TW201905399A - Multi-tube air conditioner including cooling chip wherein heat exchange with the liquid in the liquid pipeline is performed, such that the temperature of the air is reduced to form cold air, and a purpose of outputting the cold air is achieved - Google Patents

Multi-tube air conditioner including cooling chip wherein heat exchange with the liquid in the liquid pipeline is performed, such that the temperature of the air is reduced to form cold air, and a purpose of outputting the cold air is achieved

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Publication number
TW201905399A
TW201905399A TW106120969A TW106120969A TW201905399A TW 201905399 A TW201905399 A TW 201905399A TW 106120969 A TW106120969 A TW 106120969A TW 106120969 A TW106120969 A TW 106120969A TW 201905399 A TW201905399 A TW 201905399A
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Taiwan
Prior art keywords
liquid
heat exchange
air
space
exchange box
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TW106120969A
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Chinese (zh)
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林世軒
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林世軒
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Priority to TW106120969A priority Critical patent/TW201905399A/en
Publication of TW201905399A publication Critical patent/TW201905399A/en

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

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  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A multi-tube air conditioner including a cooling chip includes a box body with a hollow space, and including a partitioning plate with a plurality of perforations, which separates the hollow space into a first space and a second space, wherein one side of the box body located in the first space and the second space is provided with at least one air inlet hole and a plurality of air outlet holes; an air intake fan, which is located in the first space; a plurality of transport pipelines, which are located in the second space, and include a tube body, at least one gas pipeline and at least one liquid pipeline respectively, wherein two ends of the gas pipeline are respectively connected to the corresponding perforations and the air outlet holes, and a part or all of the liquid pipeline is located in the tube body; and a heat exchange box, wherein the liquid pipeline is connected to the heat exchange box via a high-temperature pipeline and a cooling pipeline to form a circulation loop. The heat exchange box includes a cooling chip capable of absorbing heat of the liquid in the heat exchange box; when air is drawn into the gas pipeline by the air intake fan, heat exchange with the liquid in the liquid pipeline is performed, such that the temperature of the air is reduced to form cold air, the cold air is outputted outwards from the air outlet holes, and accordingly, a purpose of outputting the cold air is achieved.

Description

包含致冷晶片的多管式空調機構  Multi-tube air conditioning mechanism including a cooling chip  

本發明係有關於空調機構，尤其是一種包含致冷晶片的多管式空調機構。 The present invention relates to an air conditioning mechanism, and more particularly to a multi-tube air conditioning mechanism including a cryogenic wafer.

習知之空調機，大部分應用冷媒來進行冷熱交換，整個系統相當複雜，而且在冷熱交換的過程需要相當多的管路，一方面進行空氣循環，一方面進行冷媒的循環，而且為達成有效的熱力循環，必須配置適當的裝置，因此整個機體相當的龐大，而且組件也多，相對的成本也相當的高。 Conventional air conditioners, most of which use refrigerant for cold and heat exchange, the whole system is quite complicated, and the process of hot and cold exchange requires quite a lot of pipelines, on the one hand, air circulation, on the one hand, the circulation of refrigerant, and in order to achieve effective The thermodynamic cycle must be equipped with appropriate devices, so the entire body is quite large, and there are many components, and the relative cost is also quite high.

近代由於積體電路的進步，致冷晶片已經被研發出來，該致冷晶片應用電子方式可以達成晶片兩側有效的熱交換，其作業程序相當簡單，所以可以應用簡單的配置方式達到以往複雜熱力循環相同的功效。而且致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能。惟如果單純的以致冷晶片進行熱交換，仍然會有交換效率不高的問題。 In modern times, due to the advancement of integrated circuits, cryogenic wafers have been developed. The cooled wafers can be electronically exchanged to achieve efficient heat exchange on both sides of the wafer. The operating procedure is quite simple, so simple configuration can be applied to achieve complex heat in the past. Loop the same effect. Moreover, the power consumed by the cooling chip is much smaller than that of the conventional air conditioner using a compressor or the like. However, if the cold wafer is simply exchanged for heat exchange, there will still be a problem that the exchange efficiency is not high.

故本案希望提出一種嶄新的包含致冷晶片的多管式空調機構，係基於致冷晶片作為熱交換媒介的原理，以達到低耗 能下即可達到有效的熱交換的目的，以解決上述先前技術上的缺陷。 Therefore, this case hopes to propose a brand-new multi-tube air conditioning mechanism containing a cooling chip, based on the principle of using a cold-storing wafer as a heat exchange medium, so as to achieve effective heat exchange at low energy consumption to solve the above-mentioned previous Technical flaws.

