TWM552088U - Air conditioning mechanism including thermoelectric cooling chip - Google Patents

Air conditioning mechanism including thermoelectric cooling chip Download PDF

Info

Publication number
TWM552088U
TWM552088U TW106209109U TW106209109U TWM552088U TW M552088 U TWM552088 U TW M552088U TW 106209109 U TW106209109 U TW 106209109U TW 106209109 U TW106209109 U TW 106209109U TW M552088 U TWM552088 U TW M552088U
Authority
TW
Taiwan
Prior art keywords
space
air
liquid
gas delivery
air conditioning
Prior art date
Application number
TW106209109U
Other languages
Chinese (zh)
Inventor
shi-xuan Lin
Original Assignee
shi-xuan Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by shi-xuan Lin filed Critical shi-xuan Lin
Priority to TW106209109U priority Critical patent/TWM552088U/en
Publication of TWM552088U publication Critical patent/TWM552088U/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

包含致冷晶片的空調機構 Air conditioning mechanism including a refrigerated wafer

本創作係有關於空調機構，尤其是一種包含致冷晶片的空調機構。 This creation is about air conditioning mechanisms, especially an air conditioning mechanism that includes a cryogenic wafer.

習知之空調機，大部分應用冷媒來進行冷熱交換，整個系統相當複雜，而且在冷熱交換的過程需要相當多的管路，一方面進行空氣循環，一方面進行冷媒的循環，而且為達成有效的熱力循環，必須配置適當的裝置，因此整個機體相當的龐大，而且組件也多，相對的成本也相當的高。 Conventional air conditioners, most of which use refrigerant for cold and heat exchange, the whole system is quite complicated, and the process of hot and cold exchange requires quite a lot of pipelines, on the one hand, air circulation, on the one hand, the circulation of refrigerant, and in order to achieve effective The thermodynamic cycle must be equipped with appropriate devices, so the entire body is quite large, and there are many components, and the relative cost is also quite high.

近代由於積體電路的進步，致冷晶片已經被研發出來，該致冷晶片應用電子方式可以達成晶片兩側有效的熱交換，其作業程序相當簡單，所以可以應用簡單的配置方式達到以往複雜熱力循環相同的功效。而且致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能。惟如果單純的以致冷晶片進行熱交換，仍然會有交換效率不高的問題。 In modern times, due to the advancement of integrated circuits, cryogenic wafers have been developed. The cooled wafers can be electronically exchanged to achieve efficient heat exchange on both sides of the wafer. The operating procedure is quite simple, so simple configuration can be applied to achieve complex heat in the past. Loop the same effect. Moreover, the power consumed by the cooling chip is much smaller than that of the conventional air conditioner using a compressor or the like. However, if the cold wafer is simply exchanged for heat exchange, there will still be a problem that the exchange efficiency is not high.

故本案希望提出一種嶄新的包含致冷晶片的空調機構，係基於致冷晶片作為熱交換媒介的原理，以達到低耗能下即 可達到有效的熱交換的目的，以解決上述先前技術上的缺陷。 Therefore, this case hopes to propose a brand new air conditioning mechanism containing a cryogenic wafer based on the principle of using a cryogenic wafer as a heat exchange medium to achieve low energy consumption. An efficient heat exchange can be achieved to address the aforementioned prior art deficiencies.

所以本創作的目的係為解決上述習知技術上的問題，本創作中提出一種包含致冷晶片的空調機構，係將該致冷晶片配置在一箱體上，而經由該致冷晶片吸收該箱體內填充的液體之熱量，而冷卻流經位於該箱體內之氣體輸送管路內的空氣，使得該箱體可以輸出冷氣。再者本案也可以在箱體上配置該電熱管而使得熱交換的方向相反，而加熱該氣體輸送管路內的空氣，使得該箱體可以輸出暖氣。相較於習知使用壓縮機等的空調機，本案的結構相當簡單，即可達成熱交換的目的，以輸出冷氣或暖氣，因此有效降低整體成本。再者致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能，因此本案也可以達到節能的目的。 Therefore, the purpose of the present invention is to solve the above-mentioned problems in the prior art. In the present invention, an air conditioning mechanism including a refrigerating wafer is disposed on a casing, and the refrigerating wafer is absorbed through the refrigerating wafer. The heat of the liquid filled in the tank, and the cooling flows through the air in the gas delivery line of the tank, so that the tank can output cold air. Furthermore, in the present case, the electric heating pipe may be disposed on the casing such that the heat exchange direction is reversed, and the air in the gas delivery pipe is heated, so that the casing can output the heating. Compared with the conventional air conditioner using a compressor or the like, the structure of the present invention is relatively simple, and the purpose of heat exchange can be achieved to output cold air or heating, thereby effectively reducing the overall cost. Furthermore, the power consumed by the cooled wafer is much smaller than that of the conventional air conditioner using a compressor, etc., so the present case can also achieve the purpose of energy saving.

