KR940005202A - 인쇄 배선기판의 제조방법 - Google Patents

인쇄 배선기판의 제조방법 Download PDF

Info

Publication number
KR940005202A
KR940005202A KR1019930016708A KR930016708A KR940005202A KR 940005202 A KR940005202 A KR 940005202A KR 1019930016708 A KR1019930016708 A KR 1019930016708A KR 930016708 A KR930016708 A KR 930016708A KR 940005202 A KR940005202 A KR 940005202A
Authority
KR
South Korea
Prior art keywords
manufacturing
wiring board
printed wiring
resist
copolymer
Prior art date
Application number
KR1019930016708A
Other languages
English (en)
Other versions
KR970004758B1 (ko
Inventor
마사시 미야자끼
하루오 아까호시
소조 노하라
겐찌 기꾸따
도시아끼 이시마루
Original Assignee
가나이 쓰또무
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쓰또무, 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가나이 쓰또무
Publication of KR940005202A publication Critical patent/KR940005202A/ko
Application granted granted Critical
Publication of KR970004758B1 publication Critical patent/KR970004758B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

인쇄 배선기판의 제조를 위한 어디티브(additive)공정에 있어서, 비염소계 유기 용매 및 알칼리성 수용액을 포함하는 현상액과, 레지스트 재료로서, 메타 크릴산 메타크릴레이트로 이루어진 공중합체 등을 사용함으로서, 대면적을 갖는 기판을 사용함에도 불구하고, 상기 제조단계가 단순화되며, 현상액으로서, 염소계 유기용매의 사용을 폐지할 수 있게 된다.

Description

인쇄 배선기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 인쇄 배선기판의 제조방법을 설명하는 순서도.
제2a 내지 2f도는 제1도에 대응하는 세미어디티브(semiadditive)공정에 의해 본 발명의 방법을 설명하기 위한 단면도.
제3a 내지 3d도는 풀어디티브(fulladditive)공정에 의해 본 발명의 방법을 설명하기 위한 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 기판 2 : 동박
3 : 패턴동도금 4 : 포토레지스트
4a : 포토레지스트의 조사부 4b : 도금레지스트
5 : 포토마스크 6 : 자외선
7 : 스프레이 노즐 8 : 현상액
9 : 땜납도금막 10 : 접착제

Claims (11)

  1. 인쇄 배선기판의 제조방법에 있어서, 기판상에 포토레지스트 막을 형성하는 단계와, 상기 포토레지스트 막에 자외선을 조사하는 단계와, 상기 포토레지스트 막을 현상하여 레지스트 패턴을 형성하는 단계와, 그리고 도금 레지스트로서 상기 레지스트 패턴을 사용하여 동도금을 행하여 배선패턴을 형성하는 단계를 포함하고, 상기 포토레지스트 막은 비염소계 유기용매 및 알칼리성 수용액으로 이루어진 현상액으로 현상할 수 있는 레지스트 재료를 사용하는 제조됨을 특징으로 하는 인쇄 배선기판의 제조방법.
  2. 제1항에 있어서, 상기 도금 레지스트는 영구 레지스트로서 사용됨을 특징으로 하는 인쇄 배선기판의 제조방법.
  3. 제1항에 있어서, 상기 기판은 그 위에 동박을 구비하고, 상기 배선패턴은 도금 레지스트로서 레지스트 패턴을 사용하여 동도금을 행하고, 상기 동도금 상에 에칭 레지스트를 형성하며, 상기 도금 레지스트를 박리하고, 상기 기판상의 상기 동박을 에칭하는 것에 의해 형성됨을 특징으로 하는 인쇄 배선기판의 제조방법.
  4. 제1,2 또는 3항에 있어서, 상기 동도금은 무전해 동도금으로 행해짐을 특징으로 하는 인쇄 배선기판의 제조방법.
  5. 제3항에 있어서, 상기 동도금은 전기도금을 행해짐을 특징으로 하는 인쇄 배선기판의 제조방법.
  6. 제1,2 또는 3항에 있어서, 상기 레지스트 재료는 메틸 메타크릴레이트와 메타크릴산의 공중합체를 포함함을 특징으로 하는 인쇄 배선기판의 제조방법.
  7. 제6항에 있어서, 상기 상기 레지스트 재료는 메틸-메타크릴레이트와 메타크릴산의 공중합체이고, 상기 타크릴산의 함량은 공중합체의 100중량부당 1.5 내지 10중량부임을 특징으로 하는 인쇄 배선기판의 제조방법.
  8. 제6항에 있어서, 상기 레지스트 재료는 메틸 메탈크릴레이트와 메타크릴산의 공중합체를 포함하고, 비수성 용매를 사용하여 박리되며, 쌍기 메타크릴산의 함량은 상기 공중합체의 10중량부당 1.5 내지 6중량부임을 특징으로 하는 인쇄 배선기판의 제조방법.
  9. 제6항에 있어서, 비염소계 유기용매 및 알칼리성 수용액을 포함하는 박리용액으로 박리하는 경우에, 상기 메타크릴산 함량이 공중합체의 100중량부 당 6 내지 10중량부임을 특징으로 하는 인쇄 배선기판의 제조방법.
  10. 제1,2 또는 3항에 있어서, 상기 현상액은 에틸렌글리콜 에테르 도는 프로필렌글리콜 에테르를 알칼리성 수용액에 용해시킴으로써 얻어짐을 특징으로 하는 인쇄 배선기판의 제조방법.
  11. 제9항에 있어서, 상기 박리용액은 아민 화합물을 또한 포함함을 특징으로 하는 인쇄 배선기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930016708A 1992-08-28 1993-08-26 인쇄 배선기판의 제조방법 KR970004758B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22969292 1992-08-28
JP92-229692 1992-08-28

Publications (2)

Publication Number Publication Date
KR940005202A true KR940005202A (ko) 1994-03-16
KR970004758B1 KR970004758B1 (ko) 1997-04-03

Family

ID=16896212

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930016708A KR970004758B1 (ko) 1992-08-28 1993-08-26 인쇄 배선기판의 제조방법

Country Status (6)

Country Link
US (2) US5438751A (ko)
EP (1) EP0584780B1 (ko)
KR (1) KR970004758B1 (ko)
CN (1) CN1038806C (ko)
DE (1) DE69326925T2 (ko)
TW (1) TW229350B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100932535B1 (ko) * 2007-11-28 2009-12-17 주식회사 심텍 임베디드 저항이 포함된 인쇄회로기판 및 그 제조방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235755A (ja) * 1994-02-25 1995-09-05 Hitachi Ltd プリント配線基板の製法
JP2001144432A (ja) * 1999-11-02 2001-05-25 Internatl Business Mach Corp <Ibm> 絶縁層上の導体層の製造方法およびビルドアップ回路基板の製造方法
US6360950B1 (en) 2000-03-10 2002-03-26 Melida J. Hoover-Szendre Circuit board stuffing process
EP1561256A4 (en) * 2000-08-25 2006-06-21 Ngimat Co ELECTRONIC AND OPTICAL DEVICES AND METHOD FOR FORMING THESE DEVICES
US7029529B2 (en) 2002-09-19 2006-04-18 Applied Materials, Inc. Method and apparatus for metallization of large area substrates
US7666291B2 (en) 2005-09-28 2010-02-23 Chunghwa Picture Tubes, Ltd. Method for fabricating metal wires
US8765217B2 (en) 2008-11-04 2014-07-01 Entrotech, Inc. Method for continuous production of (meth)acrylate syrup and adhesives therefrom
US8329079B2 (en) 2009-04-20 2012-12-11 Entrochem, Inc. Method and apparatus for continuous production of partially polymerized compositions and polymers therefrom
CN103369837B (zh) * 2012-04-09 2016-04-06 安捷利电子科技（苏州）有限公司 卷式催化浆料填孔并形成电路的双面柔性电路板工艺
CN105407648B (zh) * 2014-09-16 2018-08-03 常州欣盛微结构电子有限公司 极细的金属线路的制造方法及其结构

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US21737A (en) * 1858-10-12 bishop
USRE21737E (en) 1941-03-04 Resin bonded abrasive article
US2884336A (en) * 1955-01-27 1959-04-28 Rohm & Haas Methods for producing coated leather and the products thereof
US3311966A (en) * 1962-09-24 1967-04-04 North American Aviation Inc Method of fabricating multilayer printed-wiring boards
JPS5226259B2 (ko) * 1973-02-10 1977-07-13
US3883352A (en) * 1973-04-05 1975-05-13 Grace W R & Co Process for forming a photocured solder resist
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
US4181752A (en) * 1974-09-03 1980-01-01 Minnesota Mining And Manufacturing Company Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing
JPS5397416A (en) * 1977-02-04 1978-08-25 Asahi Chemical Ind Light polymeric constitute possible for water development
JPS54133322A (en) * 1978-04-07 1979-10-17 Cho Lsi Gijutsu Kenkyu Kumiai Positive type ionizing radiation sensitive resist
US4196272A (en) * 1978-11-27 1980-04-01 Nalco Chemical Company Continuous process for the preparation of an acrylic acid-methyl acrylate copolymer in a tubular reactor
JPS56145907A (en) * 1980-04-15 1981-11-13 Kyowa Gas Chem Ind Co Ltd Production of methacrylic resin having excellent heat distorsion resistance
DE3131448A1 (de) * 1981-08-07 1983-02-24 Basf Ag, 6700 Ludwigshafen Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse
JPH0642073B2 (ja) * 1984-04-10 1994-06-01 三菱レイヨン株式会社 光重合性樹脂組成物
JPS61213213A (ja) * 1985-03-19 1986-09-22 Fuji Photo Film Co Ltd 光重合性組成物
US4716303A (en) * 1985-05-01 1987-12-29 Sharp Kabushiki Kaisha MOS IC pull-up circuit
JPS61262736A (ja) * 1985-05-17 1986-11-20 Nippon Oil & Fats Co Ltd 感光性樹脂組成物
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
JPS6410234A (en) * 1987-07-02 1989-01-13 Mitsubishi Chem Ind Photopolymerizable negative type resist
JPH01296248A (ja) * 1988-05-24 1989-11-29 Neos Co Ltd フォトレジスト用剥離剤
SU1668369A1 (ru) * 1988-11-14 1991-08-07 Научно-исследовательский институт химии при Горьковском государственном университете им.Н.И.Лобачевского Способ получени органического стекла
JPH0636472B2 (ja) * 1990-05-28 1994-05-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
DE19507174A1 (de) * 1995-03-02 1996-09-05 Roehm Gmbh UV-härtbare Kratzfestlacke mit einpolymerisierendem Verdicker

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100932535B1 (ko) * 2007-11-28 2009-12-17 주식회사 심텍 임베디드 저항이 포함된 인쇄회로기판 및 그 제조방법

Also Published As

Publication number Publication date
DE69326925T2 (de) 2000-02-24
KR970004758B1 (ko) 1997-04-03
CN1038806C (zh) 1998-06-17
EP0584780A3 (en) 1995-08-02
TW229350B (ko) 1994-09-01
DE69326925D1 (de) 1999-12-09
US5919603A (en) 1999-07-06
US5438751A (en) 1995-08-08
EP0584780B1 (en) 1999-11-03
CN1086372A (zh) 1994-05-04
EP0584780A2 (en) 1994-03-02

Similar Documents

Publication Publication Date Title
KR940005202A (ko) 인쇄 배선기판의 제조방법
CN110537396B (zh) 利用种子层的电路形成方法
JP2004510061A (ja) 誘電体を選択的に金属化する方法
US5134056A (en) Method for applying a solder resist layer to a printed circuit board
DE59905871D1 (de) Verfahren zur herstellung von geätzten schaltungen
JPS63182888A (ja) プリント配線板の製造方法
ATE265131T1 (de) Verfahren zur herstellung von mehrlagenschaltungen
JP4676317B2 (ja) レジストパターンの形成方法、回路基板の製造方法及び回路基板
JP7049051B2 (ja) レジスト残渣除去剤及びこれを利用した導体パターン形成方法並びに基板製造方法
KR20010047629A (ko) 인쇄회로기판 제조방법
JPH1168297A (ja) 回路基板の製造方法
KR960030756A (ko) 인쇄 배선 보드와 그 형성 방법
JP4341281B2 (ja) プリント配線基板用の積層板の製造方法
Uno et al. The Development of Dry Film Photoresist with 15µm Lines/Spaces Resolution for Semi-Additive Processing
JP2016063120A (ja) 多層プリント配線板の形成方法
JPS62169493A (ja) プリント配線板の製造方法
CN110519930A (zh) 一种防止cof卷带生产中产生金属异物的方法
KR920011299A (ko) 프린트 기판의 제조방법
JPH05267848A (ja) 印刷配線板の製造方法
JPS59121895A (ja) プリント配線基板の製造方法
KR970078781A (ko) 인쇄회로 기판의 제조 방법
JPS63302596A (ja) プリント基板の製造方法
JPS63199493A (ja) プリント配線板の製造方法
JPH0936519A (ja) プリント配線板の製造方法
JPH0274096A (ja) 回路基板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20020716

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee