KR970013178A - 웨이퍼링의 공급·반송장치 - Google Patents

웨이퍼링의 공급·반송장치 Download PDF

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Publication number
KR970013178A
KR970013178A KR1019960034161A KR19960034161A KR970013178A KR 970013178 A KR970013178 A KR 970013178A KR 1019960034161 A KR1019960034161 A KR 1019960034161A KR 19960034161 A KR19960034161 A KR 19960034161A KR 970013178 A KR970013178 A KR 970013178A
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South Korea
Prior art keywords
wafer ring
cassette
wafer
guide rails
conveying means
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Application number
KR1019960034161A
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English (en)
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KR100251431B1 (ko
Inventor
오사무 나카무라
시게루 이치카와
츠네하루 아라이
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
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Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR970013178A publication Critical patent/KR970013178A/ko
Application granted granted Critical
Publication of KR100251431B1 publication Critical patent/KR100251431B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

「과제」 장치의 소형화를 꾀한다. 「해결수단」 웨이퍼링 반송수단(35)에 의해서 반송되는 웨이퍼링(1)이 양측단부를 안내하는 한쌍의 가이드 레일(69,70)은, 웨이퍼링 캬세트(10)측을 중심으로 하여 상하방향에 회동이 자유롭게 설치되고, 웨이퍼링(1)의 반송때에 가이드 레일(69,70)의 반송면(69a, 70a)이 수평이 되도록 회동시킨다.

Description

웨이퍼링의 공급 · 반송장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 웨이퍼링의 공급 · 반송장치의 하나의 실시예를 나타내는 일부 단면 정면도이다.

Claims (2)

  1. 팰릿이 첨부된 웨이퍼시트가 점착고정된 웨이퍼링을 일정피치로 수납하는 웨이퍼링 캬세트와, 이 웨이퍼링 카세트를 상하이동시키는 엘리베이트 장치와, 웨이퍼링 카세트에 수납된 웨이퍼링을 1개씩 반송하여 팰릿 픽업장치에 공급함과 함께, 반도체 팰릿이 픽업된 뒤의 사용종료 웨이퍼링을 상기 웨이퍼링 카세트의 비어있는 수납부에 반송하는 웨이퍼링 반송수단과, 이 웨이퍼링 반송수단에 의해서 반송되는 웨이퍼링의 양쪽 단부를 안내하는 한쌍의 가이드 레일을 구비한 웨이퍼링의 공급 · 반송장치에 있어서, 상기 가이드 레일은, 상기 웨이퍼링 카세트측의 회전축을 중심으로 하여 상하방향에 회동이 자유롭게 설치되고, 웨이퍼링 반송때에 가이드 레일의 반송면이 수평이 되도록 회동시켜지는 것을 특징으로 하는 웨이퍼링의 공급 · 반송장치
  2. 제1항에 있어서, 상기 가리드 레일의 상기 웨이퍼링 카세트측은 회전축으로 고정되어, 회전축은 틀체에 회전이 자유롭게 지지되고 또한 구동수단으로 회동시켜주는 것을 특징으로 하는 웨이퍼링 공급 · 반송장치
KR1019960034161A 1995-08-18 1996-08-19 웨이퍼링의 공급·반송장치 KR100251431B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-232108 1995-08-18
JP23210895A JP3198401B2 (ja) 1995-08-18 1995-08-18 ウェーハリングの供給・返送装置

Publications (2)

Publication Number Publication Date
KR970013178A true KR970013178A (ko) 1997-03-29
KR100251431B1 KR100251431B1 (ko) 2000-04-15

Family

ID=16934138

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960034161A KR100251431B1 (ko) 1995-08-18 1996-08-19 웨이퍼링의 공급·반송장치

Country Status (4)

Country Link
US (1) US5853532A (ko)
JP (1) JP3198401B2 (ko)
KR (1) KR100251431B1 (ko)
TW (1) TW297144B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107128A (ja) * 1996-10-01 1998-04-24 Shinkawa Ltd ウェーハリングの供給装置
JP3662404B2 (ja) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JPH11307553A (ja) * 1998-04-21 1999-11-05 Shinkawa Ltd 半導体ペレットの位置決め方法及びその装置
JP2001176892A (ja) 1999-12-15 2001-06-29 Shinkawa Ltd ダイボンディング方法及びその装置
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US20040071534A1 (en) * 2002-07-18 2004-04-15 August Technology Corp. Adjustable wafer alignment arm
US20080003091A1 (en) * 2006-06-22 2008-01-03 Bonora Anthony C Method and apparatus for transporting, queuing, and loading of large area substrates in multi-tool processing operations
KR100986281B1 (ko) * 2010-01-21 2010-10-07 주식회사 이노비즈 엘이디 검사장비의 웨이퍼 로딩유닛
TWI566317B (zh) * 2015-03-13 2017-01-11 均華精密工業股份有限公司 晶圓環快速換料裝置及其方法
KR102490593B1 (ko) 2016-08-22 2023-01-20 세메스 주식회사 웨이퍼링 이송 장치
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4638601A (en) * 1985-11-04 1987-01-27 Silicon Technology Corporation Automatic edge grinder
JPS62106642A (ja) * 1985-11-05 1987-05-18 Toshiba Seiki Kk ウェハリングの供給・返送方法
US5478428A (en) * 1994-08-01 1995-12-26 Grand Rapids Label Company Label separator and method for separating a label from a backing

Also Published As

Publication number Publication date
KR100251431B1 (ko) 2000-04-15
US5853532A (en) 1998-12-29
TW297144B (ko) 1997-02-01
JPH0964147A (ja) 1997-03-07
JP3198401B2 (ja) 2001-08-13

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