TWI265905B - Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method - Google Patents
Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier methodInfo
- Publication number
- TWI265905B TWI265905B TW093124682A TW93124682A TWI265905B TW I265905 B TWI265905 B TW I265905B TW 093124682 A TW093124682 A TW 093124682A TW 93124682 A TW93124682 A TW 93124682A TW I265905 B TWI265905 B TW I265905B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- installation
- removal
- substrate carrier
- carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
An installation/removal device (1) for putting or removing a substrate (A) into or from a storage container (10) in which substrates are stored, the installation/removal device comprising a mounting table (31) on which the substrate (A) is mounted, a holder (32) for holding the substrate (A) provided on the mounting table (31) so as to be movable in the direction of installation/removal of the substrate (A), and rollers (37) provided on the mounting table which support the substrate (A), being held by the holder (32), such that it is movable in the direction of installation/removal.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003296454A JP3909597B2 (en) | 2003-08-20 | 2003-08-20 | Board loading / unloading device |
JP2003296453A JP2005064431A (en) | 2003-08-20 | 2003-08-20 | Apparatus and method for substrate transfer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200512144A TW200512144A (en) | 2005-04-01 |
TWI265905B true TWI265905B (en) | 2006-11-11 |
Family
ID=34680569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093124682A TWI265905B (en) | 2003-08-20 | 2004-08-17 | Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100633848B1 (en) |
CN (1) | CN1600658B (en) |
TW (1) | TWI265905B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481541B (en) * | 2010-08-04 | 2015-04-21 | Daifuku Kk | Transport device and transport method for plate-shaped objects |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102464210A (en) * | 2010-11-11 | 2012-05-23 | 株式会社Siti | Substrate carrying device |
CN102602695A (en) * | 2011-01-25 | 2012-07-25 | 佶新科技股份有限公司 | Substrate conveying and sorting device |
CN104495357B (en) * | 2014-12-12 | 2017-01-04 | 南通富士通微电子股份有限公司 | A kind of photolithography plate Filtting device |
JP6449074B2 (en) * | 2015-03-25 | 2019-01-09 | 住友化学株式会社 | Substrate processing apparatus and substrate processing method |
JP6339057B2 (en) * | 2015-09-29 | 2018-06-06 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and program |
CN107601043A (en) * | 2017-08-23 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | Base plate transfer device |
CN109250502B (en) * | 2018-10-18 | 2020-08-11 | 深圳市华星光电半导体显示技术有限公司 | Substrate conveying device |
JP7204537B2 (en) * | 2019-03-05 | 2023-01-16 | キオクシア株式会社 | Substrate bonding apparatus and semiconductor device manufacturing method |
CN114408572B (en) * | 2021-12-20 | 2024-04-26 | 江苏长欣车辆装备有限公司 | Transfer device that glass production workshop used |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197728A (en) * | 2001-12-27 | 2003-07-11 | Aitec:Kk | Cassette for storing substrate |
-
2004
- 2004-08-17 TW TW093124682A patent/TWI265905B/en not_active IP Right Cessation
- 2004-08-18 CN CN2004100905202A patent/CN1600658B/en not_active Expired - Fee Related
- 2004-08-18 KR KR1020040065082A patent/KR100633848B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481541B (en) * | 2010-08-04 | 2015-04-21 | Daifuku Kk | Transport device and transport method for plate-shaped objects |
Also Published As
Publication number | Publication date |
---|---|
KR100633848B1 (en) | 2006-10-13 |
CN1600658A (en) | 2005-03-30 |
TW200512144A (en) | 2005-04-01 |
KR20050020662A (en) | 2005-03-04 |
CN1600658B (en) | 2012-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent |