加工裝置、雷射加工方法、加工控制裝置及加工控制 方法。 (解決課題的手段） 為了解決上述課題並達成前述目的，本發明的雷射加 工裝置具備：加工台，載置屬於加工對象物之工件，並且 藉由吸著所載置的前述工件的底面之吸著孔而吸著固定前 述工件；雷射加工部，對被吸著固定在前述加工台上的前 述工件照射雷射光而'對前述工件進行加工孔的開孔加工； 及加工控制裝置，藉由控制前述加工台及前述雷射加工 4 32】229修正版 1378840 部，使前述加工台上的工件和前述雷射光的照射位置的相 對位置移動；前述加工控制裝置係具備：抽出部，將當載 置前述工件到前述加工台上時成為位於屬於從前述吸著孔 起預定範圍内之吸著區域上側的前述加工孔予以抽出；及 第1設定部，將從成為加工對象的加工孔之中排除前述抽 出部所抽出的加工孔後留下的加工孔設定為屬於第1次的 開孔加工對象之第1次加工孔；前述雷射加工部係進行前 述第1設定部所設定的第1次加工孔的開孔加工作為第1 次的開孔加工。 (發明的效果） 本發明的雷射加工裝置係以將載置工件到加工台上 時成為位於吸著孔上側的加工孔排除後留下的加工孔作為 第1次的開孔加工對象而進行開孔加工，因此可達到能夠 以短時間於工件予以加工相同加工品質的加工孔之效果。 【實施方式】 以下，茲根據圖式詳細說明本發明實施形態的雷射加 工裝置、雷射加工方法、加工控制裝置及加工控制方法。 另外，本發明並非限定於以下的實施形態。 實施形態 第1圖係顯示實施形態的雷射加工裝置的一部分之 圖。在第1圖中係顯示雷射加工裝置（雷射開孔加工機）的 一部分之進行工件（加工對象物）31的開孔加工處理的雷 射加工機構（雷射加工部）101A的構成。 雷射加工機構101A係具備掃描電鏡（galvano scan 5 321229修正版 1378840 _ 第098135227號專利申請案 101年7月25日修正替換頁 mirror)2a 2b ' 電鏡掃描器（gaivan〇 scanner)3a、此、f1378840 _ 6. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus, a laser processing method, a processing control apparatus, and a processing control method for performing laser processing while absorbing a fixed workpiece. [Prior Art] A processing apparatus for a workpiece (object to be processed) such as a printed board has a laser processing apparatus that irradiates laser light onto a workpiece and performs drilling. When such a laser processing apparatus performs the drilling process, once the workpiece is moved, the position of the machining hole is deflected, so the workpiece must be fixed to the processing table. As a method for fixing the workpiece to the processing table, there is a method of decompressing the suction hole after placing the workpiece on the suction hole provided on the processing table. In this method, laser processing of the workpiece can be performed while preventing warpage of the workpiece or the like by providing a plurality of suction holes in the processing table (see Patent Document 1). Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-334593. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, the above-described prior art has the following problems, that is, on the processing hole and the processing table of the workpiece. The processing quality of the machining hole and the machining hole of the workpiece when the suction holes overlap and the suction holes on the processing table do not overlap, the processing quality of the two will be different. For the reason that there are different processing qualities in the portion where the suction hole is formed and the portion where the suction hole is not provided, one of them is the way of heat transfer to the back side of the 321229 revision 1378840 piece. The way heat is transferred to the back side of the workpiece is different because the heat of laser processing dissipates through the processing table in the portion where there is a suction hole and the portion where there is no suction hole. Therefore, when the workpiece is machined on a processing table without a suction hole, even if the machining conditions (energy, pulse wave number) used do not rupture the material under the workpiece, the workpiece on the suction hole is made. There is still a situation in which the material under the workpiece is easily broken during processing. In the case of %1, there is a problem that it takes a lot of time to determine the processing quality in the portion where the suction hole is formed and the portion where the suction hole is not the same. Further, in order to make the processing quality the same in the portion having the suction hole and the portion having no suction hole, there is a method of reducing the laser power at the portion where the hole is sucked and irradiating the plurality of times, but the method has laser processing. It takes a long time. The present invention has been made in view of the above circumstances, and an object thereof is to obtain a φ laser processing apparatus, a laser processing method, a processing control apparatus, and a processing control method for processing holes having the same processing quality in a short time on a workpiece. (Means for Solving the Problem) In order to solve the above problems and achieve the above object, a laser processing apparatus according to the present invention includes a processing table on which a workpiece belonging to an object to be processed is placed, and by suctioning a bottom surface of the workpiece placed thereon The workpiece is sucked and fixed by the suction hole; the laser processing unit irradiates the workpiece that is sucked and fixed on the processing table with laser light, and performs a hole processing process on the workpiece; and a processing control device Controlling the processing table and the laser processing 4328] 229 revision 1378840 portion to move the relative position of the workpiece on the processing table and the irradiation position of the laser light; the processing control device includes: a drawing portion, which will be When the workpiece is placed on the processing table, the processing hole is positioned on the upper side of the absorbing region within a predetermined range from the absorbing hole, and the first setting portion is to be processed from the processing hole to be processed. The processing hole left after the processing hole extracted by the extraction portion is excluded is set as the first processing hole belonging to the first opening processing target; The laser processing unit performs the first hole processing of the first machining hole set by the first setting unit described above. (Effect of the Invention) The laser processing apparatus according to the present invention performs the processing of the processing hole which is left after the processing hole on the upper side of the suction hole when the workpiece is placed on the processing table, as the first opening processing target. The hole is machined, so that the effect of machining holes of the same processing quality in a short time can be achieved. [Embodiment] Hereinafter, a laser processing apparatus, a laser processing method, a processing control apparatus, and a processing control method according to embodiments of the present invention will be described in detail based on the drawings. Further, the present invention is not limited to the following embodiments. (Embodiment) Fig. 1 is a view showing a part of a laser processing apparatus according to an embodiment. In the first embodiment, a laser processing unit (laser processing unit) 101A that performs a drilling process of a workpiece (object to be processed) 31 is shown in a part of a laser processing apparatus (laser drilling machine). The laser processing mechanism 101A is provided with a scanning electron microscope (galvano scan 5 321229 modified version 1378840 _ 098 135 227 patent application July 25, revised amendment page mirror) 2a 2b 'electroscope scanner (gaivan〇scanner) 3a, this, f
61透鏡4、及戴置工件31的加工台21。雷射加工機構101A 係藉由设置在加工台21的整面的吸著孔22H而將工件31 •予以吸著固定，再將雷射光照射於該工件31以進行工件 31的開孔加工。吸著孔22H係用以吸著工件31的底面而 將工件31固定在加工台21的孔。加工台21係在載置有工 件31後’藉由將吸著孔22H減壓而使加工台21的上面吸 者工件31的底面。 φ 掃描電鏡2a係受未圖示的雷射振盪器所輸出的雷射 光1照射的第1掃描電鏡^掃描電鏡士係連接至電鏡掃描 器3a的驅動軸，電鏡掃描器3a的驅動軸係朝向Z軸方向。 掃描電鏡2a的鏡面係隨著電鏡掃描器如的驅動轴的旋轉 而變位，從而將入射的雷射光丨的光軸往第i方向（例如χ 軸方向）偏向掃描而送出至掃描電鏡2b。 掃描電鏡2b係受來自掃描電鏡2a的雷射光1照射的 φ 第2掃描電鏡。掃描電鏡2b係連接至電鏡掃描器3b的驅 動軸，電鏡掃描器3b的驅動軸係朝向χ轴方向。掃描電鏡 2b的鏡面係隨著電鏡掃描器3b的驅動軸的旋轉而變位， 從而將入射的雷射光1的光軸往大致正交於第i方向的第 2方向（例如Y軸方向）偏向掃描而送出至透鏡4。 f 0透鏡4係將在χγ面内進行2維掃描的雷射光i聚 光照射於工件31上。印刷基板材料或陶瓷生胚薄片 (ceramic green sheet)等工件31係具有平面形狀，在加 工台21係將工件31载置於χγ平面内。 321229修正版 6 1378840 雷射加工機構101A係使加工台21在XY平面内移動， 並且藉由電鏡掃描器3a、3b使雷射光1進行2維掃描。藉 此，在掃描區7内（亦即，藉由電鏡掃描器3a、3b所能使 • 雷射光1進行2維掃描的範圍内）的工件31形成（開孔加 - 工）1至複數個加工孔32h。 第2圖係顯示實施形態的雷射加工裝置的構成之方塊 圖。雷射加工裝置100係具有加工控制裝置103、雷射加 工機構101A、及搬送裝置102。 ® 加工控制裝置103係連接於雷射加工機構101A及搬 送裝置102，加工控制裝置103係用以控制雷射加工機構 101A及搬送裝102的電腦等裝置。加工控制裝置103係具 備輸入部11、資料轉換部12、吸著孔座標記憶部13、第1 次加工孔設定部14、第2次加工孔設定部15、抽出部16、 及控制部19。 輸入部Π係接收要於工件31開孔加工的孔的座標資 φ 料、及與對工件31進行的開孔加工相關的各種指示資訊等 的輸入。資料轉換部12係將輸入至輸入部11的座標資料 進行資料轉換而轉換成雷射加工資料。雷射加工資料係進 行開孔加工時加工控制裝置103使用的座標資料，由加工 台資料和電鏡資料表示。由於要在工件31開複數個孔，因 此依孔的每一位置以加工台資料和電鏡資料來表示各孔的 位置。加工台資料係加工台21及加工頭的相對座標，係例 如使加工台21移動的位置的資料（座標）。電鏡資料係由掃 描電鏡2a、2b、電鏡掃描器3a、3b所調整的雷射光的照 7 321229修正版 1378840 • 射位且（座“）。電鏡資料係表示在掃指區7内的座標。 吸著孔座標記憶部13係記憶設置在加工台21上的吸 者孔22H的位置（以下，稱為吸著孔座標）之記憶體等。吸 著孔座標係吸著孔22U的中心座標及直徑，作為雷射加工 裝置100的固有數值而預先記憶於吸著孔座標記憶部13。 抽出部16係依據吸著孔座標記憶部13所記憶的吸著 孔座標和資料轉換部12所轉換的雷射加工資料，抽出要開 在工件31的加工孔32h之中的位於吸著孔22h上的加工孔 32h。 第1次加工孔設定部14係將抽出部16從雷射加工資 料抽出的加工孔32h排除，並且使用排除加工孔32h後的 雷射加工資料’從要開在工件31的加工孔32h之中設定以 第1次（第1輪）的開孔加工來開口的孔（後述的第丨次加工 孔32a)。換言之，第1次加工孔設定部14係產生用以使 第1次加工孔32a開口的雷射加工資料。 I 第2次加工孔設定部15係使用抽出部16所抽出的加 孔32h從要開在工件31的加工孔32h之中設定以第£ 次（第2輪）的開孔加工來開口的孔（後述的第2次加工孔 3jb)。換言之，第2次加工孔設定部15係產生用以使第2 次加工孔32b開口的雷射加工資料。藉此，第2次加工孔 "又疋。卩15係;k要開在工件31的加工孔3汍之中將位於吸 著孔22H上的加工孔32h設定為第2次加工孔挪。控制 部19係控制輸入部u、資料轉換部12、吸著孔座標記憶 部13、第1次加工孔設定部14、第2次加工孔設定部π、 321229修正版 8 丄378840 - 及抽出部16。 在本實施形態中，將最初載置工件31於加工台21上 時不會位於吸著孔22H上的加工孔32h設定為第1次加工 孔32a而進行苐1次加工孔32a的開孔加工。之後，在加 工台21上移動工件31，藉此而使工件31和加工台21的 相對位置移動。此時係以使最初载置工件31於加工台21 . 上時位於吸著孔22H上的第2次加工孔32b的開孔加工不 鲁會位於吸著孔22H上的方式在加工台21上移動工件31。 接著’進行第2次加工孔32b的開孔加工。藉此，雷射加 工裝置100係在不會位於吸著孔22H上的位置對第1次加 工孔32a與第2次加工孔32b兩者進行開孔加工。 