TW201809452A - Cold and hot circulating machine of using semiconductor as cooling core characterized by using the coordination of the thermoelectric cooling chip, the cold circulator, the heat-dissipating circulation device and the power supply-thermostat, thereby having higher circulation efficiency of cold and hot exchange - Google Patents

Cold and hot circulating machine of using semiconductor as cooling core characterized by using the coordination of the thermoelectric cooling chip, the cold circulator, the heat-dissipating circulation device and the power supply-thermostat, thereby having higher circulation efficiency of cold and hot exchange Download PDF

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TW201809452A
TW201809452A TW105122672A TW105122672A TW201809452A TW 201809452 A TW201809452 A TW 201809452A TW 105122672 A TW105122672 A TW 105122672A TW 105122672 A TW105122672 A TW 105122672A TW 201809452 A TW201809452 A TW 201809452A
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cold
cooling
heat
water
temperature
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TW105122672A
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TWI599713B (en
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陳傳生
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陳傳生
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Priority to TW105122672A priority Critical patent/TWI599713B/en
Priority to CN201610836466.4A priority patent/CN106802020A/en
Priority to CN201621067263.5U priority patent/CN206440031U/en
Priority to JP2017001155U priority patent/JP3211172U/en
Priority to US15/475,141 priority patent/US10386085B2/en
Priority to MYUI2017701298A priority patent/MY182972A/en
Priority to KR2020170001952U priority patent/KR200487943Y1/en
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Publication of TW201809452A publication Critical patent/TW201809452A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/70—Control systems characterised by their outputs; Constructional details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/12—Improving ICE efficiencies

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed is a cold and hot circulating machine of using semiconductor as cooling core, which mainly consists of at least one thermoelectric cooling chip, a cold circulator, a heat-dissipating circulation device, and a power supply-thermostat. When an electric end of the thermoelectric cooling chip is electrically connected to the power supply-thermostat to import electric power, one end thereof forms a cold-generating face. At the same time, the other end of the cold-generating face forms a heat-generating face. The cold-generating face is tightly next to the cold circulator, and the heat-generating face is tightly next to the heat-dissipating circulation device. Both the cold circulator and the heat-dissipating circulation device consist of a bypass return tank having a surface totally covered with heat-conducting fins, a fan and an auxiliary temperature-transferring device having a pumping flow of an electric water pump. A chamber-stored water temperature-bearing guide plate in the bypass return tank is closely attached to a corresponding chip surface of the thermoelectric cooling chip. The fan is installed at the periphery of the heat-conducting fins. The electric water pump is installed at an appropriate position of being capable of circulating the pumping flow for the bypass return tank. A power-supply output end of the power-supply thermostat is electrically connected to the thermoelectric cooling chip, and a power input end thereof is electrically connected to the power source. The power-supply thermostat is mainly a master controller provided with a power source switch key, a temperature control key and a constant temperature control key, thereby setting a desired constant temperature or rising/lowering the temperature. The cold and hot air conditioner capable of adjusting the heat-dissipating circulation device and the cold circulator to have a predetermined temperature of the environmental space is obtained, and the effect of present invention is much better than that of the previous inventions.

Description

以半導體為致冷核心之冷暖循環機 Cooling and heating cycle machine with semiconductor as cooling core

本發明係有關於一種以半導體為致冷核心之冷暖循環機，尤指一種應用熱電致冷晶片導電發功產生一端發熱另端發冷性質，搭配發熱循環單元、散熱循環設備、及電源供應兼溫控器之更新穎可調溫之冷熱交換機結構，且冷循環器及散熱循環設備皆由表面遍佈傳熱鰭片之繞管迴流箱、風扇及具有電動水泵泵流之輔助傳溫設備所組成，使其功效更遠勝於本發明人先前此類發明者。 The present invention relates to a heating and cooling cycle machine using a semiconductor as a cooling core, and in particular, it uses a thermoelectric cooling chip to generate heat at one end to generate heat at the other end, and is equipped with a heating cycle unit, a heat dissipation cycle device, and a power supply unit. The thermostat has a more novel temperature-adjustable hot and cold heat exchanger structure, and the cold circulator and the heat-dissipation cycle equipment are composed of a recirculating tube return box with a heat transfer fin on its surface, a fan, and an auxiliary temperature transfer device with an electric water pump pump flow To make it far more effective than previous inventors of this type.

習知冷暖氣機及電冰箱等冷暖電器，均係使用冷媒與壓縮機來達成冷氣之使用功能，由於壓縮機之體積龐大笨重，搬動與安裝均甚費力，且會產生噪音，耗電量又高，大大影響生活環境品質，而且如果不謹慎配合會滴水雜音與運轉噪音等因素考量安裝，安裝地點，就會嚴重擾鄰，使習用冷氣機之裝設處所更受限制，於是如何製造出省電且搬動與安裝均可方便與省力，兼少噪音公害之冷暖電器產品，就一直是本發明人致力追求的目標。 It is known that cooling and heating appliances such as refrigerators and refrigerators use refrigerants and compressors to achieve the function of air conditioning. Due to the large size of the compressor, it is laborious to move and install, and it will generate noise and power consumption. It is high, which greatly affects the quality of the living environment, and if the installation is not carefully coordinated with factors such as dripping noise and operating noise, the installation location will seriously disturb the neighbors, making the installation of conventional air conditioners more restricted, so how to create Electricity-saving and heating and cooling electrical products that are convenient and labor-saving for both moving and installation, and less noise pollution have always been the goals that the present inventor has been pursuing.

