KR910005468A - 반도체 집적회로장치 - Google Patents
반도체 집적회로장치 Download PDFInfo
- Publication number
- KR910005468A KR910005468A KR1019900012365A KR900012365A KR910005468A KR 910005468 A KR910005468 A KR 910005468A KR 1019900012365 A KR1019900012365 A KR 1019900012365A KR 900012365 A KR900012365 A KR 900012365A KR 910005468 A KR910005468 A KR 910005468A
- Authority
- KR
- South Korea
- Prior art keywords
- ground
- semiconductor substrate
- circuit block
- main circuit
- terminal
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims 6
- 230000001681 protective effect Effects 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예에 의한 반도체 집적회로장치에 있어서 보호소자의 배열을 나타낸 회로도.
제2도는 반도체 집적회로장치에 있어서 회로의 블럭 구성을 나타낸 개념도.
Claims (3)
- 접지단자를 각각에 가진 회로 블럭을 2개 이상 갖추고, 각각의 접지단자에 대하여, 각각의 상기 회로 블럭이 가지는 전원단자, 출력단자 또는 입력단자가 보호소자에 의해서 각각 접속되어 있고, 각각의 단자간에 과전압이 인가된 경우에 단락해서 과전류를 흘리는 것에 의해서 회로를 보호하는 단략경로를 가진 반도체 집적회로장치에 있어서, 상기 회로 블럭중의, 칩 점유면적이 가장 큰 메인회로 블럭(1)이 가지는 접지단자(102)에 접속되어, 이 메인회로 블럭의 배선영역내에서, 상기 서브회로 블럭 (2,3)에 근접한 위치에 배선된 제1의 접지선(22)과, 상기 회로블럭중의, 상기 메인회로 블럭 의외의 서브회로블럭(2,3)이 가지는 접지단자(105,108)에 접속되어, 이 서브회로 블럭의 배선 영역내에서, 상기 메인회로 블럭에 근접한 위치에 배선된 제2의 접지선(32,42), 상기 제1의 접지선과 상기 제2의 접지선간에 접속된 보호소자(15,16)를 갖추고, 상기 제1 또는 제2의 접지선중 적어도 1개를 지나서 상기 단락경로가 형성되는 것을 특징으로 하는 반도체 집적회로장치.
- 제1항에 있어서, 상기 메인회로 블럭을 가지는 전원단자(101)에 접속되어, 이 메인회로 블럭의 배선영역내에서, 상기 제1의 접지선에 근접한 위치에 배선된 전원라인(21)과, 이 전원라인과 상기 제1의 접지선간에 접속된 2개 이상의 보호소자(14)를 그 위에 갖추고, 상기 보호소자는 소정의 간격을 두어 접속되어 있는 것을 특징으로 하는 반도체 집적회로장치.
- 제1 또는 제2항에 있어서, 상기 보호소자는 반도체기판(52) 혹은 반도체기판 표면에 형성된 웰을 베이스로 한 바이폴라 트랜지스터, 또는 반도체기판(52)상 혹은 반도체기판 표면에 형성된 웰상의 게이트 산화막(54) 및 게이트전극(55)의 양단에 불순물 확사층(51a,52b)을 형성할 수 있는 MOS형의 트랜지스터, 또는 반도체기판(52) 표면상 혹은 반도체기판 표면에 형성된 웰 표면상의 피일드 산화막(53)의 표면상에 알루미늄 또는 다결정 실리콘으로 이루어진 전극(56)을 형성할 수 있는 피일드형 트랜지스터인 것을 특징으로 하는 반도체 집적회로장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1209167A JPH065705B2 (ja) | 1989-08-11 | 1989-08-11 | 半導体集積回路装置 |
JP1-209167 | 1989-08-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910005468A true KR910005468A (ko) | 1991-03-30 |
KR930011797B1 KR930011797B1 (ko) | 1993-12-21 |
Family
ID=16568442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900012365A KR930011797B1 (ko) | 1989-08-11 | 1990-08-11 | 반도체 집적회로장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5079612A (ko) |
EP (1) | EP0412561B1 (ko) |
JP (1) | JPH065705B2 (ko) |
KR (1) | KR930011797B1 (ko) |
DE (1) | DE69013267T2 (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS633055A (ja) * | 1986-06-24 | 1988-01-08 | Mitsubishi Chem Ind Ltd | インサ−ト成形品 |
JP2742735B2 (ja) * | 1991-07-30 | 1998-04-22 | 三菱電機株式会社 | 半導体集積回路装置およびそのレイアウト設計方法 |
KR940009605B1 (ko) * | 1991-09-16 | 1994-10-15 | 삼성전자 주식회사 | 반도체 메모리의 정전방전 보호장치 |
JPH07502868A (ja) * | 1991-10-30 | 1995-03-23 | ハリス・コーポレーション | アナログ−ディジタル變換器及びその製造方法 |
US5272371A (en) * | 1991-11-19 | 1993-12-21 | Sgs-Thomson Microelectronics, Inc. | Electrostatic discharge protection structure |
US5535084A (en) * | 1992-07-24 | 1996-07-09 | Kawasaki Steel Corporation | Semiconductor integrated circuit having protection circuits |
JP2972494B2 (ja) * | 1993-06-30 | 1999-11-08 | 日本電気株式会社 | 半導体装置 |
US5372951A (en) * | 1993-10-01 | 1994-12-13 | Advanced Micro Devices, Inc. | Method of making a semiconductor having selectively enhanced field oxide areas |
JP2636773B2 (ja) * | 1995-01-25 | 1997-07-30 | 日本電気株式会社 | 半導体集積回路装置 |
ATE229230T1 (de) * | 1995-04-06 | 2002-12-15 | Infineon Technologies Ag | Integrierte halbleiterschaltung mit einem schutzmittel |
JP2636804B2 (ja) * | 1995-05-30 | 1997-07-30 | 日本電気株式会社 | 半導体装置 |
JP2834034B2 (ja) * | 1995-06-22 | 1998-12-09 | 日本電気アイシーマイコンシステム株式会社 | 半導体装置 |
WO1997010615A1 (en) * | 1995-09-11 | 1997-03-20 | Analog Devices, Inc. (Adi) | Electrostatic discharge protection network and method |
KR100211539B1 (ko) | 1995-12-29 | 1999-08-02 | 김영환 | 반도체소자의 정전기방전 보호장치 및 그 제조방법 |
US5721658A (en) * | 1996-04-01 | 1998-02-24 | Micron Technology, Inc. | Input/output electrostatic discharge protection for devices with multiple individual power groups |
JP3017083B2 (ja) * | 1996-04-10 | 2000-03-06 | 日本電気株式会社 | 入出力保護回路 |
US5875089A (en) * | 1996-04-22 | 1999-02-23 | Mitsubishi Denki Kabushiki Kaisha | Input protection circuit device |
US5757208A (en) * | 1996-05-01 | 1998-05-26 | Motorola, Inc. | Programmable array and method for routing power busses therein |
JP2000510653A (ja) * | 1997-04-16 | 2000-08-15 | ザ ボード オブ トラスティーズ オブ ザ リーランド スタンフォード ジュニア ユニバーシティ | 高速集積回路のための分散型esd保護デバイス |
US6445039B1 (en) * | 1998-11-12 | 2002-09-03 | Broadcom Corporation | System and method for ESD Protection |
US8405152B2 (en) | 1999-01-15 | 2013-03-26 | Broadcom Corporation | System and method for ESD protection |
US7687858B2 (en) * | 1999-01-15 | 2010-03-30 | Broadcom Corporation | System and method for ESD protection |
AU3209000A (en) * | 1999-01-15 | 2000-08-01 | Broadcom Corporation | System and method for esd protection |
US6587321B2 (en) * | 2000-07-13 | 2003-07-01 | Broadcom Corporation | Methods and systems for improving ESD clamp response time |
DE10102354C1 (de) * | 2001-01-19 | 2002-08-08 | Infineon Technologies Ag | Halbleiter-Bauelement mit ESD-Schutz |
US6947273B2 (en) * | 2001-01-29 | 2005-09-20 | Primarion, Inc. | Power, ground, and routing scheme for a microprocessor power regulator |
FR2831328A1 (fr) | 2001-10-23 | 2003-04-25 | St Microelectronics Sa | Protection d'un circuit integre contre des decharges electrostatiques et autres surtensions |
JP3908669B2 (ja) * | 2003-01-20 | 2007-04-25 | 株式会社東芝 | 静電気放電保護回路装置 |
US20070120244A1 (en) * | 2003-11-27 | 2007-05-31 | Iwao Kojima | Semiconductor device having electrostatic breakdown protection element |
WO2005088701A1 (ja) * | 2004-03-12 | 2005-09-22 | Rohm Co., Ltd | 半導体装置 |
US7439592B2 (en) * | 2004-12-13 | 2008-10-21 | Broadcom Corporation | ESD protection for high voltage applications |
US7505238B2 (en) * | 2005-01-07 | 2009-03-17 | Agnes Neves Woo | ESD configuration for low parasitic capacitance I/O |
JP2006237101A (ja) | 2005-02-23 | 2006-09-07 | Nec Electronics Corp | 半導体集積回路装置 |
JP5337173B2 (ja) * | 2011-01-07 | 2013-11-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124262A (ja) * | 1982-01-20 | 1983-07-23 | Nec Corp | 集積回路装置 |
US4819047A (en) * | 1987-05-15 | 1989-04-04 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
US4990802A (en) * | 1988-11-22 | 1991-02-05 | At&T Bell Laboratories | ESD protection for output buffers |
-
1989
- 1989-08-11 JP JP1209167A patent/JPH065705B2/ja not_active Expired - Fee Related
-
1990
- 1990-08-09 US US07/564,615 patent/US5079612A/en not_active Expired - Lifetime
- 1990-08-10 EP EP90115402A patent/EP0412561B1/en not_active Expired - Lifetime
- 1990-08-10 DE DE69013267T patent/DE69013267T2/de not_active Expired - Fee Related
- 1990-08-11 KR KR1019900012365A patent/KR930011797B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH065705B2 (ja) | 1994-01-19 |
EP0412561B1 (en) | 1994-10-12 |
KR930011797B1 (ko) | 1993-12-21 |
US5079612A (en) | 1992-01-07 |
DE69013267T2 (de) | 1995-03-16 |
EP0412561A2 (en) | 1991-02-13 |
DE69013267D1 (de) | 1994-11-17 |
JPH0372666A (ja) | 1991-03-27 |
EP0412561A3 (en) | 1991-05-29 |
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FPAY | Annual fee payment |
Payment date: 20091127 Year of fee payment: 17 |
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EXPY | Expiration of term |