為達到上述目的本創作中提出一種包含致冷晶片的空調機構，包含：一箱體，具有中空空間，該箱體包含一隔板位於該中空空間內，而將該中空空間分隔為第一空間及第二空間；其中該隔板上形成多個穿孔；其中該箱體之側壁為可導熱之結構；其中該箱體位於該第一空間的一側形成至少一進氣口，該箱體位於該第二空間的一側形成多個出氣孔；一電源位於該箱體外部，用於提供電力；一進氣扇，以可旋轉的方式配置於該第一空間內，該進氣扇連結該電源；當該電源 驅動該進氣扇旋轉時，該進氣扇即會將該箱體外部的空氣經由該進氣口抽入該第一空間內，並驅動空氣流動到該隔板處，而經由該隔板上的該穿孔輸入該第二空間內；多個氣體輸送管路，配置於該第二空間內，其中各該氣體輸送管路的一端分別連接於該隔板上各個對應的穿孔，另一端連接於各個對應的出氣孔；來自該第一空間的空氣係從該隔板上的各該穿孔輸入對應的氣體輸送管路，再經由對應之出氣孔輸出該箱體外；其中該第二空間內位於該多個氣體輸送管路及該箱體側壁內側之間處形成一密閉空間，該密閉空間係填充有液體；至少一致冷晶片配置於該箱體的側壁外側上；其中各該致冷晶片連接該電源，當各該致冷晶片通電時，可吸收經由該箱體的側壁傳遞出來的熱量，使得該第二空間內的液體之熱量傳遞到該致冷晶片，使得該液體的溫度降低；其中當空氣進入該氣體輸送管路時，會與該第二空間內的液體進行熱交換；該空氣的熱能會經由該氣體輸送管路傳遞到該第二空間內的液體，再經由該箱體的側壁傳遞到該至少一致冷晶片，使得該空氣的溫度降低形成冷空氣，而從該出氣孔向外輸出，而達到輸出冷氣的目的。一電熱管，位於該第二空間內，該電熱管連接該電源，係用於產生熱能。 In order to achieve the above object, an air conditioning mechanism including a refrigerating wafer is provided in the present invention, comprising: a box having a hollow space, the box comprising a partition in the hollow space, and separating the hollow space into the first space And a second space; wherein the partition is formed with a plurality of perforations; wherein the side wall of the box is a heat conductive structure; wherein the box is located at one side of the first space to form at least one air inlet, the box is located One side of the second space forms a plurality of air outlets; a power source is located outside the box for providing electric power; and an air intake fan is rotatably disposed in the first space, the air intake fan is coupled to the Power supply; when the power supply When the intake fan is driven to rotate, the air intake fan draws air outside the box into the first space via the air inlet, and drives air to flow to the partition through the partition plate. The perforation is input into the second space; a plurality of gas delivery lines are disposed in the second space, wherein one end of each of the gas delivery lines is respectively connected to each corresponding perforation on the partition, and the other end is connected to Each of the corresponding air outlets; the air from the first space is input into the corresponding gas delivery pipeline from each of the perforations on the partition, and is output to the outer casing through the corresponding air outlet; wherein the second space is located in the Forming a closed space between the plurality of gas delivery lines and the inner side of the side wall of the case, the sealed space is filled with liquid; at least the uniform cold wafer is disposed on the outer side of the side wall of the case; wherein each of the cooling chips is connected to the a power source, when each of the cooling fins is energized, absorbing heat transferred through a sidewall of the casing, so that heat of the liquid in the second space is transferred to the refrigerating wafer, so that the temperature of the liquid is lowered Wherein when the air enters the gas delivery line, heat exchange is performed with the liquid in the second space; the thermal energy of the air is transmitted to the liquid in the second space via the gas delivery line, and then through the housing The sidewall is transferred to the at least uniform cold wafer such that the temperature of the air is lowered to form cold air, and is outputted outward from the vent to achieve the purpose of outputting cold air. An electric heating tube is located in the second space, and the electric heating tube is connected to the power source for generating thermal energy.

由下文的說明可更進一步瞭解本創作的特徵及其優點，閱讀時並請參考附圖。 The features of the present invention and its advantages can be further understood from the description below, and please refer to the attached drawings when reading.

10‧‧‧箱體 10‧‧‧ cabinet

11‧‧‧第一空間 11‧‧‧First space

12‧‧‧第二空間 12‧‧‧Second space

15‧‧‧密閉空間 15‧‧‧Confined space

17‧‧‧側壁 17‧‧‧ side wall

20‧‧‧隔板 20‧‧‧Baffle

21‧‧‧穿孔 21‧‧‧Perforation

30‧‧‧電源 30‧‧‧Power supply

35‧‧‧開關 35‧‧‧ switch

40‧‧‧進氣扇 40‧‧‧Intake fan

50‧‧‧氣體輸送管路 50‧‧‧ gas delivery line

55‧‧‧鰭片 55‧‧‧Fins

60‧‧‧散熱鰭片 60‧‧‧heat fins

70‧‧‧致冷晶片 70‧‧‧Cold wafer

80‧‧‧沉水馬達葉輪組 80‧‧‧Submersible motor impeller group

81‧‧‧葉輪 81‧‧‧ Impeller

82‧‧‧沉水馬達 82‧‧‧Submersible motor

90‧‧‧電熱管 90‧‧‧Electric heat pipe

100‧‧‧控制器 100‧‧‧ Controller

110‧‧‧進氣口 110‧‧‧air inlet

120‧‧‧出氣孔 120‧‧‧ Vents

200‧‧‧液體 200‧‧‧Liquid

圖1顯示本案之箱體及其內部之元件示意圖。 Figure 1 shows a schematic view of the housing of the present case and its components.

圖2顯示本案之致冷晶片及散熱鰭片之配置關係示意圖。 FIG. 2 is a schematic view showing the arrangement relationship between the cold chip and the heat dissipating fin in the present case.

圖3顯示本案之元件組合之剖面示意圖。 Figure 3 shows a schematic cross-sectional view of the component combination of the present invention.

圖4顯示本案之另一實施例。 Figure 4 shows another embodiment of the present invention.

茲謹就本案的結構組成，及所能產生的功效與優點，配合圖式，舉本案之一較佳實施例詳細說明如下。 In view of the structural composition of the case, and the functions and advantages that can be produced, in conjunction with the drawings, a preferred embodiment of the present invention is described in detail below.

請參考圖1至圖4所示，顯示本創作之包含致冷晶片的空調機構，包含下列元件： Referring to FIG. 1 to FIG. 4, the air conditioning mechanism including the cooling chip of the present invention is shown, and includes the following components:

一箱體10，具有中空空間，該箱體10包含一隔板20位於該中空空間內，而將該中空空間分隔為第一空間11及第二空間12。其中該隔板20上形成多個穿孔21。其中該箱體10之側壁17為可導熱之結構。 A case 10 has a hollow space, and the case 10 includes a partition 20 located in the hollow space, and the hollow space is partitioned into a first space 11 and a second space 12. A plurality of through holes 21 are formed in the partition plate 20. The side wall 17 of the case 10 is a heat conductive structure.

其中該箱體10位於該第一空間11的一側形成至少一進氣口110，該箱體10位於該第二空間12的一側形成多個出氣孔120。其中該進氣口110可以是孔狀或網狀結構。 The casing 10 is located at one side of the first space 11 to form at least one air inlet 110, and the casing 10 is formed at a side of the second space 12 to form a plurality of air outlets 120. The air inlet 110 may be a hole or a mesh structure.

一電源30位於該箱體10外部，用於提供電力，如圖3所示。 A power source 30 is external to the housing 10 for providing power, as shown in FIG.

一進氣扇40，以可旋轉的方式配置於該第一空間11內，該進氣扇40連結該電源30。當該電源30驅動該進氣扇40旋轉時，該進氣扇40即會將該箱體10外部的空氣經由該進 氣口110抽入該第一空間11內，並驅動空氣流動到該隔板20處，而經由該隔板20上的該穿孔21輸入該第二空間12內。 An intake fan 40 is rotatably disposed in the first space 11, and the intake fan 40 is coupled to the power source 30. When the power source 30 drives the intake fan 40 to rotate, the air intake fan 40 will pass the air outside the casing 10 through the The gas port 110 is drawn into the first space 11 and drives air to flow to the partition 20, and is introduced into the second space 12 via the perforation 21 on the partition 20.

多個氣體輸送管路50，配置於該第二空間12內，其中各該氣體輸送管路50的一端分別連接於該隔板20上各個對應的穿孔21，另一端連接於各個對應的出氣孔120。來自該第一空間11的空氣係從該隔板20上的各該穿孔21輸入對應的氣體輸送管路50，再經由對應之出氣孔120輸出該箱體10外。 A plurality of gas delivery lines 50 are disposed in the second space 12, wherein one end of each of the gas delivery lines 50 is respectively connected to each corresponding through hole 21 of the partition plate 20, and the other end is connected to each corresponding air outlet hole. 120. The air from the first space 11 is input into the corresponding gas delivery line 50 from each of the perforations 21 on the partition 20, and is output to the outside of the casing 10 via the corresponding air outlet 120.

其中該第二空間12內位於該多個氣體輸送管路50及該箱體10側壁17內側之間處形成一密閉空間15，該密閉空間15係填充有液體200，較佳者該液體200為水。 A sealed space 15 is formed in the second space 12 between the plurality of gas delivery lines 50 and the inner side of the side wall 17 of the box 10. The sealed space 15 is filled with a liquid 200. Preferably, the liquid 200 is water.

為達到高的熱傳效果，該氣體輸送管路50可具有不同的配置方式。如圖1中所示，該氣體輸送管路50形成彎曲折管的型態，以增加其兩側與該液體200的接觸面積。或者是如圖4中所示之另一實施例，在該氣體輸送管路50的外側配置有鰭片55均為本案的範圍之內。 To achieve a high heat transfer effect, the gas delivery line 50 can have a different configuration. As shown in FIG. 1, the gas delivery line 50 forms a curved tube shape to increase the contact area of the sides thereof with the liquid 200. Alternatively, as in another embodiment as shown in Fig. 4, the fins 55 disposed outside the gas delivery line 50 are within the scope of the present invention.

至少一致冷晶片70配置於該箱體10的側壁17外側上。其中各該致冷晶片70連接該電源30，當各該致冷晶片70通電時，可吸收經由該箱體10的側壁17傳遞出來的熱量，使得該第二空間12內的液體200之熱量傳遞到該致冷晶片70，使得該液體200的溫度降低。其中當空氣進入該氣體輸送管 路50時，會與該第二空間12內的液體200進行熱交換。該空氣的熱能會經由該氣體輸送管路50傳遞到該第二空間12內的液體200，再經由該箱體10的側壁17傳遞到該至少一致冷晶片70，使得該空氣的溫度降低形成冷空氣，而從該出氣孔120向外輸出，而達到輸出冷氣的目的。 At least the uniform cold wafer 70 is disposed on the outer side of the side wall 17 of the casing 10. Each of the refrigerating wafers 70 is connected to the power source 30. When each of the refrigerating wafers 70 is energized, the heat transferred through the side walls 17 of the casing 10 can be absorbed, so that the heat of the liquid 200 in the second space 12 is transferred. To the cooled wafer 70, the temperature of the liquid 200 is lowered. Where air enters the gas delivery tube At the time of the road 50, heat exchange is performed with the liquid 200 in the second space 12. The heat of the air is transferred to the liquid 200 in the second space 12 via the gas delivery line 50, and then transferred to the at least uniform cold wafer 70 via the side wall 17 of the case 10, so that the temperature of the air is lowered to form a cold. The air is outputted outward from the air outlet 120 to achieve the purpose of outputting cold air.

至少一散熱鰭片60位於該第二空間12內，且各該散熱鰭片60配置於該箱體10的側壁17內側，其中各該散熱鰭片60的配置位置係分別對應於各個致冷晶片70，如圖2所示。該散熱鰭片60用於增加該箱體10與該液體200的接觸面積，而提高散熱效果。 At least one of the heat dissipating fins 60 is disposed in the second space 12, and each of the heat dissipating fins 60 is disposed inside the side wall 17 of the box body 10, wherein each of the heat dissipating fins 60 is disposed at a position corresponding to each of the fins 70, as shown in Figure 2. The heat dissipation fins 60 are used to increase the contact area of the casing 10 with the liquid 200 to improve the heat dissipation effect.

一沉水馬達葉輪組80，配置於該第二空間12內，該沉水馬達葉輪組80包含葉輪81以及連接該葉輪81的沉水馬達82，該沉水馬達82連接該電源30。當該沉水馬達82驅動該葉輪81旋轉時，可以攪拌該第二空間12內的液體200，使得該第二空間12內的液體200產生適當的循環流動。 A submersible motor impeller assembly 80 is disposed in the second space 12. The submersible motor impeller assembly 80 includes an impeller 81 and a submersible motor 82 coupled to the impeller 81. The submersible motor 82 is coupled to the power source 30. When the submersible motor 82 drives the impeller 81 to rotate, the liquid 200 in the second space 12 can be agitated such that the liquid 200 in the second space 12 produces an appropriate circulating flow.

本案尚包含一電熱管90，位於該第二空間12內。該電熱管90連接該電源30，係用於產生熱能。 The present invention also includes an electric heating tube 90 located in the second space 12. The electric heating tube 90 is connected to the power source 30 for generating thermal energy.

該電熱管90所產生的熱能係經由該箱體10傳導到該第二空間12內的液體200，使得該液體200被加熱，而使得該液體200的熱量傳遞到該多個氣體輸送管路50內部的空氣，因此令該空氣的溫度升高形成暖空氣，而從該出氣孔120向外輸出，而達到輸出暖氣的目的。 The heat energy generated by the electric heating tube 90 is conducted to the liquid 200 in the second space 12 via the tank 10, so that the liquid 200 is heated, so that the heat of the liquid 200 is transferred to the plurality of gas delivery lines 50. The internal air thus raises the temperature of the air to form warm air, and is outputted outward from the air outlet 120 to achieve the purpose of outputting the heating.

其中該進氣扇40、該沉水馬達葉輪組80、各該致冷晶片70、該電熱管90係分別經由一開關35連接該電源30，如圖3所示。 The intake fan 40, the submersible motor impeller group 80, each of the refrigerating wafers 70, and the electric heating tube 90 are respectively connected to the power source 30 via a switch 35, as shown in FIG.

一控制器100，以有線或無線的方式連接該進氣扇40、該沉水馬達葉輪組80、各該致冷晶片70、該電熱管90所對應之開關35。該控制器100用於控制該開關35，而控制該進氣扇40、該沉水馬達葉輪組80、該致冷晶片70、該電熱管90的運作方式，而達到控制風量及溫度的目的。較佳者，該控制器100包含一計時器105，用於在設定的時段開啟或關閉對應之開關35。 A controller 100 connects the intake fan 40, the submersible motor impeller group 80, each of the refrigerating wafers 70, and the switch 35 corresponding to the electric heating tube 90 in a wired or wireless manner. The controller 100 is used to control the switch 35, and controls the operation mode of the intake fan 40, the submersible motor impeller group 80, the refrigerating wafer 70, and the electric heating tube 90 to achieve the purpose of controlling the air volume and temperature. Preferably, the controller 100 includes a timer 105 for turning the corresponding switch 35 on or off for a set period of time.

本案的優點在於將該致冷晶片配置在一箱體上，而經由該致冷晶片吸收該箱體內填充的液體之熱量，而冷卻流經位於該箱體內之氣體輸送管路內的空氣，使得該箱體可以輸出冷氣。再者本案也可以在箱體上配置該電熱管而使得熱交換的方向相反，而加熱該氣體輸送管路內的空氣，使得該箱體可以輸出暖氣。相較於習知使用壓縮機等的空調機，本案的結構相當簡單，即可達成熱交換的目的，以輸出冷氣或暖氣，因此有效降低整體成本。再者致冷晶片所耗費的電力遠小於傳統使用壓縮機等的空調機所耗費的電能，因此本案也可以達到節能的目的。 The advantage of the present invention is that the refrigerated wafer is disposed on a tank, and the heat of the liquid filled in the tank is absorbed by the refrigerating wafer, and the air flowing through the gas conveying pipeline located in the tank is cooled, so that The cabinet can output cold air. Furthermore, in the present case, the electric heating pipe may be disposed on the casing such that the heat exchange direction is reversed, and the air in the gas delivery pipe is heated, so that the casing can output the heating. Compared with the conventional air conditioner using a compressor or the like, the structure of the present invention is relatively simple, and the purpose of heat exchange can be achieved to output cold air or heating, thereby effectively reducing the overall cost. Furthermore, the power consumed by the cooled wafer is much smaller than that of the conventional air conditioner using a compressor, etc., so the present case can also achieve the purpose of energy saving.

