PH12021550127A1 - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
PH12021550127A1
PH12021550127A1 PH12021550127A PH12021550127A PH12021550127A1 PH 12021550127 A1 PH12021550127 A1 PH 12021550127A1 PH 12021550127 A PH12021550127 A PH 12021550127A PH 12021550127 A PH12021550127 A PH 12021550127A PH 12021550127 A1 PH12021550127 A1 PH 12021550127A1
Authority
PH
Philippines
Prior art keywords
tape
glass processing
adhesive tape
thermo
base film
Prior art date
Application number
PH12021550127A
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12021550127A1 publication Critical patent/PH12021550127A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a tape for glass processing, whereby sufficient heat shrinking can occur in a short time and kerf width can be maintained. This tape 10 for glass processing has an adhesive tape 15 having a base film 11 and an adhesive layer 12 formed on at least one surface side of the base film 11. The adhesive tape 15 has a negative value for the sum of: the average thermal deformation rate for each 1øC between 40-80øC measured during temperature increase in the MD direction, by a thermo-mechanical property tester; and the average heat deformation rate for each 1øC between 40-80øC measured during temperature increase in the TD direction, by a thermo-mechanical property tester. The adhesive tape 15 is characterized by being used in glass processing that includes an expanding step in which the adhesive tape 15 is expanded.
PH12021550127A 2019-05-29 2021-01-18 Tape for glass processing PH12021550127A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100127A JP7269095B2 (en) 2019-05-29 2019-05-29 glass processing tape
PCT/JP2020/009035 WO2020240964A1 (en) 2019-05-29 2020-03-04 Tape for glass processing

Publications (1)

Publication Number Publication Date
PH12021550127A1 true PH12021550127A1 (en) 2021-10-04

Family

ID=73545917

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550127A PH12021550127A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7269095B2 (en)
KR (1) KR102505643B1 (en)
CN (1) CN112351859B (en)
PH (1) PH12021550127A1 (en)
SG (1) SG11202100514UA (en)
TW (1) TWI743810B (en)
WO (1) WO2020240964A1 (en)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235119B2 (en) * 1982-12-27 1990-08-08 Tokyo Gasu Kk SUIHEICHOKYORISAKUSHINKOHONIOKERUKUTSUSAKUHETSUDO
JPH10310749A (en) * 1997-05-13 1998-11-24 Mitsui Chem Inc Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer
WO2000061658A1 (en) * 1999-04-09 2000-10-19 Kaneka Corporation Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
JP5519971B2 (en) * 2008-11-26 2014-06-11 日東電工株式会社 Dicing die-bonding film and method for manufacturing semiconductor device
JP5290853B2 (en) * 2009-04-28 2013-09-18 三菱樹脂株式会社 Dicing adhesive sheet
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP5744434B2 (en) * 2010-07-29 2015-07-08 日東電工株式会社 Heat release sheet-integrated film for semiconductor back surface, semiconductor element recovery method, and semiconductor device manufacturing method
KR20120068453A (en) * 2010-12-17 2012-06-27 제일모직주식회사 Dicing die bonding film
JP5764519B2 (en) * 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
JP5019657B1 (en) * 2011-10-27 2012-09-05 古河電気工業株式会社 Adhesive tape for semiconductor device processing
JP5053455B1 (en) * 2011-10-28 2012-10-17 古河電気工業株式会社 Dicing tape for semiconductor processing
JP2013133464A (en) * 2011-12-27 2013-07-08 Nitto Denko Corp Pressure-sensitive adhesive sheet for glass plate
JP5294358B2 (en) * 2012-01-06 2013-09-18 古河電気工業株式会社 Wafer processing tape and semiconductor device manufacturing method using the same
JP5731080B2 (en) * 2013-03-28 2015-06-10 古河電気工業株式会社 Adhesive tape and wafer processing tape
JP5607847B1 (en) * 2013-11-29 2014-10-15 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
KR102359829B1 (en) * 2014-05-12 2022-02-07 덴카 주식회사 Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method
JP6445315B2 (en) * 2014-12-12 2018-12-26 日東電工株式会社 Dicing sheet, dicing die-bonding film, and semiconductor device manufacturing method
WO2016152957A1 (en) 2015-03-24 2016-09-29 古河電気工業株式会社 Semiconductor processing tape
JP2017147293A (en) * 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP2018166148A (en) * 2017-03-28 2018-10-25 リンテック株式会社 Substrate film for dicing sheet and dicing sheet
JP6978890B2 (en) * 2017-10-16 2021-12-08 リンテック株式会社 Manufacturing method of dicing die bonding sheet and semiconductor chip
JP6535119B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape

Also Published As

Publication number Publication date
KR102505643B1 (en) 2023-03-06
TW202043400A (en) 2020-12-01
SG11202100514UA (en) 2021-02-25
TWI743810B (en) 2021-10-21
WO2020240964A1 (en) 2020-12-03
CN112351859B (en) 2023-04-11
JP2020194905A (en) 2020-12-03
CN112351859A (en) 2021-02-09
KR20210015891A (en) 2021-02-10
JP7269095B2 (en) 2023-05-08

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