FR2786317B1 - Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede - Google Patents
Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procedeInfo
- Publication number
- FR2786317B1 FR2786317B1 FR9814802A FR9814802A FR2786317B1 FR 2786317 B1 FR2786317 B1 FR 2786317B1 FR 9814802 A FR9814802 A FR 9814802A FR 9814802 A FR9814802 A FR 9814802A FR 2786317 B1 FR2786317 B1 FR 2786317B1
- Authority
- FR
- France
- Prior art keywords
- flushed
- manufacturing
- laser engraving
- contact smart
- engraving step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 2
- 238000010147 laser engraving Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9814802A FR2786317B1 (fr) | 1998-11-24 | 1998-11-24 | Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede |
PCT/FR1999/002865 WO2000031686A1 (fr) | 1998-11-24 | 1999-11-22 | Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede |
AU12784/00A AU1278400A (en) | 1998-11-24 | 1999-11-22 | Method for making a flush chip card using a laser engraving step and resulting chip card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9814802A FR2786317B1 (fr) | 1998-11-24 | 1998-11-24 | Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2786317A1 FR2786317A1 (fr) | 2000-05-26 |
FR2786317B1 true FR2786317B1 (fr) | 2002-12-27 |
Family
ID=9533138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9814802A Expired - Fee Related FR2786317B1 (fr) | 1998-11-24 | 1998-11-24 | Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1278400A (fr) |
FR (1) | FR2786317B1 (fr) |
WO (1) | WO2000031686A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9854977B2 (en) | 2006-01-10 | 2018-01-02 | Accuvein, Inc. | Scanned laser vein contrast enhancer using a single laser, and modulation circuitry |
EP1818851A1 (fr) * | 2006-02-09 | 2007-08-15 | Axalto S.A. | Objet portable avec interface de contact, et personnalisation d'une interface de contact. |
EP2073154A1 (fr) | 2007-12-20 | 2009-06-24 | Gemalto SA | Micro-module biométrique |
EP2418609A1 (fr) * | 2010-07-23 | 2012-02-15 | Gemalto SA | Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication |
CN107195560A (zh) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | Ic卡的激光封装***及方法 |
CN113299561B (zh) * | 2021-05-21 | 2023-06-27 | 浙江集迈科微电子有限公司 | 一种腔底防溢胶结构的制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2695234B1 (fr) * | 1992-08-26 | 1994-11-04 | Gemplus Card Int | Procédé de marquage d'une carte à puce. |
EP0688050A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue |
DE69512137T2 (de) * | 1994-06-15 | 2000-05-25 | De La Rue Cartes Et Systemes, Paris | Herstellungsverfahren und Montage für IC-Karte. |
DE4441052A1 (de) * | 1994-11-18 | 1996-05-23 | Orga Kartensysteme Gmbh | Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten |
DE19502157B4 (de) * | 1995-01-25 | 2011-07-21 | Sagem Orga GmbH, 33106 | Trägerelement für einen IC-Baustein zum Einbau in Chipkarten |
FR2736740A1 (fr) * | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue |
DE19607212C1 (de) * | 1996-02-26 | 1997-04-10 | Richard Herbst | Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen |
-
1998
- 1998-11-24 FR FR9814802A patent/FR2786317B1/fr not_active Expired - Fee Related
-
1999
- 1999-11-22 AU AU12784/00A patent/AU1278400A/en not_active Abandoned
- 1999-11-22 WO PCT/FR1999/002865 patent/WO2000031686A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2786317A1 (fr) | 2000-05-26 |
WO2000031686A1 (fr) | 2000-06-02 |
AU1278400A (en) | 2000-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090731 |