SG11202100512QA - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
SG11202100512QA
SG11202100512QA SG11202100512QA SG11202100512QA SG11202100512QA SG 11202100512Q A SG11202100512Q A SG 11202100512QA SG 11202100512Q A SG11202100512Q A SG 11202100512QA SG 11202100512Q A SG11202100512Q A SG 11202100512QA SG 11202100512Q A SG11202100512Q A SG 11202100512QA
Authority
SG
Singapore
Prior art keywords
tape
glass processing
glass
processing
Prior art date
Application number
SG11202100512QA
Other languages
English (en)
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11202100512QA publication Critical patent/SG11202100512QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
SG11202100512QA 2019-05-29 2020-03-04 Tape for glass processing SG11202100512QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100125A JP7060547B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
PCT/JP2020/009033 WO2020240962A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ

Publications (1)

Publication Number Publication Date
SG11202100512QA true SG11202100512QA (en) 2021-03-30

Family

ID=73547635

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202100512QA SG11202100512QA (en) 2019-05-29 2020-03-04 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7060547B2 (ko)
KR (1) KR102505582B1 (ko)
CN (1) CN112368108B (ko)
PH (1) PH12021550125A1 (ko)
SG (1) SG11202100512QA (ko)
TW (1) TWI755743B (ko)
WO (1) WO2020240962A1 (ko)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235117B2 (ja) * 1984-06-18 1990-08-08 Daiho Kensetsu Shiirudoki
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5151015B2 (ja) * 2005-08-25 2013-02-27 東洋紡株式会社 熱収縮性ポリエステル系フィルム及びラベルとその製造方法
US20100130716A1 (en) * 2007-05-08 2010-05-27 Mitsui Chemicals, Inc. Crosslinked material of propylene polymer
JP5290853B2 (ja) 2009-04-28 2013-09-18 三菱樹脂株式会社 ダイシング用粘着シート
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5801584B2 (ja) * 2011-03-29 2015-10-28 リンテック株式会社 ダイシングテープおよびチップ状部品の製造方法
JP5764519B2 (ja) 2011-03-31 2015-08-19 古河電気工業株式会社 ダイシングテープ及び半導体ウエハ加工方法
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
KR102047347B1 (ko) * 2012-12-26 2019-11-21 히타치가세이가부시끼가이샤 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치
JP5379919B1 (ja) * 2013-02-13 2013-12-25 古河電気工業株式会社 半導体加工用粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2016152919A1 (ja) * 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6632115B2 (ja) * 2015-07-17 2020-01-15 藤森工業株式会社 接着性樹脂層及び接着性樹脂フィルム
JP2017147293A (ja) * 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2017174945A (ja) * 2016-03-23 2017-09-28 京セラ株式会社 積層型電子部品
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535117B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Also Published As

Publication number Publication date
WO2020240962A1 (ja) 2020-12-03
JP2020194903A (ja) 2020-12-03
KR20210015888A (ko) 2021-02-10
PH12021550125A1 (en) 2021-10-04
CN112368108A (zh) 2021-02-12
JP7060547B2 (ja) 2022-04-26
CN112368108B (zh) 2022-11-04
KR102505582B1 (ko) 2023-03-06
TWI755743B (zh) 2022-02-21
TW202043401A (zh) 2020-12-01

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