FR2779272B1 - Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule - Google Patents

Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule

Info

Publication number
FR2779272B1
FR2779272B1 FR9806683A FR9806683A FR2779272B1 FR 2779272 B1 FR2779272 B1 FR 2779272B1 FR 9806683 A FR9806683 A FR 9806683A FR 9806683 A FR9806683 A FR 9806683A FR 2779272 B1 FR2779272 B1 FR 2779272B1
Authority
FR
France
Prior art keywords
micromodule
manufacturing
storage medium
medium
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9806683A
Other languages
English (en)
Other versions
FR2779272A1 (fr
Inventor
Olivier Brunet
Jean Christophe Fidalgo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9806683A priority Critical patent/FR2779272B1/fr
Priority to EP99918061A priority patent/EP1086492A1/fr
Priority to PCT/FR1999/001142 priority patent/WO1999062118A1/fr
Priority to CN99806708A priority patent/CN1303521A/zh
Priority to AU36116/99A priority patent/AU3611699A/en
Publication of FR2779272A1 publication Critical patent/FR2779272A1/fr
Application granted granted Critical
Publication of FR2779272B1 publication Critical patent/FR2779272B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
FR9806683A 1998-05-27 1998-05-27 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule Expired - Fee Related FR2779272B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9806683A FR2779272B1 (fr) 1998-05-27 1998-05-27 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule
EP99918061A EP1086492A1 (fr) 1998-05-27 1999-05-12 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule
PCT/FR1999/001142 WO1999062118A1 (fr) 1998-05-27 1999-05-12 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule
CN99806708A CN1303521A (zh) 1998-05-27 1999-05-12 制造微模块方法和制造含有微模块的存储媒体的方法
AU36116/99A AU3611699A (en) 1998-05-27 1999-05-12 Method for making a micromodule and a storage medium comprising such a micromodule

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9806683A FR2779272B1 (fr) 1998-05-27 1998-05-27 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule

Publications (2)

Publication Number Publication Date
FR2779272A1 FR2779272A1 (fr) 1999-12-03
FR2779272B1 true FR2779272B1 (fr) 2001-10-12

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FR9806683A Expired - Fee Related FR2779272B1 (fr) 1998-05-27 1998-05-27 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule

Country Status (5)

Country Link
EP (1) EP1086492A1 (fr)
CN (1) CN1303521A (fr)
AU (1) AU3611699A (fr)
FR (1) FR2779272B1 (fr)
WO (1) WO1999062118A1 (fr)

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FR2828333B1 (fr) * 2000-06-23 2003-11-07 Gemplus Card Int Procede d'isolation electrique de puces comportant des circuits integres par le depot d'une couche isolante
FR2817656B1 (fr) * 2000-12-05 2003-09-26 Gemplus Card Int Isolation electrique de microcircuits regroupes avant collage unitaire

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EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
WO1993026142A1 (fr) * 1992-06-05 1993-12-23 Mitsui Toatsu Chemicals, Incorporated Plaquette de circuit imprime en relief, boitier de circuit electronique utilisant cette plaquette et procede de realisation de cette plaquette
DE69512137T2 (de) * 1994-06-15 2000-05-25 De La Rue Cartes Et Systemes, Paris Herstellungsverfahren und Montage für IC-Karte.
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
DE19618103C2 (de) * 1996-05-06 1998-05-14 Siemens Ag Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung
EP0824301A3 (fr) * 1996-08-09 1999-08-11 Hitachi, Ltd. Panneau à circuit imprimé, carte à puce, et leur procédé de fabrication

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WO1999062118A1 (fr) 1999-12-02
CN1303521A (zh) 2001-07-11
FR2779272A1 (fr) 1999-12-03
AU3611699A (en) 1999-12-13
EP1086492A1 (fr) 2001-03-28

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