KR900001812A - 접착 테이프 및 그 이용방법 - Google Patents
접착 테이프 및 그 이용방법 Download PDFInfo
- Publication number
- KR900001812A KR900001812A KR1019890010452A KR890010452A KR900001812A KR 900001812 A KR900001812 A KR 900001812A KR 1019890010452 A KR1019890010452 A KR 1019890010452A KR 890010452 A KR890010452 A KR 890010452A KR 900001812 A KR900001812 A KR 900001812A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive layer
- molecular weight
- epoxy resin
- chip
- low molecular
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 11
- 239000012790 adhesive layer Substances 0.000 claims 19
- 238000000034 method Methods 0.000 claims 16
- 239000003822 epoxy resin Substances 0.000 claims 10
- 229920000647 polyepoxide Polymers 0.000 claims 10
- 150000003384 small molecules Chemical class 0.000 claims 8
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 239000003999 initiator Substances 0.000 claims 5
- 229920000058 polyacrylate Polymers 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000012634 fragment Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 접착 테이프의 단면도이다.
제2도 내지 7도는 정착 테이프가 사용되는 웨이퍼 프로세싱의 여러단계에 있어서 제1도의 접착 테이프의 상태를 나타내는 단면도이다.
Claims (9)
- 장력이 40dyne/㎝ 이하이고 그 한쪽 표면상에 접착제층이 형성되어 있으며 이 접착제층은 (메타)아크릴레이트 폴리머, 에폭시 수지, 광중합에 가능한 저분자량 화합물, 에폭시 수지를 위한 열에 의해 활성화될 수 있는 경화제와 광중합 가능한 저분자량 화합물을 위한 광중합 개시제를 포함하고 있는 것을 특징으로 하는 접착테이프.
- 장력이 40dyne/㎝ 이하이고 그 한쪽표면 상에 접착제층이 형성되어 있으며 이 접착제층은 (메타)아크릴레이트 폴리머, 에폭시 수지, 광중합 가능한 저분자량 회합물, 에폭시 수지를 위한 열에 의해 활성화될 수 있는 경화제와 광중합 가능한 저분자량 화합물을 위한 광중합 개시제를 포함하고 있는 접착 테이프를 이용하는 방법에 있어서, 반도체 웨이퍼를 접착 테이프에 접착시키고, 이 웨이퍼를 접착 테이프의 접착제층과 함께 칩으로 다이싱하고, 접착 테이프의 접착제층을 에너지 비임으로 조사하고, 칩에 접착된 다이싱된 접착제층 단편과 함께 베이스 시이트로부터 칩을 픽업하고, 각각의 접착제층 단편이 리드 프레임과 접촉될 수 있도록 리드 프레임에 칩을 놓고, 다이싱된 접착제층 단편이 가열에 의해 다시 접착성을 나타냄으로써 칩이 리드 프레임에 안전하게 장착되는 과정으로 이루어지는 것을 특징으로 하는 방법.
- 제2항에 있어서, 베이스 시이트가 광투과성이고 에너지 비임이 자외선인 것을 특징으로 하는 방법.
- 제2항에 있어서, 다이싱 과정이 조사과정에 앞서서 실시되는 것을 특징으로 하는 방법.
- 제2항에 있어서, 조사과정이 다시잉 과정에 앞서서 실시되는 것을 특징으로 하는 방법.
- 제2항에 있어서, 다이싱 과정후 픽업과정 전에 베이스 시이트의 평면내에서 두방향을 직각으로 교차하는 다이싱된 접착제층 단편과 함께 칩을 갖고 있는 접착 테이프의 베이스 시이트를 확장시키는 단계가 포함되어 있는 것을 특징으로 하는 방법.
- (메타)아크릴레이트 폴리머, 에폭시 수지, 광중합 가능한 저분자량 화합물, 에폭시 수지를 위한 열에 의해 활성화 될 수 있는 경화제, 광중합 가능한 저분자량 화합물을 위한 광중합 개시제를 구성되는 있는 접착제층을 포함하고 있는 것을 특징으로 하는 접착 테이프.
- (메타)아크릴레이트 폴리머, 에폭시수지, 광중합 가능한 저분자량 화합물, 에폭시 수지를 위한 열에 의해 활성화될 수 있는 경화제, 광중합 가능한 저분자량 화합물을 위한 광중합 개시제로 구성되어 있는 접착제층을 포함하고 있는 접착 테이프를 이용하는 방법에 있어서, 반도체 웨이퍼를 분리 시이트 위에 형성되어 있는 접착 테이프에 접착시키고, 접착제층을 에너지 비임으로 조사하고 이 웨이퍼를 접착 테이프의 접착 계층과 함께 칩으로 다이싱하고, 칩에 접착된 다이싱된 접착제층 단편과 함께 분리시이트로부터 칩을 픽업하고, 각각의 접착제층 단편이 리드 프레임과 접촉될 수 있도록 칩에 접착되어 있는 다이싱된 접착제층 단편과 함께 칩을 리드 프레임에 놓고, 다이싱된 접착제층 단편이 가열에 의해 다시 점착성을 나타냄으로써 칩이 리드 프레임에 안전하게 장착되는 과정으로 이루어지는 것을 특징으로 하는 방법.