因此，本發明人曾發明一件”運用半導體冷暖電器“，並於2007/08/07發證日取得美國專利號7,251,943，此發明已初具理想有效，惟其 冷熱交換循環效率還仍有改進空間，於此再略說明前該發明案，且變更其實體性質下，對說明文詞略作調整，以方便審查進行，其如第一至第三圖所示，前發明案開始即特別以至少一只之熱電致冷晶片2作為冷熱溫差產生來源，於熱電致冷晶片2之冷產生面固設冷循環器3，而熱電致冷晶片2之冷產生面固設散熱循環設備4，並有電源開關1及溫控器5電連接至該些熱電致冷晶片2供應經調控之電力，而冷循環器3、散熱循環設備4係分別由冷、熱導板31、41裝設冷水管32與散熱管42、鰭片33,43，並對該散熱循環設備4裝設有風扇44等所構成，而冷、熱導板31、41在實施上係以冷、熱傳導作用最佳之銅或鋁材製成儲入循環液體之中空板體，藉由電源開關1啟動作用，並藉由溫控器5使用介面上之恆溫控制鍵51與升降溫控制鍵52設定所需溫度，若使發明之此種運用半導體冷暖電器裝設在屋內外壁之間，區隔致冷區域與散熱區域，即能隨心所欲穩定室內溫度，以達到所需冷房或暖房效果，此一發明確實有效，但冷、熱導板31、41內之循環液體對應流入及迴流出冷水管32與散熱管42的構成方式，係任其在管內自然流動為之，使其管內流動速度，比不上用電動水泵泵流流入及迴流出冷水管32與散熱管42地強制循環迴流來得快，突顯效率不足。 Therefore, the inventor has invented a "use of semiconductor heating and heating appliances", and obtained US Patent No. 7,251,943 on the date of issue of 2007/08/07, this invention has begun to be ideal and effective, but its There is still room for improvement in the efficiency of the cold and heat exchange cycle. Here we will briefly explain the previous invention and change its physical nature, and slightly adjust the description to facilitate the review. As shown in the first to third figures, In the beginning of the previous invention case, at least one thermoelectric cooling chip 2 was used as a source of cold and heat temperature difference. A cold circulator 3 was fixed on the cold generating surface of the thermoelectric cooling chip 2 and the cold generating surface of the thermoelectric cooling chip 2 was fixed. A cooling cycle device 4 is provided, and a power switch 1 and a thermostat 5 are electrically connected to the thermoelectric cooling chips 2 to supply regulated power, and the cold cycle device 3 and the cooling cycle device 4 are respectively composed of a cold and a heat conduction plate. 31, 41 are equipped with cold water pipe 32, heat dissipation pipe 42, fins 33, 43, and the cooling cycle equipment 4 is equipped with a fan 44 and the like, and the cold and heat guide plates 31, 41 are implemented as cold 2. The copper or aluminum material with the best heat transfer effect is made of hollow plate that is stored in the circulating liquid. The function is activated by the power switch 1 and the thermostat 5 uses the thermostatic control key 51 and the temperature control key 52 on the interface. Set the required temperature, if the invention uses such semiconductors to cool and warm The device is installed between the interior and exterior walls of the house to separate the cooling area and the heat dissipation area, that is, it can stabilize the indoor temperature as desired to achieve the desired cold room or warm room effect. This invention is indeed effective, but the cold and heat guide plates 31, 41 The circulating liquid inside corresponds to the structure of the inflow and return of the cold water pipe 32 and the heat dissipation pipe 42. It allows the natural flow of the liquid in the pipe to make the flow speed in the pipe incomparable to the inflow and return of the electric water pump. The forced circulation backflow of the cold water pipe 32 and the heat dissipation pipe 42 comes quickly, highlighting the insufficient efficiency.

另外，對散熱循環設備4的餘排除散發，在鰭片熱43表面外部，僅由風扇44吹經鰭片43氣冷方式為之，但散熱循環設備4的餘熱排除散發若能更快排散掉，減少積熱反流囘熱電致冷晶片2冷產生面，也就會連帶增進熱電致冷晶片2冷產生面之致冷效益，而眾所週知，光用氣冷散熱遠不如水冷結構或水冷加氣冷結構來得速效，所以前發明案於此散熱循環設備4仍有改進空間。 In addition, the residual heat dissipation of the heat dissipation cycle equipment 4 is radiated outside the surface of the fin heat 43 by the fan 44 only through the air cooling method of the fin 43. However, if the residual heat dissipation of the heat dissipation cycle equipment 4 can be discharged faster It can reduce the accumulated heat and return to the cooling surface of the thermoelectric cooling chip 2. It will also increase the cooling efficiency of the cooling surface of the thermoelectric cooling chip. It is well known that the heat dissipation by air cooling is far inferior to the water cooling structure or water cooling. The air-cooled structure is quick-acting, so there is still room for improvement in the heat dissipation cycle device 4 of the previous invention.

