CN102015943A - 具有图案化背衬的切割带和晶粒附连粘合剂 - Google Patents

具有图案化背衬的切割带和晶粒附连粘合剂 Download PDF

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CN102015943A
CN102015943A CN2009801157248A CN200980115724A CN102015943A CN 102015943 A CN102015943 A CN 102015943A CN 2009801157248 A CN2009801157248 A CN 2009801157248A CN 200980115724 A CN200980115724 A CN 200980115724A CN 102015943 A CN102015943 A CN 102015943A
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Prior art keywords
tackiness agent
backing
pattern
cutting
acrylic ester
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大卫·J·普劳特
埃里克·G·拉森
乔尔·A·热舍尔
奥莱斯特·小本森
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3M Innovative Properties Co
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3M Innovative Properties Co
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Abstract

本发明提供的条带、设备和方法整体涉及单层粘合剂，所述单层粘合剂可在半导体器件制造中用作切割带并且还可用作晶粒附连粘合剂，以用于切割薄晶圆以及后续的所切割的小片的晶粒附连操作。所述条带、设备和方法包括背衬，所述背衬具有包括图案的表面改性区域。

Description

具有图案化背衬的切割带和晶粒附连粘合剂
相关专利申请
本专利申请要求提交于2008年3月7日的美国临时专利申请61/034,791的优先权。
技术领域
本发明提供的条带、设备和方法总体上涉及单层粘合剂，其可在半导体器件制造中用作切割带以及也用作晶粒附连粘合剂，用于切割薄型晶圆以及切割的小片的后续晶粒附连操作。
背景技术
其上形成有集成电路的半导体材料(例如硅和砷化镓)的晶圆具有相对较大的直径。在集成电路(IC)的制备中，这种晶圆被粘附至压敏粘合剂条带(有时又称作切割带)，并且切割成集成电路芯片。然后从切割带移出集成电路芯片，将粘合剂涂覆至该芯片或基板上，并将该芯片设置在基板上并使粘合剂固化以将晶粒附连至基板上。
在将晶圆切割成单独小片的步骤中，切割带可为半导体晶圆提供强效粘附力。然而，切割带也可随后为晶粒提供充分低的粘附力，以使得能将单独的小片从该条带快速、干净且容易地移出。即，当移出小片时，切割带具有低的粘附力是有用的，并且在小片上应具有极少或不具有来自切割带的残余物。因此，已经制备了对晶圆的粘附力具有这样一种平衡的切割带：在切片步骤中可强效粘附，但在将小片从条带移出时该条带也可从各个小片剥离而未在小片上留下残余物。已经制备了一些切割带，这些切割带在暴露于紫外光之后可以去粘性化，从而改善各个小片的干净移出。如果不存在粘附力平衡，则很难进行切割晶圆、拾取以及布置各个小片的步骤。当从切割带移出各个小片时，如果切割带的粘附力不平衡并且一些粘合剂保留在各个小片上，那么就需要额外的步骤来将粘合剂残余从小片移除。这些额外的步骤通常包括使用有机溶剂。另外，如果切割带的粘附力不平衡，那么一些粘合剂可保留在切割架上，所述切割架用于在切割期间限制住晶圆、粘合剂和背衬。
