CN112368108B - 玻璃加工用胶带 - Google Patents

玻璃加工用胶带 Download PDF

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Publication number
CN112368108B
CN112368108B CN202080003846.4A CN202080003846A CN112368108B CN 112368108 B CN112368108 B CN 112368108B CN 202080003846 A CN202080003846 A CN 202080003846A CN 112368108 B CN112368108 B CN 112368108B
Authority
CN
China
Prior art keywords
adhesive layer
glass
adhesive
film
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080003846.4A
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English (en)
Chinese (zh)
Other versions
CN112368108A (zh
Inventor
松原侑弘
横井启时
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN112368108A publication Critical patent/CN112368108A/zh
Application granted granted Critical
Publication of CN112368108B publication Critical patent/CN112368108B/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN202080003846.4A 2019-05-29 2020-03-04 玻璃加工用胶带 Active CN112368108B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-100125 2019-05-29
JP2019100125A JP7060547B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
PCT/JP2020/009033 WO2020240962A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ

Publications (2)

Publication Number Publication Date
CN112368108A CN112368108A (zh) 2021-02-12
CN112368108B true CN112368108B (zh) 2022-11-04

Family

ID=73547635

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080003846.4A Active CN112368108B (zh) 2019-05-29 2020-03-04 玻璃加工用胶带

Country Status (7)

Country Link
JP (1) JP7060547B2 (ko)
KR (1) KR102505582B1 (ko)
CN (1) CN112368108B (ko)
PH (1) PH12021550125A1 (ko)
SG (1) SG11202100512QA (ko)
TW (1) TWI755743B (ko)
WO (1) WO2020240962A1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272437A (zh) * 2013-02-13 2015-01-07 古河电气工业株式会社 半导体加工用粘合胶带
CN107408501A (zh) * 2015-03-24 2017-11-28 古河电气工业株式会社 半导体加工用带

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235117B2 (ja) * 1984-06-18 1990-08-08 Daiho Kensetsu Shiirudoki
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5151015B2 (ja) * 2005-08-25 2013-02-27 東洋紡株式会社 熱収縮性ポリエステル系フィルム及びラベルとその製造方法
US20100130716A1 (en) * 2007-05-08 2010-05-27 Mitsui Chemicals, Inc. Crosslinked material of propylene polymer
JP5290853B2 (ja) 2009-04-28 2013-09-18 三菱樹脂株式会社 ダイシング用粘着シート
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5801584B2 (ja) * 2011-03-29 2015-10-28 リンテック株式会社 ダイシングテープおよびチップ状部品の製造方法
JP5764519B2 (ja) 2011-03-31 2015-08-19 古河電気工業株式会社 ダイシングテープ及び半導体ウエハ加工方法
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
KR102047347B1 (ko) * 2012-12-26 2019-11-21 히타치가세이가부시끼가이샤 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6632115B2 (ja) * 2015-07-17 2020-01-15 藤森工業株式会社 接着性樹脂層及び接着性樹脂フィルム
JP2017147293A (ja) * 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2017174945A (ja) * 2016-03-23 2017-09-28 京セラ株式会社 積層型電子部品
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535117B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272437A (zh) * 2013-02-13 2015-01-07 古河电气工业株式会社 半导体加工用粘合胶带
CN107408501A (zh) * 2015-03-24 2017-11-28 古河电气工业株式会社 半导体加工用带

Also Published As

Publication number Publication date
WO2020240962A1 (ja) 2020-12-03
JP2020194903A (ja) 2020-12-03
SG11202100512QA (en) 2021-03-30
KR20210015888A (ko) 2021-02-10
PH12021550125A1 (en) 2021-10-04
CN112368108A (zh) 2021-02-12
JP7060547B2 (ja) 2022-04-26
KR102505582B1 (ko) 2023-03-06
TWI755743B (zh) 2022-02-21
TW202043401A (zh) 2020-12-01

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