因此，有鑑於習知冷暖氣機及電冰箱等冷暖電器有笨重、噪音大、耗電高等問題，而本發明人前番發明冷熱交換循環效率仍有待改進之缺點，本發明人再更精進研究解決之道，經過一番努力終於有本發明產生。 Therefore, in view of the conventional cooling and heating appliances such as refrigerators and refrigerators, which are bulky, noisy, and high power consumption, and the inventors have previously invented the shortcomings of the cold and heat exchange cycle efficiency that still needs to be improved, the inventors have further studied The way, after some efforts, the invention finally came into being.

因此，本發明雖以前發明為基礎，但對冷熱循環機制及熱交換效率卻更為精進，其係提供一種以半導體為致冷核心之冷暖循環機，主要由至少一熱電致冷晶片、一冷循環器、一散熱循環設備，及一電源供應兼溫控器(註：前發明案供應電源之電源開關與溫控器為分開組成，今合而為一)所組成，其中該些熱電致冷晶片接電端電連接電源供應兼溫控器導入電力時，其一端形成冷產生面，同時冷產生面另端形成熱產生面，而冷產生面緊接冷循環器，熱產生面緊接散熱循環設備，且冷循環器及散熱循環設備皆由表面遍佈傳熱鰭片(註：傳熱鰭片即前發明案之鰭片33,43)之繞管迴流箱(註：繞管回流箱即前發明案之冷、熱導板31、41、冷水管32與散熱管42、鰭片33,43之合稱)、風扇及特別加入具有電動水泵泵流之輔助傳溫設備所組成，使繞管迴流箱內之空腔蓄水受溫導板(註：空腔蓄水受溫導板即前發明案之冷、熱導板31、41)緊貼熱電致冷晶片對應片面，風扇設於傳熱鰭片周圍，電動水泵設於能對繞管迴流箱循環泵流適當位置，至於電源供應兼溫控器供電輸出端電接該些熱電致冷晶片，且其電力輸入端電接電源，主要為面板上設有電源開啟鍵、升降溫控制鍵及恆溫控制鍵之一主控介面器，由此設定所需的恆溫或升降溫度，就能調整出散熱循環設備與冷循環器對周圍空間預定冷熱氣溫交換度的冷暖氣機者，具有 冷熱循環效率強制提升效果，此即為本發明之主要目的。 Therefore, although the present invention is based on the previous invention, it is more advanced in the cold and heat cycle mechanism and heat exchange efficiency. It provides a cold and warm cycle machine with a semiconductor as the cooling core, which is mainly composed of at least one thermoelectric cooling chip, one cold Circulator, a cooling cycle equipment, and a power supply and temperature controller (Note: The power switch of the power supply of the previous invention is separated from the temperature controller and is now one), among which the thermoelectric refrigeration When the chip connection terminal is electrically connected to the power supply and the temperature controller introduces power, one end of the chip generates a cold generating surface, and the other end of the cold generating surface forms a heat generating surface. The cold generating surface is connected to the cold cycler, and the heat generating surface is connected to heat dissipation. Circulation equipment, and the cold circulator and heat dissipation circulation equipment are all made up of a tube recirculation box (Note: the tube recirculation box is full of heat transfer fins (note: the fins 33,43 of the previous invention) on the surface. The cold and heat guide plates 31 and 41, the cold water pipe 32 and the cooling pipe 42, and the fins 33 and 43 of the previous invention are collectively referred to as a fan, and an auxiliary temperature transmission device with an electric water pump The water storage in the cavity of the tube return tank is guided by temperature (Note: The cavity water storage temperature receiving plates are the cold and hot plates 31 and 41 of the previous invention.) They are close to the corresponding surface of the thermoelectric cooling chip. The fan is set around the heat transfer fins. The electric water pump is set to The circulating pump flow of the tube return box is in a proper position. As for the power supply and the thermostat power supply output terminal, the thermoelectric cooling chips are electrically connected, and the power input terminal is electrically connected to the power supply. The panel is provided with a power on button and temperature control. One of the main control interfaces of the key and the thermostatic control key, so as to set the required constant temperature or raising and lowering temperature, and can adjust the heat and cold circulation device and the cold cycler to preset the cold and hot air temperature exchange degree of the surrounding space. The effect of the forced improvement of the hot and cold cycle efficiency is the main purpose of the present invention.

又，本發明此種以半導體為致冷核心之冷暖循環機，其散熱循環設備之輔助傳溫設備除了電動水泵外，復可包括：一冷卻水箱、一水箱水循環泵、循環泵進水管及循環泵出水管，於貼近冷卻水箱底插伸出循環泵進水管，循環泵進水管再管接到水箱水循環泵進水口，從水箱水循環泵出水口再管接循環泵出水管穿伸囘冷卻水箱內對應冷卻水面上方，將散熱循環設備之繞管迴流箱除了空腔蓄水受溫導板外的所有部份，浸入冷卻水箱內冷卻水面下，使繞管迴流箱之傳熱鰭片及繞管受水包圍冷卻，又前述風扇裝設在冷卻水箱殼壁對應冷卻水面上方適當位置，由而冷卻水箱內之冷卻水不斷藉由水箱水循環泵抽流回冷卻水箱內對應冷卻水面上方噴射迴流，就能不斷氣冷冷卻水，讓強制流動的冷卻水不斷快速冷卻傳熱鰭片及繞管，散熱循環設備的餘熱排除散能更快排散掉，減少積熱反流囘熱電致冷晶片冷產生面，達到快速冷卻提升致冷效益效果，此為本發明之又一目的。 In addition, in addition to the electric water pump, the auxiliary temperature-transmitting device of the heat-dissipating circulation device of the cooling and heating cycle machine using the semiconductor as a cooling core of the present invention may include: a cooling water tank, a water tank water circulating pump, a circulating pump inlet pipe, and a circulation Pump the water outlet pipe, insert the extension pump inlet pipe close to the bottom of the cooling water tank, and the circulation pump inlet pipe is then connected to the water inlet of the water tank water circulation pump. From the water outlet of the water circulation pump, connect the water outlet pipe of the circulation pump to the cooling water tank. Correspond to the cooling water surface, immerse all parts of the tube recirculation tank of the heat dissipation circulation equipment except the cavity water storage and temperature receiving guide plate under the cooling water surface in the cooling water tank to make the heat transfer fins and tubes of the tube recirculation tank. Surrounded by water for cooling, the fan is installed at a suitable position above the cooling water surface of the cooling water tank shell, so that the cooling water in the cooling water tank is continuously pumped back to the cooling water tank by the water tank circulating pump and sprayed back to the cooling water surface. It can continuously air-cool the cooling water, so that the forced-flow cooling water continuously cools the heat transfer fins and the tubes, and the waste heat of the heat dissipation cycle equipment can remove the heat more quickly. Dissipated, a further object to reduce the accumulation of heat flow back into the thermoelectric cooler cooling the wafer surface is generated, to enhance the rapid cooling effect of the refrigerating efficiency, the present invention.

至於本發明之詳細構造、應用原理、作用與功效，則參照下列依附圖所作之說明即可得到完全的了解。 As for the detailed structure, application principle, function and effect of the present invention, it can be fully understood with reference to the following description made with reference to the accompanying drawings.

1‧‧‧電源開關 1‧‧‧Power switch

2‧‧‧熱電致冷晶片 2‧‧‧thermoelectric cooling chip

3‧‧‧冷循環器 3‧‧‧Cold Circulator

31‧‧‧冷導板 31‧‧‧cold guide

32‧‧‧冷水管 32‧‧‧ cold water pipe

33,43‧‧‧鰭片 33,43‧‧‧fins

35‧‧‧液體 35‧‧‧Liquid

4‧‧‧散熱循環設備 4‧‧‧ Thermal cycle equipment

41‧‧‧熱導板 41‧‧‧Heat guide plate

42‧‧‧散熱管 42‧‧‧heat pipe

44‧‧‧風扇 44‧‧‧fan

45‧‧‧排熱 45‧‧‧Exhaust heat

5‧‧‧溫控器 5‧‧‧ Thermostat

51‧‧‧恆溫控制鍵 51‧‧‧ constant temperature control key

52‧‧‧升降溫控制鍵 52‧‧‧Temperature control key

100,101‧‧‧熱電致冷晶片 100,101‧‧‧thermoelectric cooling chip

200‧‧‧冷循環器 200‧‧‧Cold Circulator

201,202,301,302‧‧‧傳熱鰭片 201,202,301,302‧‧‧ heat transfer fins

203,303‧‧‧繞管迴流箱 203,303‧‧‧‧Return box

204,304‧‧‧空腔蓄水受溫導板 204,304‧‧‧cavity water storage temperature guide

205,305‧‧‧風扇 205,305‧‧‧fan

206‧‧‧冷水出水管 206‧‧‧cold water outlet pipe

300‧‧‧散熱循環設備 300‧‧‧ Thermal cycle equipment

301,302‧‧‧傳熱鰭片 301,302‧‧‧ heat transfer fins

303‧‧‧繞管迴流箱 303‧‧‧wound return box

303A,303B‧‧‧繞管 303A, 303B

306‧‧‧冷卻水回流管 306‧‧‧cooling water return pipe

400,401‧‧‧輔助傳溫設備 400,401‧‧‧ auxiliary temperature transmission equipment

402,403‧‧‧電動水泵 402,403‧‧‧electric water pump

404‧‧‧水箱水循環泵 404‧‧‧Water tank water circulation pump

405‧‧‧循環泵進水管 405‧‧‧Circulation pump inlet pipe

406‧‧‧循環泵出水管 406‧‧‧Circulating pump outlet pipe

407‧‧‧冷卻水箱 407‧‧‧cooling water tank

408‧‧‧冷卻水面 408‧‧‧ cooling water surface

500‧‧‧電源供應兼溫控器 500‧‧‧ Power supply and temperature controller

501,505‧‧‧電源開啟鍵 501,505‧‧‧ Power on button

502,506‧‧‧升降溫控制鍵 502,506‧‧‧Temperature control key

503,507‧‧‧恆溫控制鍵 503,507‧‧‧ constant temperature control key

504‧‧‧主控介面器 504‧‧‧Master Control Interface

508‧‧‧副控介面器 508‧‧‧Sub-controller

第1圖係本發明人先前發明運用半導體冷暖電器之方塊圖。 FIG. 1 is a block diagram of a semiconductor heating and heating appliance invented by the present inventor.

第2圖係本發明人先前發明運用半導體冷暖電器之構造示意圖。 Figure 2 is a schematic diagram of the structure of a semiconductor heating and heating appliance invented by the present inventor.

第3圖係本發明人先前發明運用半導體冷暖電器之立體示意圖。 FIG. 3 is a schematic perspective view of a semiconductor heating and heating appliance invented by the present inventor.

第4圖係本發明此種以半導體為致冷核心之冷暖循環機之流程圖。 Fig. 4 is a flow chart of the cooling and heating cycle machine using the semiconductor as a cooling core of the present invention.

第5圖係本發明此種以半導體為致冷核心之冷暖循環機之立體實施例圖。 Fig. 5 is a three-dimensional embodiment of the cooling and heating cycle machine using the semiconductor as a cooling core of the present invention.

第1圖至第3圖所示本發明人先前發明運用半導體冷暖電器之結構及原理已如前述，此處不再贅述。 The structure and principle of the semiconductor inventors using the semiconductor heating and heating appliances previously invented by the inventors shown in FIG. 1 to FIG. 3 are as described above, and are not repeated here.

第4圖係本發明此種以半導體為致冷核心之冷暖循環機之流程圖，請同時參照第5圖之立體實施例圖，由該些圖所示可知本發明此種以半導體為致冷核心之冷暖循環機，主要由至少一熱電致冷晶片100,101、一冷循環器200、一散熱循環設備300、及一電源供應兼溫控器500所組成，其中該些熱電致冷晶片100,101接電端電連接電源供應兼溫控器500導入電力時，其一端形成冷產生面，同時冷產生面另端形成熱產生面，而冷產生面緊接冷循環器200，熱產生面緊接散熱循環設備300，且冷循環器200及散熱循環設備300皆由表面遍佈傳熱鰭片201,202,301,302之繞管迴流箱203,303、風扇205,305及具有電動水泵402,403泵流之輔助傳溫設備400,401所組成，使繞管迴流箱203,303內之空腔蓄水受溫導板204,304緊貼熱電致冷晶片100,101對應片面，風扇205,305設於傳熱鰭片201,202,301,302周圍，電動水泵402,403設於能對繞管迴流箱203,303循環泵流適當位置，如圖三所示，位於熱電致冷晶片100,101冷產生面側冷循環器200之電動水泵402可設於空腔蓄水受溫導板204接至繞管迴流箱203彎管之冷水出水管206中段，而位於熱電致冷晶片100,101熱產生面側散熱循環設備300之電動水泵403可設於繞管迴流箱303彎管接回空腔蓄水受溫導板304之冷卻水回流管306中段，藉由該些電動水泵402,403強制泵送作用，使繞管迴流箱203,303內流體傳溫循環更快速，加快散熱循環設備300與冷循環器200對周圍空間預定冷 熱空調溫度效率，而冷循環器200之傳熱鰭片201,202周圍所設之風扇205可為滾輪風扇，於傳熱鰭片201,202與空氣接觸地吸熱交換過程中，將所傳出之冷氣溫由滾輪風扇輸出冷氣。 Fig. 4 is a flow chart of the cooling and heating cycle machine using the semiconductor as the cooling core of the present invention. Please refer to the three-dimensional embodiment diagram of Fig. 5 at the same time. From these figures, it can be seen that the semiconductor-based cooling of the present invention The core heating and cooling cycle machine is mainly composed of at least one thermoelectric cooling chip 100, 101, a cooling cycler 200, a cooling cycle device 300, and a power supply and temperature controller 500. Among these thermoelectric cooling chips 100, 101 are connected to electricity. When the terminal is connected to the power supply and temperature controller 500, the cold generating surface is formed at one end and the heat generating surface is formed at the other end of the cold generating surface. The cold generating surface is connected to the cold cycler 200 and the heat generating surface is connected to the heat dissipation cycle. The equipment 300, and the cold cycler 200 and the heat-dissipation cycle equipment 300 are composed of a tube returning box 203,303 with heat transfer fins 201,202,301,302 on the surface, a fan 205,305, and an auxiliary temperature transmission device 400,401 with an electric water pump 402,403 pumping. The water storage and temperature guide plates 204, 304 in the recirculation tanks 203 and 303 are close to the corresponding surfaces of the thermoelectric cooling chips 100 and 101. The fans 205 and 305 are set around the heat transfer fins 201, 202, 301 and 302. The electric water pumps 402 and 403 are set At an appropriate position to circulate pumps around the tube return box 203, 303, as shown in FIG. 3, the electric water pump 402 located on the thermoelectric cooling chip 100, 101 cold generating surface side cold circulator 200 can be installed in the cavity water storage temperature receiving guide plate 204 The middle section of the cold water outlet pipe 206 connected to the elbow of the pipe return box 203, and the electric water pump 403 located on the thermoelectric cooling chip 100, 101 heat generating surface side heat circulation cycle equipment 300 can be installed in the pipe return box 303 and the pipe returns to the cavity storage The middle section of the cooling water return pipe 306 of the water receiving temperature guide plate 304. By the forced pumping action of these electric water pumps 402, 403, the fluid temperature circulation cycle in the return pipe 203, 303 is faster, and the heat dissipation cycle equipment 300 and the cold cycle 200 are accelerated. Schedule cold for surrounding space Thermal air conditioning temperature efficiency, and the fan 205 provided around the heat transfer fins 201 and 202 of the cold cycler 200 may be a roller fan. During the heat exchange process of the heat transfer fins 201 and 202 in contact with the air, the transmitted cold temperature is changed from The roller fan outputs cold air.