在切割操作和小片分离完成之后，随后必须将第二粘合剂设置在小片和基板之间，以将小片在基板上牢固地保持就位。可将第二粘合剂(通常称为晶粒附连粘合剂)涂覆到小片与电路相对的表面上，或者可将其直接被涂覆到小片将要粘合的基板上。使用单独的晶粒附连粘合剂需要额外的步骤和设备来将粘合剂设置在小片或者基板上。
发明内容
根据上文所述，已经认识到，存在对这样的单层粘合剂膜的需要：该单层粘合剂膜可提供晶圆切割功能所需的粘附力与干净剥离之间的适当平衡、使得在切割后能将粘合剂从薄膜背衬转移，以及还可在后续的晶粒附连步骤中提供所需的必要粘合。
在一个方面，提供了适于连续用作切割带和晶粒附连粘合剂的粘合剂转移切割带，其包括粘合剂组合物以及与该粘合剂接触的背衬，其中所述背衬具有包括图案的表面改性区，并且其中所述粘合剂与所述图案的至少一部分相接触。
在另一个方面，提供了制品，其包括具有包括图案的表面改性区的背衬、与图案相接触的粘合剂、与粘合剂相接触的半导体晶圆以及与粘合剂接触的切割架，其中所述切割架包绕晶圆并且所述切割架正下方的粘合剂的至少一部分与图案的至少一部分相接触。
在又一个方面，提供了切割半导体晶圆的方法，其包括提供与具有包括图案的表面改性区的背衬相接触的粘合剂、将半导体晶圆附连至粘合剂、将切割架附连至粘合剂以使得切割架与粘合剂接触并且包绕晶圆以及切割晶圆以形成小片，其中位于切割架下面的粘合剂的至少一部分与图案的至少一部分相接触。
使用所提供的粘合剂转移切割带可在将晶圆切割成单个小片的步骤期间为半导体晶圆提供强效粘附力，并且随后可为晶粒提供充分低的粘附力以允许各个小片能从该条带快速、干净、容易地移出。同时，包括背衬图案的表面改性区可增加粘合剂对背衬的粘附力，从而在移出切割架时，位于切割架下面并且与包括背衬图案的表面改性区相接触的粘合剂优先粘附到背衬上，从而使得能干净地移出切割架。
除非另外指明，否则本发明中使用的所有的科学和技术术语具有在本领域中所普遍使用的含义。本文所提供的定义是为了便于理解本文中经常使用的某些术语，而无意于限制本发明的范围。
如本文所用：
单数形式“一个”和“一种”和“所述”涵盖具有多种指代物的实施例，除非上下文中明确地指出不是这样。如本说明书和随附权利要求书中所用，术语“或”通常是以其包括“和/或”的含义使用，除非上下文明确地指出不是这样。
“小片”是指成片的半导体晶圆并且可与“晶粒”互换使用。
“去粘性化”、“去粘性”是指降低粘合剂的粘性量；
“晶粒”是指半导体晶圆在其被切削或切割后的片状物。并且
“电离辐射”是指有潜力在诸如气体之类的分子中形成高能离子或自由基的高能粒子或波，并且包括(例如)火焰处理、电晕处理、等离子处理、离子束处理或电子束处理。
以上内容并非意图描述本发明每种实施方式的每个公开实施例。附图说明和随后的具体实施方式更具体地对示例性实施例进行了举例说明。
附图说明
图1为用于制备所提供的切割带的实施例的电晕处理设备的示意图，该设备被构造成可产生包括图案的表面改性区。
图2为背衬片材的透视图，该背衬片材具有包括利用图1所示的设备产生的图案的表面改性区。
图3a为所提供的实施例的剖视图，示出了背衬、粘合剂、表面改性区、晶圆和切割架。
图3b为图3a所示实施例的剖视图，示出了切削或切割的晶圆。
图3c为图3b所示实施例的剖视图，其中粘合剂已进行去粘性化，切割架已被移出，切割带已被拉伸并且小片已被移出。
图4为图3a所示实施例的透视图。
具体实施方式
在以下的描述中参考了随附的一组附图，这些附图构成本说明书的一部分，其中通过举例说明的方式显示了若干具体的实施例。应当理解，设想并且在不脱离本发明的范围或精神情况下可实施其他的实施例。因此，以下具体实施方式并非意图进行限制。
除非另外指明，否则在所有情况下，说明书和权利要求书中用来表述特征尺寸、数量和物理特性的所有数字均应理解为由术语“约”来修饰。因此，除非有相反的指示，否则上述说明书和所附权利要求书中提出的数值参数均为近似值，并且根据本领域的技术人员利用本文所公开的教导内容获得的所需特性，这些近似值可有所不同。由端点表述的数值范围包括该范围内所包含的所有数值(例如，1至5包括1、1.5、2、2.75、3、3.80、4、和5)以及在此范围内的任何范围。
