JP7060547B2 - ガラス加工用テープ - Google Patents

ガラス加工用テープ Download PDF

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Publication number
JP7060547B2
JP7060547B2 JP2019100125A JP2019100125A JP7060547B2 JP 7060547 B2 JP7060547 B2 JP 7060547B2 JP 2019100125 A JP2019100125 A JP 2019100125A JP 2019100125 A JP2019100125 A JP 2019100125A JP 7060547 B2 JP7060547 B2 JP 7060547B2
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JP
Japan
Prior art keywords
adhesive layer
glass
resin
tape
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019100125A
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English (en)
Japanese (ja)
Other versions
JP2020194903A (ja
Inventor
侑弘 松原
啓時 横井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019100125A priority Critical patent/JP7060547B2/ja
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to PCT/JP2020/009033 priority patent/WO2020240962A1/ja
Priority to CN202080003846.4A priority patent/CN112368108B/zh
Priority to SG11202100512QA priority patent/SG11202100512QA/en
Priority to KR1020207037097A priority patent/KR102505582B1/ko
Priority to TW109117769A priority patent/TWI755743B/zh
Publication of JP2020194903A publication Critical patent/JP2020194903A/ja
Priority to PH12021550125A priority patent/PH12021550125A1/en
Application granted granted Critical
Publication of JP7060547B2 publication Critical patent/JP7060547B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2019100125A 2019-05-29 2019-05-29 ガラス加工用テープ Active JP7060547B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019100125A JP7060547B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
CN202080003846.4A CN112368108B (zh) 2019-05-29 2020-03-04 玻璃加工用胶带
SG11202100512QA SG11202100512QA (en) 2019-05-29 2020-03-04 Tape for glass processing
KR1020207037097A KR102505582B1 (ko) 2019-05-29 2020-03-04 유리 가공용 테이프
PCT/JP2020/009033 WO2020240962A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ
TW109117769A TWI755743B (zh) 2019-05-29 2020-05-28 玻璃加工用膠帶
PH12021550125A PH12021550125A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019100125A JP7060547B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ

Publications (2)

Publication Number Publication Date
JP2020194903A JP2020194903A (ja) 2020-12-03
JP7060547B2 true JP7060547B2 (ja) 2022-04-26

Family

ID=73547635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019100125A Active JP7060547B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ

Country Status (7)

Country Link
JP (1) JP7060547B2 (ko)
KR (1) KR102505582B1 (ko)
CN (1) CN112368108B (ko)
PH (1) PH12021550125A1 (ko)
SG (1) SG11202100512QA (ko)
TW (1) TWI755743B (ko)
WO (1) WO2020240962A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535117B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235117B2 (ja) * 1984-06-18 1990-08-08 Daiho Kensetsu Shiirudoki
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5151015B2 (ja) * 2005-08-25 2013-02-27 東洋紡株式会社 熱収縮性ポリエステル系フィルム及びラベルとその製造方法
US20100130716A1 (en) * 2007-05-08 2010-05-27 Mitsui Chemicals, Inc. Crosslinked material of propylene polymer
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5801584B2 (ja) * 2011-03-29 2015-10-28 リンテック株式会社 ダイシングテープおよびチップ状部品の製造方法
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
KR102047347B1 (ko) * 2012-12-26 2019-11-21 히타치가세이가부시끼가이샤 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치
JP5379919B1 (ja) * 2013-02-13 2013-12-25 古河電気工業株式会社 半導体加工用粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2016152919A1 (ja) * 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6632115B2 (ja) * 2015-07-17 2020-01-15 藤森工業株式会社 接着性樹脂層及び接着性樹脂フィルム
JP2017147293A (ja) * 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2017174945A (ja) * 2016-03-23 2017-09-28 京セラ株式会社 積層型電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535117B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Also Published As

Publication number Publication date
WO2020240962A1 (ja) 2020-12-03
JP2020194903A (ja) 2020-12-03
SG11202100512QA (en) 2021-03-30
KR20210015888A (ko) 2021-02-10
PH12021550125A1 (en) 2021-10-04
CN112368108A (zh) 2021-02-12
CN112368108B (zh) 2022-11-04
KR102505582B1 (ko) 2023-03-06
TWI755743B (zh) 2022-02-21
TW202043401A (zh) 2020-12-01

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