至於電源供應兼溫控器500供電輸出端電接該些熱電致冷晶片100,101，且其電力輸入端電接電源，主要為面板上設有電源開啟鍵501、升降溫控制鍵502及恆溫控制鍵503之一主控介面器504，或者電源供應兼溫控器500也可為面板上設有電源開啟鍵501、升降溫控制鍵502及恆溫控制鍵503之一主控介面器504，以及面板上亦設有電源開啟鍵505、升降溫控制鍵506及恆溫控制鍵507，以遙控主控介面器504作動之副控介面器508。 As for the power supply and temperature controller 500's power supply output terminal, the thermoelectric cooling chips 100 and 101 are electrically connected, and the power input terminal is electrically connected to the power supply. The panel is provided with a power on button 501, a temperature control button 502, and a thermostatic control button. One of the main control interface 504 of 503, or the power supply and temperature controller 500 may also be provided on the panel with a power on key 501, a temperature rise and fall control key 502, and a thermostat control key 504. A power-on key 505, a temperature rise and fall control key 506, and a thermostat control key 507 are also provided, and a sub-controller 508 operated by remotely controlling the main-controller 504.

另且，散熱循環設備300之輔助傳溫設備401除了電動水泵403外，還可包括：一冷卻水箱407、一水箱水循環泵404、循環泵進水管405及循環泵出水管406，於貼近冷卻水箱407底插伸出循環泵進水管405，循環泵進水管405再管接到水箱水循環泵404進水口，從水箱水循環泵404出水口再管接循環泵出水管406穿伸囘冷卻水箱407內對應冷卻水面408上方，將散熱循環設備300之繞管迴流箱303除了空腔蓄水受溫導板304外的所有部份，浸入冷卻水箱407內冷卻水面408下，使繞管迴流箱303之傳熱鰭片301,302及繞管303A,303B受水包圍冷卻，又前述一風扇305裝設在冷卻水箱407殼壁對應冷卻水面408上方適當位置，由而冷卻水箱407內之冷卻水不斷藉由水箱水循環泵404抽流回冷卻水箱407內對應冷卻水面408上方噴滴迴流，就能不斷氣冷冷卻水，讓強制流動的冷卻水不斷快速冷卻傳熱鰭片301,302及繞管303A,303B，散熱循環設備300的餘熱排除散能更快排散掉，減少積熱反流囘熱電致冷晶片冷產生面，達到快速冷卻提升致冷效益效果。 In addition, in addition to the electric water pump 403, the auxiliary temperature transmission device 401 of the heat dissipation circulation device 300 may include: a cooling water tank 407, a water tank water circulation pump 404, a circulation pump inlet pipe 405, and a circulation pump outlet pipe 406, which are close to the cooling water tank. 407 is inserted into the bottom of the circulating pump inlet pipe 405. The circulating pump inlet pipe 405 is then connected to the water tank water circulation pump 404 inlet. From the water tank water circulation pump 404 outlet, the pipe is connected to the circulating pump outlet pipe 406 and extended back to the cooling water tank 407. Above the cooling water surface 408, immerse all parts of the tube return tank 303 of the heat dissipation circulation device 300 except the cavity water storage and temperature receiving guide plate 304 under the cooling water surface 408 in the cooling water tank 407 to pass the tube return tube 303. The hot fins 301 and 302 and the surrounding tubes 303A and 303B are surrounded by water for cooling, and the aforementioned fan 305 is installed at an appropriate position above the cooling water surface 408 on the shell wall of the cooling water tank 407, so that the cooling water in the cooling water tank 407 is continuously circulated by the water in the water tank. The pump 404 pumps back to the cooling water tank 407 and sprays back and forth above the corresponding cooling water surface 408 to continuously air-cool the cooling water, so that the forced-flow cooling water continuously cools the heat transfer fins 301, 302 and the coil 30. 3A, 303B, the waste heat of the heat dissipation cycle equipment 300 can be dissipated more quickly, and the accumulated heat can be returned to the cold generation surface of the thermoelectric cooling chip to achieve rapid cooling and improve the cooling effect.