在一个方面，提供了适于连续用作切割带和晶粒附连粘合剂的粘合剂转移切割带，其包括粘合剂组合物以及与该粘合剂接触的背衬。背衬包括表面改性区，其在与粘合剂接触的面上具有图案。切割带可用于在切割期间(其中将晶圆切削或切割成单个的晶粒或小片)粘附以及固定半导体晶圆。此条带还可用作晶粒附连粘合剂。切割之后，可从背衬中移出小片以及已从背衬剥离的粘合剂。然后可移动具有粘合剂的小片并且将其牢固地固定到(例如)引线框架上，在此位置可进行引线结合以及后续的操作。
粘合剂组合物可为本领域的技术人员已知的对诸如半导体晶圆之类的电子器件具有良好的粘附力以在将其切割成小片器件进行牢固固定、可在切割之后利用诸如辐射或加热之类的外部能量源进行去粘性化、可从背衬处移出并粘附到小片上、可保留足够的粘附力以将小片粘附到另一个基板(例如，引线框架)上并且最终可在引线结合和其他操作之后用于永久性地粘合小片的任何粘合剂组合物。
可用的粘合剂组合物可为当暴露于热或光辐射时能够固化的那些组合物并且可包括基于聚烯烃、聚(甲基)丙烯酸酯、环氧树脂、聚酰亚胺、异氰脲酸酯树脂的粘合剂以及二阶(称为B阶)粘合剂(其可为上述类型的材料中的不止一种的组合)。可用于所提供的切割带和晶粒附连粘合剂中的示例性粘合剂组合物包括公开于美国专利No.5,110,388；No.5,118,567；和No.5,356,949(Komiyama等人)；No.5,705,016和No.5,888,606(Senoo等人)；美国专利公开No.2005/0031795(Chaudhury等人)、No.2007/0190318(Asai等人)；日本专利公开No.2004-349441(Shohei等人)、No.2006-104246(Harunori)和No.08-053655(Senoo等人)中。特别要关注的是公开于2007年3月16日提交的申请人的共同未决的公开U.S.S.N.60/895,189中的粘合剂。粘合剂组合物可具有与粘合剂相接触的剥离衬片。
在一个实施例中，粘合剂组合物可包含具有官能团的丙烯酸酯聚合物、多官能热固性树脂(其中所述丙烯酸酯聚合物和多官能热固性树脂能够相互进行反应)、多官能丙烯酸酯、丙烯酸酯聚合催化剂或固化剂、适用于使该多官能热固性树脂固化的潜热催化剂以及丙烯酸盐。
具有官能团的合适丙烯酸酯聚合物包括(例如)直链或支链的、单官能的、不饱和的、非叔烷基醇的丙烯酸酯或甲基丙烯酸酯的共聚物，其烷基具有1至14个、特别是4至12个碳原子，并且一个或多个(甲基)丙烯酸酯官能单体具有额外的官能团。优选的单官能单体包括(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸异辛酯、(甲基)丙烯酸异壬酯和(甲基)丙烯酸2-乙基丁酯。具有额外官能团的(甲基)丙烯酸酯官能单体包括上述单体，其中所述(甲基)丙烯酸酯还具有一个或多个选自羧酸基团、羟基、缩水甘油基、酰胺基和酸酐基的取代基。在一些实施例中，尤其优选的是具有额外官能团的(甲基)丙烯酸酯单体，所述(甲基)丙烯酸酯单体可为丙烯酸、甲基丙烯酸、丙烯酸羟乙酯、甲基丙烯酸羟乙酯、丙烯酸羟丙酯、甲基丙烯酸羟丙酯、丙烯酸羟基丁酯、甲基丙烯酸羟基丁酯、丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯和N-羟甲基丙烯酰胺中的一者或多者。
合适的多官能热固性树脂包括(例如)聚环氧官能树脂及其氮丙啶类似物。多官能缩水甘油基醚环氧树脂在本发明的粘合剂组合物中的含量为约15重量％(wt％)至约40wt％。在其它实施例中，多官能缩水甘油基醚环氧树脂在粘合剂组合物中的含量为约23wt％至约37wt％。本发明的其它粘合剂组合物可包含在15wt％至40wt％之间的任何量的多官能缩水甘油基醚环氧树脂。
