PH12021550127A1 - Tape for glass processing - Google Patents
Tape for glass processingInfo
- Publication number
- PH12021550127A1 PH12021550127A1 PH12021550127A PH12021550127A PH12021550127A1 PH 12021550127 A1 PH12021550127 A1 PH 12021550127A1 PH 12021550127 A PH12021550127 A PH 12021550127A PH 12021550127 A PH12021550127 A PH 12021550127A PH 12021550127 A1 PH12021550127 A1 PH 12021550127A1
- Authority
- PH
- Philippines
- Prior art keywords
- tape
- glass processing
- adhesive tape
- thermo
- base film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Provided is a tape for glass processing, whereby sufficient heat shrinking can occur in a short time and kerf width can be maintained. This tape 10 for glass processing has an adhesive tape 15 having a base film 11 and an adhesive layer 12 formed on at least one surface side of the base film 11. The adhesive tape 15 has a negative value for the sum of: the average thermal deformation rate for each 1øC between 40-80øC measured during temperature increase in the MD direction, by a thermo-mechanical property tester; and the average heat deformation rate for each 1øC between 40-80øC measured during temperature increase in the TD direction, by a thermo-mechanical property tester. The adhesive tape 15 is characterized by being used in glass processing that includes an expanding step in which the adhesive tape 15 is expanded.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100127A JP7269095B2 (en) | 2019-05-29 | 2019-05-29 | glass processing tape |
PCT/JP2020/009035 WO2020240964A1 (en) | 2019-05-29 | 2020-03-04 | Tape for glass processing |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12021550127A1 true PH12021550127A1 (en) | 2021-10-04 |
Family
ID=73545917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12021550127A PH12021550127A1 (en) | 2019-05-29 | 2021-01-18 | Tape for glass processing |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7269095B2 (en) |
KR (1) | KR102505643B1 (en) |
CN (1) | CN112351859B (en) |
PH (1) | PH12021550127A1 (en) |
SG (1) | SG11202100514UA (en) |
TW (1) | TWI743810B (en) |
WO (1) | WO2020240964A1 (en) |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0235119B2 (en) * | 1982-12-27 | 1990-08-08 | Tokyo Gasu Kk | SUIHEICHOKYORISAKUSHINKOHONIOKERUKUTSUSAKUHETSUDO |
JPH10310749A (en) * | 1997-05-13 | 1998-11-24 | Mitsui Chem Inc | Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer |
WO2000061658A1 (en) * | 1999-04-09 | 2000-10-19 | Kaneka Corporation | Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these |
JP4358502B2 (en) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
TWI310230B (en) * | 2003-01-22 | 2009-05-21 | Lintec Corp | Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work |
JP2004273895A (en) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
JP5519971B2 (en) * | 2008-11-26 | 2014-06-11 | 日東電工株式会社 | Dicing die-bonding film and method for manufacturing semiconductor device |
JP5290853B2 (en) * | 2009-04-28 | 2013-09-18 | 三菱樹脂株式会社 | Dicing adhesive sheet |
JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
JP5744434B2 (en) * | 2010-07-29 | 2015-07-08 | 日東電工株式会社 | Heat release sheet-integrated film for semiconductor back surface, semiconductor element recovery method, and semiconductor device manufacturing method |
KR20120068453A (en) * | 2010-12-17 | 2012-06-27 | 제일모직주식회사 | Dicing die bonding film |
JP5764519B2 (en) * | 2011-03-31 | 2015-08-19 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer processing method |
JP5019657B1 (en) * | 2011-10-27 | 2012-09-05 | 古河電気工業株式会社 | Adhesive tape for semiconductor device processing |
JP5053455B1 (en) * | 2011-10-28 | 2012-10-17 | 古河電気工業株式会社 | Dicing tape for semiconductor processing |
JP2013133464A (en) * | 2011-12-27 | 2013-07-08 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for glass plate |
JP5294358B2 (en) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | Wafer processing tape and semiconductor device manufacturing method using the same |
JP5731080B2 (en) * | 2013-03-28 | 2015-06-10 | 古河電気工業株式会社 | Adhesive tape and wafer processing tape |
JP5607847B1 (en) * | 2013-11-29 | 2014-10-15 | 古河電気工業株式会社 | Adhesive tape for semiconductor processing |
JP6295135B2 (en) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
KR102359829B1 (en) * | 2014-05-12 | 2022-02-07 | 덴카 주식회사 | Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method |
JP6445315B2 (en) * | 2014-12-12 | 2018-12-26 | 日東電工株式会社 | Dicing sheet, dicing die-bonding film, and semiconductor device manufacturing method |
WO2016152957A1 (en) | 2015-03-24 | 2016-09-29 | 古河電気工業株式会社 | Semiconductor processing tape |
JP2017147293A (en) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape |
JP2018166148A (en) * | 2017-03-28 | 2018-10-25 | リンテック株式会社 | Substrate film for dicing sheet and dicing sheet |
JP6978890B2 (en) * | 2017-10-16 | 2021-12-08 | リンテック株式会社 | Manufacturing method of dicing die bonding sheet and semiconductor chip |
JP6535119B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
-
2019
- 2019-05-29 JP JP2019100127A patent/JP7269095B2/en active Active
-
2020
- 2020-03-04 WO PCT/JP2020/009035 patent/WO2020240964A1/en active Application Filing
- 2020-03-04 SG SG11202100514UA patent/SG11202100514UA/en unknown
- 2020-03-04 KR KR1020207037105A patent/KR102505643B1/en active IP Right Grant
- 2020-03-04 CN CN202080003823.3A patent/CN112351859B/en active Active
- 2020-05-28 TW TW109117771A patent/TWI743810B/en active
-
2021
- 2021-01-18 PH PH12021550127A patent/PH12021550127A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102505643B1 (en) | 2023-03-06 |
TW202043400A (en) | 2020-12-01 |
SG11202100514UA (en) | 2021-02-25 |
TWI743810B (en) | 2021-10-21 |
WO2020240964A1 (en) | 2020-12-03 |
CN112351859B (en) | 2023-04-11 |
JP2020194905A (en) | 2020-12-03 |
CN112351859A (en) | 2021-02-09 |
KR20210015891A (en) | 2021-02-10 |
JP7269095B2 (en) | 2023-05-08 |
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