雷射加工裝置100係使用CCD(Charge Co叩ledA lens 4 and a processing table 21 on which the workpiece 31 is placed. The laser processing mechanism 101A sucks and fixes the workpiece 31 by the suction hole 22H provided on the entire surface of the processing table 21, and irradiates the laser light to the workpiece 31 to perform the drilling of the workpiece 31. The suction hole 22H is for sucking the bottom surface of the workpiece 31 to fix the workpiece 31 to the hole of the processing table 21. The processing table 21 is configured such that after the workpiece 31 is placed, the bottom surface of the workpiece 31 is sucked by the upper surface of the processing table 21 by decompressing the suction hole 22H. The φ scanning electron microscope 2a is connected to the driving shaft of the electron microscope scanner 3a by the first scanning electron microscope irradiated by the laser light output from the laser oscillator (not shown), and the driving shaft of the electron microscope scanner 3a is oriented. Z-axis direction. The mirror surface of the scanning electron microscope 2a is displaced in accordance with the rotation of the drive shaft of the electron microscope scanner, and the optical axis of the incident laser aperture is deflected toward the ith direction (e.g., the paraxial direction) and sent to the scanning electron microscope 2b. The scanning electron microscope 2b is a φ second scanning electron microscope that is irradiated with the laser light 1 from the scanning electron microscope 2a. The scanning electron microscope 2b is connected to the driving shaft of the electron microscope scanner 3b, and the driving shaft of the electron microscope scanner 3b is oriented in the x-axis direction. The mirror surface of the scanning electron microscope 2b is displaced by the rotation of the drive shaft of the electron microscope scanner 3b, thereby deflecting the optical axis of the incident laser light 1 in a second direction (for example, the Y-axis direction) substantially orthogonal to the i-th direction. Scanning is sent to the lens 4. The f 0 lens 4 condenses the laser light i which is subjected to two-dimensional scanning in the χγ plane onto the workpiece 31. The workpiece 31 such as a printed substrate material or a ceramic green sheet has a planar shape, and the workpiece 31 is placed on the χγ plane in the processing table 21. 321229 Rev. 6 1378840 The laser processing mechanism 101A moves the processing table 21 in the XY plane, and the laser light 1 is scanned in two dimensions by the electron microscope scanners 3a, 3b. Thereby, the workpiece 31 is formed (opening plus) 1 to a plurality of pieces in the scanning area 7 (i.e., in the range in which the scanning light 3 can be scanned by the electron microscope scanners 3a and 3b). The hole 32h is machined. Fig. 2 is a block diagram showing the configuration of a laser processing apparatus according to an embodiment. The laser processing apparatus 100 includes a processing control device 103, a laser processing unit 101A, and a conveying device 102. The processing control device 103 is connected to the laser processing unit 101A and the transport unit 102, and the processing control unit 103 is a device for controlling the laser processing unit 101A and the computer of the transport unit 102. The machining control device 103 is provided with an input unit 11, a data conversion unit 12, a suction hole coordinate storage unit 13, a first machining hole setting unit 14, a second machining hole setting unit 15, a drawing unit 16, and a control unit 19. The input unit receives the coordinates of the coordinates of the hole to be machined in the workpiece 31, and various kinds of instruction information related to the drilling process for the workpiece 31. The data conversion unit 12 converts the coordinate data input to the input unit 11 into data for conversion into laser processing materials. The laser processing data is the coordinate data used by the processing control device 103 during the drilling process, and is represented by the processing table data and the electron microscope data. Since a plurality of holes are to be opened in the workpiece 31, the position of each hole is indicated by the processing table data and the electron microscope data at each position of the hole. The processing table data is a relative coordinate between the processing table 21 and the processing head, and is, for example, a data (coordinate) of a position at which the processing table 21 is moved. The electron microscope data is a photo of the laser light adjusted by the scanning electron microscopes 2a, 2b and the electron microscope scanners 3a, 3b. 7 321229 modified version 1378840 • The position of the laser beam is (the "seat"). The electron microscope data indicates the coordinates in the swept area 7. The suction hole coordinate storage unit 13 stores a memory or the like at a position (hereinafter referred to as a suction hole coordinate) of the suction hole 22H provided in the processing table 21. The suction hole coordinates are the center coordinates of the suction hole 22U and The diameter is stored in advance in the suction hole coordinate storage unit 13 as a unique value of the laser processing apparatus 100. The extraction unit 16 is converted by the suction hole coordinates and the data conversion unit 12 which are memorized by the suction hole coordinate storage unit 13. The laser processing data extracts the machining hole 32h which is to be opened in the machining hole 32h of the workpiece 31 and which is located in the suction hole 22h. The first machining hole setting portion 14 is a process for extracting the extraction portion 16 from the laser processing material. The hole 32h is excluded, and the hole which is opened by the first (first round) opening process is set from the machining hole 32h to be opened in the workpiece 31 by using the laser processing material 32 (the latter) The first processing hole 32a). In other words The first machining hole setting unit 14 generates laser processing data for opening the first machining hole 32a. I The second machining hole setting unit 15 uses the hole 32h extracted by the extraction unit 16 to be opened. In the machining hole 32h of the workpiece 31, a hole (the second machining hole 3jb to be described later) that is opened by the second hole (second round) is formed. In other words, the second machining hole setting unit 15 is used. The laser processing data for opening the second processing hole 32b, whereby the second processing hole is further 疋 系 15 series; k is to be opened in the processing hole 3 of the workpiece 31 and will be located in the suction hole The machining hole 32h on the 22H is set as the second machining hole. The control unit 19 controls the input unit u, the data conversion unit 12, the suction hole coordinate storage unit 13, the first machining hole setting unit 14, and the second processing. The hole setting unit π, 321229 correction plate 8 丄 378840 - and the extraction portion 16. In the present embodiment, the machining hole 32h that is not placed on the suction hole 22H when the workpiece 31 is placed on the processing table 21 is set to the first The hole 32a is machined once, and the hole 32a is machined once. After that, the workpiece 31 is moved on the processing table 21, and the workpiece 31 is borrowed. Thereby, the relative position of the workpiece 31 and the processing table 21 is moved. At this time, the opening of the second processing hole 32b located on the suction hole 22H when the workpiece 31 is first placed on the processing table 21 is not processed. The workpiece 31 is moved on the processing table 21 in such a manner as to be positioned on the suction hole 22H. Next, the opening processing of the second processing hole 32b is performed. Thereby, the laser processing apparatus 100 is not positioned on the suction hole 22H. The position of the first processed hole 32a and the second processed hole 32b is opened. The laser processing apparatus 100 uses a CCD (Charge Co叩led).
Device ;電荷耦合元件）攝像機等來檢測預先設置在工件 31的對準記號（aligment mark)(定位記號），並根據對準 記號的位置來修正工件31和加工台21的相對位置。雷射 •加工裝置丨〇〇係根據修正後的工件31的座標來進行對工件 .31的開孔加工。 搬送裝置102係進行工件31的往加工台21搬入/搬 出之裝置（裝載裝置（1 oader)/卸載裴置（un丨oader))。本實 施形態的搬送裝置102係在進行第1次.加工孔32a的開孔 加工後’以第2次加工孔32b不會位於吸著孔22H上的方 式在加工台21上移動工件31。 加工控制裝置103係令搬送裝置丨〇2將工件31和加 工台21的相對位置移動達到根據吸著孔座標和雷射加工 9 321229修正版 1378840 ' 資料之預定座標。此外，加工控制裝置103係以在根據吸 著孔座標和雷射加工資料之預定座標位置進行開孔加工的 方式控制雷射加工機構101A。 加工控制裝置103係構成為含有CPU(CentralA device or the like (charge coupling element) detects an alignment mark (positioning mark) previously set in the workpiece 31, and corrects the relative position of the workpiece 31 and the processing table 21 in accordance with the position of the alignment mark. The laser processing apparatus performs the drilling of the workpiece .31 based on the coordinates of the corrected workpiece 31. The transport device 102 is a device (loader (unloader)/unloader) that carries in/out the workpiece 31 to the processing table 21. In the transport apparatus 102 of the present embodiment, after the first processing hole 32a is opened, the workpiece 31 is moved on the processing table 21 so that the second machining hole 32b does not land on the suction hole 22H. The machining control device 103 causes the conveying device 丨〇2 to move the relative positions of the workpiece 31 and the processing table 21 to a predetermined coordinate according to the suction hole coordinates and the laser processing 9 321229 revision 1378840'. Further, the processing control device 103 controls the laser processing mechanism 101A in such a manner as to perform the drilling processing at the predetermined coordinate position based on the suction hole coordinates and the laser processing data. The processing control device 103 is configured to include a CPU (Central)
Processing Unit ;中央處理器）、R〇M(Read Only Memory ; 唯4 5己憶體）、RAM(Random Access Memory ;隨機存取記憶 體）。在加工控制裝置103 ’ CPU係依據來自輸入部的使用 鲁者的輸入而讀取儲存在R〇M裡的各種控制程式與應用程式 等並載入至RAM内的程式儲存區域而執行各種處理’並將 在該處理時產生的各種資料暫時性地記憶在腫内形成的 資料儲存區域’從而控制雷射加工裝置丨〇〇。CplJ所執行的 知式係有：設定第1次加工孔32a與第2次加工孔32b之 私式、算出第1次加工孔32a的加工順序之程式、算出第 2次加工孔32b的加工順序之程式、算出使工件31和加工 台21的相對位置移動時的加工台21的移動量之程式等程 • 式。 另外’工件31的往加工台21上的載置與工件31在 加工台21上的移動亦可以手動來進行。此時，雷射加工裝 置100可不具備搬送裝置1〇2。 接著’針對本實施形態的雷射加工裝置1〇〇的雷射加 工方法進行說明。為了消除吸著孔22H上的加工孔32h和 位於吸著孔22H以外的位置的加工孔32h之間的加工品質 差’雷射加工裝置1〇〇對有吸著孔22H的部分係不施行開 孔加工，而是在吸著孔22H以外的位置進行開孔加工。具 10 321229修正版 1378840 體而言，加工控制裝置103對相當在吸著孔22H上的雷射 加工資料的孔係不進行開孔加工而略過該開孔加工。 第3圖係用以說明工件與加工台之圖。在第3圖中， • 顯示有工件31與加工台21的斜視圖。在加工台21上係 • 設置1至複數個吸著孔22H，在工件31載置在加工台21 上後，藉由吸著孔22H使工件31固定在加工台21上。接 著，雷射加工裝置100係在固定工件31於加工台21上的 狀態下進行加工孔32h的開孔加工。此外，工件31係形成 ® 為例如矩形狀，且在上面側的四個角落等設置有定位記號 33 ° 在雷射加工裝置100進行加工孔32h的開孔加工時係 利用定位記號33來判斷工件31的正確位置。具體而言， 藉由雷射加工裝置100所具備的CCD攝像機對工件31的定 位記號33進行圖像辨識，而將必須進行開孔加工的位置特 定為雷射加工裝置100的固有位置。換言之，加工控制裝 φ 置103的資料轉換部12係具有與工件31的配置（旋轉、伸 縮等）相應之雷射加工裝置10.0固有的演算法。 CCD攝像機係在工件31固定在加工台21後，對配置 在工件31的四個角落的定位記號33進行攝像。之後，從 雷射加工裝置100的加工頭射出雷射光1而對預定位置進 行開孔加工。在進行工件31的開孔加工時，以按照雷射加 工資料之順序進行開孔加工。此時，為了進行與工件31 的旋轉或伸縮等相應之開孔加工，加工控制裝置103係一 邊執行工件31的位置的修正計算一邊特定開孔加工的目 11 321229修正版 1378840 標位置。 在固定工件31於加工台21上後，會有加工孔32h與 吸著孔22H重疊的情形出現。第4圖係用以說明加工孔和 • 吸著孔的位置關係之圖。在第4圖中係顯示從上面觀看工 - 件31與加工台21時的情形。於工件31必須形成複數個加 工孔32h，此外，在加工台21上係設置有複數個吸著孔 22H。是故，在將工件31的底面固定在加工台21的上面後， 會存在有位於吸著孔22H上的加工孔32h與位於吸著孔 隹22H上以外的位置的加工孔32h。 第5圖係第4圖的A-A剖面圖。工件31係具有例如 雙層構造，上層側係以例如樹脂材料來形成，下層側係利 用例如銅來形成。此外，在雷射加工裝置100進行工件31 的開孔加工時係僅工件31的上層側形成加工孔32h而避免 貫通工件31的下層側。然而，當預定加工的加工孔32h 位於吸著孔22H的上部時，會有工件31的下層側因為雷射 φ 加工的熱而破裂的情形。 在本實施形態中，由於在吸著孔22H上不進行開孔加 工，因此在資料轉換部12算出加工孔32h的目標位置後， 抽出部16係進行雷射加工裝置100固有的加工孔32h的位 置是否為吸著孔22H上位置之判定並抽出吸著孔22H上的 加工孔32h。在抽出部16判斷加工孔32h的目標位置為吸 著孔22H上時，加工控制裝置103的第1次加工孔設定部 14係不對該加工孔32h輸出雷射照射的指令。 其中，關於加工孔32h的位置是否為吸著孔22H上的 12 321229修正版 1378840 位置之判定的進行，抽出部16係以從各吸著孔22H的中心 起預定範圍内作為吸著區域而根據該吸著區域内的上部是 否有加工孔32h的位置來判定各加工孔32h的位置是否為 • 吸著孔22H上的位置。例如，各加工孔32h的位置是否為 • 吸著孔22H上的位置之判定係可由抽出部16就每一加工孔 32h，根據加工孔32h的全面積是否位於吸著孔22H上來判 定，亦可由抽出部16就每一加工孔32h，根據加工孔32h 的一部分是否位於吸著孔22H上來判定。此外，抽出部16 ® 亦可設置比各吸著孔22H還大預定尺寸的較大區域，就每 一加工孔32h，根據比該吸著孔22H大的區塊（area)上是 否有加工孔32h的位置來判定加工孔32h的位置是否為吸 著孔22H上的位置。 第6圖係用以說明進行第1次開孔加工時的加工孔和 吸著孔的位置關係之圖。第7圖係用以說明進行第2次開 孔加工時的加工孔和吸著孔的位置關係之圖。在第6圖及 φ 第7圖中係顯示工件31與加工台21的斜視圖。 由第1次加工孔設定部14所設定來進行第1次的開 孔加工之加工孔32h係為載置工件31於加工台21上時加 工孔32h之中沒有與吸著孔22H重疊的加工孔32h，以下， 稱為第1次加工孔32a。在第6圖中，以端部P1來表示對 第1次加工孔32a進行開孔加工時的加工台21上的工件 31的配置位置（工件31的外周部）。此外，在第6圖中， 以位置22a來表示加工台21上的位置之中成為第1次加工 孔32a的下部之位置，以位置22b來表示加工台21上的位 13 321229修正版 I378840 置之中成為第2次加工孔32b的下部之位置。 -欠二1，㈣2次加玉孔設定部】5所設定來進行第2 夂的開孔加工之加工孔32h(沒有被設絲進行第丨次 孔加工之加工孔32h)係為载置工件31於加工台21上時： 工孔32h之中與吸著孔22H重疊的 . 為第2次加y 的加工孔咖’以下，稱 形態中係在對第丨次加工孔如進行加工 後’使工件31在XY平面上移動，藉此而改變第2欠加工 孔3扑和吸著孔22H的相對位置。在第 來表示對第！次加工孔32a進行開孔加工時的加== 上的工件31的位置，以配置位置p2來表示對第2次加工 孔32b騎開孔加工時的加工台21上的工件31的位置。 圖中’以位置22c來表示加工台21上的位置 之中成為第2次加工孔32b的下部之位置。另外，工件 2移動方向可為只有X軸方向之移動，亦可為只有γ轴方 此外’工件31的移動方向亦可為斜方向（X軸 方向及Υ轴方向）。 第8圖係用以說明對第2次加工孔進行開孔加工 進i于的加工孔的移動處理之圖。在第8圖中係顯示從上面 硯看工件31時的情形，第8圖中左側的圖係顯示第！次加 工孔32a進行開孔加工時的工件&的位置，第8圖中 的圖係顯示第2次加工孔咖進行開孔加工時的工件31 的位置。 在對第1次加工孔, 進订開孔加工後（s 1)改變苐2 321229修正版 】4 1378840 次加工孔32b和吸著孔22H的相對位置時，係以使全部的 第2次加工孔32b不會位於吸著孔22H上的方式移動工件 3li：s2)。此時，已完成加工的第1次加工孔32a位於吸著 • 孔22H上亦無妨。 • 在第1次加工孔設定部14設定第1次加工孔32a後 進行第1次加工孔32a的開孔加工處理。此時，第1次加 工孔設定部14係使雷射加工機構101A進行如下的開孔加 工：僅對第1次加工孔32a進行開孔加工，略過第2次加 鲁工孔32b。 第9圖係用以說明第1次加工孔的加工處理順序之 圖。第9圖中左侧的圖係顯示加工孔32h全部都是第1次 加工孔32a時的第1次加工孔的加工處理順序，第9圖中 右側的圖係顯示加工孔32h之中含有第2次加工孔32b時 的第1次加工孔的加工處理順序。 若雷射加工裝置100進行開孔加工的加工孔32h全部 φ 都是第1次加工孔32a的話，則依照原本的加工程式依序 對第1次加工孔32a(加工孔32h)進行開孔加工。例如，當 第1次加工孔32a的加工順序為第1次加工孔32a(l)、 32a(2)、32a(3)、32a(4)、32a(5)、32a(6)'32a(7)、32a(8)、 32a(9)的順序時，雷射加工裝置100係以該順序使照射至 各第1次加工孔32a的雷射光1的照射位置移動。 在上述情形中·，例如若在加工孔32h之中含有第2次 加工孔32b，則將第2次加工孔32b排除，僅對第1次加 工孔32a依序進行開孔加工。例如，若第1次加工孔32a(6) 15 321229修正版 1378840 為第2次加工孔32b，則雷射加工裝置100係以將第1次 加工孔32a(6)排除在外的方式對各第1次加工孔32a進行 .開孔加工。具體而言，由於將第1次加工孔32a的加工順 * 序以第 1 次加工孔 32a(l)、32a(2)、32a(3)、32a(4)、 、 32a(5)、32a(7)、32a(8)、32a(9)的順序進行開孔加工， 因此使照射至各第1次加工孔32a的雷射光1的照射位置 _ 以該順序移動。換言之，在對第1次加工孔32a(5)進行開 孔加工後，不使雷射光1的照射位置移動至第1次加工孔 參32a(6)的位置，而是使雷射光1的照射位置移動至第1次 加工孔32a(7)的位置。 接著，針對工件31的加工台21上的移動處理進行說 明。第10圖係用以說明工件的移動處理之圖，第11圖係 顯示工件的移動處理順序之圖。 搬送裝置102係具備將工件31搬入至加工台21上並 且將工件31從加工台21上搬出的臂41。臂41係於其下 鲁部具有接墊且成為藉由該接墊接著於工件31的上面而能 夠拿起工件31之構成。臂41係將進行第1次加工孔32a 的開孔加工後的工件31拿起，並使工件31從第1次加工 孔32a的開孔加工時載置工件31的位置（端部P1)移動至 第2次加工孔32b的開孔加工時工件31的載置位置（端部 P2)。 具體而言，係如第11圖所示，在進行第1次加工孔 32a的開孔加工後，搬送裝置102係使臂41移動到工件31 上（ST1)。之後，使臂41下降而使臂41的接墊接著於工件 16 321229修正版 1378840 31的上面，藉此，使臂41固定工件31。接著，藉由停止 吸著孔22H的減壓而解除加工台21對工件31的固定（ST2)。 搬送裝置102係使臂41上升，藉此而拿起工件31 * (ST3)。接著，加工控制裝置103係使加工台21移動達到 - 根據加工孔座標和雷射加工資料之預定座標（ST4)。此時， 雷射加工裝置100可使加工台21移動，亦可使工件31移 動。在使加工台21和工件31的相對位置移動後，搬送裝 置102係使臂41下降而使工件31載置於加工台21上。另 • 外，加工控制裝置103亦可使加工台21移動達至預先設定 的預定距離（指定挪移量）。例如，對加工控制裝置1 〇 3預 先設定像是往預定方向挪移幾mm(X±〇. 〇〇〇mm,Y±〇. 〇〇〇mm)等指定挪移量。 雷射加工裝置100係在載置工件31於加工台21上後 將吸著孔22H減壓，從而將工件31固定在加工台21上。 接著，使臂41的接墊脫離工件31的上面，藉此而解除臂 φ 41對工件31的固定（ST5)。 之後，搬送裝置102係使臂41升高到預定高度，之 後使臂41自工件31上退避（ST6)。在臂41自工件31退 避後，雷射加工裝置100係照射雷射光1至第2次加工孔 32b以進行對苐2次加工孔32b的開孔加工（ST7)。雷射加 工裝置100係在對該第2次加工孔32b進行開孔加工時， 使CCD攝像機移動達至與工件31的移動距離相應之距離而 檢測工件31的位置，並根據檢測結果來進行對第2次加工 孔32b的開孔加工。 17 321229修正版 1378840 另外，雖然在本實施形態中係針對加工孔32h以即時 (real time)處理來設定第1次加工孔32a和第2次加主孔 32b的情形加以說明，但亦可預先設定第1次加工孔32a * 和第2次加工孔32b。例如，當工件31載置到加工台21 • 上的載置位置沒有偏離且可預知工件31的載置位置時，雷 射加工裝置100亦可在載置工件31到加工台21上之前算 出加工孔32h和吸著孔22H重疊的位置。藉此，即使是在 載置工件31到加工台21上之前也是能夠設定第1次加工 •孔32a和第2次加工孔32b。 此外，亦可將加工台21上的區塊分割為複數個區塊， 並將各區塊設為配置吸著孔22H的區塊（後述的吸著孔配 置區塊25B)或沒有配置吸著孔22H的區塊（後述的非配置 區塊25A)。此時，首先在非配置區塊25A對加工孔32h進 行開孔加工，之後使位於吸著孔配置區塊25B上的加工孔 32h移動至非配置區塊25A上而進行開孔加工。 φ 第12圖係用以說明加工台上的吸著區塊和非吸著區 塊之圖。在第12圖中係顯示加工台21X和工件31的斜視 圖。加工台21X上的區塊係被分割成例如與X軸方向平行 的直條狀或與Y軸方向平行的ΐ條狀。在第12圖中係顯示 將加工台21Χ上的區塊分割成與Υ軸方向平行的直條狀的 情形。 被分割成直條狀的加工台21Χ上的區塊之中，於吸著 孔配置區塊25Β配置有吸著孔22Η，於非配置區塊25Α則 不配置吸著孔22Η。另外，形成在吸著孔配置區塊25Β的 18 321229修正版 1378840 吸著孔22H並非僅限於將吸著孔22H配置為1行的情形， 可為任何配置（例如2行配置）。在第12圖中係顯示分別以 寬度L1的間隔朝X軸方向連續排列吸著孔配置區塊25B . 和非配置區塊25A的情形。 抽出部16係預先將工件31上的區塊分割成與γ軸方 向平行的直條狀。此時，抽出部16係根據加工台21χ上的 吸著孔配置區塊25Β和非配置區塊25Α的配置來將工件31 上的&塊分告彳成直條狀。具體而言，抽出部16係以使吸著 孔配置區塊25B與非配置區塊25A的分界線成為工件31 上的直條分界之方式來分割工件31上的區塊。並且，抽出 部16係將非配置區塊25A上的工件31的區塊設定為第j 次加工孔32a用的區塊35A，將吸著孔配置區塊25B上的 工件31的區塊設定為第2次加工孔32b用的區塊35B。藉 此，區塊35A和區塊35B便與吸著孔配置區塊25B和非配 置區塊25A的配置同樣地分別以寬度L]的間隔朝χ軸方向 φ 連續排列。 第13圖係用以說明使用第12圖所示的加工台來進行 的開孔加工之圖。第13圖係顯示朝χ軸方向切斷加工台 21Χ和工件31的情形之剖面圖。第13圖上侧的圖係顯示 對第1次加工孔32a進行開孔加工時的雷射照射位置，第 13圖下侧的圖係顯示對第2次加工孔3 2 b進行開孔加工時 的雷射照射位置。 首先，雷射加工裝置100係對位於區塊35a上的第工 次加工孔32a進行開孔加工’且略過位於區塊35β上的第 19 321229修正版 1378840Processing Unit; Central Processing Unit), R〇M (Read Only Memory), RAM (Random Access Memory; Random Access Memory). The processing control device 103' reads the various control programs and applications stored in the R〇M based on the input from the input unit and loads them into the program storage area in the RAM to execute various processes' The various materials generated at the time of the treatment are temporarily stored in the data storage area formed in the swolth to control the laser processing apparatus. The knowledge system executed by CplJ is a program for setting the processing order of the first machining hole 32a and the second machining hole 32b, calculating the machining order of the first machining hole 32a, and calculating the machining sequence of the second machining hole 32b. The program is a program equation for calculating the amount of movement of the processing table 21 when the relative positions of the workpiece 31 and the processing table 21 are moved. Further, the mounting of the workpiece 31 on the processing table 21 and the movement of the workpiece 31 on the processing table 21 can also be performed manually. At this time, the laser processing apparatus 100 does not have the transport apparatus 1〇2. Next, the laser processing method of the laser processing apparatus 1A of the present embodiment will be described. In order to eliminate the difference in processing quality between the machined hole 32h on the suction hole 22H and the machined hole 32h located at a position other than the suction hole 22H, the portion of the laser processing apparatus 1 that does not have the suction hole 22H is not opened. The hole is machined, but the hole is processed at a position other than the suction hole 22H. In the case of the 10 321 229 modified version 1378840, the machining control device 103 skips the drilling process by not performing the drilling process on the hole system of the laser processing material corresponding to the suction hole 22H. Figure 3 is a diagram for explaining the workpiece and the processing table. In Fig. 3, an oblique view of the workpiece 31 and the processing table 21 is shown. On the processing table 21, 1 to a plurality of suction holes 22H are provided, and after the workpiece 31 is placed on the processing table 21, the workpiece 31 is fixed to the processing table 21 by the suction holes 22H. Next, the laser processing apparatus 100 performs the drilling process of the processing hole 32h in a state where the workpiece 31 is fixed on the processing table 21. Further, the workpiece 31 is formed, for example, in a rectangular shape, and the positioning marks 33 are provided at the four corners on the upper side, etc. When the laser processing apparatus 100 performs the drilling of the machining hole 32h, the positioning mark 33 is used to judge the workpiece. The correct position of 31. Specifically, the position recognition mark 33 of the workpiece 31 is image-recognized by the CCD camera provided in the laser processing apparatus 100, and the position at which the drilling processing is necessary is specified as the unique position of the laser processing apparatus 100. In other words, the data conversion unit 12 of the machining control unit φ 103 has an algorithm inherent to the laser processing apparatus 10.0 corresponding to the arrangement (rotation, expansion, etc.) of the workpiece 31. The CCD camera images the positioning marks 33 disposed at the four corners of the workpiece 31 after the workpiece 31 is fixed to the processing table 21. Thereafter, the laser beam 1 is emitted from the processing head of the laser processing apparatus 100 to perform a drilling process on a predetermined position. When the drilling of the workpiece 31 is performed, the drilling is performed in the order of the laser processing data. At this time, in order to perform the drilling processing corresponding to the rotation or the expansion and contraction of the workpiece 31, the machining control device 103 performs the correction calculation of the position of the workpiece 31 while specifying the target position of the correction of the opening of the workpiece 31. After the workpiece 31 is fixed on the processing table 21, there is a case where the processing hole 32h overlaps with the suction hole 22H. Figure 4 is a diagram for explaining the positional relationship between the machined hole and the suction hole. In Fig. 4, the situation when the workpiece 31 and the processing table 21 are viewed from above is shown. A plurality of processing holes 32h must be formed in the workpiece 31, and a plurality of suction holes 22H are formed in the processing table 21. Therefore, after the bottom surface of the workpiece 31 is fixed to the upper surface of the processing table 21, there are a machining hole 32h located in the suction hole 22H and a machining hole 32h located at a position other than the suction hole 22H. Fig. 5 is a cross-sectional view taken along line A-A of Fig. 4. The workpiece 31 has, for example, a two-layer structure in which the upper layer side is formed of, for example, a resin material, and the lower layer side is formed of, for example, copper. Further, when the laser processing apparatus 100 performs the drilling of the workpiece 31, only the processing hole 32h is formed on the upper layer side of the workpiece 31 to avoid the lower layer side of the workpiece 31. However, when the machined hole 32h to be processed is located at the upper portion of the suction hole 22H, there is a case where the lower layer side of the workpiece 31 is broken due to the heat of the laser processing. In the present embodiment, since the drilling operation is not performed in the suction hole 22H, the data conversion unit 12 calculates the target position of the machining hole 32h, and the extraction unit 16 performs the machining hole 32h unique to the laser processing apparatus 100. Whether the position is the position on the suction hole 22H and the machining hole 32h on the suction hole 22H is extracted. When the extracting portion 16 determines that the target position of the machining hole 32h is the suction hole 22H, the first machining hole setting portion 14 of the machining control device 103 does not output a command for laser irradiation to the machining hole 32h. Here, whether or not the position of the machining hole 32h is the determination of the position of the 12321229 correction plate 1378840 on the suction hole 22H, the extraction portion 16 is used as the sorption region within a predetermined range from the center of each suction hole 22H. Whether or not the upper portion of the suction region has the position of the machining hole 32h determines whether or not the position of each machining hole 32h is the position on the suction hole 22H. For example, whether the position of each machining hole 32h is the position of the suction hole 22H can be determined by the extraction portion 16 for each machining hole 32h, depending on whether or not the entire area of the machining hole 32h is located on the suction hole 22H, or The extraction portion 16 is determined for each of the machining holes 32h based on whether or not a part of the machining hole 32h is located on the suction hole 22H. Further, the extraction portion 16 ® may be provided with a larger area larger than the respective suction holes 22H by a predetermined size, and for each of the machining holes 32h, whether or not there is a machining hole according to an area larger than the suction hole 22H The position of 32h is used to determine whether the position of the machining hole 32h is the position on the suction hole 22H. Fig. 6 is a view for explaining the positional relationship between the machined hole and the suction hole in the first hole drilling process. Fig. 7 is a view for explaining the positional relationship between the machined hole and the suction hole at the time of the second opening process. In Fig. 6 and Fig. 7, a perspective view of the workpiece 31 and the processing table 21 is shown. The machining hole 32h which is set by the first machining hole setting unit 14 and performs the first hole drilling process is a process in which the machining hole 31 is not overlapped with the suction hole 22H when the workpiece 31 is placed on the machining table 21. The hole 32h, hereinafter, is referred to as a first machining hole 32a. In Fig. 6, the position of the workpiece 31 on the processing table 21 (the outer peripheral portion of the workpiece 31) when the first processing hole 32a is subjected to the drilling process is indicated by the end portion P1. Further, in Fig. 6, the position of the lower portion of the first machining hole 32a among the positions on the machining table 21 is indicated by the position 22a, and the position 13 321229 revision I378840 of the machining table 21 is indicated by the position 22b. Among them, the position of the lower portion of the second hole 32b is processed. -Under 2, (4) 2 times jade hole setting unit] 5 processing holes 32h for the second hole opening process (the machining hole 32h for which the second hole is not machined by the wire) is placed on the workpiece 31 when it is on the processing table 21: The working hole 32h overlaps with the suction hole 22H. The processing hole for the second addition of y is below, and the form is called after the processing of the second processing hole. The workpiece 31 is moved in the XY plane, whereby the relative position of the second under-machined hole 3 and the suction hole 22H is changed. In the first place, it is right! The position of the workpiece 31 on the plus == when the secondary machining hole 32a is opened, and the position of the workpiece 31 on the machining table 21 when the second machining hole 32b is subjected to the drilling process is indicated by the arrangement position p2. In the figure, the position at the lower portion of the second machining hole 32b is indicated by the position 22c. Further, the moving direction of the workpiece 2 may be only the movement in the X-axis direction, or may be only the γ-axis side. Further, the moving direction of the workpiece 31 may be an oblique direction (the X-axis direction and the x-axis direction). Fig. 8 is a view for explaining the movement processing of the machining hole in which the second machining hole is bored. In Fig. 8, the case where the workpiece 31 is viewed from above is displayed, and the figure on the left side in Fig. 8 shows the first! The position of the workpiece & when the secondary processing hole 32a is opened, and the figure in Fig. 8 shows the position of the workpiece 31 when the second processing hole is opened. After the first hole is machined, after the hole is machined (s 1), the relative position of the 加工2 321229 modified version 4 1378840 times of the machined hole 32b and the suction hole 22H is changed so that all the second processing is performed. The workpiece 32li is moved in such a manner that the hole 32b does not lie on the suction hole 22H: s2). At this time, it is also possible that the first machining hole 32a that has been processed is located on the suction hole 22H. • After the first machining hole setting unit 14 sets the first machining hole 32a, the hole machining processing of the first machining hole 32a is performed. At this time, the first machining hole setting unit 14 causes the laser machining mechanism 101A to perform the hole drilling process: only the first machining hole 32a is subjected to the drilling process, and the second lubrication hole 32b is skipped. Fig. 9 is a view for explaining the processing sequence of the first processed hole. The drawing on the left side in Fig. 9 shows the processing sequence of the first machining hole when all of the machining holes 32h are the first machining holes 32a, and the drawing on the right side in Fig. 9 shows that the machining hole 32h contains the The processing sequence of the first processing hole when the hole 32b is machined twice. When all of the processing holes 32h of the laser processing apparatus 100 for the drilling process are the first machining holes 32a, the first machining hole 32a (machining hole 32h) is sequentially machined in accordance with the original machining program. . For example, when the processing order of the first processing hole 32a is the first processing hole 32a(1), 32a(2), 32a(3), 32a(4), 32a(5), 32a(6)'32a( 7) In the order of 32a (8) and 32a (9), the laser processing apparatus 100 moves the irradiation position of the laser light 1 irradiated to each of the first processing holes 32a in this order. In the above case, for example, when the second machining hole 32b is included in the machining hole 32h, the second machining hole 32b is removed, and only the first machining hole 32a is sequentially subjected to the drilling process. For example, when the first machining hole 32a (6) 15 321229 correction plate 1378840 is the second machining hole 32b, the laser machining apparatus 100 is configured to exclude the first machining hole 32a (6). The machining hole 32a is performed once. The hole processing is performed. Specifically, since the processing of the first processing hole 32a is performed, the first processing holes 32a(1), 32a(2), 32a(3), 32a(4), 32a(5), 32a are processed first. Since the holes are formed in the order of (7), 32a (8), and 32a (9), the irradiation position _ of the laser light 1 irradiated to each of the first processed holes 32a is moved in this order. In other words, after the first processing hole 32a (5) is subjected to the drilling process, the irradiation position of the laser beam 1 is not moved to the position of the first processing hole 32a (6), but the irradiation of the laser light 1 is performed. The position is moved to the position of the first machining hole 32a (7). Next, the movement processing on the processing table 21 of the workpiece 31 will be described. Fig. 10 is a view for explaining the movement processing of the workpiece, and Fig. 11 is a view showing the movement processing sequence of the workpiece. The transport device 102 includes an arm 41 that carries the workpiece 31 onto the processing table 21 and carries the workpiece 31 out of the processing table 21. The arm 41 has a configuration in which the lower portion has a pad and the workpiece 31 can be picked up by the pad being attached to the upper surface of the workpiece 31. The arm 41 picks up the workpiece 31 after the drilling of the first machining hole 32a, and moves the workpiece 31 from the position (end portion P1) at which the workpiece 31 is placed during the drilling of the first machining hole 32a. The placement position (end portion P2) of the workpiece 31 at the time of the hole machining of the second machining hole 32b. Specifically, as shown in Fig. 11, after the drilling of the first machining hole 32a is performed, the conveying device 102 moves the arm 41 to the workpiece 31 (ST1). Thereafter, the arm 41 is lowered to cause the pad of the arm 41 to follow the upper surface of the workpiece 16321229 revision 1378840 31, whereby the arm 41 is fixed to the workpiece 31. Then, the workpiece 31 is fixed to the workpiece 31 by stopping the pressure reduction of the suction hole 22H (ST2). The conveying device 102 raises the arm 41, thereby picking up the workpiece 31* (ST3). Next, the machining control device 103 moves the machining table 21 to a predetermined coordinate based on the machined hole coordinates and the laser processed data (ST4). At this time, the laser processing apparatus 100 can move the processing table 21 or move the workpiece 31. After the relative position of the processing table 21 and the workpiece 31 is moved, the conveying device 102 lowers the arm 41 to place the workpiece 31 on the processing table 21. Alternatively, the machining control device 103 can move the processing table 21 to a predetermined predetermined distance (specified shift amount). For example, the machining control device 1 〇 3 is preliminarily set to shift the amount of movement by a few mm (X ± 〇. 〇〇〇 mm, Y ± 〇. 〇〇〇 mm) in a predetermined direction. The laser processing apparatus 100 is configured to fix the workpiece 31 to the processing table 21 by placing the workpiece 31 on the processing table 21 and then decompressing the suction hole 22H. Next, the pad of the arm 41 is released from the upper surface of the workpiece 31, whereby the fixing of the arm φ 41 to the workpiece 31 is released (ST5). Thereafter, the conveying device 102 raises the arm 41 to a predetermined height, and then the arm 41 is retracted from the workpiece 31 (ST6). After the arm 41 is retracted from the workpiece 31, the laser processing apparatus 100 irradiates the laser beam 1 to the second processing hole 32b to perform the drilling process for the secondary processing hole 32b (ST7). The laser processing apparatus 100 detects the position of the workpiece 31 by moving the CCD camera to a distance corresponding to the moving distance of the workpiece 31 when the second processing hole 32b is subjected to the drilling process, and performs the pairing based on the detection result. The hole processing of the second processing hole 32b is performed. In addition, in the present embodiment, the case where the first processing hole 32a and the second main hole 32b are set in real time processing for the machining hole 32h will be described. The first machining hole 32a* and the second machining hole 32b are set. For example, when the mounting position of the workpiece 31 placed on the processing table 21 is not deviated and the mounting position of the workpiece 31 is predicted, the laser processing apparatus 100 can also calculate the machining before placing the workpiece 31 onto the processing table 21. The position where the hole 32h and the suction hole 22H overlap. Thereby, the first machining hole 32a and the second machining hole 32b can be set even before the workpiece 31 is placed on the processing table 21. Further, the block on the processing table 21 may be divided into a plurality of blocks, and each block may be a block in which the suction hole 22H is disposed (the suction hole arrangement block 25B to be described later) or not configured to be sucked. A block of the hole 22H (non-arranged block 25A to be described later). At this time, first, the machining hole 32h is bored in the non-arrangement block 25A, and then the machining hole 32h located on the suction hole arrangement block 25B is moved to the non-arrangement block 25A to perform the drilling process. φ Figure 12 is a diagram for illustrating the sorption block and the non-sorption block on the processing table. In Fig. 12, a perspective view of the processing table 21X and the workpiece 31 is shown. The block on the processing table 21X is divided into, for example, a straight strip parallel to the X-axis direction or a strip shape parallel to the Y-axis direction. In Fig. 12, the case where the block on the processing table 21 is divided into straight strips parallel to the z-axis direction is shown. Among the blocks on the processing table 21 that is divided into straight strips, the suction holes 22 are disposed in the suction hole arranging block 25, and the suction holes 22 are not disposed in the non-arranged block 25. Further, the 18321229 correction plate 1378840 formed in the suction hole arranging block 25 is not limited to the case where the suction hole 22H is arranged in one line, and may be any configuration (for example, two rows). In Fig. 12, the case where the suction hole arranging block 25B and the non-arrangement block 25A are continuously arranged in the X-axis direction at intervals of the width L1 are shown. The extracting portion 16 divides the block on the workpiece 31 into a straight strip shape parallel to the γ-axis direction in advance. At this time, the extracting portion 16 divides the & block on the workpiece 31 into a straight strip according to the arrangement of the suction hole arranging block 25 Β and the non-arranging block 25 χ on the processing table 21 . Specifically, the extracting portion 16 divides the block on the workpiece 31 such that the boundary line between the suction hole arranging block 25B and the non-arranged block 25A becomes a straight boundary on the workpiece 31. Further, the extracting unit 16 sets the block of the workpiece 31 on the non-arranged block 25A to the block 35A for the j-th processing hole 32a, and sets the block of the workpiece 31 on the suction hole arranging block 25B to The block 35B for the hole 32b is processed for the second time. As a result, the block 35A and the block 35B are continuously arranged in the z-axis direction φ at intervals of the width L] in the same manner as the arrangement of the suction hole arranging block 25B and the non-arranged block 25A. Fig. 13 is a view for explaining the drilling process using the processing table shown in Fig. 12. Fig. 13 is a cross-sectional view showing a state in which the processing table 21A and the workpiece 31 are cut in the x-axis direction. The figure on the upper side of Fig. 13 shows the laser irradiation position when the first processing hole 32a is opened, and the lower side of Fig. 13 shows the hole processing of the second processing hole 3 2 b. The location of the laser irradiation. First, the laser processing apparatus 100 performs the drilling process for the second processing hole 32a located on the block 35a and skips the 19321229 revision 1378840 located on the block 35β.
.2次加工孔32b的開孔加工。接著，在位於區塊35A上的 第1次加工孔32a的開孔加工結束後，使區塊35B(區塊35B 上的第2次加工孔32b)移動至非配置區塊25A上而對區塊 . 35B上的第2次加工孔32b進行開孔加工。當使區塊35B 移動時，係藉由使區塊35B朝X軸方向移動達至吸著孔配 置區塊25B的寬度L1而使區塊35B移動到非配置區塊35A 上。藉此，便能夠效率佳地使區塊35B移動。當為第12 圖的情形時，藉由將加工台21X朝+ X方向挪移達至L1， ® 便能夠以第2次的開孔加工對所有的第2次加工孔32b進 行開孔加工。 在如上述將工件31上的區塊分割成區塊35A和區塊 35B來進行第1次加工孔32a和第2次加工孔32b的開孔 加工的情形中，使用第1次加工孔32a用的雷射加工資料 和第2次加工孔32b用的雷射加工資料而進行開孔加工。 另外，雖然在第12圖中將加工台21X和工件31表示 φ 為相同的尺寸，但工件31可為任何尺寸。此外，雖然在第 12圖中係針對將加工台21X分割成直條狀的情形進行說 明，但亦可將加工台21X分割成格子狀並以吸著孔配置區 塊25B和非配置區塊25A相鄰的方式將吸著孔配置區塊 25B和非配置區塊25A配置成格紋狀。 此外，雖然在第13圖中係針對在對區塊35A内的第1 次加工孔32a進行開孔加工後將加工台21挪移達至L1的 距離而對區塊35B内的第2次加工孔32b進行開孔加工的 情形進行說明，但加工台21的移動距離並不限於L1。雷 20 321229修正版 1378840 射加工裝置100係只要使加工台21移動達至能夠以第1 次的開孔加工和第2次的開孔加工對第1次加工孔32a和 第2次加工孔32b的所有加工孔32h進行開孔加工之距離 • 即可。 - 此外，雖然在本實施形態中係針對抽出部16將工件 31上的區塊分割成區塊35A和區塊35B的情形進行說明， 但亦可由第1次加工孔設定部14與第2次加工孔設定部 15將工件31上的區塊分割成區塊35A和區塊35B。2. The hole processing of the machining hole 32b is performed twice. Next, after the hole processing of the first machining hole 32a located in the block 35A is completed, the block 35B (the second machining hole 32b on the block 35B) is moved to the non-arrangement block 25A to be the opposite zone. The second processing hole 32b on the block 35B is subjected to the drilling process. When the block 35B is moved, the block 35B is moved to the non-arranged block 35A by moving the block 35B in the X-axis direction up to the width L1 of the suction hole arranging block 25B. Thereby, the block 35B can be moved efficiently. In the case of Fig. 12, by moving the processing table 21X in the +X direction up to L1, all of the second machining holes 32b can be opened by the second opening process. In the case where the block on the workpiece 31 is divided into the block 35A and the block 35B to perform the drilling process of the first processed hole 32a and the second processed hole 32b as described above, the first processed hole 32a is used. The laser processing data and the laser processing data for the second processing hole 32b are used for the opening processing. Further, although the processing table 21X and the workpiece 31 indicate that φ is the same size in Fig. 12, the workpiece 31 may be of any size. In addition, in the case of FIG. 12, the case where the processing table 21X is divided into straight strips is described, but the processing table 21X may be divided into a lattice shape, and the block 25B and the non-arranged block 25A may be arranged by the suction holes. The adjacent hole arranging block 25B and the non-arranging block 25A are arranged in a lattice pattern in an adjacent manner. Further, in Fig. 13, the second processing hole in the block 35B is moved to the distance L1 after the opening of the first machining hole 32a in the block 35A, and the machining hole 21 is moved to the distance L1. The case where the opening process is performed in 32b will be described, but the moving distance of the processing table 21 is not limited to L1. Ray 20 321229 Revision 1378840 The machining apparatus 100 is configured to move the processing table 21 up to the first machining hole 32a and the second machining hole 32b by the first drilling process and the second drilling process. The distance of all the processing holes 32h for the hole processing is enough. Further, in the present embodiment, the case where the partitioning unit 16 divides the block on the workpiece 31 into the block 35A and the block 35B will be described. However, the first processed hole setting unit 14 and the second time may be used. The machined hole setting portion 15 divides the block on the workpiece 31 into a block 35A and a block 35B.
® 此外，雖然在第12圖中係針對吸著孔配置區塊25B 和非配置區塊25A的寬度為相同的L1之情形進行說明，但 吸著孔配置區塊25B和非配置區塊25A的寬度亦可為相異 的寬度。例如，藉由將吸著孔配置區塊25B的寬度設計為 比非配置區塊25A的寬度還窄，便能夠效率佳地進行開孔 力σ工0 此外，吸著孔配置區塊25Β與非配置區塊25Α的寬度 φ L1可為任意尺寸。例如，將吸著孔配置區塊25Β與非配置 區塊25Α的寬度L1設計為與電鏡掃描Is 3a、3b的掃描區 塊的X軸方向的寬度相同的尺寸。藉此，工作台21的移動 次數變少，而能夠效率佳地進行開孔加工。此外，亦可將 掃描區塊的X軸方向的寬度設計為與吸著孔配置區塊25B 與非配置區塊25A的寬度L1相應的尺寸。此時工作台21 的移動次數變少，而能夠效率佳地進行開孔加工。 雖然在第12圖中係針對於加工台21X設置吸著孔配 置區塊25B和非配置區塊25A的情形進行說明，但亦可將 21 321229修正版 1378840 與吸著孔配置區塊25B和非配置區塊25A對應的預定治具 (後述的吸著區塊限定治具40)安裝在以第3圖所說明的加 工台21 〇 。 第14圖係顯示吸著區塊限定治具的構成之圖。在第 14圖中係顯示吸著區塊限定治具40的斜視圖。吸著區塊 限定治具40係為具有與加工台21的主面大致相同大小的 主面且散熱性佳的板（銅板等），且形成為大致平板狀。吸 著區塊限定治具4 0係僅在與吸著孔配置區塊2 5 B對應的吸 ® 著孔配置區塊45B之與吸著孔22H相同的位置設置吸著孔 41h，而在與非配置區塊25A對應的非配置區塊45A則未設 置吸著孔41h。該吸著區塊限定治具40係藉由載置至加工 台21上以被吸著固定在工作台21上。接著，藉由載置工 件31到吸著區塊限定治具40上，工件31係由吸著區塊限 定治具40吸著固定。非配置區塊45A係為與設定有非配置 區塊25A的區塊相同的區塊，於非配置區塊45A的下部並 鲁未配置吸著孔41h。此外，吸著孔配置區塊45B係為與設 定有吸著孔配置區塊25B的區塊相同的區塊，於吸著孔配 置區塊45B的下部係配置有吸著孔41h。 第15圖係用以說明使用第14圖所示的吸著區塊限定 治具來進行的開孔加工之圖。首先，雷射加工裝置1〇〇係 對位於非配置區塊45A上的區塊35A的第1次加工孔32a 進行開孔加工，且略過位於吸著孔配置區塊45B上的區塊 35B上的第2次加工孔32b的開孔加工。 雷射加工裝置100係在位於非配置區塊45A上的第1 22 321229修正版 1378840 次加工孔32a的開孔加工結束後，使區塊35B移動至非配 ψIn addition, although the case where the width of the suction hole arrangement block 25B and the non-configuration block 25A is the same L1 is explained in Fig. 12, the suction hole arrangement block 25B and the non-configuration block 25A are described. The width can also be a different width. For example, by designing the width of the suction hole arranging block 25B to be narrower than the width of the non-arranged block 25A, it is possible to efficiently perform the opening force σ 0. In addition, the absorbing hole arranging block 25 is Β The width φ L1 of the configuration block 25Α can be any size. For example, the width L1 of the suction hole arranging block 25 Β and the non-arrangement block 25 设计 is designed to be the same size as the width of the scanning block of the electron microscope scanning Is 3a, 3b in the X-axis direction. Thereby, the number of movements of the table 21 is reduced, and the drilling process can be performed efficiently. Further, the width of the scanning block in the X-axis direction may be designed to correspond to the width L1 of the suction hole arrangement block 25B and the non-configuration block 25A. At this time, the number of movements of the table 21 is reduced, and the drilling process can be performed efficiently. Although the case where the suction hole arranging block 25B and the non-arranged block 25A are provided in the processing table 21X is explained in Fig. 12, the 21321229 revision 1378840 and the suction hole arranging block 25B may be used. The predetermined jig (the absorbing block defining jig 40 to be described later) corresponding to the arranging block 25A is attached to the processing table 21 说明 described in FIG. Fig. 14 is a view showing the constitution of the occlusion block defining jig. In Fig. 14, a perspective view of the sorption block defining jig 40 is shown. The absorbing block 40 is a plate (such as a copper plate) having a main surface having substantially the same size as the main surface of the processing table 21 and having excellent heat dissipation properties, and is formed in a substantially flat shape. The absorbing block defining jig 40 is provided with the absorbing hole 41h only at the same position as the absorbing hole 22H of the suction hole arranging block 45B corresponding to the absorbing hole arranging block 2 5 B, and The non-arranged block 45A corresponding to the non-arranged block 25A is not provided with the suction hole 41h. The absorbing block defining jig 40 is attached to the processing table 21 to be affixed and fixed to the table 21. Next, by placing the workpiece 31 to the absorbing block to define the jig 40, the workpiece 31 is slidably fixed by the absorbing block defining jig 40. The non-arranged block 45A is the same block as the block in which the non-arranged block 25A is set, and the suction hole 41h is not disposed in the lower portion of the non-arranged block 45A. Further, the suction hole arranging block 45B is the same block as the block in which the absorbing hole arranging block 25B is provided, and the absorbing hole 41h is disposed in the lower portion of the absorbing hole arranging block 45B. Fig. 15 is a view for explaining the drilling process using the absorbing block defining jig shown in Fig. 14. First, the laser processing apparatus 1 performs the hole processing on the first processing hole 32a of the block 35A located on the non-arrangement block 45A, and skips the block 35B located on the suction hole arrangement block 45B. The opening of the second processing hole 32b is performed. The laser processing apparatus 100 moves the block 35B to the non-matching after the opening processing of the 1 22 321229 revision 1378840 secondary processing hole 32a on the non-arranged block 45A is completed.