优选的多官能缩水甘油基醚环氧树脂包括分子内平均有两个以上缩水甘油基的那些环氧树脂。缩水甘油基醚环氧树脂的具体例子包括多官能酚醛型环氧树脂(由酚醛与环氧氯丙烷的反应合成)、甲酚醛环氧树脂和双酚A酚醛环氧树脂。多官能缩水甘油基醚环氧树脂的粒子包括可得Hexion Specialty Chemicals(Columbus，OH)的商品名为EPON1050、EPON160、EPON164、EPON1031、EPONSU-2.5、EPONSU-3和EPONSU-8的那些环氧树脂；可得自Dow Chemical Company(Midland，MI)的“DEN”系列环氧树脂；以及可得自Huntsman Chemical(East Lansing，MI)的TACTIX756和TACTIX556环氧树脂。
在一些实施例中，可用的多官能缩水甘油基醚环氧树脂可为双酚A的二缩水甘油基醚并且可包括(但不限于)可得自Hexion SpecialtyChemicals的商品名为EPON树脂825、826和828的那些；可得自DowChemical Company的D.E.R.330、331和332树脂；以及可得CibaSpecialty Chemicals(Tarrytown，NY)的Araldite GY 6008、GY 6010和GY 2600树脂。
在其他实施例中，可用的多官能缩水甘油基醚环氧树脂可为双酚F的二缩水甘油基醚并且可包括(但不限于)可得自Hexion SpecialtyChemicals的商品名为EPON Resin 862树脂的那些；以及可得自CibaSpecialty Chemicals的ARALDITEGY 281、GY 282、GY 285、PY 306、和PY 307树脂。多官能缩水甘油基醚环氧树脂的环氧当量通常为约170至约500，在其它实施例中为约170至约350，并且在其他实施例中为约170至约250。环氧官能团的平均范围为约1.5至约10。
丙烯酸酯聚合物和热固性树脂能够彼此进行反应(通常通过开环反应或缩合反应进行)，使得反应产物为链延长聚合物和/或交联聚合物。合适的多官能丙烯酸酯包括(例如)二、三、四羟基化合物的(甲基)丙烯酸酯，例如二丙烯酸乙二醇酯、二丙烯酸聚乙二醇酯、二甲基丙烯酸乙二醇酯、二丙烯酸己二醇酯、二丙烯酸三乙二醇酯、三羟甲基丙烷三丙烯酸酯、三丙烯酸甘油酯、三丙烯酸季戊四醇酯、三甲基丙烯酸季戊四醇酯、四丙烯酸季戊四醇酯和四甲基丙烯酸季戊四醇酯。还可使用诸如得自Sartomer Co.(Exton，PA)的CN2301、2302、2303、2304之类的高支化多元醇的丙烯酸酯。三羟甲基丙烷三丙烯酸酯尤其适用于通过光化学诱导的聚合反应来降低粘合剂的粘性。
合适的丙烯酸酯聚合催化剂包括(例如)光引发剂和热引发剂，在特别需要延长的储藏期限的应用中光引发剂通常是优选的。合适的紫外光活化的光引发剂的例子为IRGACURE651、IRGACURE184、IRGACURE369和IRGACURE819、以及DAROCUR1173(全部为CibaSpecialty Chemicals Co.的产品)，以及LUCIRIN TPO-L(BASF Corp.的产品)。
在一些实施例中，可使用热引发剂。热引发剂包括有机过氧化物(例如，过氧化苯甲酰)、偶氮化合物、醌、亚硝基化合物、酰卤、腙、巯基化合物、吡喃鎓化合物、咪唑、氯三嗪、苯偶姻、苯偶姻烷基醚、二酮、苯酮以及它们的混合物。合适的热引发剂的例子为VAZO52、VAZO64和VAZO67偶氮化合物热引发剂，上述产品均得自DuPont。
适用于使多官能热固性树脂固化的合适潜热催化剂包括(例如)可用于一部分环氧树脂粘合剂的潜在催化剂。示例性的催化剂包括诸如得自Air Products(Allentown，PA)的MZ-A、MA-OK和PHZ-S之类的嵌段咪唑，以及诸如得自Landec Inc.(Menlo Park，CA)的INTELIMER7004之类的聚合物键合的咪唑。在一些实施例中，可以使用咪唑催化剂(特别是固体)，例如1，3-二烷基咪唑鎓盐、咪唑衍生物-过度金属络合物、2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑以及2，4-二氨基-6-[2′-甲基咪唑-(1)′]乙基-s-三嗪。催化剂(如果实施例中存在的话)占组合物的至少0.01重量％、优选至少约0.1重量％。在其它实施例中，催化剂占组合物的低于约5重量％、优选不超过约10重量％。
