KR960002771A - 전자 집적 회로 카드 제조 및 조립 방법과 그에 따른 전자 집적 회로 카드 - Google Patents

전자 집적 회로 카드 제조 및 조립 방법과 그에 따른 전자 집적 회로 카드 Download PDF

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Publication number
KR960002771A
KR960002771A KR1019950016312A KR19950016312A KR960002771A KR 960002771 A KR960002771 A KR 960002771A KR 1019950016312 A KR1019950016312 A KR 1019950016312A KR 19950016312 A KR19950016312 A KR 19950016312A KR 960002771 A KR960002771 A KR 960002771A
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South Korea
Prior art keywords
integrated circuit
cavity
manufacturing
electronic integrated
track
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KR1019950016312A
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English (en)
Inventor
로네이 프랑수와
베낭브르 쟈크
Original Assignee
에프. 제이. 스미트
필립스 일렉트로닉스 엔.브이.
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Application filed by 에프. 제이. 스미트, 필립스 일렉트로닉스 엔.브이. filed Critical 에프. 제이. 스미트
Publication of KR960002771A publication Critical patent/KR960002771A/ko

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  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

전자 카드는 집적 회로(14)를 수용하기 위한 캐비티(15)와 함께 제공된 저기 절연 카드 지지부(1)를 포함하며, 한 면상에서 금속 접촉 패드(2)가 집적 회로의 접촉부에 전기적으로 접속된다. 본 발명은 상기 캐비티(5)의 하부벽(7) 및 측벽(6)에 대향하여 제공되며, 캐비티(5)를 포함하는 지지부(3)의 표면상에 배열된 금속 접촉 패드(2)중의 하나에 각각 접속되는 MID(성형 상호 접속 장치) 기술에 의한 전기 도체 트랙을 적용하는 단계와, 상기 캐비티(5)에 위치된 집적회로(4)의 접촉부와 캐비티의 하부(7)에 있는 도체 트랙(9)을 상호 접속하는 전기적, 접속을 실현시키는 단계와, 연속 중합되는 보호 수지(13)와 함께 상기 캐비티(5)를 충전시키는 단계를 포함한다.

Description

전자 집적 회로 카드 제조 및 조립 방법과 그에 따른 전자 집적 회로 카드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 따른 방법에 의해 실현될 분리의 집적 회로 카드에 대한 횡단면도 및 평면도.
제3도는 본 발명에 따른 방법에서 사용될 수 있는 가열하에서 재개될 수 있는 접착제와 함께 제공된 도체 트랙면의 횡단면도.

Claims (10)

  1. 는 집적 회로를 수용하기 위한 캐비티와 함께 제공된 전기 절연 카드 지지부를 포함하며, 한 면상에서 금속 접촉 패드가 집적 회로의 접촉부에 전기적으로 접속되는 전자 집적 회로 카드를 제조 및 조립하는 방법에 있어서, 상기 캐비티의 하부 및 측벽에 대항하여 제공되며, 캐비티를 포함하는 지지부의 표면상에 배열된 금속 접촉 패드중의 하나에 각각 접속되는 MID(성형 상호 접속 장치) 기술에 의한 전기 도체 트랙을 적용하는 단계와, 상기 캐비티에 위치된 집적회로의 접촉부와 캐비티의 하부에 있는 도체 트랙을 상호 접속하는 전기적, 접속을 실현시키는 단계와, 연속 중합되는 보호 수지와 함께 상기 캐비티를 충전시키는 단계를 포함하는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  2. 제1항에 있어서, 상기 전기 전도 트랙을 적용하는 단계는 열에 의해 활성화되는(고온 포일 엠보싱 방법)접착제와 함께 제공된 트랙의 온도 및 압력하에서의 접착에 근거하는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  3. 제1항에 있어서, 상기 전기 전도 트랙을 적용하는 단계는 트랙용으로 용구되는 형상에 따라 패드 인쇄공정에 있어서 촉매의 적용에 근거하며, 자촉 반응을 통한 금속화에 의해 수행되는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  4. 제1항에 있어서, 상기 전기 전도 트랙을 적용하는 단계는 레이저 홀로그램을 이용하는 3차원 포토리소그래피 공정에 근거하는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  5. 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 전기적 접속을 실현시키는 단계는 전도성 또는 비전도성 접착제에 의해 상기 캐비티의 하부에 대항하여 집적 회로를 그의 베이스와 접착시키는 것에 근거하며, 집적 회로 및 도체 트랙에 접착부 사이의 도체 와이어를 납땜으로써 수행되는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  6. 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 카드 지지부는 캐비티와 함께 사출 성형 기술에 의해 실현되며, 도체 트랙의 단부용으로 설계된 위치에 있는 캐비티 하부에 상승부를 포함하는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  7. 제1항 내지 제4항 또는 제6항 중 어느 한 항에 있어서, 상기 전기적 접속을 실현시키는 단계를 플립 칩 집적 회로 장착 기술에 근거하며, 상기 접속은 납땜, 절연 접착제 또는 집적 회로의 접촉부가 상승부와 함께 제공되는 한정된 위치의 전도성 접착제에 의해 실현되는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  8. 제1항 내지 제4항 또는 제6항 중 어느 한 항에 있어서, 상기 전기적 접속을 실현시키는 단계를 플립 칩 집적 회로 장착 기술에 근거하며, 상기 접속은 예비 성형된 포일 또는 페이스트의 형상으로 집적 회로의 접촉부가 상승부 없이 제공되는 비등방성 전기 전도성 접촉부에 의해 가압과 함께 접착되무로써 실현되는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  9. 제8항에 있어서, 상기 비등방성 전기 전도성 접착제는 전기적 접속이 실현되는 단계전에 중합화되는 것과, 그의 최종 중합하는 보호수지의 중합화와 동시에 수행되는 것을 특징으로 하는 전자 집적 회로 카드용 제조 및 조립 방법.
  10. 청구항 제1항 내지 9항 중 어느 한 항에 따른 방법에 의해 제조된 전자 집적 회로 카드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950016312A 1994-06-15 1995-06-15 전자 집적 회로 카드 제조 및 조립 방법과 그에 따른 전자 집적 회로 카드 KR960002771A (ko)

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EP0688051B1 (fr) 1999-09-15
EP0688051A1 (fr) 1995-12-20
JPH087066A (ja) 1996-01-12
DE69512137T2 (de) 2000-05-25
DE69512137D1 (de) 1999-10-21
US5647122A (en) 1997-07-15

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