所以本發明的目的係為解決上述習知技術上的問題，本發明中提出一種包含致冷晶片的多管式空調機構，係在箱體內配置氣體管路及液體管路，並將致冷晶片配置在液體管路所連通的一熱交換箱上，而經由該致冷晶片吸收該熱交換箱內填充的液體之熱量，而冷卻流經位於該熱交換箱之液體管路內的液體，而進一步與氣體管路內的空氣進行熱交換，使得該氣體管路內的空氣冷卻，而可以令該箱體輸出冷氣。再者本案也可以在熱交換箱上配置電熱管而使得熱交換的方向相反，而加熱該氣體管路內的空氣，使得該箱體可以輸出暖氣。本案中採用多個輸送管路並聯該熱交換箱，而將氣體管路與對應的液體管路配置在對應的輸送管路中，可達到最佳的熱交換效率。再者致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能，因此本案也可以達到節能的目的。 Therefore, the object of the present invention is to solve the above-mentioned problems in the prior art. In the present invention, a multi-tube air conditioning mechanism including a refrigerating wafer is provided, in which a gas line and a liquid line are disposed in a tank, and a cooling chip is disposed. Arranging on a heat exchange box connected to the liquid line, and absorbing heat of the liquid filled in the heat exchange box through the refrigerating wafer, and cooling the liquid flowing through the liquid line in the heat exchange box, and Further, heat exchange is performed with the air in the gas pipeline to cool the air in the gas pipeline, and the cabinet can output cold air. Furthermore, in the present case, the electric heating tube may be disposed on the heat exchange box so that the heat exchange direction is reversed, and the air in the gas line is heated, so that the box can output the heating. In the present case, a plurality of delivery lines are used in parallel to the heat exchange box, and the gas line and the corresponding liquid line are disposed in the corresponding delivery lines to achieve optimal heat exchange efficiency. Furthermore, the power consumed by the cooled wafer is much smaller than that of the conventional air conditioner using a compressor, etc., so the present case can also achieve the purpose of energy saving.

為達到上述目的本發明中提出一種包含致冷晶片的多管式空調機構，包含：一箱體，具有中空空間，該箱體包含一隔板位於該中空空間內，而將該中空空間分隔為第一空間及第二空間；其中該隔板上形成多個穿孔；其中該箱體位於該 第一空間的一側形成至少一進氣口，該箱體位於該第二空間的一側形成多個出氣孔；一電源位於該箱體外部，用於提供電力；一進氣扇，以可旋轉的方式配置於該第一空間內，該進氣扇連結該電源；當該電源驅動該進氣扇旋轉時，該進氣扇即會將該箱體外部的空氣經由該進氣口抽入該第一空間內，並驅動空氣流動到該隔板處，而經由該隔板上的該穿孔輸入該第二空間內；多個輸送管路位於該第二空間內，各該輸送管路包含一管體、至少一氣體管路及至少一液體管路；其中該氣體管路位於該管體內，其一端連接於該隔板上對應的穿孔，另一端連接於對應的出氣孔；來自該第一空間的空氣係從該隔板上的各該穿孔輸入對應的氣體管路，再經由對應之出氣孔輸出該箱體外；其中該液體管路的部分或全部係位於該管體內；該液體管路內具有液體；一熱交換箱具有中空結構，位於該第二空間內，其中各該輸送管路的該液體管路的第一開口及第二開口包含高溫管路及冷卻管路，係延伸到該管體外而連接該熱交換箱，使得液體可經由該液體管路的高溫管路輸入該熱交換箱，再從該熱交換箱經由該冷卻管路回流到該液體管路內，而形成一循環迴路；其中該熱交換箱為可冷卻之結構；該熱交換箱包含一致冷晶片位於該熱交換箱的一端，該致冷晶片連接該電源，當該致冷晶片通電時，可吸收該熱交換箱內的液體所傳遞出來的熱量，使得該熱交換箱內的液體溫度降低；其中當空氣進入該氣體管路時，會與 該液體管路內的液體進行熱交換，而將該空氣的熱能傳遞到該液體管路內的液體。 In order to achieve the above object, a multi-tube air conditioning mechanism including a refrigerating wafer is provided in the present invention, comprising: a box having a hollow space, the box comprising a partition in the hollow space, and separating the hollow space into a first space and a second space; wherein the partition is formed with a plurality of perforations; wherein the box is located at one side of the first space to form at least one air inlet, and the box is located at one side of the second space An air outlet; a power source is located outside the cabinet for supplying electric power; an air intake fan is rotatably disposed in the first space, the air intake fan is connected to the power source; and when the power source drives the air inlet When the fan rotates, the air intake fan draws air outside the box into the first space via the air inlet, and drives air to flow to the partition through the perforation on the partition a plurality of delivery lines are located in the second space, each of the delivery lines includes a tube body, at least one gas line, and at least one liquid line; wherein the gas line is located in the tube body One end of which is connected to the partition Corresponding perforations, the other end is connected to the corresponding air outlet; the air from the first space is input into the corresponding gas pipeline from each of the perforations on the partition, and then output to the outside of the box through the corresponding air outlet; Part or all of the liquid line is located in the tube; the liquid line has a liquid therein; and a heat exchange box has a hollow structure, located in the second space, wherein the liquid line of each of the transfer lines is first The opening and the second opening comprise a high temperature pipeline and a cooling pipeline extending outside the tube to connect the heat exchange box, so that liquid can be input into the heat exchange box through the high temperature pipeline of the liquid pipeline, and then the heat exchange is performed The tank is returned to the liquid line via the cooling line to form a circulation loop; wherein the heat exchange box is a coolable structure; the heat exchange box includes a uniform cold wafer at one end of the heat exchange box, the refrigeration The wafer is connected to the power source, and when the cooling chip is energized, the heat transferred by the liquid in the heat exchange box can be absorbed, so that the temperature of the liquid in the heat exchange box is lowered; wherein when the air enters When the gas pipeline, will exchange heat with the liquid within the liquid conduit, the heat in the air is transferred to the liquid in the liquid conduit.