合适的丙烯酸盐包括(例如)含有通过一个或多个多价金属盐桥连接的低聚物单元的(甲基)丙烯酸。这种盐桥可在高于环境温度的温度下分离，从而改善粘合剂组合物的流动性。合适的丙烯酸盐包括CN2404(聚酯丙烯酸盐低聚物)和CN2405(聚氨酯丙烯酸盐低聚物)，二者均可得Sartomer(Exton，PA)。
在一些实施例中，多官能热固性树脂可为环氧树脂。在一些实施例中，丙烯酸酯聚合物可为丙烯酸丁酯和甲基丙烯酸缩水甘油酯的共聚物。在另外一些实施例中，多官能丙烯酸酯可包括三羟甲基丙烷三丙烯酸酯(TMPTA)。
在一些实施例中，聚合物催化剂或固化剂可为光引发的自由基固化剂。在一些实施例中，潜热催化剂可为咪唑促进剂。在另外一些实施例中，丙烯酸盐可为丙烯酸或甲基丙烯酸的金属盐。
背衬不受具体限制。背衬可为聚合物背衬、金属背衬、包含纤维的背衬、由纸材组成的背衬等等中的任何一种，并且优选使用聚合物背衬。聚合物背衬的例子包括聚合物薄膜或薄片。构成聚合物薄膜或薄片的背衬例子包括聚烯烃树脂(如，低密度聚乙烯、直链聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、丙烯无规共聚物、丙烯嵌段共聚物、丙烯均聚物、聚丁烯和聚甲基戊烯)、乙烯/醋酸乙烯共聚物、离聚物树脂、乙烯/(甲基)丙烯酸共聚物、乙烯/(甲基)丙烯酸酯共聚物(如，无规共聚物和交替共聚物)、乙烯/丁烯共聚物、乙烯/己烯共聚物、聚氨酯、聚酯树脂(如，聚(对苯二酸乙二酯)、聚(萘二甲酸乙二酯)、聚(对苯二酸丁二酯)、和聚(萘二甲酸乙二酯))、聚酰亚胺、聚酰胺、聚醚酮、聚醚、聚醚砜、聚苯乙烯树脂(如聚苯乙烯)、聚(氯乙烯)、聚(偏二氯乙烯)、聚(乙烯醇)、聚(醋酸乙烯酯)、氯乙烯/醋酸乙烯酯共聚物、聚碳酸酯、氟树脂、纤维素树脂以及通过交联这些树脂获得的材料。这些组分材料可单独使用或它们的两种或更多种结合使用。聚合物薄膜或薄片的组分材料可具有结合其中的官能团，或者可为接枝有官能单体或改性单体的材料。优选的背衬包括诸如聚烯烃之类的光学透明的弹性体材料。
优选的是，背衬可为至少部分透射辐射(如X-线、紫外线或电子束)的材料，从而形成于背衬上的辐射固化性压敏粘合剂可通过从背衬侧照射该层来进行固化。背衬可具有单层或多层构造。背衬可含有常规的添加剂或成分，例如填充剂、阻燃剂、抗老化剂、抗静电剂、软化剂、紫外线吸收剂、抗氧化剂、增塑剂和表面活性剂。
背衬可具有至少一个与粘合剂接触的表面。背衬中与粘合剂接触的部分可包括具有图案的表面改性区。所谓表面改性，其意指背衬的表面已经处理以改变背衬的表面化学性质以及改变其表面能。电离辐射可用于产生表面改性区并且可包括(例如)电晕处理、电子束处理、等离子处理、火焰处理、紫外线处理或可针对背衬的任何其他处理。辐射的图案化以及从而实现的表面改性可(例如)通过遮蔽部分辐射以便辐射仅作用于背衬的图案化部分或通过使辐射光栅化来产生图案而实现。还可以设想，可通过诸如使用图案化底漆或图案化蚀刻步骤之类的化学手段来实现表面改性。
在一些优选的实施例中，可使用电晕处理在诸如聚合物背衬之类的背衬上产生图案化的表面改性区。电晕放电可通过包括高频功率发生器、高压变压器、固定电极和处理器地辊或滚筒的设备来产生。通过变压器将标准电源转变成较高频率的电源，然后将其提供给处理器工位。处理器工位通过在气隙上方并指向材料表面的陶瓷或金属电极来施加此电力。此处理在背衬上产生了较好的粘合表面。
利用电晕处理对幅材进行图案化表面改性已公开于(例如)美国专利No.4,879,430和No.5,139,804(Hoffman)中。利用此方法，提供具有通过(例如)刻印来实现的向其中凹陷的图案施加辊或滚筒。可使诸如聚烯烃幅材之类的聚合物幅材在辊上通过并且同时远离该辊的顶部侧面暴露于电晕放电。电晕放电可无选择性地对幅材的顶部侧面进行改性，这意味着无任何图案。在幅材的背侧(朝向辊的一侧)，凹陷图案可使在不与施加辊接触的位置处截留空气。此截留空气可通过电晕处理活化并可截留空气的位置处于幅材下表面上产生图案化的表面改性区。
