TW512498B - Semiconductor device, method of manufacture thereof, circuit board, and electronic device - Google Patents
Semiconductor device, method of manufacture thereof, circuit board, and electronic device Download PDFInfo
- Publication number
- TW512498B TW512498B TW089120696A TW89120696A TW512498B TW 512498 B TW512498 B TW 512498B TW 089120696 A TW089120696 A TW 089120696A TW 89120696 A TW89120696 A TW 89120696A TW 512498 B TW512498 B TW 512498B
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- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 257
- 238000000034 method Methods 0.000 title claims description 95
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Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP28247499 | 1999-10-04 |
Publications (1)
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| TW512498B true TW512498B (en) | 2002-12-01 |
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| TW089120696A TW512498B (en) | 1999-10-04 | 2000-10-04 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
Country Status (4)
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| US (1) | US6744122B1 (ja) |
| JP (1) | JP3994262B2 (ja) |
| TW (1) | TW512498B (ja) |
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| JP4549491B2 (ja) * | 2000-03-13 | 2010-09-22 | 大日本印刷株式会社 | 樹脂封止型半導体装置 |
| SG122743A1 (en) * | 2001-08-21 | 2006-06-29 | Micron Technology Inc | Microelectronic devices and methods of manufacture |
| US6869831B2 (en) * | 2001-09-14 | 2005-03-22 | Texas Instruments Incorporated | Adhesion by plasma conditioning of semiconductor chip surfaces |
| SG104293A1 (en) | 2002-01-09 | 2004-06-21 | Micron Technology Inc | Elimination of rdl using tape base flip chip on flex for die stacking |
| SG115459A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Flip chip packaging using recessed interposer terminals |
| SG111935A1 (en) | 2002-03-04 | 2005-06-29 | Micron Technology Inc | Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods |
| SG115455A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Methods for assembly and packaging of flip chip configured dice with interposer |
| SG115456A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
| US6975035B2 (en) * | 2002-03-04 | 2005-12-13 | Micron Technology, Inc. | Method and apparatus for dielectric filling of flip chip on interposer assembly |
| SG121707A1 (en) * | 2002-03-04 | 2006-05-26 | Micron Technology Inc | Method and apparatus for flip-chip packaging providing testing capability |
| US20040036170A1 (en) * | 2002-08-20 | 2004-02-26 | Lee Teck Kheng | Double bumping of flexible substrate for first and second level interconnects |
| JP2004247530A (ja) * | 2003-02-14 | 2004-09-02 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| DE10339609A1 (de) * | 2003-08-28 | 2005-03-24 | Forschungszentrum Karlsruhe Gmbh | Oligonukleotid, Verfahren und System zur Detektion von Antibiotikaresistenz-vermittelnden Genen in Mikroorganismen mittels der Echtzeit-PCR |
| JP2005101125A (ja) * | 2003-09-24 | 2005-04-14 | Seiko Epson Corp | 半導体装置の製造方法及び半導体装置、回路基板並びに電子機器 |
| JP3693060B2 (ja) * | 2003-09-24 | 2005-09-07 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| JP2007242641A (ja) * | 2004-04-14 | 2007-09-20 | Nippon Mektron Ltd | チップ部品実装用可撓性プリント回路基板 |
| JP2006100385A (ja) | 2004-09-28 | 2006-04-13 | Rohm Co Ltd | 半導体装置 |
| US11842972B2 (en) | 2004-09-28 | 2023-12-12 | Rohm Co., Ltd. | Semiconductor device with a semiconductor chip connected in a flip chip manner |
| JP4613958B2 (ja) * | 2005-08-05 | 2011-01-19 | 株式会社村田製作所 | 電子部品の製造方法及び電子部品 |
| JP4819471B2 (ja) * | 2005-10-12 | 2011-11-24 | 日本電気株式会社 | 配線基板及び配線基板を用いた半導体装置並びにその製造方法 |
| US20110254661A1 (en) | 2005-12-23 | 2011-10-20 | Invue Security Products Inc. | Programmable security system and method for protecting merchandise |
| JP2008078382A (ja) * | 2006-09-21 | 2008-04-03 | Toshiba Corp | 半導体装置とその製造方法 |
| JP2008096318A (ja) * | 2006-10-13 | 2008-04-24 | Fujitsu Media Device Kk | 振動センサおよびその製造方法 |
| JP2008147367A (ja) * | 2006-12-08 | 2008-06-26 | Sony Corp | 半導体装置及びその製造方法 |
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| KR100292033B1 (ko) * | 1998-05-13 | 2001-07-12 | 윤종용 | 반도체칩패키지및그제조방법 |
-
2000
- 2000-09-29 WO PCT/JP2000/006767 patent/WO2001026147A1/ja active Application Filing
- 2000-09-29 JP JP2001529016A patent/JP3994262B2/ja not_active Expired - Fee Related
- 2000-09-29 US US09/856,924 patent/US6744122B1/en not_active Expired - Fee Related
- 2000-10-04 TW TW089120696A patent/TW512498B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP3994262B2 (ja) | 2007-10-17 |
| US6744122B1 (en) | 2004-06-01 |
| WO2001026147A1 (fr) | 2001-04-12 |
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