綜上所述，本發明此種以半導體為致冷核心之冷暖循環機，確實達到所述提高效率之功效，而且未見諸公開使用，合於專利法之規定，懇請賜准專利，實為德便。 In summary, the cooling and heating cycle machine using the semiconductor as the cooling core of the present invention does achieve the above-mentioned effect of improving efficiency, and it has not been used in public. It is in accordance with the provisions of the Patent Law. Deben.

須陳明者，以上所述者乃是本發明較佳具體的實施例，若依本發明之構想所作之改變，或其產生之功能作用，仍未超出說明書與圖示所涵蓋之精神時，均應在本發明之範圍內，合予陳明。 It must be noted that the above are the preferred and specific embodiments of the present invention. If the changes made according to the concept of the present invention, or the functional effects thereof, still do not exceed the spirit covered by the description and drawings, All should be within the scope of the present invention and shared by Chen Ming.

100,101‧‧‧熱電致冷晶片 100,101‧‧‧thermoelectric cooling chip

200‧‧‧冷循環器 200‧‧‧Cold Circulator

201,202,301,302‧‧‧傳熱鰭片 201,202,301,302‧‧‧ heat transfer fins

203,303‧‧‧繞管迴流箱 203,303‧‧‧‧Return box

204,304‧‧‧空腔蓄水受溫導板 204,304‧‧‧cavity water storage temperature guide

205,305‧‧‧風扇 205,305‧‧‧fan

206‧‧‧冷水出水管 206‧‧‧cold water outlet pipe

300‧‧‧散熱循環設備 300‧‧‧ Thermal cycle equipment

303‧‧‧繞管迴流箱 303‧‧‧wound return box

306‧‧‧冷卻水回流管 306‧‧‧cooling water return pipe

400,401‧‧‧輔助傳溫設備 400,401‧‧‧ auxiliary temperature transmission equipment

402,403‧‧‧電動水泵 402,403‧‧‧electric water pump

404‧‧‧水箱水循環泵 404‧‧‧Water tank water circulation pump

405‧‧‧循環泵進水管 405‧‧‧Circulation pump inlet pipe

406‧‧‧循環泵出水管 406‧‧‧Circulating pump outlet pipe

407‧‧‧冷卻水箱 407‧‧‧cooling water tank

408‧‧‧冷卻水面 408‧‧‧ cooling water surface

500‧‧‧電源供應兼溫控器 500‧‧‧ Power supply and temperature controller

Claims (4)