置區塊45A上而對區塊35B上的第2次加工孔32b進行開 孔加工。當使區塊35B移動時，係藉由使區塊35B朝X轴 方向移動達至吸著孔配置區塊45B的寬度L1而使區塊35B • 移到到非配置區塊45A上。藉此，便能夠效率佳地使區塊 35B移動。當為第14圖的情形時，藉由將加工台21X朝+X 方向挪移達至L1，便能夠以第2次的開孔加工對所有的第 2次加工孔32b進行開孔加工。 • 另外，吸著區塊限定治具40並不限於第14圖所示的 構成，亦可為其他構成。例如，亦可為以在將吸著區塊限 定治具40載置到加工台21上時在所有的吸著孔22H上使 吸著孔41h重疊的方式，在吸著區塊限定具40的整面設置 孔徑比吸著孔22H還小的吸著孔41h。 另外，使用以第12圖與第14圖所說明的加工台21X 與吸著區塊限定治具40來進行工件31的開孔加工時所用 φ 的吸著孔22H的位置與尺寸及吸著孔41h的位置與尺寸亦 可由作業者（加工作業員）輸入至雷射加工裝置100,亦可 預先登錄至雷射加工裝置100。 雖然針對抽出部16抽出要開在工件31的加工孔32h 之中位於吸著孔22H上的加工孔32h之情形進行說明，但 亦可由作業者抽出位於吸著孔22H上的加工孔32h。例如， 在使用以第12圖所說明的加工台21X或以第14圖所說明 的吸著區塊限定治具40的情形中，只要知道工件31的載 置位置便可得知哪個加工孔32h位於吸著孔22H上。是以， 23 321229修正版 1378840 作業者只要根據非位於吸著孔22H上的加工孔32h的位置 來製作對第1次加工孔32a進行加工時使用的第1次加工 程式和對第2次加工孔32b進行加工時使用的第2次加工 程式即可。作業者係利用第1次加工程式而加工第1次加 - 工孔32a，之後，使工件31移動，利用第2次加工程式而 加工第2次加工孔32b。藉此，即使不具有抽出部106，雷 射加工機構101A仍然能夠在吸著孔22H上以外的位置對工 件31上的所有加工孔32h進行開孔加工。 ® 另外，第1次加工程式與第2次加工程式亦可由加工 控制裝置103以外的裝置來製作。此時，雷射加工裝置係 將由其他裝置製作的第1次加工程式與第2次加工程式從 輸入部11予以外部輸入，利用所輸入的第1次加工程式與 第2次加工程式來進行工件31的開孔加工。 另外，雖然在本實施形態中係針對雷射加工機構101A 使用1束雷射光1來對工件31進行開孔加工的情形進行說 φ 明，但亦可將本實施形態的雷射加工方法應用於可使用複 數束雷射光1加工工件31的雷射加工機構。 第16圖係顯示將雷射光予以多軸化的雷射加工機構 的構成例之圖。雷射加工機構101B係構成為具備分光器8 及2組雷射頭9a、9b。雷射頭9a、9b係分別具有掃描電 鏡2a、2b、電鏡掃描器3a、3b、及ίθ透鏡4。雷射振盪 器所輸出的雷射光1係由分光器8所分光，被分洗的雷射 光1係同時供給至雷射頭9a、9b。接著.，照射自雷射頭9a、 9b的雷射光1係同時對各自的工件31進行開孔加工。另 24 321229修正版 1378840 外，雖然在第16圖中係針對具有2組雷射頭的雷射加工機 構101B進行說明，但雷射加工機構101B亦可具有4組以 上的雷射頭。 例如，在使用具有2組雷射頭的雷射加工機構101B 來進行2個工件的開孔加工之情形中，會出現一方的工件 31的位於吸著孔22H上的加工孔32h和另一方的工件31 的位於吸著孔22H上的加工孔32h因為工件31的載置位置 而相異的情形。換言之，會有即便是相同的加工孔32h， ® 在一方的工件31係位於吸著孔22H上，在另一方的工件 31卻不是位於吸著孔22H上的情形。是故，雷射加工機構 101B係在雷射頭9a側和雷射頭9b側分別抽出位於吸著孔 22H上的加工孔32h。 當位於吸著孔22H上的加工孔32h在雷射頭9a側和 雷射頭9b側為相異時，雷射加工機構101B係無法在雷射 頭9a側和雷射頭9b側進行相同的動作。是故，當在一方 φ 的工件31是於吸著孔22H上以外的位置具有加工孔32h 且在另一方的工件31是於吸著孔22H上的位置具有加工孔 32h時，不將雷射光1照射另一方的工件31。在不使雷射 光1照射另一方的工件31的加工孔32的情形中（略過加 工），例如在雷射頭9a、9b設置用以遮斷雷射光1且開閉 自如的遮光器（shutter)(未圖示）等，藉由關閉該遮光器來 遮斷雷射光1。此外，當任一方的工件31的加工孔32h(任 一軸）為略過對象時，亦可為將對兩方的工件31之雷射光 照予以略過，藉此略過左右兩方的開孔加工。 25 321229修正版 1378840 另外，雖然在第16圖中係針對雷射加工機構101B以 分光器8將雷射光1予以分光並將分光後的雷射光1同時 供給至雷射頭9a、9b的情形進行說明，但供給至雷射頭 9a、9b的雷射光1並不需要同時供給。雷射加工機構101B - 亦可例如將雷射光1交替地分配至雷射頭9a、9b。具體而 言係將雷射光1依時間分配給雷射頭9a、9b，藉此使雷射 光1依序分歧成2條光路。於是藉由雷射頭9a和雷射頭 9b交替地將雷射光照射至一方的加工台21(左側的工件31) •和另一方的加工台21(右側的工件31)。 然而，當第2次的開孔加工之時的加工台21和工件 31的相對位置不適當時，第2次的開孔加工之時也是不進 行對第2次加工孔32b之雷射光照射。是故，雷射加工裝 置100亦可具備在最後將是否已完成對所有與雷射加工資 料對應的加工孔32h進行開孔加工的資訊通知予作業者之 功能（例如液晶監視器等顯示手段）。另外，當雷射加工裝 擊置100未能夠藉由第1次及第2次的開孔加工完成所有的 開孔加工時，雷射加工裝置100亦可進行第3次或更多次 的開孔加工。例如，雷射加工裝置100係在第3次的開孔 加工時以使在第1次及第2次的開孔加工的兩者時皆位於 吸著孔22H上的加工孔32h不會位於吸著孔22H上的方式 移動工件31。 依據上述實施形態，在進行第1次的開孔加工時，不 對位於吸著孔22H上的第2次加工孔32b進行加工，而僅 進行第1次加工孔32a的開孔加工，因此能夠以短時間於 26 321229修正版 1378840 工件31予以開孔加工相同加工品質的加工孔。此外，在進 行第1次的開孔加工時，不對位於吸著孔22H上的第2次 加工孔32b進行加工，而在第1次加工孔32a的開孔加工 . 結束後，挪移加工台21和工件31的相對位置，因此，能 夠使位於吸著孔22H上的第2次加工孔32b移動到不會與 吸著孔22H重疊的位置。是以，能夠挪移位於吸著孔22H 上的第2次加工孔32b的位置而進行對加工孔32h的開孔 加工，因此以短時間於工件31予以開孔加工相同加工品質 ®的加工孔。 此外，由於藉由搬送裝置102來使工件31的位置移 動，因此能夠容易地進行工件31的移動。此外，加工台 21具有吸著孔配置區塊25B和非配置區塊25A，並且在工 件31上的區塊設定有第1次加工孔32a用的區塊35A和第 2次加工孔32a用的區塊35B，因此能夠容易地進行效率佳 的開孔加工。此外，由於吸著區塊限定治具40上係具有吸 鲁著孔配置區塊45B及非配置區塊45A，且於工件31上的區 塊設定第1次加工孔32a用的區塊35A和第2次加工孔32b 用的區塊35B，因此能夠容易地進行效率佳的開孔加工。 此外，·由於將吸著孔配置區塊25B與非配置區塊25A的寬 度L1設計為與電鏡掃描Is 3a、3b的掃描區塊7的X轴方 向的寬度相同尺寸，因此，加工台21的移動次數變少，能 夠效率佳地進行開孔加工。 (產業上的可利用性） 如上所述，本發明的雷射加工裝置、雷射加工方法、 27 321229修正版 1378840 •加卫控制裝置及加工控制方法能夠—邊吸著以工件一邊 進行雷射加工。 【圖式簡單說明】 帛1圖係顯示實施形態的雷射加工裝置的—部分之圖。 帛2圖係顯示實施形㈣f射加工裝置的構成之方塊 圖。 第3圖係用以說明工件與加工台之圖。 •，第4圖係用以說明加工孔和吸著孔的位置關係之圖。 第5圖係第4圖的Α-Α剖面圖。 —第6圖係用以說明進行第1次開孔加工時的加工孔和 吸者孔的位置關係之圖。 —第7圖係用以說明進行第2次開孔加工時的加工孔和 吸者孔的位置關係之圖。 第8圖係用以說明第2次加工孔的開孔加工之前進行 的工件的移動處理之圖。 • 帛9圖係用以說明第1次加工孔的加工處理順序之圖。 第10圖係用以說明工件的移動處理之圖。 第11圖係顯示工件的移動處理順序之圖。 第12圖係用以說明加工台上的吸著區塊和非吸著區 塊之圖。 第〗3圖係用以說明使用苐12圖所示的加工台來進行 的開孔加工之圖。 第14圖係顯示吸著區塊限定治具的構成之圖。 第15圖係用以說明使用第14圖所示的吸著區塊限定 321229修正版 28 1378840 治具來進行的開孔加工之圖。 第16圖係顯示將雷射光予以多轴化的雷射加工機構 的構成例之圖。 【主要元件符號說明】 1 雷射光 2a ' 2b 掃描電鏡 3a、3b 電鏡掃描器 4 f 0透鏡 7 掃描區塊 8 分光器 9a、9b 雷射頭 11 輸入部 12 資料轉換部 13 吸著孔座標記憶部 14 第1次加工孔設定部 15 第2次加工孔設定部 16 抽出部 19 控制部 21 ' 21X 加工台 22H 、41h 吸著孔 25A 、 45A 非配置區塊 25B 、45B 吸著孔配置區塊 31 工件 φ 32a、32(a)至32(9) 第1次加工孔 32b 第2次加工孔 32h 加工孔 33 定位記號 35A、 35B 區塊 40 吸著區塊限定治具 41 臂 100 雷射加工裝置 101A、 101B 雷射加工機構 102 搬送裝置 103 加工控制裝置 L1 吸著孔配置區塊和非配置區塊的間隔寬度 PI、P2 端部 29 321229修正版The second processing hole 32b on the block 35B is opened in the block 45A. When the block 35B is moved, the block 35B is moved to the non-configured block 45A by moving the block 35B in the X-axis direction up to the width L1 of the suction hole arranging block 45B. Thereby, the block 35B can be moved efficiently. In the case of Fig. 14, by moving the processing table 21X in the +X direction up to L1, all of the second machining holes 32b can be opened by the second drilling process. Further, the absorbing block defining jig 40 is not limited to the configuration shown in Fig. 14, and may have other configurations. For example, in the case where the suction block defining fixture 40 is placed on the processing table 21, the suction holes 41h may be overlapped on all of the suction holes 22H, and the suction block defining device 40 may be used. A suction hole 41h having a smaller aperture than the suction hole 22H is provided over the entire surface. Further, the position and size of the suction hole 22H and the suction hole of φ used for the drilling of the workpiece 31 using the processing table 21X and the absorbing block defining jig 40 described in Figs. 12 and 14 are used. The position and size of 41h may be input to the laser processing apparatus 100 by an operator (processing operator), or may be registered in advance to the laser processing apparatus 100. Although the case where the machining unit 32h which is to be opened in the suction hole 22H among the machining holes 32h of the workpiece 31 is extracted in the extraction portion 16, the operator can extract the machining hole 32h located in the suction hole 22H. For example, in the case where the jig 40 is defined using the processing table 21X illustrated in Fig. 12 or the absorbing block illustrated in Fig. 14, it is known which machining hole 32h is known by knowing the placement position of the workpiece 31. Located on the suction hole 22H. Therefore, the operator can make the first processing program and the second processing used for processing the first machining hole 32a based on the position of the machining hole 32h not located in the suction hole 22H. The second processing program used for processing the hole 32b may be used. The operator processes the first machining hole 32a by the first machining program, and then moves the workpiece 31 to process the second machining hole 32b by the second machining program. Thereby, even if the extracting portion 106 is not provided, the laser processing mechanism 101A can perform the drilling processing on all the processing holes 32h on the workpiece 31 at positions other than the suction holes 22H. ® The first machining program and the second machining program can also be produced by devices other than the machining control device 103. At this time, the laser processing apparatus externally inputs the first processing program and the second processing program created by another device from the input unit 11, and performs the workpiece using the input first machining program and second machining program. 31 hole processing. Further, in the present embodiment, the laser processing unit 101A uses one laser beam 1 to perform the drilling process on the workpiece 31. However, the laser processing method of the present embodiment can be applied to the laser processing method. A laser processing mechanism that processes the workpiece 31 using a plurality of beams of laser light 1 can be used. Fig. 16 is a view showing a configuration example of a laser processing mechanism for multi-axisizing laser light. The laser processing mechanism 101B is configured to include a spectroscope 8 and two sets of laser heads 9a and 9b. The laser heads 9a, 9b have scanning mirrors 2a, 2b, electron microscope scanners 3a, 3b, and ίθ lenses 4, respectively. The laser light 1 output from the laser oscillator is split by the spectroscope 8, and the laser light 1 to be washed is simultaneously supplied to the laser heads 9a and 9b. Next, the laser light 1 irradiated from the laser heads 9a and 9b simultaneously performs drilling processing on the respective workpieces 31. Further, in addition to the 24,321,229 revision 1378840, although the laser processing mechanism 101B having two sets of laser heads is described in Fig. 16, the laser processing mechanism 101B may have more than four sets of laser heads. For example, in the case of performing the drilling process of two workpieces using the laser processing mechanism 101B having two sets of laser heads, the machining hole 32h of the one workpiece 31 located on the suction hole 22H and the other side may occur. The machining hole 32h of the workpiece 31 located on the suction hole 22H differs depending on the placement position of the workpiece 31. In other words, even if the same machining hole 32h is used, the one workpiece 31 is located on the suction hole 22H, and the other workpiece 31 is not located on the suction hole 22H. Therefore, the laser processing mechanism 101B draws the processing holes 32h on the suction holes 22H on the side of the laser head 9a and the side of the laser head 9b, respectively. When the processed hole 32h located on the suction hole 22H is different from the side of the laser head 9a and the side of the laser head 9b, the laser processing mechanism 101B cannot perform the same on the side of the laser head 9a and the side of the laser head 9b. action. Therefore, when the workpiece 31 of one φ has the machining hole 32h at a position other than the suction hole 22H and the other workpiece 31 has the machining hole 32h at the position on the suction hole 22H, the laser light is not irradiated. 1 illuminates the other workpiece 31. In the case where the laser light 1 is not irradiated to the processing hole 32 of the other workpiece 31 (slight processing), for example, a shutter for blocking the laser light 1 and opening and closing is provided in the laser heads 9a, 9b. (not shown) or the like, the laser light 1 is blocked by turning off the shutter. In addition, when the processing hole 32h (either axis) of the workpiece 31 of any one of the workpieces is skipped, the laser light of the workpieces 31 on both sides may be skipped, thereby bypassing the left and right openings. machining. 25 321229 Revision 1378840 Further, in the case of the laser processing mechanism 101B, the laser beam 1 is split by the spectroscope 8 and the laser light 1 after the splitting is simultaneously supplied to the laser heads 9a and 9b. Note that the laser light 1 supplied to the laser heads 9a, 9b does not need to be supplied at the same time. Laser processing mechanism 101B - Laser light 1 can also be alternately distributed to the laser heads 9a, 9b, for example. Specifically, the laser light 1 is distributed to the laser heads 9a, 9b in time, whereby the laser light 1 is sequentially divided into two optical paths. Then, the laser beam is alternately irradiated to the one processing table 21 (the workpiece 31 on the left side) and the other processing table 21 (the workpiece 31 on the right side) by the laser head 9a and the laser head 9b. However, when the relative position of the processing table 21 and the workpiece 31 at the time of the second opening processing is not appropriate, the laser light for the second processing hole 32b is not irradiated at the time of the second opening processing. Therefore, the laser processing apparatus 100 may be provided with a function of notifying the operator of whether or not the processing of the processing holes 32h corresponding to the laser processing materials has been completed (for example, a display means such as a liquid crystal monitor). . In addition, when the laser processing apparatus 100 is not capable of performing all the opening processing by the first and second opening processing, the laser processing apparatus 100 can also perform the third or more opening. Hole processing. For example, in the third processing operation of the laser processing apparatus 100, the processing hole 32h which is located on the suction hole 22H during both the first and second opening processing is not located in the suction processing. The workpiece 31 is moved in such a manner as to be on the hole 22H. According to the above-described embodiment, the first machining hole 32b located in the suction hole 22H is not processed during the first hole drilling process, and only the hole machining of the first machining hole 32a is performed. Short time at 26 321229 Revision 1378840 Workpiece 31 is machined to machine holes of the same machining quality. Further, when the first hole drilling process is performed, the second machining hole 32b located in the suction hole 22H is not processed, and after the hole machining of the first machining hole 32a is completed, the machining table 21 is moved. Since the relative position to the workpiece 31 is made, the second machining hole 32b located on the suction hole 22H can be moved to a position where it does not overlap the suction hole 22H. Therefore, since the hole of the machining hole 32h can be moved by moving the position of the second machining hole 32b located in the suction hole 22H, the machining hole of the same machining quality ® is machined in the workpiece 31 for a short time. Further, since the position of the workpiece 31 is moved by the conveying device 102, the movement of the workpiece 31 can be easily performed. Further, the processing table 21 has the suction hole arranging block 25B and the non-arranged block 25A, and the block on the workpiece 31 is provided with the block 35A for the first processing hole 32a and the second processing hole 32a. Since the block 35B is used, it is possible to easily perform the hole drilling process with high efficiency. Further, since the absorbing block defining jig 40 has the absorbing hole arrangement block 45B and the non-arrangement block 45A, and the block on the workpiece 31 sets the block 35A for the first processing hole 32a and Since the block 35B for the hole 32b is processed for the second time, it is possible to easily perform the hole drilling process with high efficiency. Further, since the width L1 of the suction hole arrangement block 25B and the non-arrangement block 25A is designed to be the same size as the width of the scanning block 7 of the electron microscope scans Is 3a, 3b in the X-axis direction, the processing table 21 is The number of movements is reduced, and the drilling process can be performed efficiently. (Industrial Applicability) As described above, the laser processing apparatus and the laser processing method of the present invention, 27321229 Rev. 1378840 • The garying control device and the machining control method can perform the laser while sucking the workpiece machining. BRIEF DESCRIPTION OF THE DRAWINGS The 帛1 diagram shows a part of a laser processing apparatus of an embodiment. The 帛2 diagram shows a block diagram of the configuration of the (4) f-ray processing apparatus. Figure 3 is a diagram for explaining the workpiece and the processing table. • Figure 4 is a diagram for explaining the positional relationship between the machined hole and the suction hole. Figure 5 is a cross-sectional view of the Α-Α in Fig. 4. - Fig. 6 is a view for explaining the positional relationship between the machined hole and the sucker hole at the time of the first hole drilling. - Fig. 7 is a view for explaining the positional relationship between the machined hole and the sucker hole in the second hole drilling process. Fig. 8 is a view for explaining the movement processing of the workpiece before the drilling of the second machining hole. • The 帛9 drawing is a diagram for explaining the processing sequence of the first machining hole. Figure 10 is a diagram for explaining the movement processing of the workpiece. Figure 11 is a diagram showing the sequence of movement processing of the workpiece. Figure 12 is a diagram for explaining the sorption block and the non-sorption block on the processing table. Fig. 3 is a view for explaining the drilling process using the processing table shown in Fig. 12. Fig. 14 is a view showing the constitution of the occlusion block defining jig. Fig. 15 is a view for explaining the drilling process using the visor block defining 321229 revision 28 1378840 jig shown in Fig. 14. Fig. 16 is a view showing a configuration example of a laser processing mechanism for multi-axisizing laser light. [Description of main component symbols] 1 Laser light 2a ' 2b Scanning electron microscope 3a, 3b Electron microscopy scanner 4 f 0 Lens 7 Scanning block 8 Beam splitter 9a, 9b Laser head 11 Input section 12 Data conversion section 13 Suction hole coordinate memory Part 14 First processing hole setting unit 15 Second processing hole setting unit 16 Extraction unit 19 Control unit 21 ' 21X Processing table 22H, 41h Suction hole 25A, 45A Non-arrangement block 25B, 45B Suction hole arrangement block 31 Workpiece φ 32a, 32(a) to 32(9) 1st machining hole 32b 2nd machining hole 32h machining hole 33 positioning mark 35A, 35B block 40 sorption block limited fixture 41 arm 100 laser processing Apparatus 101A, 101B Laser processing mechanism 102 Transfer apparatus 103 Processing control apparatus L1 Space width of the suction hole arrangement block and non-configuration block PI, P2 End part 29 321229 revision