- 에너비 비임에 의한 조사에 의해 경화될 수 있으며 이렇게 경화된 접착제층은 가열에 의해 다시 점착성을 나타낼 수 있는 접착제층을 형성하기 위한 접착제 조성물에 있어서, (메타)아크릴레이트 폴리머 100중량부에 대해 적어도 하나의 (메타) 아크릴레이트로부터 유도된 유니트가 적어도 50mol%인 (메타) 아크릴레이트 5-2000중량부, 분자량이 100-10000인 에폭시 수지 10-1000중량부, 분자량이 100-30000인 광중합 가능한 저분자량 화합물과 에폭시 수지를 위한 열에 의해 활성화될 수 있는 경화제 및 광중합 가능한 저분자량 화합물을 위한 광중합 개시제를 포함하고 있는 것을 특징으로 하는 접착제 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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JP??63-183158 | 1988-07-21 | ||
JP63183158A JPH0715087B2 (ja) | 1988-07-21 | 1988-07-21 | 粘接着テープおよびその使用方法 |
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Cited By (1)
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KR20200053525A (ko) * | 2017-09-15 | 2020-05-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 경화성 에폭시/티올 수지 조성물을 포함하는 (메트)아크릴레이트 매트릭스를 포함하는 접착제 필름, 테이프 및 방법 |
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US5277972B1 (en) * | 1988-09-29 | 1996-11-05 | Tomoegawa Paper Co Ltd | Adhesive tapes |
DE68922812T2 (de) * | 1988-09-29 | 1995-12-07 | Tomoegawa Paper Mfg Co Ltd | Klebebänder. |
CA2009566A1 (en) * | 1989-03-09 | 1990-09-09 | Shinobu Sato | Epoxy-acrylate blend pressure-sensitive thermosetting adhesives |
DE3923023A1 (de) * | 1989-07-12 | 1991-01-24 | Siemens Ag | Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren |
JP2665062B2 (ja) * | 1991-02-12 | 1997-10-22 | 三菱電機株式会社 | 半導体装置の製造方法 |
US5300172A (en) * | 1991-11-01 | 1994-04-05 | The Furukawa Electric Co., Ltd. | Surface-protection method during etching |
US5762744A (en) * | 1991-12-27 | 1998-06-09 | Rohm Co., Ltd. | Method of producing a semiconductor device using an expand tape |
JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
JP2994510B2 (ja) * | 1992-02-10 | 1999-12-27 | ローム株式会社 | 半導体装置およびその製法 |
KR950701371A (ko) * | 1992-05-05 | 1995-03-23 | 테릴 켄트 쿠알리 | 토포그래픽(topographical)방법 |
US5283467A (en) * | 1992-06-05 | 1994-02-01 | Eaton Corporation | Heat sink mounting system for semiconductor devices |
DE4230784A1 (de) * | 1992-09-15 | 1994-03-17 | Beiersdorf Ag | Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape) |
US5435876A (en) * | 1993-03-29 | 1995-07-25 | Texas Instruments Incorporated | Grid array masking tape process |
US6485589B1 (en) | 1993-04-15 | 2002-11-26 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
JP3410202B2 (ja) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
US5466325A (en) * | 1993-06-02 | 1995-11-14 | Nitto Denko Corporation | Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method |
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-
1988
- 1988-07-21 JP JP63183158A patent/JPH0715087B2/ja not_active Expired - Lifetime
-
1989
- 1989-07-14 MY MYPI89000962A patent/MY105793A/en unknown
- 1989-07-14 US US07/380,548 patent/US5118567A/en not_active Expired - Lifetime
- 1989-07-21 EP EP89307441A patent/EP0359373B1/en not_active Expired - Lifetime
- 1989-07-21 KR KR1019890010452A patent/KR950009551B1/ko not_active IP Right Cessation
- 1989-07-21 DE DE68920807T patent/DE68920807T2/de not_active Expired - Lifetime
-
1991
- 1991-02-08 US US07/653,232 patent/US5110388A/en not_active Expired - Lifetime
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1992
- 1992-02-21 US US07/837,117 patent/US5356949A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200053525A (ko) * | 2017-09-15 | 2020-05-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 경화성 에폭시/티올 수지 조성물을 포함하는 (메트)아크릴레이트 매트릭스를 포함하는 접착제 필름, 테이프 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
US5356949A (en) | 1994-10-18 |
EP0359373B1 (en) | 1995-01-25 |
EP0359373A3 (en) | 1992-01-02 |
US5118567A (en) | 1992-06-02 |
DE68920807T2 (de) | 1995-06-29 |
US5110388A (en) | 1992-05-05 |
DE68920807D1 (de) | 1995-03-09 |
EP0359373A2 (en) | 1990-03-21 |
JPH0715087B2 (ja) | 1995-02-22 |
JPH0232181A (ja) | 1990-02-01 |
MY105793A (en) | 1995-01-30 |
KR950009551B1 (ko) | 1995-08-24 |
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