PH12021550130A1 - Tape for glass processing - Google Patents
Tape for glass processingInfo
- Publication number
- PH12021550130A1 PH12021550130A1 PH12021550130A PH12021550130A PH12021550130A1 PH 12021550130 A1 PH12021550130 A1 PH 12021550130A1 PH 12021550130 A PH12021550130 A PH 12021550130A PH 12021550130 A PH12021550130 A PH 12021550130A PH 12021550130 A1 PH12021550130 A1 PH 12021550130A1
- Authority
- PH
- Philippines
- Prior art keywords
- tape
- adhesive tape
- machining
- derivative
- measured
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Provided is glass machining tape that can be sufficiently heat-shrunk in a short length of time, and that is capable of maintaining cuff width. Glass machining tape 10 according to the present invention is characterized by comprising adhesive tape 15 having a base film 11 and an adhesive agent layer 12 formed on at least one surface side of the base film 11; the sum of the average value of the derivative of the rate of thermal deformation of the adhesive tape 15 in the machine direction per 1øC in a range from 40øC to 80øC as measured by a thermomechanical properties tester during heating and the average value of the derivative of the rate of thermal deformation thereof in the transverse direction per 1øC in a range from 40øC to 80øC as measured by a thermomechanical properties tester during heating is a negative value; and the machining tape is used in glass machining including an expansion step for expanding the adhesive tape 15.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100128A JP7269096B2 (en) | 2019-05-29 | 2019-05-29 | glass processing tape |
PCT/JP2020/009036 WO2020240965A1 (en) | 2019-05-29 | 2020-03-04 | Glass machining tape |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12021550130A1 true PH12021550130A1 (en) | 2021-09-27 |
Family
ID=73545921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12021550130A PH12021550130A1 (en) | 2019-05-29 | 2021-01-18 | Tape for glass processing |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7269096B2 (en) |
KR (1) | KR102505638B1 (en) |
CN (1) | CN112368106B (en) |
PH (1) | PH12021550130A1 (en) |
SG (1) | SG11202100516XA (en) |
TW (1) | TWI743811B (en) |
WO (1) | WO2020240965A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114804647B (en) * | 2022-03-25 | 2024-04-05 | 吴江南玻华东工程玻璃有限公司 | Preparation method of coated glass sample wafer and hollow sandwich glass sample wafer |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS611830A (en) * | 1985-05-16 | 1986-01-07 | Yanmar Diesel Engine Co Ltd | Speed adjustor for diesel engine |
JPH10310749A (en) * | 1997-05-13 | 1998-11-24 | Mitsui Chem Inc | Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer |
JP4358502B2 (en) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
JP2004273895A (en) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
EP1634673A4 (en) * | 2003-04-25 | 2009-04-08 | Nitto Denko Corp | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
JP5151015B2 (en) * | 2005-08-25 | 2013-02-27 | 東洋紡株式会社 | Heat-shrinkable polyester film and label and method for producing the same |
US20100130716A1 (en) * | 2007-05-08 | 2010-05-27 | Mitsui Chemicals, Inc. | Crosslinked material of propylene polymer |
JP5290853B2 (en) * | 2009-04-28 | 2013-09-18 | 三菱樹脂株式会社 | Dicing adhesive sheet |
JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
JP2012174945A (en) * | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | Processing method of semiconductor wafer |
JP5801584B2 (en) * | 2011-03-29 | 2015-10-28 | リンテック株式会社 | Dicing tape and chip-shaped part manufacturing method |
JP5764519B2 (en) * | 2011-03-31 | 2015-08-19 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer processing method |
JP5184685B1 (en) * | 2011-09-26 | 2013-04-17 | 古河電気工業株式会社 | Semiconductor wafer processing tape |
JP5294358B2 (en) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | Wafer processing tape and semiconductor device manufacturing method using the same |
JP6295135B2 (en) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
WO2016152957A1 (en) | 2015-03-24 | 2016-09-29 | 古河電気工業株式会社 | Semiconductor processing tape |
JP6632115B2 (en) * | 2015-07-17 | 2020-01-15 | 藤森工業株式会社 | Adhesive resin layer and adhesive resin film |
JP2017147293A (en) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape |
JP2018166148A (en) * | 2017-03-28 | 2018-10-25 | リンテック株式会社 | Substrate film for dicing sheet and dicing sheet |
JP6535138B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
-
2019
- 2019-05-29 JP JP2019100128A patent/JP7269096B2/en active Active
-
2020
- 2020-03-04 WO PCT/JP2020/009036 patent/WO2020240965A1/en active Application Filing
- 2020-03-04 CN CN202080003817.8A patent/CN112368106B/en active Active
- 2020-03-04 KR KR1020207037146A patent/KR102505638B1/en active IP Right Grant
- 2020-03-04 SG SG11202100516XA patent/SG11202100516XA/en unknown
- 2020-05-28 TW TW109117774A patent/TWI743811B/en active
-
2021
- 2021-01-18 PH PH12021550130A patent/PH12021550130A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP7269096B2 (en) | 2023-05-08 |
JP2020194906A (en) | 2020-12-03 |
TWI743811B (en) | 2021-10-21 |
CN112368106A (en) | 2021-02-12 |
TW202043403A (en) | 2020-12-01 |
WO2020240965A1 (en) | 2020-12-03 |
KR20210015893A (en) | 2021-02-10 |
SG11202100516XA (en) | 2021-02-25 |
CN112368106B (en) | 2022-11-01 |
KR102505638B1 (en) | 2023-03-06 |
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