由下文的說明可更進一步瞭解本發明的特徵及其優點，閱讀時並請參考附圖。 The features of the present invention and its advantages are further understood from the following description, and reference is made to the accompanying drawings.

10‧‧‧箱體 10‧‧‧ cabinet

11‧‧‧第一空間 11‧‧‧First space

12‧‧‧第二空間 12‧‧‧Second space

20‧‧‧隔板 20‧‧‧Baffle

21‧‧‧穿孔 21‧‧‧Perforation

30‧‧‧電源 30‧‧‧Power supply

35‧‧‧開關 35‧‧‧ switch

40‧‧‧進氣扇 40‧‧‧Intake fan

50‧‧‧輸送管路 50‧‧‧Transportation line

52‧‧‧管體 52‧‧‧ tube body

54‧‧‧氣體管路 54‧‧‧ gas pipeline

56‧‧‧液體管路 56‧‧‧Liquid line

57‧‧‧高溫管路 57‧‧‧High temperature pipeline

58‧‧‧冷卻管路 58‧‧‧Cooling line

60‧‧‧散熱鰭片 60‧‧‧heat fins

70‧‧‧熱交換箱 70‧‧‧Heat exchange box

72‧‧‧致冷晶片 72‧‧‧Chilled wafer

74‧‧‧風扇 74‧‧‧fan

80‧‧‧循環馬達 80‧‧‧Circuit motor

81‧‧‧葉輪 81‧‧‧ Impeller

90‧‧‧電熱管 90‧‧‧Electric heat pipe

100‧‧‧控制器 100‧‧‧ Controller

105‧‧‧計時器 105‧‧‧Timer

110‧‧‧進氣口 110‧‧‧air inlet

120‧‧‧出氣孔 120‧‧‧ Vents

561‧‧‧第一開口 561‧‧‧ first opening

562‧‧‧第二開口 562‧‧‧second opening

圖1顯示本案之元件組合示意圖。 Figure 1 shows a schematic diagram of the component combinations of the present case.

圖2顯示本案之輸送管路及熱交換箱之配置關係示意圖。 Figure 2 is a schematic view showing the arrangement relationship of the conveying pipe and the heat exchange box in the present case.

圖3顯示圖2之剖面示意圖。 Figure 3 shows a schematic cross-sectional view of Figure 2.

圖4顯示本案之元件組合之側視示意圖。 Figure 4 shows a side view of the component combination of the present invention.

圖5之截面圖顯示本案之氣體管路及液體管路之另一配置方式。 Figure 5 is a cross-sectional view showing another configuration of the gas and liquid lines of the present invention.

圖6之截面圖顯示本案之氣體管路及液體管路之再一配置方式。 Figure 6 is a cross-sectional view showing another arrangement of the gas and liquid lines of the present invention.

圖7之截面圖顯示本案之氣體管路及液體管路之又一配置方式。 Figure 7 is a cross-sectional view showing another arrangement of the gas and liquid lines of the present invention.

茲謹就本案的結構組成，及所能產生的功效與優點，配合圖式，舉本案之一較佳實施例詳細說明如下。 In view of the structural composition of the case, and the functions and advantages that can be produced, in conjunction with the drawings, a preferred embodiment of the present invention is described in detail below.

請參考圖1至圖7所示，顯示本發明之包含致冷晶片的多管式空調機構，包含下列元件： Referring to FIG. 1 to FIG. 7, a multi-tube air conditioner including a refrigerating wafer of the present invention is shown, which comprises the following components:

一箱體10，具有中空空間，該箱體10包含一隔板20位於該中空空間內，而將該中空空間分隔為第一空間11及第二空間12。其中該隔板20上形成多個穿孔21。 A case 10 has a hollow space, and the case 10 includes a partition 20 located in the hollow space, and the hollow space is partitioned into a first space 11 and a second space 12. A plurality of through holes 21 are formed in the partition plate 20.

其中該箱體10位於該第一空間11的一側形成至少一進氣口110，該箱體10位於該第二空間12的一側形成多個出氣孔120。其中該進氣口110可以是孔狀或網狀結構。 The casing 10 is located at one side of the first space 11 to form at least one air inlet 110, and the casing 10 is formed at a side of the second space 12 to form a plurality of air outlets 120. The air inlet 110 may be a hole or a mesh structure.

一電源30位於該箱體10外部，用於提供電力，如圖4所示。 A power source 30 is external to the housing 10 for providing power, as shown in FIG.

一進氣扇40，以可旋轉的方式配置於該第一空間11內，該進氣扇40連結該電源30。當該電源30驅動該進氣扇40旋轉時，該進氣扇40即會將該箱體10外部的空氣經由該進氣口110抽入該第一空間11內，並驅動空氣流動到該隔板20處，而經由該隔板20上的該穿孔21輸入該第二空間12內。 An intake fan 40 is rotatably disposed in the first space 11, and the intake fan 40 is coupled to the power source 30. When the power source 30 drives the intake fan 40 to rotate, the air intake fan 40 draws air outside the casing 10 into the first space 11 via the air inlet 110, and drives air to flow to the partition. At the plate 20, the perforation 21 on the partition 20 is introduced into the second space 12.

多個輸送管路50位於該第二空間12內，各該輸送管路50包含一管體52、至少一氣體管路54及至少一液體管路56。其中該氣體管路54位於該管體52內，其一端連接於該隔板20上對應的穿孔21，另一端連接於對應的出氣孔120。來自該第一空間11的空氣係從該隔板20上的各該穿孔21輸入對應的氣體管路54，再經由對應之出氣孔120輸出該箱體10外。 A plurality of delivery lines 50 are located in the second space 12, and each of the delivery lines 50 includes a tube body 52, at least one gas line 54 and at least one liquid line 56. The gas line 54 is located in the tube body 52, and one end thereof is connected to the corresponding through hole 21 of the partition plate 20, and the other end is connected to the corresponding air outlet hole 120. The air from the first space 11 is input into the corresponding gas line 54 from each of the perforations 21 on the partition 20, and is outputted to the outside of the casing 10 via the corresponding air outlet 120.

其中該液體管路56的部分或全部係位於該管體52內，且較佳者該液體管路56貼近於該氣體管路54的一側，而沿著該氣體管路54的一側延伸。該液體管路56內具有液體。較佳者該液體為水或油。其中該液體可加入金屬粉末以增加熱傳導。 Wherein some or all of the liquid line 56 is located within the tube body 52, and preferably the liquid line 56 is adjacent to one side of the gas line 54 and extends along one side of the gas line 54. . The liquid line 56 has a liquid therein. Preferably, the liquid is water or oil. Wherein the liquid can be added to the metal powder to increase heat transfer.

