PH12021550125A1 - Tape for glass processing - Google Patents
Tape for glass processingInfo
- Publication number
- PH12021550125A1 PH12021550125A1 PH12021550125A PH12021550125A PH12021550125A1 PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1 PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1
- Authority
- PH
- Philippines
- Prior art keywords
- sensitive adhesive
- pressure
- tape
- adhesive tape
- glass processing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100125A JP7060547B2 (ja) | 2019-05-29 | 2019-05-29 | ガラス加工用テープ |
PCT/JP2020/009033 WO2020240962A1 (ja) | 2019-05-29 | 2020-03-04 | ガラス加工用テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12021550125A1 true PH12021550125A1 (en) | 2021-10-04 |
Family
ID=73547635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12021550125A PH12021550125A1 (en) | 2019-05-29 | 2021-01-18 | Tape for glass processing |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7060547B2 (ko) |
KR (1) | KR102505582B1 (ko) |
CN (1) | CN112368108B (ko) |
PH (1) | PH12021550125A1 (ko) |
SG (1) | SG11202100512QA (ko) |
TW (1) | TWI755743B (ko) |
WO (1) | WO2020240962A1 (ko) |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0235117B2 (ja) * | 1984-06-18 | 1990-08-08 | Daiho Kensetsu | Shiirudoki |
JPH10310749A (ja) * | 1997-05-13 | 1998-11-24 | Mitsui Chem Inc | 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法 |
JP4358502B2 (ja) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
JP2004273895A (ja) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | 半導体ウエーハの分割方法 |
JP5151015B2 (ja) * | 2005-08-25 | 2013-02-27 | 東洋紡株式会社 | 熱収縮性ポリエステル系フィルム及びラベルとその製造方法 |
US20100130716A1 (en) * | 2007-05-08 | 2010-05-27 | Mitsui Chemicals, Inc. | Crosslinked material of propylene polymer |
JP5290853B2 (ja) | 2009-04-28 | 2013-09-18 | 三菱樹脂株式会社 | ダイシング用粘着シート |
JP5554118B2 (ja) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP5801584B2 (ja) * | 2011-03-29 | 2015-10-28 | リンテック株式会社 | ダイシングテープおよびチップ状部品の製造方法 |
JP5764519B2 (ja) | 2011-03-31 | 2015-08-19 | 古河電気工業株式会社 | ダイシングテープ及び半導体ウエハ加工方法 |
JP5294358B2 (ja) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
KR102047347B1 (ko) * | 2012-12-26 | 2019-11-21 | 히타치가세이가부시끼가이샤 | 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치 |
JP5379919B1 (ja) * | 2013-02-13 | 2013-12-25 | 古河電気工業株式会社 | 半導体加工用粘着テープ |
JP6295135B2 (ja) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
WO2016152919A1 (ja) * | 2015-03-24 | 2016-09-29 | 古河電気工業株式会社 | 半導体加工用テープ |
WO2016152957A1 (ja) | 2015-03-24 | 2016-09-29 | 古河電気工業株式会社 | 半導体加工用テープ |
JP6632115B2 (ja) * | 2015-07-17 | 2020-01-15 | 藤森工業株式会社 | 接着性樹脂層及び接着性樹脂フィルム |
JP2017147293A (ja) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | 接着シートとダイシングテープを用いる半導体装置の製造方法 |
JP2017174945A (ja) * | 2016-03-23 | 2017-09-28 | 京セラ株式会社 | 積層型電子部品 |
JP2018166148A (ja) | 2017-03-28 | 2018-10-25 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
JP6535117B1 (ja) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | 半導体加工用テープ |
-
2019
- 2019-05-29 JP JP2019100125A patent/JP7060547B2/ja active Active
-
2020
- 2020-03-04 CN CN202080003846.4A patent/CN112368108B/zh active Active
- 2020-03-04 KR KR1020207037097A patent/KR102505582B1/ko active IP Right Grant
- 2020-03-04 SG SG11202100512QA patent/SG11202100512QA/en unknown
- 2020-03-04 WO PCT/JP2020/009033 patent/WO2020240962A1/ja active Application Filing
- 2020-05-28 TW TW109117769A patent/TWI755743B/zh active
-
2021
- 2021-01-18 PH PH12021550125A patent/PH12021550125A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2020240962A1 (ja) | 2020-12-03 |
JP2020194903A (ja) | 2020-12-03 |
SG11202100512QA (en) | 2021-03-30 |
KR20210015888A (ko) | 2021-02-10 |
CN112368108A (zh) | 2021-02-12 |
JP7060547B2 (ja) | 2022-04-26 |
CN112368108B (zh) | 2022-11-04 |
KR102505582B1 (ko) | 2023-03-06 |
TWI755743B (zh) | 2022-02-21 |
TW202043401A (zh) | 2020-12-01 |
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