CN111594958A - Refrigerating device - Google Patents
Refrigerating device Download PDFInfo
- Publication number
- CN111594958A CN111594958A CN202010447367.3A CN202010447367A CN111594958A CN 111594958 A CN111594958 A CN 111594958A CN 202010447367 A CN202010447367 A CN 202010447367A CN 111594958 A CN111594958 A CN 111594958A
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- Prior art keywords
- water
- refrigerating
- tank
- water tank
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 201
- 238000005057 refrigeration Methods 0.000 claims abstract description 62
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000000889 atomisation Methods 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims 3
- 238000005482 strain hardening Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 9
- 239000003595 mist Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000004519 grease Substances 0.000 description 5
- 238000010622 cold drawing Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
- F24F5/0035—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning using evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a refrigerating device, which comprises a refrigerating water tank, a refrigerating device and a water curtain device, wherein the refrigerating water tank is used for cooling and refrigerating the refrigerating water tank, the water curtain device comprises a water curtain box and a water curtain arranged in the water curtain box, the water curtain box is provided with an air inlet and an air outlet which are communicated with the water curtain box, and a power fan is arranged at the air inlet. The invention has simple structure and convenient use, utilizes the electronic refrigeration technology of the semiconductor refrigeration piece to obtain low-temperature water, conveys the low-temperature water to the water curtain box to wet the water curtain, and blows the water of the water curtain out in a gas state by the fan to obtain cold air.
Description
Technical Field
The invention relates to the technical field of refrigeration, in particular to a device capable of refrigerating.
Background
The cooling devices commonly used in the prior art are usually fans and air conditioners when hot in summer.
For the fan, when the temperature is too high, the effect of the fan is lost, and the purpose of cooling cannot be achieved; the air conditioner needs high-cost materials and chemical refrigerants, is relatively complex in spare parts, consumes much electric quantity, is not suitable for being used in light and movable occasions, and needs more installation conditions such as space positions, power supply quantity, professionals and the like.
When the cost of using the air conditioner is far higher than the benefit brought by temperature reduction, the air conditioner is not suitable any more.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a refrigerating device, which utilizes an electronic refrigerating technology of a semiconductor refrigerating sheet to obtain low-temperature water, conveys the low-temperature water to a water curtain box to wet a water curtain, and blows out the water of the water curtain in a gas state by a fan to obtain cold air.
In order to achieve the technical effects, the invention adopts the following scheme:
the utility model provides a refrigerating plant, includes the refrigeration water tank, for the refrigerated refrigerating plant of refrigeration water tank cooling to and the cascade device, the refrigeration water tank is used for providing low temperature cold water to the cascade device, and the cascade device includes the cascade case and locates the cascade of cascade incasement, and the cascade case has air intake and the air outlet that link up the setting of cascade case, and air intake department is equipped with power fan.
According to the preferred technical scheme, the first water pump is arranged at the bottom of the refrigeration water tank and connected with the first water pipe, and the other end of the first water pipe extends into the water curtain tank and is arranged towards the water curtain to provide low-temperature cold water for the water curtain.
According to the preferred technical scheme, the ultrasonic atomization sheet is arranged at the bottom of the refrigeration water tank, the refrigeration water tank is connected with a second water pipe, one end of the second water pipe is communicated with the refrigeration water tank, and the other end of the second water pipe is communicated with the air inlet of the water curtain box.
According to the preferable technical scheme, the other end of the second water pipe is positioned on one side of negative pressure of the power fan or the other end of the second water pipe is positioned on one side of positive pressure of the power fan.
According to the preferable technical scheme, the refrigeration water tank is connected with a water storage container, a second water pump is arranged at the bottom of the water storage container, and the second water pump is communicated with the refrigeration water tank through a water injection pipe.
According to the preferable technical scheme, the water storage container is communicated with the bottom of the water curtain tank.
According to the preferred technical scheme, the refrigerating device comprises a semiconductor refrigerating piece, the lower end of the refrigerating water tank is arranged on the semiconductor refrigerating piece and used for cooling the refrigerating water tank, the cold end working face of the semiconductor refrigerating piece faces the refrigerating water tank, and the hot end working face of the semiconductor refrigerating piece is provided with a heat radiating device.
The lower extreme of refrigeration water tank is equipped with the cold storage board, and the cold storage board is located between semiconductor refrigeration piece and the refrigeration water tank, and the cold storage board pastes with the lower extreme of refrigeration water tank mutually, and the size of cold storage board is not less than the size of refrigeration water tank bottom.
According to the preferable technical scheme, a heat-conducting silicone grease layer is coated between the cold storage plate and the semiconductor refrigeration plate.
According to the preferred technical scheme, the heat dissipation device comprises a heat conduction plate, one side face of the heat conduction plate is attached to the hot end working face of the semiconductor refrigeration sheet, a plurality of heat dissipation fins are arranged on the other side face of the heat conduction plate, and a heat dissipation fan for accelerating heat dissipation of the heat dissipation fins is arranged below the heat dissipation fins.
Compared with the prior art, beneficial effect does:
the invention has simple structure and convenient use, obtains low-temperature water by utilizing the electronic refrigeration technology of the semiconductor refrigeration sheet, transports the low-temperature water to the water curtain box to wet the water curtain, blows the water of the water curtain in a gas state by the fan to obtain cold air, and has low energy consumption.
Drawings
FIG. 1 is a schematic diagram of the inventive structure.
Reference numerals: 1. a refrigeration water tank; 2. a water curtain tank; 3. a water curtain; 4. a power fan; 5. a semiconductor refrigeration sheet; 6. a heat conducting plate; 7. a heat sink; 8. a heat radiation fan; 9. a cold plate; 10. a thermally conductive silicone layer; 11. a second water pipe; 12. a water storage container; 13. a water injection pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
Example 1
The utility model provides a refrigerating plant, includes refrigeration water tank 1, for the refrigerated refrigerating plant of 1 cooling of refrigeration water tank to and cascade 3 device, refrigeration water tank 1 is used for providing low temperature cold water to cascade 3 device, and cascade 3 device includes cascade 2 and locates cascade 3 in the cascade 2, and cascade 2 has the air intake and the air outlet that link up the setting of cascade 2, and air intake department is equipped with power fan 4.
The material of refrigerating water tank 1 is with food level stainless steel, keeps warm with insulation material parcel on the outer wall, carries out rapid cooling refrigeration through refrigerating plant with the water in the refrigerating water tank 1 and obtains low temperature cold water, carries low temperature cold water to the cascade case 2 in and drenches cascade 3 again, and the wind that blows off through power fan 4 drives the evaporation of water on the cascade 3 to blow off the low temperature cold water and the cold air of evaporation, carry out the humidification cooling indoor.
The preferred technical scheme, 1 bottom of refrigeration water tank is equipped with first water pump, and first water pump is connected with first water pipe, and the other end of first water pipe stretches into in the cascade case 2 towards cascade 3 setting, provides low temperature cold water to cascade 3. The low-temperature cold water in the refrigeration water tank 1 is pumped to the water curtain 3 through the first water pump.
According to the preferable technical scheme, the refrigeration water tank 1 is connected with a water storage container 12, a second water pump is arranged at the bottom of the water storage container 12 and communicated with the refrigeration water tank 1 through a water injection pipe 13. A large amount of water is stored in the water storage container 12, the more the water in the refrigeration water tank 1 is, the more the refrigerating capacity required for cooling is, when the refrigerating capacity required is larger than the refrigerating capacity provided by the cold end working face of the semiconductor refrigerating sheet 5, the refrigerating effect of the water in the refrigeration water tank 1 can be greatly reduced, so that the water in the refrigeration water tank 1 cannot be too much, the water is supplemented to the refrigeration water tank 1 through the water storage container 12, and the low-temperature cold water can be continuously generated.
A water level limit switch is arranged in the refrigeration water tank 1, and when the water level in the refrigeration water tank 1 reaches the maximum, the limit switch sends a signal to stop water injection; when the water level in the refrigeration water tank 1 is too low, a signal is sent out to start water injection.
According to the preferable technical scheme, the water storage container 12 is communicated with the bottom of the water curtain box 2, the height of the water storage container 12 is lower than that of the bottom of the water curtain box 2, part of low-temperature cold water pumped to the water curtain 3 falls at the bottom of the water curtain box 2, and after the water storage container 12 is communicated with the bottom of the water curtain box 2, the low-temperature cold water gathered in the water curtain box 2 returns to the water storage container 12, so that water resources are saved.
According to the preferred technical scheme, the refrigerating device comprises a semiconductor refrigerating piece 5, the lower end of the refrigerating water tank 1 is arranged on the semiconductor refrigerating piece 5 and used for cooling the refrigerating water tank 1, the cold end working face of the semiconductor refrigerating piece 5 faces the refrigerating water tank 1, and the hot end working face of the semiconductor refrigerating piece 5 is provided with a heat radiating device.
The semiconductor refrigerating sheet 5 is also called as a thermoelectric refrigerating sheet, is a heat pump, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the semiconductor refrigerating sheet 5 can achieve the purpose of refrigeration and is a heat transfer tool. When a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the thermocouple pair by utilizing the Pe-ier effect of the semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts of the two types are equal, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset. The temperature of the cold and hot ends will not change continuously. In order to make the cold end working surface of the semiconductor refrigeration piece 5 reach lower temperature, the temperature of the hot end working surface of the semiconductor refrigeration piece 5 can be reduced by adopting a heat dissipation mode of a heat dissipation device and the like.
According to the preferred technical scheme, the lower end of the refrigerating water tank 1 is provided with the cold storage plate 9, the cold storage plate 9 is located between the semiconductor refrigerating sheet 5 and the refrigerating water tank 1, the cold storage plate 9 is attached to the lower end of the refrigerating water tank 1, and the size of the cold storage plate 9 is not smaller than that of the bottom end of the refrigerating water tank 1.
Store up cold drawing 9 and locate the bottom of refrigeration case and paste rather than mutually, the cold junction working face of semiconductor refrigeration piece 5 reduces earlier and stores up the temperature of cold drawing 9, conducts low temperature to the cooler bin through storing up cold drawing 9, because the size of storing up cold drawing 9 matches with the bottom size of refrigeration case, consequently the refrigeration bottom of the case portion receives cold evenly everywhere, has promoted the refrigeration effect of water.
According to the preferable technical scheme, a heat-conducting silicone layer 10 is coated between the cold storage plate 9 and the semiconductor refrigeration sheet 5.
The heat-conducting silicone grease is a high-heat-conducting insulating silicone material, is almost never cured, and can be kept in a grease state for a long time at the temperature of between 50 ℃ below zero and 230 ℃. The insulating material has excellent electrical insulation, excellent heat conductivity, low freeness (tending to zero), high and low temperature resistance, water resistance, ozone resistance and weather aging resistance.
Therefore, the low temperature of the cold end working surface of the semiconductor can be efficiently transmitted to the cold storage plate 9 through the heat-conducting silicone grease, and the loss of the low temperature in the conduction process is reduced.
In addition, in temperature conduction applications, even two planes with very clean surfaces will have voids when they are in contact with each other, and the air in these voids is a poor conductor of temperature conduction and hinders the temperature conduction. The heat-conducting silicone grease is a material which can fill the gaps and enable the temperature conduction to be smoother and quicker.
According to the preferred technical scheme, the heat dissipation device comprises a heat conduction plate 6, one side face of the heat conduction plate 6 is attached to the hot end working face of the semiconductor refrigeration sheet 5, a plurality of heat dissipation fins 7 are arranged on the other side face of the heat conduction plate 6, and a heat dissipation fan 8 for accelerating heat dissipation of the heat dissipation fins 7 is arranged below the heat dissipation fins 7.
The heat of the working face of the hot end of the semiconductor refrigerating piece 5 is radiated through the radiating fins 7, the temperature difference of the cold and hot ends of the semiconductor refrigerating piece 5 can reach 40-65 degrees generally, the hot end temperature is reduced through the active radiating mode of the radiating fan 8, and the cold end temperature can also correspondingly decrease, so that the lower temperature is reached.
Example 2
The difference between the embodiment 2 and the embodiment 1 is that the bottom of the refrigeration water tank 1 is provided with an ultrasonic atomization sheet, the refrigeration water tank 1 is connected with a second water pipe 11, one end of the second water pipe 11 is communicated with the refrigeration water tank 1, the other end of the second water pipe is communicated with the air inlet of the water curtain tank 2, and the other end of the second water pipe 11 is located behind the power fan 4, namely located on the negative pressure side of the power fan 4.
Since the low-temperature cold water is sent to the water curtain 3 by pumping in the foregoing embodiment 1, the water pump generates a large noise during operation, which causes noise pollution. In this embodiment, the ultrasonic atomization sheet vibrates the low-temperature cold water to break up the water droplets into tiny floating particles of about 5 microns, so as to generate suspended water mist, the water mist is sent to the rear of the power fan 4 along with the second water pipe 11 through diffusion, and when the power fan 4 works, the rear is a negative pressure region, so that the water mist in the refrigeration water tank 1 can be sucked to the rear of the power fan 4, and the water mist of the low-temperature cold water is blown to the water curtain 3 through the power fan 4.
Example 3
The difference between embodiment 3 and embodiment 2 is that the other end of the second water pipe 11 is located on the front side of the power fan 4, i.e. on the air outlet side of the power fan 4, in embodiment 2, the other end of the second water pipe 11 is located behind the power fan 4, which causes part of the mist of the low-temperature cold water to be directly diffused in the air, causing loss, and the mist sucked by the power fan 4 is mixed with the normal-temperature air, which reduces the refrigeration effect of the low-temperature cold water mist.
In this embodiment, the other end of the second water pipe 11 is disposed on the air outlet side of the power fan 4, the water mist of the low-temperature cold water discharged from the second water pipe 11 can be completely blown onto the water curtain 3, so as to improve the refrigeration effect, and the blown air drives the air at the port of the second water pipe 11 to flow, so that a negative pressure is formed when the air is discharged, and the energy source continuously discharges the water mist in the refrigeration water tank 1.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, refer to orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience in describing and simplifying the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (10)
1. The utility model provides a refrigerating plant, its characterized in that, includes the refrigeration water tank, for the refrigerated refrigerating plant of refrigeration water tank cooling to and the cascade device, the refrigeration water tank is used for providing low temperature cold water to the cascade device, and the cascade device includes the cascade case and locates the cascade of cascade incasement, and the cascade case has air intake and the air outlet that link up the setting of cascade case, and air intake department is equipped with power fan.
2. The refrigerating apparatus as claimed in claim 1, wherein a first water pump is provided at a bottom of the refrigerating water tank, the first water pump is connected to a first water pipe, and the other end of the first water pipe is extended into the water curtain tank and disposed toward the water curtain to supply cold water of low temperature to the water curtain.
3. The refrigerating apparatus as claimed in claim 1, wherein the ultrasonic atomization plate is provided at the bottom of the refrigerating water tank, and the refrigerating water tank is connected with a second water pipe, one end of which is communicated with the refrigerating water tank and the other end of which is communicated with the air inlet of the water curtain tank.
4. A refrigerating apparatus as recited in claim 3 wherein the other end of the second water line is located on the negative pressure side of the power fan or the other end of the second water line is located on the positive pressure side of the power fan.
5. A refrigerating unit as claimed in any one of claims 1 to 5, characterized in that the refrigerating water tank is connected to a water reservoir, and a second water pump is arranged at the bottom of the water reservoir and is connected to the refrigerating water tank via a water injection pipe.
6. The refrigeration unit of claim 5 wherein the water reservoir communicates with the bottom of the water curtain tank.
7. A refrigerator as claimed in any one of claims 1 to 5, characterized in that the refrigerator comprises a semiconductor cooling plate which is arranged at the lower end of the cooling water tank for cooling the cooling water tank, the cold working surface of the semiconductor cooling plate faces the cooling water tank, and the hot working surface of the semiconductor cooling plate is provided with a heat sink.
8. A refrigerator as claimed in claim 7, characterized in that the lower end of the refrigerating tank is provided with a cold storage plate, which is located between the semiconductor refrigeration plate and the refrigerating tank and which abuts against the lower end of the refrigerating tank, the size of the cold storage plate being not smaller than the size of the bottom end of the refrigerating tank.
9. A refrigeration unit as recited in claim 8 wherein a layer of thermally conductive silicone is applied between the cold storage plate and the semiconductor refrigeration plate.
10. The refrigerating device as claimed in claim 7, wherein the heat dissipating means comprises a heat conducting plate, one side surface of which is attached to the hot end working surface of the semiconductor refrigerating sheet, and the other side surface of which is provided with a plurality of heat dissipating fins, and a heat dissipating fan for accelerating heat dissipation of the heat dissipating fins is provided below the heat dissipating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010447367.3A CN111594958A (en) | 2020-05-25 | 2020-05-25 | Refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010447367.3A CN111594958A (en) | 2020-05-25 | 2020-05-25 | Refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111594958A true CN111594958A (en) | 2020-08-28 |
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ID=72187752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010447367.3A Pending CN111594958A (en) | 2020-05-25 | 2020-05-25 | Refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111594958A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818324A (en) * | 2012-08-09 | 2012-12-12 | 邹兵 | Semiconductor fan |
| CN104930628A (en) * | 2015-06-24 | 2015-09-23 | 张坚胜 | Spray cooling device used by combining with a fan |
| CN204880846U (en) * | 2015-07-17 | 2015-12-16 | 高齐微 | Water -cooling air conditioner |
| US20180023823A1 (en) * | 2016-07-19 | 2018-01-25 | Chuan-Sheng Chen | Semiconductor-based air conditioning device |
| CN207335013U (en) * | 2017-08-04 | 2018-05-08 | 中山市众智电器有限公司 | A kind of cooling fan |
| CN212720073U (en) * | 2020-05-25 | 2021-03-16 | 平湖市旭阳电子科技有限公司 | Refrigerating device |
-
2020
- 2020-05-25 CN CN202010447367.3A patent/CN111594958A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818324A (en) * | 2012-08-09 | 2012-12-12 | 邹兵 | Semiconductor fan |
| CN104930628A (en) * | 2015-06-24 | 2015-09-23 | 张坚胜 | Spray cooling device used by combining with a fan |
| CN204880846U (en) * | 2015-07-17 | 2015-12-16 | 高齐微 | Water -cooling air conditioner |
| US20180023823A1 (en) * | 2016-07-19 | 2018-01-25 | Chuan-Sheng Chen | Semiconductor-based air conditioning device |
| CN207335013U (en) * | 2017-08-04 | 2018-05-08 | 中山市众智电器有限公司 | A kind of cooling fan |
| CN212720073U (en) * | 2020-05-25 | 2021-03-16 | 平湖市旭阳电子科技有限公司 | Refrigerating device |
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