為達到高的熱傳效果，該氣體管路54可具有不同的配置方式。如圖2中所示，該氣體管路54形成彎曲折管的型態，以增加其一側與該液體管路56的接觸面積。本案中該氣體管路54及該液體管路56可具有各種不同的配置方式，比如該輸送管路50可以同時包含多個氣體管路54及液體管路56(如圖5所示)；或者該輸送管路50的該氣體管路54可包覆該液體管路56(如圖6所示)、或者該輸送管路50的液體管路56也可包覆氣體管路54(如圖7所示)。 To achieve a high heat transfer effect, the gas line 54 can have a different configuration. As shown in FIG. 2, the gas line 54 forms a curved tube shape to increase the contact area of one side with the liquid line 56. In this case, the gas line 54 and the liquid line 56 can have various configurations. For example, the delivery line 50 can include a plurality of gas lines 54 and a liquid line 56 (as shown in FIG. 5); or The gas line 54 of the delivery line 50 can cover the liquid line 56 (as shown in FIG. 6), or the liquid line 56 of the delivery line 50 can also cover the gas line 54 (see FIG. 7). Shown).

一熱交換箱70具有中空結構，位於該第二空間12內，其中各該輸送管路50的該液體管路56的第一開口561及第二開口562包含高溫管路57及冷卻管路58，係延伸到該管體52外而連接該熱交換箱70，使得液體可經由該液體管路56的高溫管路57輸入該熱交換箱70，再從該熱交換箱70經由該冷卻管路58回流到該液體管路56內，而形成一循環迴路(如圖2及圖3所示)。其中該熱交換箱70為可冷卻之結構。該熱交換箱70包含一致冷晶片72位於該熱交換箱70的一端， 該致冷晶片72連接該電源30，當該致冷晶片72通電時，可吸收該熱交換箱70內的液體所傳遞出來的熱量，使得該熱交換箱70內的液體溫度降低。 A heat exchange box 70 has a hollow structure and is located in the second space 12, wherein the first opening 561 and the second opening 562 of the liquid line 56 of each of the conveying lines 50 comprise a high temperature line 57 and a cooling line 58. Extending outside the tube body 52 to connect the heat exchange box 70, so that liquid can be input to the heat exchange box 70 via the high temperature line 57 of the liquid line 56, and then from the heat exchange box 70 via the cooling line. 58 is returned to the liquid line 56 to form a circulation loop (as shown in Figures 2 and 3). The heat exchange box 70 is a structure that can be cooled. The heat exchange tank 70 includes a uniform cold wafer 72 at one end of the heat exchange tank 70. The refrigerant wafer 72 is connected to the power source 30. When the refrigerant wafer 72 is energized, the liquid in the heat exchange tank 70 can be absorbed. The heat generated causes the temperature of the liquid in the heat exchange tank 70 to decrease.

如圖4所示，其中當空氣進入該氣體管路54時，會與該液體管路56內的液體進行熱交換，而將該空氣的熱能傳遞到該液體管路56內的液體。當該液體管路56內的液體輸入該熱交換箱70時，液體的熱量即經由該熱交換箱70傳遞到該至少一致冷晶片72。因此使得該空氣的溫度降低形成冷空氣，而從該出氣孔120向外輸出，達到輸出冷氣的目的。 As shown in FIG. 4, when air enters the gas line 54, heat is exchanged with the liquid in the liquid line 56, and the heat energy of the air is transferred to the liquid in the liquid line 56. When liquid in the liquid line 56 is introduced into the heat exchange tank 70, heat of the liquid is transferred to the at least uniform cold wafer 72 via the heat exchange tank 70. Therefore, the temperature of the air is lowered to form cold air, and is outputted outward from the air outlet 120 to achieve the purpose of outputting cold air.

較佳者，該第二空間12內部可抽真空而形成真空狀態，以令該輸送管路50達到更好的熱傳效果。 Preferably, the interior of the second space 12 can be evacuated to form a vacuum state to achieve a better heat transfer effect of the delivery line 50.

該熱交換箱70內尚可設有一散熱鰭片60位於該致冷晶片72的一側，如圖2所示。該散熱鰭片60用於增加該熱交換箱70與內部液體的接觸面積，而提高散熱效果。 A heat dissipating fin 60 may be disposed in one side of the refrigerating wafer 72 in the heat exchange box 70, as shown in FIG. The heat dissipation fins 60 are used to increase the contact area of the heat exchange box 70 with the internal liquid, thereby improving the heat dissipation effect.

