KR880701783A - 전자 전기 기기 도전부품용 재료 - Google Patents
전자 전기 기기 도전부품용 재료Info
- Publication number
- KR880701783A KR880701783A KR1019880700616A KR880700616A KR880701783A KR 880701783 A KR880701783 A KR 880701783A KR 1019880700616 A KR1019880700616 A KR 1019880700616A KR 880700616 A KR880700616 A KR 880700616A KR 880701783 A KR880701783 A KR 880701783A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic
- materials
- electrical equipment
- conductive parts
- equipment conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
- C22C21/08—Alloys based on aluminium with magnesium as the next major constituent with silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61-233454 | 1986-10-01 | ||
JP61233454A JPS6389640A (ja) | 1986-10-01 | 1986-10-01 | 電子電気機器導電部品材料 |
PCT/JP1987/000717 WO1988002411A1 (en) | 1986-10-01 | 1987-09-30 | Material for conductive parts of electronic and electric appliances |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880701783A true KR880701783A (ko) | 1988-11-05 |
KR950013291B1 KR950013291B1 (ko) | 1995-11-02 |
Family
ID=16955288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880700616A KR950013291B1 (ko) | 1986-10-01 | 1987-09-30 | 전자 전기기기 도전부품용 재료 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS6389640A (ko) |
KR (1) | KR950013291B1 (ko) |
WO (1) | WO1988002411A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717982B2 (ja) * | 1986-10-09 | 1995-03-01 | スカイアルミニウム株式会社 | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 |
US5302342A (en) * | 1989-11-17 | 1994-04-12 | Honda Giken Kogyo Kabushiki Kaisha | Aluminum alloy for heat exchangers |
US6459153B1 (en) * | 1999-05-12 | 2002-10-01 | Koninklijke Philips Electronics N.V. | Compositions for improving interconnect metallization performance in integrated circuits |
JP5254764B2 (ja) * | 2002-03-01 | 2013-08-07 | 昭和電工株式会社 | Al−Mg−Si系合金材 |
WO2003074750A1 (fr) * | 2002-03-01 | 2003-09-12 | Showa Denko K.K. | Procede de production d'une plaque en alliage al-mg-si, plaque en alliage al-mg-si et materiau en alliage al-mg-si |
DE102010027082A1 (de) * | 2010-07-13 | 2012-01-19 | Phoenix Contact Gmbh & Co. Kg | Klemmkörper für einen elektrischen Leiter |
WO2013065583A1 (ja) * | 2011-11-02 | 2013-05-10 | 住友電気工業株式会社 | 端子用アルミニウム合金板、端子金具、及び電線の端末接続構造 |
WO2014084424A1 (ko) * | 2012-11-30 | 2014-06-05 | 인하대학교 산학협력단 | 고방열 고강도 알루미늄 합금 |
WO2015166407A1 (en) * | 2014-04-28 | 2015-11-05 | Ennio Corrado | Electrical connector comprising a contact element of an aluminium based alloy |
CA3125339A1 (en) * | 2019-01-25 | 2020-07-30 | Rio Tinto Alcan International Limited | Foundry alloys for high-pressure vacuum die casting |
CN114645163B (zh) * | 2022-03-24 | 2023-06-23 | 中铝东南材料院(福建)科技有限公司 | 汽车高光外装饰件用铝合金板材及其制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5665968A (en) * | 1979-10-31 | 1981-06-04 | Kansai Electric Power Co Inc:The | Manufacture of electrically conductive aluminum alloy with high heat resistance |
JPS5947365A (ja) * | 1983-08-08 | 1984-03-17 | Furukawa Electric Co Ltd:The | 高力耐熱アルミニウム合金導体の製造法 |
JPS60215751A (ja) * | 1984-03-19 | 1985-10-29 | Furukawa Electric Co Ltd:The | 導電用高力アルミニウム合金線の製造方法 |
JPS61136653A (ja) * | 1984-12-08 | 1986-06-24 | Nippon Light Metal Co Ltd | アルミニウム極細線の製造方法 |
JPS6296642A (ja) * | 1985-10-22 | 1987-05-06 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
JPS6296644A (ja) * | 1985-10-24 | 1987-05-06 | Nippon Light Metal Co Ltd | リ−ドフレ−ム用アルミニウム合金 |
JPS6296638A (ja) * | 1985-10-24 | 1987-05-06 | Nippon Light Metal Co Ltd | リ−ドフレ−ム用アルミニウム合金 |
JPS62130254A (ja) * | 1985-11-29 | 1987-06-12 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
-
1986
- 1986-10-01 JP JP61233454A patent/JPS6389640A/ja active Pending
-
1987
- 1987-09-30 WO PCT/JP1987/000717 patent/WO1988002411A1/ja unknown
- 1987-09-30 KR KR1019880700616A patent/KR950013291B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950013291B1 (ko) | 1995-11-02 |
JPS6389640A (ja) | 1988-04-20 |
WO1988002411A1 (en) | 1988-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |