TW200922422A - Solder ball printing device - Google Patents

Solder ball printing device Download PDF

Info

Publication number
TW200922422A
TW200922422A TW097109091A TW97109091A TW200922422A TW 200922422 A TW200922422 A TW 200922422A TW 097109091 A TW097109091 A TW 097109091A TW 97109091 A TW97109091 A TW 97109091A TW 200922422 A TW200922422 A TW 200922422A
Authority
TW
Taiwan
Prior art keywords
solder ball
printing
screen
substrate
flux
Prior art date
Application number
TW097109091A
Other languages
English (en)
Chinese (zh)
Other versions
TWI351905B (ja
Inventor
Makoto Honma
Isao Abe
Noriaki Mukai
Akio Igarashi
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200922422A publication Critical patent/TW200922422A/zh
Application granted granted Critical
Publication of TWI351905B publication Critical patent/TWI351905B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW097109091A 2007-05-21 2008-03-14 Solder ball printing device TW200922422A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007134257A JP5098434B2 (ja) 2007-05-21 2007-05-21 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
TW200922422A true TW200922422A (en) 2009-05-16
TWI351905B TWI351905B (ja) 2011-11-01

Family

ID=40100695

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097109091A TW200922422A (en) 2007-05-21 2008-03-14 Solder ball printing device

Country Status (4)

Country Link
JP (1) JP5098434B2 (ja)
KR (1) KR100998279B1 (ja)
CN (1) CN101312136B (ja)
TW (1) TW200922422A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515274A (zh) * 2012-06-28 2014-01-15 株式会社日立制作所 焊球印刷搭载装置
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
EP4099366A3 (en) * 2017-08-07 2023-02-15 Boston Process Technologies, Inc. System for the flux free processing of a plurality of solder balls on a wafer

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* Cited by examiner, † Cited by third party
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JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
JP5206572B2 (ja) * 2009-04-23 2013-06-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
DE102009053575B4 (de) * 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
WO2012173059A1 (ja) * 2011-06-13 2012-12-20 千住金属工業株式会社 ソルダペースト
CN102990183B (zh) * 2011-09-09 2014-10-01 中国航天科工集团第三研究院第八三五七研究所 一种bga器件返修过程中转移膏状助焊剂的方法
JP5808229B2 (ja) * 2011-11-14 2015-11-10 株式会社日立製作所 ハンダボール印刷機
CN103418872A (zh) * 2012-05-15 2013-12-04 深圳市木森科技有限公司 一种焊接微型引脚的方法和装置
KR101388787B1 (ko) * 2012-07-25 2014-04-23 삼성전기주식회사 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
CN103687328A (zh) * 2012-09-26 2014-03-26 光宝电子(广州)有限公司 焊锡检测及自动修补***及其方法
KR101442350B1 (ko) * 2012-11-22 2014-09-17 삼성전기주식회사 솔더볼 리페어 장치
JP2014165455A (ja) * 2013-02-27 2014-09-08 Shibuya Kogyo Co Ltd 導電性ボールの搭載状態検査装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
KR101452963B1 (ko) * 2013-05-02 2014-10-22 (주) 피토 반도체 리볼링 장치
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
KR101995771B1 (ko) * 2014-11-11 2019-07-03 가부시키가이샤 신가와 플럭스 모음 장치
CN104668695B (zh) * 2015-02-03 2017-01-18 河北科瑞达仪器科技股份有限公司 一种对电子产品整机进行焊点检测并进行焊锡的方法
CN104889520B (zh) * 2015-04-14 2017-08-22 东莞市合易自动化科技有限公司 一种智能化aoi选焊***及其方法
JP6616981B2 (ja) * 2015-08-05 2019-12-04 アスリートＦａ株式会社 ボール検査リペア装置
JP6545085B2 (ja) * 2015-11-13 2019-07-17 アスリートＦａ株式会社 導電性ボールを搭載するシステム
TWI555601B (zh) * 2015-12-21 2016-11-01 矽品精密工業股份有限公司 打線裝置及排除不良銲線之方法
JP6813772B2 (ja) * 2016-10-14 2021-01-13 澁谷工業株式会社 微小ボール搭載装置
US11032959B2 (en) * 2016-12-12 2021-06-08 Fuji Corporation Component mounting machine
US10973161B2 (en) * 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
KR102004824B1 (ko) * 2017-11-08 2019-07-29 (주)비와이텍 터치스크린용 고효율 인쇄장치
EP3482934B1 (de) * 2017-11-10 2021-06-30 Exentis Group AG 3d-siebdrucksystem zum drucken dreidimensional geformter strukturen
CN109014553A (zh) * 2018-06-26 2018-12-18 江苏米研工业设备有限公司 一种锂电池全自动超声波焊接机用定位识别焊接***
JP7109076B2 (ja) * 2018-09-26 2022-07-29 アスリートＦａ株式会社 基板吸着固定ステージ及びボール搭載装置
KR102012977B1 (ko) * 2018-10-30 2019-10-21 위재우 미세 솔더볼 리워크 피커 모듈
CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
KR20230058520A (ko) 2020-10-15 2023-05-03 코모리 가부시키가이샤 볼 탑재방법 및 볼 탑재장치
US11949053B2 (en) * 2020-12-14 2024-04-02 Lumileds Llc Stencil printing flux for attaching light emitting diodes
CN112338307B (zh) * 2021-01-08 2021-03-19 四川赛狄信息技术股份公司 一种高精密电路板封装芯片中心引脚补差焊接方法及装置
KR102606828B1 (ko) * 2021-08-30 2023-11-29 에스케이하이닉스 주식회사 검사 및 리페어 장치를 포함하는 반도체 제조 시스템, 그 구동 방법 및 이를 이용한 반도체 패키지의 제조방법
CN113766823B (zh) * 2021-09-10 2023-06-02 上海无线电设备研究所 一种基于smt返修台的bga植球装置及方法
WO2023177347A1 (en) * 2022-03-15 2023-09-21 Capcon Holdings (Beijing) Limited A system and method for placement of at least one conductor pin

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3254459B2 (ja) * 1994-03-04 2002-02-04 株式会社日立製作所 微小ハンダ供給方法及び微小ハンダ供給装置
JP3360435B2 (ja) * 1994-10-14 2002-12-24 株式会社日立製作所 電子回路装置の製造方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP3770496B2 (ja) * 2003-03-10 2006-04-26 日立金属株式会社 導電性ボールの搭載方法および搭載装置
JP4560683B2 (ja) * 2005-05-10 2010-10-13 澁谷工業株式会社 導電性ボール配列装置
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515274A (zh) * 2012-06-28 2014-01-15 株式会社日立制作所 焊球印刷搭载装置
CN103515274B (zh) * 2012-06-28 2016-03-23 株式会社日立制作所 焊球印刷搭载装置
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
EP4099366A3 (en) * 2017-08-07 2023-02-15 Boston Process Technologies, Inc. System for the flux free processing of a plurality of solder balls on a wafer

Also Published As

Publication number Publication date
CN101312136B (zh) 2011-09-21
TWI351905B (ja) 2011-11-01
JP5098434B2 (ja) 2012-12-12
KR100998279B1 (ko) 2010-12-03
CN101312136A (zh) 2008-11-26
JP2008288515A (ja) 2008-11-27
KR20080102963A (ko) 2008-11-26

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees