CN213811314U - Refrigeration chip air conditioning heat pump structure - Google Patents
Refrigeration chip air conditioning heat pump structure Download PDFInfo
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- CN213811314U CN213811314U CN202022123253.1U CN202022123253U CN213811314U CN 213811314 U CN213811314 U CN 213811314U CN 202022123253 U CN202022123253 U CN 202022123253U CN 213811314 U CN213811314 U CN 213811314U
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- temperature
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- refrigeration chip
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Abstract
The utility model discloses a refrigeration chip air conditioning heat pump structure, including a water tank and a high heat conduction efficiency samming board and a refrigeration chip, and a heat dissipation tower, and a fan, and a temperature controller, and a thermal-insulated cotton, and a bolt shell, and a transformer, and a fan speed regulator, the utility model discloses a combination of refrigeration chip and high heat conduction board, simple externally hung, insert the water and can use, easy operation, convenient to use can use at air conditioning and hot water manufacturing machine to reach required temperature or the requirement comfort of temperature.
Description
Technical Field
The utility model relates to a can be used to pass through high conduction heat mode, the cooperation sees through the cold and hot conversion of refrigeration chip, produces the heat pump effect, can produce a refrigeration chip air conditioning heat pump structure of air conditioning and hot water simultaneously.
Background
The cold and hot technology of household appliances always stays at compressor cold air, on one hand, a large amount of electric energy is consumed, on the other hand, the compressor cold air is huge in size and cannot be conveniently carried or moved, and the light miniature cold air sold in the market cannot effectively reduce the temperature of the cold air, so that the light miniature cold air is considered as a toy and cannot be popularized, and therefore, the design of a refrigeration chip cold air heat pump structure is a problem which needs to be solved urgently by technical personnel in the related field.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a technical scheme does: a refrigeration chip air conditioning heat pump structure comprises a water tank, a heat pump and a heat pump, wherein room temperature water or low temperature water can be filled in the water tank;
the high heat conduction efficiency temperature-equalizing plate can be partially and directly inserted into the water tank for cooling or heating;
one side of the refrigeration chip is tightly combined with the temperature equalizing plate with high heat conduction efficiency;
one side of the heat dissipation tower is tightly combined with one side of the refrigeration chip, which is far away from the temperature equalization plate with high heat conduction efficiency;
the fan is locked on the heat dissipation tower through screws and blows wind to the heat dissipation tower;
the temperature controller is connected with the water body through the temperature sensor and can automatically control the required temperature;
the heat insulation cotton coats the surface of the temperature equalizing plate with high heat conduction efficiency exposed in the air;
the pin shell is arranged in the water tank, one end of the pin shell can be inserted by the high-heat-conduction-efficiency temperature equalizing plate, and the pin shell can uniformly conduct heat into water;
and a transformer, the transformer can step down 110V or 220V AC power to 12V for the power of the refrigeration chip or fan and temperature controller;
and the fan speed regulator is electrically connected with the fan and is used for regulating the air volume to control the temperature and the blowing-out distance of air.
As an improvement, the pin shell is obliquely arranged at the bottom of the water tank, and one end of the temperature equalizing plate with high heat conduction efficiency is obliquely inserted.
As an improvement, the top of the water tank is provided with a water injection hole communicated with the inside of the water tank.
After the structure more than adopting, the utility model has the advantages of as follows: the utility model discloses a combination of refrigeration chip and high heat conduction board, simple external, it can use to insert the water, easy operation, and convenient to use can use at air conditioning and hot water making machine to reach the required temperature or the requirement comfort of temperature.
Drawings
Fig. 1 is a schematic structural view of a cold and heat engine main body in a refrigeration chip cold and air heat pump structure of the present invention.
Fig. 2 is a schematic view of the connection structure between the refrigeration chip air conditioning heat pump structure and the water tank of the present invention.
As shown in the figure: 1. the heat-insulation water tank comprises a water tank, 2 parts of a high-heat-conduction-efficiency temperature-equalizing plate, 3 parts of a refrigeration chip, 4 parts of a heat-dissipation tower, 5 parts of a fan, 6 parts of a temperature controller, 7 parts of heat-insulation cotton, 8 parts of a plug pin shell, 9 parts of a transformer, 10 parts of a fan speed regulator, 11 parts of a water injection hole.
Detailed Description
With reference to the attached drawings, the refrigeration chip cold air heat pump structure comprises a water tank 1, wherein room temperature water or low temperature water can be filled in the water tank;
the high heat conduction efficiency temperature-equalizing plate 2 can be partially and directly inserted into the water tank for cooling or heating;
the refrigeration chip 3, one side of the refrigeration chip 3 is closely combined with the temperature-equalizing plate 2 with high heat conduction efficiency;
one side of the heat dissipation tower 4 is tightly combined with one side of the refrigeration chip 3, which is far away from the temperature equalization plate 2 with high heat conduction efficiency;
the fan 5 is locked on the heat dissipation tower 4 through screws and blows wind to the heat dissipation tower 4;
the temperature controller 6 is connected with the water body through a temperature sensor, so that the required temperature can be automatically controlled;
the heat insulation cotton 7 is used for coating the surface of the temperature equalizing plate 2 with high heat conduction efficiency exposed in the air;
the pin shell 8 is arranged in the water tank 1, one end of the pin shell 8 can be inserted by the uniform temperature plate 2 with high heat conduction efficiency, and the uniform heat conduction is carried out in water;
and a transformer 9, the transformer 9 step-down converts 110V or 220V AC into 12V for the power supply of the refrigeration chip or fan and temperature controller;
and a fan speed regulator 10, the said fan speed regulator is connected with fan electricity, adjust the magnitude of the wind rate to control the temperature and blow out distance of the wind.
As a preferred embodiment of this embodiment, the latch case 8 is obliquely installed at the bottom of the water tank 1, and one end of the high heat transfer efficiency vapor chamber 2 is obliquely inserted.
As the preferred embodiment of the embodiment, the top of the water tank 1 is provided with a water injection hole 11 communicated with the inside of the water tank.
The utility model has the advantages that the structure main body is a high-heat-conduction temperature equalizing plate, the high conduction can dissipate heat, the air-conditioning air outlet can be 3-5 degrees lower than the room temperature, if ice blocks are added into water, the air-conditioning air outlet can be cooled by 6-10 degrees, the miniature air conditioner can be used for half an hour to one hour, and the generated four liters of hot water can be used for bathing and washing the face;
when the high-heat-conduction-efficiency temperature-equalizing plate is inserted into the pin shell and the water tank is used, the part of the pin shell in the water tank can be slightly obliquely arranged, so that the high-heat-conduction-efficiency temperature-equalizing plate is obliquely inserted, the efficiency of heat conduction of the high-heat-conduction-efficiency temperature-equalizing plate into water is improved along the heat rising principle, a refrigerating chip mounting space is reserved in the part of the high-heat-conduction-efficiency temperature-equalizing plate exposed to the air, the high-heat-conduction-efficiency temperature-equalizing plate is tightly connected with a heat dissipation tower through a back plate and screws, the rest surfaces are coated with EVA heat insulation cotton to prevent heat energy from leaking, and the heat energy only flows on a heat conduction plate as much as possible;
the automatic temperature controller is attached to the water tank, can automatically and simply control the temperature rise of the water body, can automatically cut off the power when a certain water temperature is reached, and can be arranged at a DC direct current position or an AC alternating current position;
the plug pin shell is made of waterproof high-heat-conductivity metal, and is connected and fixed with the water tank by being sealed by silicon after being inserted into the water tank and then connected and fixed with the water tank, so that the machine main body can be inserted for use, and the temperature switch is attached or locked on the edge of the water tank; if the pin shell design is not used, the heat pump can be manufactured into a host fixed heat pump as long as the heat-conducting temperature-equalizing plate part of the machine main body is inserted into the water tank and the contact edge of the water tank is sealed by the silicon wafer;
the material of the water tank can be acrylic or plastic with a relatively heat preservation effect, if the refrigeration chip is required to produce hot air and cold water, the refrigeration chip is inverted to form a hot air main machine, a heat dissipation tower and a fan, and 180-degree reverse downward rotation can be designed, so that the heat rising and cold falling of the copper pipe are more efficient.
The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.
Claims (3)
1. A refrigeration chip air conditioning heat pump structure is characterized by comprising a water tank, a heat pump and a heat pump, wherein room temperature water or low temperature water can be filled in the water tank;
the high heat conduction efficiency temperature-equalizing plate can be partially and directly inserted into the water tank for cooling or heating;
one side of the refrigeration chip is tightly combined with the temperature equalizing plate with high heat conduction efficiency;
one side of the heat dissipation tower is tightly combined with one side of the refrigeration chip, which is far away from the temperature equalization plate with high heat conduction efficiency;
the fan is locked on the heat dissipation tower through screws and blows wind to the heat dissipation tower;
the temperature controller is connected with the water body through the temperature sensor and can automatically control the required temperature;
the heat insulation cotton coats the surface of the temperature equalizing plate with high heat conduction efficiency exposed in the air;
the pin shell is arranged in the water tank, one end of the pin shell can be inserted by the high-heat-conduction-efficiency temperature equalizing plate, and the pin shell can uniformly conduct heat into water;
and a transformer, the transformer can step down 110V or 220V AC power to 12V for the power of the refrigeration chip or fan and temperature controller;
and the fan speed regulator is electrically connected with the fan and is used for regulating the air volume to control the temperature and the blowing-out distance of air.
2. A cold-air heat pump structure of refrigerating chip as claimed in claim 1, wherein said pin housing is slantly provided at the bottom of the water tank with one end of the temperature uniforming plate having high heat-transfer efficiency inserted slantly.
3. A cold air heat pump structure of refrigerating chip as recited in claim 1, wherein said water tank is provided at its top with a water injection hole communicating with the inside of the water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022123253.1U CN213811314U (en) | 2020-09-24 | 2020-09-24 | Refrigeration chip air conditioning heat pump structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022123253.1U CN213811314U (en) | 2020-09-24 | 2020-09-24 | Refrigeration chip air conditioning heat pump structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213811314U true CN213811314U (en) | 2021-07-27 |
Family
ID=76955213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022123253.1U Active CN213811314U (en) | 2020-09-24 | 2020-09-24 | Refrigeration chip air conditioning heat pump structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213811314U (en) |
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2020
- 2020-09-24 CN CN202022123253.1U patent/CN213811314U/en active Active
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