FR2777675B1 - Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede - Google Patents

Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede

Info

Publication number
FR2777675B1
FR2777675B1 FR9804658A FR9804658A FR2777675B1 FR 2777675 B1 FR2777675 B1 FR 2777675B1 FR 9804658 A FR9804658 A FR 9804658A FR 9804658 A FR9804658 A FR 9804658A FR 2777675 B1 FR2777675 B1 FR 2777675B1
Authority
FR
France
Prior art keywords
microcircuit card
implementation
manufacturing
microcircuit
card obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9804658A
Other languages
English (en)
Other versions
FR2777675A1 (fr
Inventor
Francois Launay
Lucien Amiot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
De la Rue Cartes et Systemes SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De la Rue Cartes et Systemes SAS filed Critical De la Rue Cartes et Systemes SAS
Priority to FR9804658A priority Critical patent/FR2777675B1/fr
Priority to DE19915050.8A priority patent/DE19915050B4/de
Publication of FR2777675A1 publication Critical patent/FR2777675A1/fr
Application granted granted Critical
Publication of FR2777675B1 publication Critical patent/FR2777675B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
FR9804658A 1998-04-15 1998-04-15 Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede Expired - Lifetime FR2777675B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9804658A FR2777675B1 (fr) 1998-04-15 1998-04-15 Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede
DE19915050.8A DE19915050B4 (de) 1998-04-15 1999-04-01 Verfahren zur Herstellung einer Chipkarte und Chipkarte, erhalten unter Verwendung des Verfahrens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9804658A FR2777675B1 (fr) 1998-04-15 1998-04-15 Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede

Publications (2)

Publication Number Publication Date
FR2777675A1 FR2777675A1 (fr) 1999-10-22
FR2777675B1 true FR2777675B1 (fr) 2001-12-07

Family

ID=9525236

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9804658A Expired - Lifetime FR2777675B1 (fr) 1998-04-15 1998-04-15 Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede

Country Status (2)

Country Link
DE (1) DE19915050B4 (fr)
FR (1) FR2777675B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19962077A1 (de) * 1999-12-21 2001-06-28 Aeg Identifikationssys Gmbh Verfahren zur Herstellung einer Transponderanordnung
DE10038287A1 (de) * 2000-08-05 2002-02-21 Itt Mfg Enterprises Inc Steckkarte für elektronische Geräte
DE10047213A1 (de) * 2000-09-23 2002-04-11 Philips Corp Intellectual Pty Elektrisches oder elektronisches Bauteil und Verfahren zum Herstellen desselben
DE102007010731A1 (de) * 2007-02-26 2008-08-28 Würth Elektronik GmbH & Co. KG Verfahren zum Einbetten von Chips und Leiterplatte
DE102007020475A1 (de) * 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624651B1 (fr) 1987-12-14 1991-09-06 Sgs Thomson Microelectronics Procede de mise en place d'un composant electronique et de ses connexions electriques sur un support et produit ainsi obtenu
EP0645953B1 (fr) * 1993-09-29 1997-08-06 Siemens NV Procédé de fabrication d'un câblage à deux ou plusieurs couches, et câblage à deux ou plusieurs couches
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
EP0688051B1 (fr) 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
DE19639902C2 (de) 1996-06-17 2001-03-01 Elke Zakel Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
DE19640303C2 (de) 1996-09-30 2000-10-12 Siemens Ag Chipmodul insbesondere zur Implantation in einen Chipkartenkörper

Also Published As

Publication number Publication date
DE19915050B4 (de) 2021-08-05
FR2777675A1 (fr) 1999-10-22
DE19915050A1 (de) 1999-10-21

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20

CA Change of address

Effective date: 20201007

CD Change of name or company name

Owner name: IDEMIA FRANCE, FR

Effective date: 20201007