該熱交換箱70尚可包含一風扇74位於該致冷晶片72的另一側，且位於該熱交換箱70的外側。該風扇74用於對該致冷晶片72進行散熱。 The heat exchange box 70 may further include a fan 74 on the other side of the refrigerant chip 72 and located outside the heat exchange box 70. The fan 74 is used to dissipate heat from the cooled wafer 72.

一循環馬達80連接該電源30，配置於該熱交換箱70內，該循環馬達80連接葉輪81。當該循環馬達80驅動該葉輪81旋轉時，可以攪拌該熱交換箱70的液體，使得該熱交換箱 70的液體產生適當的循環流動。 A circulation motor 80 is connected to the power source 30 and disposed in the heat exchange box 70. The circulation motor 80 is connected to the impeller 81. When the circulation motor 80 drives the impeller 81 to rotate, the liquid of the heat exchange tank 70 can be stirred, so that the liquid of the heat exchange tank 70 generates an appropriate circulating flow.

該熱交換箱70尚可包含一電熱管90位於該熱交換箱70內。當配置該電熱管90時，則不需要該致冷晶片72。該電熱管90連接該電源30，係用於產生熱能。而將熱能傳導到該熱交換箱70內的液體，使得該液體被加熱，當經加熱的液體回流到該液體管路56內時，即將熱量傳遞到該氣體管路54內部的空氣，因此令該空氣的溫度升高形成暖空氣，而從該出氣孔120向外輸出，而達到輸出暖氣的目的。 The heat exchange box 70 may further include an electric heating tube 90 located in the heat exchange box 70. When the electric heating tube 90 is disposed, the refrigerating wafer 72 is not required. The electric heating tube 90 is connected to the power source 30 for generating thermal energy. The heat is conducted to the liquid in the heat exchange tank 70 such that the liquid is heated, and when the heated liquid is returned to the liquid line 56, heat is transferred to the air inside the gas line 54, thus The temperature of the air rises to form warm air, and is outputted outward from the air outlet 120 to achieve the purpose of outputting the heating.

其中該進氣扇40、該循環馬達80、該致冷晶片72、該風扇74、該電熱管90係分別經由一開關35連接該電源30，如圖4所示。 The intake fan 40, the circulation motor 80, the refrigerating wafer 72, the fan 74, and the electric heating tube 90 are respectively connected to the power source 30 via a switch 35, as shown in FIG.

一控制器100，以有線或無線的方式連接該進氣扇40、該循環馬達80、該致冷晶片72、該風扇74、該電熱管90所對應之開關35。該控制器100用於控制該開關35，而控制該進氣扇40、該循環馬達80、該致冷晶片72、該風扇74、該電熱管90的運作方式，而達到控制風量及溫度的目的。較佳者，該控制器100包含一計時器105，用於在設定的時段開啟或關閉對應之開關35。 A controller 100 connects the intake fan 40, the circulation motor 80, the refrigerating wafer 72, the fan 74, and the switch 35 corresponding to the electric heating tube 90 in a wired or wireless manner. The controller 100 is used to control the switch 35, and control the operation mode of the intake fan 40, the circulation motor 80, the refrigerating chip 72, the fan 74, and the electric heating tube 90 to achieve the purpose of controlling the air volume and temperature. . Preferably, the controller 100 includes a timer 105 for turning the corresponding switch 35 on or off for a set period of time.

本案的優點在於在箱體內配置氣體管路及液體管路，並將致冷晶片配置在液體管路所連通的一熱交換箱上，而經由該致冷晶片吸收該熱交換箱內填充的液體之熱量，而冷卻流 經位於該熱交換箱之液體管路內的液體，而進一步與氣體管路內的空氣進行熱交換，使得該氣體管路內的空氣冷卻，而可以令該箱體輸出冷氣。再者本案也可以在熱交換箱上配置電熱管而使得熱交換的方向相反，而加熱該氣體管路內的空氣，使得該箱體可以輸出暖氣。本案中採用多個輸送管路並聯該熱交換箱，而將氣體管路與對應的液體管路配置在對應的輸送管路中，可達到最佳的熱交換效率。再者致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能，因此本案也可以達到節能的目的。 The advantage of the present invention is that a gas pipeline and a liquid pipeline are disposed in the tank body, and the refrigerant wafer is disposed on a heat exchange box connected to the liquid pipeline, and the liquid filled in the heat exchange tank is absorbed through the refrigerant wafer. Heat, while cooling flows through the liquid in the liquid line of the heat exchange box, and further exchanges heat with the air in the gas line, so that the air in the gas line is cooled, and the box can be outputted Air conditioning. Furthermore, in the present case, the electric heating tube may be disposed on the heat exchange box so that the heat exchange direction is reversed, and the air in the gas line is heated, so that the box can output the heating. In the present case, a plurality of delivery lines are used in parallel to the heat exchange box, and the gas line and the corresponding liquid line are disposed in the corresponding delivery lines to achieve optimal heat exchange efficiency. Furthermore, the power consumed by the cooled wafer is much smaller than that of the conventional air conditioner using a compressor, etc., so the present case can also achieve the purpose of energy saving.