还可用于所提供的方法的一个实施例中的是厚度在约125μm至约500μm范围内的条带，以对施加辊进行图案化掩蔽，例如所述颁给Hoffman的专利中的那些条带。在一些实施例中，已发现使用聚合物掩模来产生包括图案的表面改性区是可行的。尤其优选的实施例使用厚的磁性聚合物幅材，该幅材被切制成图案并且磁性附着至施加辊上。这种材料(Master Magnetics Inc.，Anaheim，CA)可易于切成图案并可设置在滚筒上以便产生图案化的槽，这样使得当绕滚筒卷绕聚合物幅材并且将该幅材暴露于电晕处理时将会产生包括图案的表面改性区。
在一些实施例中，包括图案的表面改性区可为闭环形式。这种环可为圆形的、卵形的、椭圆形的、多边形的或不规则的。在一些优选实施例中，包括图案的表面改性区可为具有圆形图案的闭环并且可形成环形或环面。当待切割晶圆具有圆形形状时，环形或环面为尤其适用的图案。然而，应当设想到，图案可为至少部分包绕晶圆切割区域的任何图案。图案不是完整环而是其中具有一些断裂并因此由闭环的片段组成也是可能的。例如，图案可为环或环面形状而且可由多个布置在闭环形状内的经电晕处理的点、片段、X或任何小形状的处理区域的集合构成。
在另一个方面，提供了制品，其包括具有包括图案的表面改性区的背衬、与图案相接触的粘合剂、与粘合剂相接触的半导体晶圆以及与粘合剂接触的切割架，其中所述切割架包绕晶圆并且所述切割架正下方的粘合剂的至少一部分与图案的至少一部分相接触。形成包括图案的表面改性区以及可用于此制品中的粘合剂组合物的细节已进行了论述。制品还包括切割架。切割架可用于在切割操作期间来固定切割带和晶圆，从而使得可对晶圆进行干净地切削、可避免破碎并且可不会在切割期间弯曲或扭曲以引起晶圆损坏。切割架通常为闭环形式。在一些实施例中，优选的是，包括图案的表面改性区具有与切割架相同的形状或稍大于切割架的尺寸。这种关系示于图4中，将对其在下文中进行论述。此外，优选的是，切割架设置在包括图案的表面改性区的正上方，如3a-3c和图4所示。当切割架设置在表面改性区正上方并且与粘合剂接触时，粘合剂粘附到背衬上并且允许在切割操作之后干净地移除背衬和粘合剂。当背衬包括表面改性区时，在移出切割架时可在粘合剂和切割架之间出现粘合失效。
最后，提供了切割半导体晶圆的方法，其包括提供与具有包括图案的表面改性区的背衬相接触的粘合剂、将半导体晶圆附连至粘合剂、将切割架附连至粘合剂以使得切割架与粘合剂接触并且包绕晶圆以及切割晶圆以形成小片，其中位于切割架下面的粘合剂的至少一部分与图案的至少一部分相接触。该方法示于(例如)以图3a-3c的次序表示的附图中。
在一个实施例中，在已对晶圆进行切割后，可部分地固化粘合剂。部分固化可通过热或光来实现。如果使用诸如可见光或紫外线辐射之类的光来部分地固化粘合剂，那么背衬应对产生固化的波长来说是透明的，如上文所论述的。优选的是，透过背衬的背面来完成辐射。当粘合剂暴露于辐射时可产生粘合剂的部分固化。
部分固化后，粘合剂去粘性化的程度足以促进粘合剂和背衬之间发生粘合失效。粘合剂可保持粘附在小片上并且可仍然保持一定粘性。然后可将具有固化粘合剂的小片较容易地从背衬处移出。最后可移出切割架。
图1为电晕处理设备的实施例的示意图，其可用于制备所提供的切割带的实施例，所述切割带包括具有环形图案的表面改性区。电晕处理设备100包括接地的不锈钢筒102。在图示实施例中，筒上覆盖(卷绕)有磁性片材104。此片材具有两个切入其中并且形状为环形的孔102(一孔未示出，但为位于此筒隐藏侧上的相对孔102)。将半径小于所述两个孔的两个额外的磁性片材104的圆形薄片设置在位于筒任一侧的孔的中央。结果为暴露出筒102的环形形状。设置电晕处理器106(电源未示出)以便为此筒提供电离辐射108。使背衬幅材(未示出)在筒102周围以及在电晕处理器106下方通过，从而使得电离辐射108作用于背衬幅材上。电晕处理引起背衬顶面的非选择性表面改性区。另外，在环面具有凹陷的区域中，截留了空气形成气槽并且产生了介电屏蔽放电，从而在幅材的朝向筒的背面上产生了环形表面改性图案。