綜上所述，本案人性化之體貼設計，相當符合實際需求。其具體改進現有缺失，相較於習知技術明顯具有突破性之進 步優點，確實具有功效之增進，且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上，已符合專利法規定。 In summary, the humanized design of this case is quite in line with actual needs. Its specific improvements are currently missing, and it is clearly breakthrough compared to the prior art. The advantages of the step, indeed, have an improvement in efficacy and are not easy to achieve. The case has not been disclosed or disclosed in domestic and foreign literature and market, and has complied with the provisions of the Patent Law.

上列詳細說明係針對本創作之一可行實施例之具體說明，惟該實施例並非用以限制本創作之專利範圍，凡未脫離本創作技藝精神所為之等效實施或變更，均應包含於本案之專利範圍中。 The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiment is not intended to limit the scope of the patents, and the equivalent implementations or modifications that are not included in the spirit of the present invention should be included in The patent scope of this case.

10‧‧‧箱體 10‧‧‧ cabinet

11‧‧‧第一空間 11‧‧‧First space

12‧‧‧第二空間 12‧‧‧Second space

15‧‧‧密閉空間 15‧‧‧Confined space

17‧‧‧側壁 17‧‧‧ side wall

20‧‧‧隔板 20‧‧‧Baffle

21‧‧‧穿孔 21‧‧‧Perforation

40‧‧‧進氣扇 40‧‧‧Intake fan

50‧‧‧氣體輸送管路 50‧‧‧ gas delivery line

60‧‧‧散熱鰭片 60‧‧‧heat fins

70‧‧‧致冷晶片 70‧‧‧Cold wafer

80‧‧‧沉水馬達葉輪組 80‧‧‧Submersible motor impeller group

81‧‧‧葉輪 81‧‧‧ Impeller

82‧‧‧沉水馬達 82‧‧‧Submersible motor

90‧‧‧電熱管 90‧‧‧Electric heat pipe

110‧‧‧進氣口 110‧‧‧air inlet

120‧‧‧出氣孔 120‧‧‧ Vents

200‧‧‧液體 200‧‧‧Liquid

Claims (9)

一種包含致冷晶片的空調機構，包含：一箱體，具有中空空間，該箱體包含一隔板位於該中空空間內，而將該中空空間分隔為第一空間及第二空間；其中該隔板上形成多個穿孔；其中該箱體之側壁為可導熱之結構；其中該箱體位於該第一空間的一側形成至少一進氣口，該箱體位於該第二空間的一側形成多個出氣孔；一電源位於該箱體外部，用於提供電力；一進氣扇，以可旋轉的方式配置於該第一空間內，該進氣扇連結該電源；當該電源驅動該進氣扇旋轉時，該進氣扇即會將該箱體外部的空氣經由該進氣口抽入該第一空間內，並驅動空氣流動到該隔板處，而經由該隔板上的該穿孔輸入該第二空間內；多個氣體輸送管路，配置於該第二空間內，其中各該氣體輸送管路的一端分別連接於該隔板上各個對應的穿孔，另一端連接於各個對應的出氣孔；來自該第一空間的空氣係從該隔板上的各該穿孔輸入對應的氣體輸送管路，再經由對應之出氣孔輸出該箱體外；其中該第二空間內位於該多個氣體輸送管路及該箱體側壁內側之間處形成一密閉空間，該密閉空間係填充有液體；至少一致冷晶片配置於該箱體的側壁外側上；其中各該 致冷晶片連接該電源，當各該致冷晶片通電時，可吸收經由該箱體的側壁傳遞出來的熱量，使得該第二空間內的液體之熱量傳遞到該致冷晶片，使得該液體的溫度降低；其中當空氣進入該氣體輸送管路時，會與該第二空間內的液體進行熱交換；該空氣的熱能會經由該氣體輸送管路傳遞到該第二空間內的液體，再經由該箱體的側壁傳遞到該至少一致冷晶片，使得該空氣的溫度降低形成冷空氣，而從該出氣孔向外輸出，而達到輸出冷氣的目的。 An air conditioning mechanism including a cooling chip, comprising: a casing having a hollow space, the casing comprising a partition in the hollow space, and separating the hollow space into a first space and a second space; wherein the partition Forming a plurality of perforations on the plate; wherein the side wall of the case is a heat conductive structure; wherein the case is located at one side of the first space to form at least one air inlet, and the case is formed at one side of the second space a plurality of air outlets; a power source located outside the cabinet for providing power; an air intake fan rotatably disposed in the first space, the air intake fan connecting the power source; when the power source drives the power When the air fan rotates, the air intake fan draws air outside the box into the first space via the air inlet, and drives air to flow to the partition, and the through hole on the partition Inputting into the second space; a plurality of gas delivery lines are disposed in the second space, wherein one end of each of the gas delivery lines is respectively connected to each corresponding perforation on the partition, and the other end is connected to each corresponding Venting hole a space of air is input from each of the perforations on the partition into a corresponding gas delivery line, and then outputted to the outside of the box through a corresponding air outlet; wherein the second space is located in the plurality of gas delivery lines and the box Forming a closed space between the inner sides of the body sidewalls, the sealed space is filled with liquid; at least the uniform cold wafer is disposed on the outer side of the side wall of the box; The cooling chip is connected to the power source, and when each of the cooling chips is energized, heat transferred through the sidewall of the casing is absorbed, so that heat of the liquid in the second space is transferred to the refrigerating wafer, so that the liquid The temperature is lowered; wherein when the air enters the gas delivery line, heat exchange is performed with the liquid in the second space; the thermal energy of the air is transmitted to the liquid in the second space via the gas delivery line, and then The side wall of the tank is transferred to the at least uniform cold wafer so that the temperature of the air is lowered to form cold air, and is outputted outward from the air outlet to achieve the purpose of outputting cold air. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，尚包含至少一散熱鰭片位於該第二空間內，且各該散熱鰭片配置於該箱體的側壁內側，其中各該散熱鰭片的配置位置係分別對應於各個致冷晶片，該散熱鰭片用於增加該箱體與該液體的接觸面積，而提高散熱效果。 The air conditioning mechanism including the refrigerating chip of claim 1, further comprising at least one heat dissipating fin disposed in the second space, wherein each of the heat dissipating fins is disposed inside the side wall of the box, wherein each of the holes The arrangement positions of the heat dissipation fins respectively correspond to the respective cooling fins, and the heat dissipation fins are used to increase the contact area of the heat sink with the liquid, thereby improving the heat dissipation effect. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，尚包含一沉水馬達葉輪組，配置於該第二空間內，該沉水馬達葉輪組包含葉輪以及連接該葉輪的沉水馬達，該沉水馬達連接該電源；當該沉水馬達驅動該葉輪旋轉時，可以攪拌該第二空間內的液體，使得該第二空間內的液體產生適當的循環流動。 An air conditioning mechanism including a refrigerating wafer according to claim 1, further comprising a submersible motor impeller group disposed in the second space, the submersible motor impeller group comprising an impeller and a submerged water connecting the impeller a motor, the submersible motor is coupled to the power source; and when the submersible motor drives the impeller to rotate, the liquid in the second space can be agitated to cause a proper circulating flow of the liquid in the second space. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，尚包含一電熱管，位於該第二空間內，該電熱管連接該電源，係用於產生熱能。 The air conditioning mechanism including the refrigerating wafer according to claim 1 further includes an electric heating tube located in the second space, the electric heating tube being connected to the power source for generating thermal energy. 如申請專利範圍第3項所述之包含致冷晶片的空調機構，尚包含：一控制器；其中該進氣扇、該沉水馬達葉輪組、各該致冷晶片係分別經由一開關連接該電源；其中該控制器以有線或無線的方式連接該進氣扇、該沉水馬達葉輪組、各該致冷晶片所對應之開關；該控制器用於控制該開關，而控制該進氣扇、該沉水馬達葉輪組、該致冷晶片的運作方式，而達到控制風量及溫度的目的；其中該控制器包含一計時器，用於在設定的時段開啟或關閉對應之開關。 An air conditioning unit including a refrigerating chip according to claim 3, further comprising: a controller; wherein the intake fan, the submersible motor impeller group, and each of the refrigerating chip systems are respectively connected via a switch a power supply; wherein the controller connects the air intake fan, the submersible motor impeller group, and the switch corresponding to each of the cooling chips in a wired or wireless manner; the controller is configured to control the switch, and control the air intake fan, The submersible motor impeller group and the refrigerating wafer operate in a manner to control the air volume and temperature; wherein the controller includes a timer for turning on or off the corresponding switch for a set period of time. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，其中該氣體輸送管路形成彎曲折管的型態，以增加其兩側與該液體的接觸面積。 An air conditioning unit comprising a refrigerant chip according to claim 1, wherein the gas delivery line forms a curved tube shape to increase the contact area of the two sides with the liquid. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，其中該氣體輸送管路的外側配置有鰭片。 An air conditioning unit comprising a refrigerant chip according to claim 1, wherein the outer side of the gas delivery line is provided with fins. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，其中該液體為水。 An air conditioning unit comprising a refrigerant chip according to claim 1, wherein the liquid is water. 如申請專利範圍第1項所述之包含致冷晶片的空調機構，其中該進氣口為孔狀或網狀結構。 An air conditioning unit comprising a refrigerant chip according to claim 1, wherein the air inlet is in the form of a hole or a mesh.
TW106209109U 2017-06-23 2017-06-23 Air conditioning mechanism including thermoelectric cooling chip TWM552088U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106209109U TWM552088U (en) 2017-06-23 2017-06-23 Air conditioning mechanism including thermoelectric cooling chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106209109U TWM552088U (en) 2017-06-23 2017-06-23 Air conditioning mechanism including thermoelectric cooling chip