綜上所述，本案人性化之體貼設計，相當符合實際需求。其具體改進現有缺失，相較於習知技術明顯具有突破性之進步優點，確實具有功效之增進，且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上，已符合專利法規定。 In summary, the humanized design of this case is quite in line with actual needs. The specific improvement of the existing defects is obviously a breakthrough improvement advantage compared with the prior art, and it has an improvement in efficacy and is not easy to achieve. The case has not been disclosed or disclosed in domestic and foreign literature and market, and has complied with the provisions of the Patent Law.

上列詳細說明係針對本發明之一可行實施例之具體說明，惟該實施例並非用以限制本發明之專利範圍，凡未脫離本發明技藝精神所為之等效實施或變更，均應包含於本案之專利範圍中。 The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.

Claims (10)

一種包含致冷晶片的多管式空調機構，包含：一箱體，具有中空空間，該箱體包含一隔板位於該中空空間內，而將該中空空間分隔為第一空間及第二空間；其中該隔板上形成多個穿孔；其中該箱體位於該第一空間的一側形成至少一進氣口，該箱體位於該第二空間的一側形成多個出氣孔；一電源位於該箱體外部，用於提供電力；一進氣扇，以可旋轉的方式配置於該第一空間內，該進氣扇連結該電源；當該電源驅動該進氣扇旋轉時，該進氣扇即會將該箱體外部的空氣經由該進氣口抽入該第一空間內，並驅動空氣流動到該隔板處，而經由該隔板上的該穿孔輸入該第二空間內；多個輸送管路位於該第二空間內，各該輸送管路包含一管體、至少一氣體管路及至少一液體管路；其中該氣體管路位於該管體內，其一端連接於該隔板上對應的穿孔，另一端連接於對應的出氣孔；來自該第一空間的空氣係從該隔板上的各該穿孔輸入對應的氣體管路，再經由對應之出氣孔輸出該箱體外；其中該液體管路的部分或全部係位於該管體內；該液體管路內具有液體； 一熱交換箱具有中空結構，位於該第二空間內，其中各該輸送管路的該液體管路的第一開口及第二開口包含高溫管路及冷卻管路，係延伸到該管體外而連接該熱交換箱，使得液體可經由該液體管路的高溫管路輸入該熱交換箱，再從該熱交換箱經由該冷卻管路回流到該液體管路內，而形成一循環迴路；其中該熱交換箱為可冷卻之結構；該熱交換箱包含一致冷晶片位於該熱交換箱的一端，該致冷晶片連接該電源，當該致冷晶片通電時，可吸收該熱交換箱內的液體所傳遞出來的熱量，使得該熱交換箱內的液體溫度降低；其中當空氣進入該氣體管路時，會與該液體管路內的液體進行熱交換，而將該空氣的熱能傳遞到該液體管路內的液體。  A multi-tube air conditioner comprising a cooling chip, comprising: a box having a hollow space, the box comprising a partition in the hollow space, and separating the hollow space into a first space and a second space; Wherein the partition is formed with a plurality of perforations; wherein the casing is located at one side of the first space to form at least one air inlet, and the casing is located at one side of the second space to form a plurality of air outlets; The outside of the casing is for supplying electric power; an air intake fan is rotatably disposed in the first space, the air intake fan is connected to the power source; and when the power source drives the air intake fan to rotate, the air intake fan That is, the air outside the box is drawn into the first space through the air inlet, and the driving air is flowed to the partition, and the second space is input through the perforation on the partition; The conveying pipeline is located in the second space, each of the conveying pipelines comprises a pipe body, at least one gas pipe and at least one liquid pipeline; wherein the gas pipeline is located in the pipe body, and one end thereof is connected to the partition plate Corresponding perforations, the other end is connected to the pair The air outlet from the first space is input into the corresponding gas pipeline from each of the perforations on the partition, and is output to the outside of the tank through the corresponding air outlet; wherein part or all of the liquid pipeline is located The inside of the tube; the liquid line has a liquid; a heat exchange box has a hollow structure, and is located in the second space, wherein the first opening and the second opening of the liquid line of each of the conveying lines comprise a high temperature line And a cooling line extending outside the tube to connect the heat exchange box, so that liquid can be input into the heat exchange box through the high temperature line of the liquid line, and then returned from the heat exchange box through the cooling line to the Forming a circulation loop in the liquid line; wherein the heat exchange box is a coolable structure; the heat exchange box includes a uniform cold wafer at one end of the heat exchange box, and the refrigerant chip is connected to the power source when the refrigeration When the wafer is energized, the heat transferred by the liquid in the heat exchange box can be absorbed, so that the temperature of the liquid in the heat exchange box is lowered; wherein when the air enters the gas line, the liquid tube is Liquid in heat exchange, the heat in the air is transferred to the liquid in the liquid conduit.