图2为已穿过图1的设备而具有表面改性区的幅材200的底部侧视图(朝向的筒经电晕处理的面)。在此实施例中，背衬幅材202由聚烯烃制成。幅材的顶面已通过电晕进行了非选择性的表面改性。幅材的底面具有表面改性区204的规则环形图案，所述表面改性区是由于通过图1中所示的电晕处理器产生的。
图3a-3c为包括所提供切割带和晶粒附连薄膜的制品的实施例的剖视图。图3a示出了切割过程之初的制品300。制品包括顶面具有由区域304(环形图案的侧向视图)标明的表面改性区的背衬302。已粘附到半导体晶圆308上的粘合剂306位于该背衬的顶面上。制品还包括切割架310(环形框架的侧向视图)。架310在切割期间固定背衬-粘合剂-晶圆组合体。
图3b为制品320在切割操作之后的视图。制品320包括顶面具有由区域304标明的表面改性区的背衬302。粘合剂层306设置在背衬的顶面上并且具有与其粘附的晶圆308。晶圆308其中已切割有多个切口309。在该实施例中，已产生的切口穿过晶圆和粘合剂并且稍微进入背衬。切割架310仍固定住制品。
图3c示出了如图3a和3b所示的具有含表面改性区304的背衬302的制品330的视图。然而，在此视图中，粘合剂已利用透过背衬302固化而去粘性化。基板302已被拉伸以便分离小片308，此时小片上粘附有粘合剂306。将具有粘合剂的小片从背衬处移出并且可将其粘附到用于引线结合等的基板(未示出)上。在图3c中，切割架已被移出而位于切割架下方且位于表面改性区304上方的粘合剂306保留在背衬上。
图4为制品400(图3a中的剖视图所示的制品)的透视图。在此视图中，已将粘合剂406涂覆到背衬(未示出)上。在区域406a中，粘合剂位于背衬的环形表面改性区上。此区域还在切割架410下方延伸。半导体晶圆408已粘附到粘合剂上。此视图中的晶圆已准备用于进行切割。
下面的实例进一步说明了本发明的目的和优点，但这些实例中列举的具体材料及其量以及其他条件和细节不应被理解为是对本发明的不当限制。
实例
材料清单
Figure BPA00001251983800151
制备例1
丙烯酸丁酯/甲基丙烯酸缩水甘油酯(BA/GMA)共聚物的制备
将以下物质加入946毫升的瓶中：72.0克丙烯酸丁酯(DowChemical Co.，Midland，MI)、48.0克甲基丙烯酸缩水甘油酯(Sartomer Co.Inc.，Easton，PA)、0.18克2，2′-偶氮二(2-甲基丁腈)(DuPont，Wilmington，DE)、140克乙酸乙酯和140克甲苯。将此溶液用氮气以每分钟一升的速率吹扫两分钟。将瓶密封并置于维持在60℃的水浴中24小时。反应混合物为29.5重量％的固体，测得的特性粘度为0.78dL/g，Brookfield粘度为0.7帕斯卡-秒。
表I
用于实例1-7的制剂
Figure BPA00001251983800161
(a)聚合物在乙酸乙酯/甲苯(1∶1)中的30％溶液的重量
图案化背衬的制备
经图案电晕处理的聚烯烃衬片具有环形图案，如上文所述。用柔性磁性片材(1.5mm厚)来产生柔性金属磁性掩模，并将其卷绕在电晕处理器的金属背衬辊周围。掩模具有图案并且此装置具有如图1所示的构造。使用间隙为60密耳(1.5mm)的空气电晕电极。将薄膜以15米/分钟的速度拉过电晕处理器。电晕功率为620W，标准化的电晕能量为0.54(J/cm2)，并且在室温下室内湿度为11％。
实例1