Publications (1)

Publication Number Publication Date
TWM552088U true TWM552088U (en) 2017-11-21

Family

ID=61014955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106209109U TWM552088U (en) 2017-06-23 2017-06-23 Air conditioning mechanism including thermoelectric cooling chip

Country Status (1)

Country Link
TW (1) TWM552088U (en)

Similar Documents

Publication Publication Date Title
TWI599713B (en) To the semiconductor as the core of the cold and warm cycle machine
JP4789760B2 (en) Electronic equipment and rack-like device
JP2008215795A (en) Movable heat exchange system, and air conditioner, hot water storage device, electric fan, other heat exchanger and heat exchange system applying the system
JP6138093B2 (en) Server cooling system and cooling method thereof
CN107166601B (en) Cold and hot two accuse all-in-one of hydrologic cycle
TWM567312U (en) Refrigeration device of water cooling fan
WO2018049996A1 (en) Bicirculating environment temperature control device for electric automobile battery pack
WO2015144080A1 (en) Refrigerator
KR101863544B1 (en) High efficiency, high performance dehumidifier using thermoelectric cooling module
KR101530702B1 (en) Cold and warm air circulator
TWM552088U (en) Air conditioning mechanism including thermoelectric cooling chip
KR100823965B1 (en) Colling and heating apparatus with radiator
KR20060088488A (en) One body air conditioner
CN105241176A (en) Efficient cooling tower
TW201905399A (en) Multi-tube air conditioner including cooling chip wherein heat exchange with the liquid in the liquid pipeline is performed, such that the temperature of the air is reduced to form cold air, and a purpose of outputting the cold air is achieved
TWM556823U (en) Multi-tubular air-conditioning mechanism including cooling chip
JP2008185325A (en) Outdoor unit for air conditioner
KR20220012561A (en) Heat exchanger equipped with cooling and heating devices
KR20220056008A (en) Cold and hot device and electric heater including the same
KR100623527B1 (en) Waste heat withdrawal and air veatilation apparatus available for cooling and heating room
CN205825298U (en) A kind of split type geothermal heat pump air-conditioner
WO2012062204A1 (en) Semiconductor cold and heat storage box
JP2010021415A (en) Cooling device
CN101566371B (en) Mobile refrigerating air-conditioning fan
TWI626409B (en) Temperature control equipment and heat exchanging unit thereof

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees