TWI316069B - Polymer synthesized from silsesquioxane derivative - Google Patents

Polymer synthesized from silsesquioxane derivative

Info

Publication number
TWI316069B
TWI316069B TW093105814A TW93105814A TWI316069B TW I316069 B TWI316069 B TW I316069B TW 093105814 A TW093105814 A TW 093105814A TW 93105814 A TW93105814 A TW 93105814A TW I316069 B TWI316069 B TW I316069B
Authority
TW
Taiwan
Prior art keywords
polymer synthesized
silsesquioxane derivative
silsesquioxane
derivative
synthesized
Prior art date
Application number
TW093105814A
Other languages
English (en)
Other versions
TW200424237A (en
Inventor
Nobumasa Ootake
Masami Tanaka
Original Assignee
Chisso Petrochemical Corp
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Petrochemical Corp, Chisso Corp filed Critical Chisso Petrochemical Corp
Publication of TW200424237A publication Critical patent/TW200424237A/zh
Application granted granted Critical
Publication of TWI316069B publication Critical patent/TWI316069B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/20—Manufacture of shaped structures of ion-exchange resins
    • C08J5/22—Films, membranes or diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW093105814A 2003-03-11 2004-03-05 Polymer synthesized from silsesquioxane derivative TWI316069B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003065435A JP4479160B2 (ja) 2003-03-11 2003-03-11 シルセスキオキサン誘導体を用いて得られる重合体

Publications (2)

Publication Number Publication Date
TW200424237A TW200424237A (en) 2004-11-16
TWI316069B true TWI316069B (en) 2009-10-21

Family

ID=32984495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105814A TWI316069B (en) 2003-03-11 2004-03-05 Polymer synthesized from silsesquioxane derivative

Country Status (5)

Country Link
US (1) US7423107B2 (zh)
JP (2) JP4479160B2 (zh)
KR (1) KR101067283B1 (zh)
TW (1) TWI316069B (zh)
WO (1) WO2004081085A1 (zh)

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JP4581472B2 (ja) * 2003-06-30 2010-11-17 チッソ株式会社 有機ケイ素化合物とその製造方法、およびポリシロキサンとその製造方法
JP4742216B2 (ja) * 2004-07-08 2011-08-10 Ｊｎｃ株式会社 ケイ素化合物
KR101248532B1 (ko) * 2005-02-28 2013-04-02 제이엔씨 주식회사 액정 배향막 형성용 니스 및 그것을 사용한 액정 표시소자
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JP4682644B2 (ja) * 2005-02-28 2011-05-11 チッソ株式会社 シリコーン樹脂成型体用ワニス及びシリコーン樹脂成型体
JP5082258B2 (ja) * 2005-02-28 2012-11-28 Ｊｎｃ株式会社 カゴ型ケイ素骨格を有する有機ケイ素化合物及び高分子化合物
JP2006268037A (ja) * 2005-02-28 2006-10-05 Chisso Corp シルセスキオキサン誘導体からなる重合体を素材とする光導波路
US7373060B2 (en) * 2005-02-28 2008-05-13 Chisso Corporation Optical waveguide using polymer composed of silsesquioxane derivative
JP2006233155A (ja) * 2005-02-28 2006-09-07 Chisso Corp 平坦化膜用塗布液および平坦化膜
JP4497014B2 (ja) * 2005-04-01 2010-07-07 セイコーエプソン株式会社 偏光分離素子の製造方法
JP2006319114A (ja) * 2005-05-12 2006-11-24 Asahi Kasei Corp Ｔｆｔ層間絶縁膜
JP4602842B2 (ja) * 2005-06-07 2010-12-22 東京応化工業株式会社 反射防止膜形成用組成物、それを用いた反射防止膜
JP4826160B2 (ja) * 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
US20080039608A1 (en) * 2006-08-11 2008-02-14 General Electric Company Oxetane composition, associated method and article
JP2008078557A (ja) * 2006-09-25 2008-04-03 Fujifilm Corp 組成物、膜、およびその製造方法
JP5018065B2 (ja) * 2006-12-15 2012-09-05 Ｊｎｃ株式会社 ポリシロキサン化合物とその製造方法
JP5190667B2 (ja) * 2007-01-24 2013-04-24 国立大学法人東北大学 かご型シルセスキオキサン骨格を含有する重合体を素材とする光学素子
US8013077B2 (en) * 2007-03-02 2011-09-06 Fujifilm Corporation Insulating film forming composition and production method of insulating film
JP2009070722A (ja) * 2007-09-14 2009-04-02 Fujifilm Corp 絶縁膜形成用組成物および電子デバイス
WO2009084562A1 (ja) * 2007-12-27 2009-07-09 Nippon Steel Chemical Co., Ltd. 籠構造含有硬化性シリコーン共重合体及びその製造方法並びに籠構造含有硬化性シリコーン共重合体を用いた硬化性樹脂組成物及びその硬化物
JP5322491B2 (ja) * 2008-05-07 2013-10-23 学校法人神奈川大学 含ケイ素ポリマーおよびその製造方法並びに光学材料
JP5406466B2 (ja) * 2008-05-26 2014-02-05 旭化成株式会社 シロキサン誘導体及び硬化物並びに光半導体封止材
JP5266896B2 (ja) * 2008-06-12 2013-08-21 Ｊｎｃ株式会社 シルセスキオキサン重合体及びシリコーン樹脂成形体
JP5707607B2 (ja) 2009-04-24 2015-04-30 Jnc株式会社 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物
JP5793824B2 (ja) 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
JP2011016968A (ja) * 2009-07-10 2011-01-27 Kaneka Corp 多面体構造ポリシロキサン変性体、その製造方法および該変性体を含む組成物
CN104744705B (zh) 2010-05-18 2017-09-08 捷恩智株式会社 液状有机硅化合物的制造方法、热硬化性树脂组成物及其使用
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
JP5661657B2 (ja) * 2012-01-16 2015-01-28 信越化学工業株式会社 シリコーン樹脂組成物、蛍光体含有波長変換フィルム、及びそれらの硬化物
KR20130116782A (ko) * 2012-04-16 2013-10-24 한국전자통신연구원 계층적 비디오 부호화에서의 계층정보 표현방식
WO2015133874A1 (ko) * 2014-03-07 2015-09-11 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 세라믹코팅방법
WO2015133876A1 (ko) * 2014-03-07 2015-09-11 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 섬유코팅방법
WO2015133873A1 (ko) * 2014-03-07 2015-09-11 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 플라스틱코팅방법
WO2015133857A1 (ko) * 2014-03-07 2015-09-11 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 금속코팅방법
WO2015133875A1 (ko) * 2014-03-07 2015-09-11 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 목재 및 펄프 코팅방법
KR102414700B1 (ko) * 2014-03-07 2022-06-29 주식회사 동진쎄미켐 실세스퀴옥산 복합 고분자를 이용한 플라스틱코팅방법
EP3425006A4 (en) * 2016-03-02 2019-10-23 JNC Corporation COMPOSITION FOR HEAT DISSIPATING ELEMENT, HEAT DISSIPATING ELEMENT, ELECTRONIC INSTRUMENT AND METHOD FOR MANUFACTURING HEAT DISSIPATING ELEMENT
JP6642324B2 (ja) * 2016-07-27 2020-02-05 信越化学工業株式会社 オルガノポリシロキサン化合物およびそれを含有するコーティング用組成物

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US5412053A (en) 1993-08-12 1995-05-02 The University Of Dayton Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation
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Also Published As

Publication number Publication date
TW200424237A (en) 2004-11-16
US7423107B2 (en) 2008-09-09
JPWO2004081085A1 (ja) 2006-06-15
KR101067283B1 (ko) 2011-09-23
JP4479160B2 (ja) 2010-06-09
JP2006070049A (ja) 2006-03-16
KR20060012264A (ko) 2006-02-07
WO2004081085A1 (ja) 2004-09-23
US20060100410A1 (en) 2006-05-11

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