将表1中所列的用于实例1的组分在高剪切混合器中进行混合，涂覆至经硅处理的PET衬片(37μm厚)上，然后在65℃的鼓风烘箱中干燥5分钟。然后将该经粘合剂涂覆的衬片在室温以及40psi(276kPa)下层合至经图案化电晕处理的聚烯烃背衬的具有图案的面上。移除该PET衬片，将粘合剂/经电晕处理的聚烯烃层合至抛光的硅晶圆上。沿幅材横向方向来制备剥离样品，从而该样品包括1英寸(2.54cm)宽的经电晕处理部分。在紫外线暴露之前进行剥离的样品显示在粘合剂与硅晶圆之间的界面处失效。当将样品暴露于0.5J/cm2UVA辐射后，剥离失效方式改变为在薄膜背衬和粘合剂之间失效，但经电晕处理的2.54cm的条带除外。在该部分，失效处于粘合剂和硅晶圆之间。
实例2-7
将表1中所列的用于实例2-7的组分根据实例1进行制备以及测试。
在不背离本发明的范围和原理的条件下，本发明的各种修改和更改对本领域技术人员来说将是显而易见的，并且应当理解，本发明不应不当地受限于上文示出的示例性实施例。

Claims (21)

1.一种适于连续用作切割带和晶粒附连粘合剂的粘合剂转移切割带，其包含：
粘合剂组合物；和
与所述粘合剂相接触的背衬，
其中所述背衬包括表面改性区，所述表面改性区包括图案，并且
其中所述粘合剂与所述图案的至少一部分相接触。
2.根据权利要求1所述的条带，其中所述粘合剂组合物包含辐射固化性基团。
3.根据权利要求2所述的条带，其中所述粘合剂组合物在暴露于辐射时去粘性化。
4.根据权利要求1所述的条带，其中所述粘合剂组合物还包含：
具有官能团的丙烯酸酯聚合物；
多官能热固性树脂；
多官能丙烯酸酯；
丙烯酸酯聚合催化剂或固化剂；
适用于使所述多官能热固性树脂固化的潜热催化剂；和
丙烯酸盐，
其中所述丙烯酸酯聚合物和所述热固性树脂能相互反应。
5.根据权利要求4所述的组合物，其中所述多官能热固性树脂包含环氧树脂。
6.根据权利要求4所述的组合物，其中丙烯酸酯聚合物包含丙烯酸丁酯和甲基丙烯酸缩水甘油酯的共聚物。
7.根据权利要求4所述的组合物，其中所述多官能丙烯酸酯包括三羟甲基丙烷三丙烯酸酯。
8.根据权利要求4所述的组合物，其中所述聚合催化剂或固化剂包含光引发的自由基固化剂。
9.根据权利要求1所述的条带，其中所述粘合剂组合物还包含：
至少约50重量％的含官能团的丙烯酸酯聚合物；
约20重量％至约40重量％的多官能热固性树脂；
有效量的多官能丙烯酸酯；
用于使所述丙烯酸酯聚合物固化的催化剂；
用于使所述多官能热固性树脂固化的潜热催化剂；和
丙烯酸盐，
其中所述丙烯酸酯聚合物和所述热固性树脂能够形成粘合剂反应产物。
10.根据权利要求1所述的条带，其中所述图案包括闭环。
11.根据权利要求10所述的条带，其中所述闭环包括环面。
12.根据权利要求1所述的条带，其中所述表面改性区用电离辐射产生。
13.根据权利要求12所述的条带，其中所述电离辐射包括用电晕处理产生的辐射。
14.一种制品，包括：
背衬，所述背衬包括具有表面改性区的侧面，所述表面改性区包括图案；
与所述图案相接触的粘合剂；
与所述粘合剂相接触的半导体晶圆；和
与所述粘合剂相接触的切割架，
其中所述切割架包绕所述晶圆并且所述切割架下方的所述粘合剂的至少一部分与所述图案的至少一部分相接触。
15.根据权利要求14所述的制品，其中所述图案包括闭环。
16.根据权利要求15所述的制品，其中所述闭环包括环面。
17.一种切割半导体晶圆的方法，包括：
提供与具有包括图案的表面改性区的背衬相接触的粘合剂；
将半导体晶圆附连至所述粘合剂；
将切割架附连至所述粘合剂以使得所述切割架与所述粘合剂相接触并且包绕所述晶圆，
其中位于所述切割架下方的所述粘合剂的至少一部分与所述图案的至少一部分相接触；以及
切割所述晶圆以形成小片。
18.根据权利要求17所述的方法，该方法还包括使所述粘合剂固化。
19.根据权利要求18所述的方法，其中使粘合剂固化包括使所述粘合剂暴露于辐射。
20.根据权利要求18所述的方法，该方法还包括从其上具有所述粘合剂的所述背衬处移出所述小片。
21.根据权利要求20所述的方法，该方法还包括移出所述切割架，其中所述粘合剂保留在所述背衬的表面改性区上。
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Application publication date: 20110413