一種以半導體為致冷核心之冷暖循環機，主要由至少一熱電致冷晶片、一冷循環器、一散熱循環設備，及一電源供應兼溫控器所組成，其中該些熱電致冷晶片接電端電連接電源供應兼溫控器導入電力時，其一端形成冷產生面，同時冷產生面另端形成熱產生面，而冷產生面緊接冷循環器，與本發明人前發明冷循環器散熱循環設備內部，流體自然循環流動傳溫不同，其特徵在於：冷循環器及散熱循環設備皆由表面遍佈傳熱鰭片之繞管迴流箱、風扇及具有電動水泵泵流之輔助傳溫設備所組成，使繞管迴流箱內之空腔蓄水受溫導板緊貼熱電致冷晶片對應片面，風扇設於傳熱鰭片周圍，電動水泵設於能對繞管迴流箱循環泵流適當位置，至於電源供應兼溫控器供電輸出端電接該些熱電致冷晶片，且其電力輸入端電接電源，主要為面板上設有電源開啟鍵升降溫控制鍵及恆溫控制鍵之一主控介面器者。 A cooling and heating cycle machine using a semiconductor as a cooling core is mainly composed of at least one thermoelectric cooling chip, a cooling circulator, a heat dissipation cycle device, and a power supply and temperature controller. The thermoelectric cooling chips are connected to When the electric terminal is electrically connected to the power supply and the temperature controller is used to introduce power, one end of the cold generating surface forms a cold generating surface, and the other end of the cold generating surface forms a heat generating surface. The cold generating surface is next to the cold cycler, and the cold cycler was previously invented by the inventor. Inside the heat circulation equipment, the natural circulation of fluids has different temperature and heat transfer characteristics. It is characterized in that the cold circulator and the heat circulation cycle equipment are composed of a return tube around the heat transfer fins, a fan, and an auxiliary temperature transmission device with an electric water pump. It is composed so that the cavity water storage and temperature-receiving guide plate in the coiled tube return box is in close contact with the corresponding surface of the thermoelectric cooling chip. The fan is arranged around the heat transfer fins. The electric water pump is set to properly circulate the pump in the coiled tube return box. Position, as for the power supply and the thermostat power supply output terminal are electrically connected to the thermoelectric cooling chips, and the power input terminal is electrically connected to the power supply, mainly the panel is equipped with a power on button to raise and lower the temperature control One of the master keys and climate control key device's interface. 如請求項1所述之以半導體為致冷核心之冷暖循環機，其中該散熱循環設備之輔助傳溫設備除了電動水泵外，還包括：一冷卻水箱、一水箱水循環泵、循環泵進水管及循環泵出水管，於貼近冷卻水箱底插伸出循環泵進水管，循環泵進水管再管接到水箱水循環泵進水口，從水箱水循環泵出水口再管接循環泵出水管穿伸囘冷卻水箱內對應冷卻水面上方，將散熱循環設備之繞管迴流箱除了空腔蓄水受溫導板外的所有部份，浸入冷卻水箱內冷卻水面下，使繞管迴流箱之傳熱鰭片及繞管受水包圍冷卻，又散熱循環設備之風扇裝設在冷卻水箱殼壁對應冷卻水面上方適當位置，由而冷卻水箱內之冷卻水不斷藉由水箱水循環泵抽流回 冷卻水箱內對應冷卻水面上方噴射迴流氣冷冷卻水，讓強制流動的冷卻水不斷快速冷卻傳熱鰭片及繞管者。 The cooling and heating cycle machine with semiconductor as the cooling core as described in claim 1, in addition to the electric water pump, the auxiliary temperature transmission equipment of the heat dissipation cycle equipment includes: a cooling water tank, a water tank water circulation pump, a circulating pump inlet pipe and Circulating pump outlet pipe, insert the extension pump inlet pipe close to the bottom of the cooling water tank, and then the circulation pump inlet pipe is connected to the water inlet of the water tank water circulation pump. From the water outlet of the water circulation pump, it is connected to the outlet of the circulation pump and goes back to the cooling water tank. Inside the cooling water surface, immerse all parts of the tube return tank of the heat dissipation circulation equipment except the cavity water storage and temperature receiving guide plate under the cooling water surface in the cooling water tank, so that the heat transfer fins of the tube return tank and the coil The tube is surrounded by water for cooling, and the fan of the heat dissipation circulation equipment is installed at an appropriate position above the cooling water surface of the cooling water tank shell, so that the cooling water in the cooling water tank is continuously pumped back by the water tank water circulation pump. In the cooling water tank, the returning air-cooled cooling water is sprayed above the corresponding cooling water surface, so that the forced-flow cooling water continuously and rapidly cools the heat transfer fins and the tube circulator. 如請求項1所述之以半導體為致冷核心之冷暖循環機，其中該電源供應兼溫控器為面板上設有電源開啟鍵、升降溫控制鍵及恆溫控制鍵之一主控介面器，以及面板上亦設有電源開啟鍵、升降溫控制鍵及恆溫控制鍵，以遙控主控介面器作動之副控介面器者。 The cooling and heating cycle machine with the semiconductor as the cooling core as described in claim 1, wherein the power supply and temperature controller is a main control interface provided with one of a power on key, a temperature control key and a thermostatic control key on the panel. And the panel is also provided with a power-on key, a temperature rise and fall control key and a constant temperature control key to remotely control the main control interface device to act as a secondary control interface device. 如請求項1所述之以半導體為致冷核心之冷暖循環機，其中該冷循環器之傳熱鰭片周圍所設之風扇為滾輪風扇者。 The cooling and heating cycle machine using the semiconductor as a cooling core as described in claim 1, wherein the fan set around the heat transfer fin of the cold cycler is a roller fan.
TW105122672A 2016-07-19 2016-07-19 To the semiconductor as the core of the cold and warm cycle machine TWI599713B (en)

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CN201610836466.4A CN106802020A (en) 2016-07-19 2016-09-21 Cold-warm circulating machine with semiconductor as refrigeration core
CN201621067263.5U CN206440031U (en) 2016-07-19 2016-09-21 Cold-warm circulating machine with semiconductor as refrigeration core
JP2017001155U JP3211172U (en) 2016-07-19 2017-03-16 Heating / cooling circulator with semiconductor as cooling core
US15/475,141 US10386085B2 (en) 2016-07-19 2017-03-31 Semiconductor-based air conditioning device
MYUI2017701298A MY182972A (en) 2016-07-19 2017-04-12 Semiconductor-based air conditioning device
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