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該液體管路貼近於該氣體管路的一側，而沿著該氣體管路的一側延伸。  A multi-tube air conditioner comprising a refrigerant chip according to claim 1, wherein the liquid line is adjacent to one side of the gas line and extends along one side of the gas line.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該液體為水或油。  A multi-tube air conditioner comprising a refrigerant chip according to claim 1, wherein the liquid is water or oil.   如申請專利範圍第3項所述之包含致冷晶片的多管式空調機構，其中該液體中加入金屬粉末以增加熱傳導。  A multi-tube air conditioner comprising a refrigerant chip according to claim 3, wherein metal powder is added to the liquid to increase heat conduction.   如申請專利範圍第1項所述之包含致冷晶片的多管式 空調機構，其中該氣體管路形成彎曲折管的型態，以增加其一側與該液體管路的接觸面積。  A multi-tube air conditioner comprising a refrigerant chip according to claim 1, wherein the gas line forms a bent tube shape to increase a contact area of one side with the liquid line.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該熱交換箱內設有一散熱鰭片位於該致冷晶片的一側；該散熱鰭片用於增加該熱交換箱與內部液體的接觸面積，而提高散熱效果。  The multi-tube air conditioner comprising a cooling chip according to claim 1, wherein the heat exchange box is provided with a heat dissipating fin on one side of the refrigerating wafer; the heat dissipating fin is used to increase the heat The contact area of the exchange box with the internal liquid improves the heat dissipation effect.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該熱交換箱尚包含一風扇位於該致冷晶片的另一側，且位於該熱交換箱的外側；該風扇用於對該致冷晶片進行散熱。  The multi-tube air conditioning mechanism including a refrigerating wafer according to claim 1, wherein the heat exchange box further comprises a fan on the other side of the refrigerating wafer and located outside the heat exchange box; A fan is used to dissipate heat from the cooled wafer.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，尚包含一循環馬達連接該電源，配置於該熱交換箱內，該循環馬達連接葉輪。  The multi-tube air conditioner including the refrigerating chip according to claim 1 further includes a circulation motor connected to the power source and disposed in the heat exchange box, the circulation motor being connected to the impeller.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該熱交換箱尚包含一電熱管位於該熱交換箱內；該電熱管連接該電源，係用於產生熱能；而將熱能傳導到該熱交換箱內的液體，使得該液體被加熱。  The multi-tube air conditioner comprising a cooling chip according to claim 1, wherein the heat exchange box further comprises an electric heating tube located in the heat exchange box; the electric heating tube is connected to the power source for generating heat energy And transferring the thermal energy to the liquid in the heat exchange box so that the liquid is heated.   如申請專利範圍第1項所述之包含致冷晶片的多管式空調機構，其中該第二空間內部係為真空狀態，以令該輸送管路達到更好的熱傳效果。  The multi-tube air conditioner comprising a refrigerant chip according to claim 1, wherein the second space is in a vacuum state to achieve a better heat transfer effect.  
TW106120969A 2017-06-23 2017-06-23 Multi-tube air conditioner including cooling chip wherein heat exchange with the liquid in the liquid pipeline is performed, such that the temperature of the air is reduced to form cold air, and a purpose of outputting the cold air is achieved TW201905399A (en)

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