TW200738538A - Apparatus for receiving workpiece and method of receiving thereof - Google Patents
Apparatus for receiving workpiece and method of receiving thereofInfo
- Publication number
- TW200738538A TW200738538A TW095122286A TW95122286A TW200738538A TW 200738538 A TW200738538 A TW 200738538A TW 095122286 A TW095122286 A TW 095122286A TW 95122286 A TW95122286 A TW 95122286A TW 200738538 A TW200738538 A TW 200738538A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrates
- receiving
- substrate
- substrate cassette
- order
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Robotics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005183446A JP4941627B2 (ja) | 2005-06-23 | 2005-06-23 | ワーク収納装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200738538A true TW200738538A (en) | 2007-10-16 |
Family
ID=37570436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095122286A TW200738538A (en) | 2005-06-23 | 2006-06-21 | Apparatus for receiving workpiece and method of receiving thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4941627B2 (ja) |
KR (1) | KR100934809B1 (ja) |
CN (1) | CN101180229A (ja) |
TW (1) | TW200738538A (ja) |
WO (1) | WO2006137407A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010070328A (ja) * | 2008-09-19 | 2010-04-02 | Sinfonia Technology Co Ltd | 被搬送物仕分け装置及び被搬送物仕分け方法 |
JP5218000B2 (ja) | 2008-12-12 | 2013-06-19 | 株式会社Ihi | 基板保管供給システム |
JP5394969B2 (ja) * | 2010-03-30 | 2014-01-22 | 大日本スクリーン製造株式会社 | 基板処理装置、基板処理システム、および基板処理方法 |
JP5348290B2 (ja) * | 2012-07-17 | 2013-11-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP2018083700A (ja) * | 2016-11-25 | 2018-05-31 | 日本電産サンキョー株式会社 | 基板供給装置の制御方法、および、基板供給回収装置の制御方法 |
JP7134071B2 (ja) * | 2018-11-14 | 2022-09-09 | 株式会社ダイフク | 物品搬送設備 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59227612A (ja) * | 1983-06-07 | 1984-12-20 | Matsushita Electric Ind Co Ltd | 回路基板のバツフアストツカ−装置 |
JPH02207547A (ja) * | 1989-02-07 | 1990-08-17 | Tokyo Electron Ltd | 処理方法 |
JPH07257756A (ja) * | 1994-03-18 | 1995-10-09 | Hitachi Metals Ltd | 粉粒体の投入切り出し制御方法 |
JP4184486B2 (ja) * | 1998-07-09 | 2008-11-19 | 大日本印刷株式会社 | バッファ装置 |
JP3915415B2 (ja) * | 2001-03-02 | 2007-05-16 | 株式会社ダイフク | 板状体搬送装置 |
JP2004207279A (ja) * | 2002-12-20 | 2004-07-22 | Rorze Corp | 薄板状物製造設備 |
-
2005
- 2005-06-23 JP JP2005183446A patent/JP4941627B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-20 WO PCT/JP2006/312341 patent/WO2006137407A1/ja active Application Filing
- 2006-06-20 CN CNA2006800181072A patent/CN101180229A/zh active Pending
- 2006-06-20 KR KR1020077027104A patent/KR100934809B1/ko not_active IP Right Cessation
- 2006-06-21 TW TW095122286A patent/TW200738538A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP4941627B2 (ja) | 2012-05-30 |
JP2007001716A (ja) | 2007-01-11 |
WO2006137407A1 (ja) | 2006-12-28 |
KR100934809B1 (ko) | 2009-12-31 |
CN101180229A (zh) | 2008-05-14 |
KR20080004620A (ko) | 2008-01-09 |
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