KR870017634U - 전기 전자기기용 냉각장치 - Google Patents

전기 전자기기용 냉각장치

Info

Publication number
KR870017634U
KR870017634U KR2019860005647U KR860005647U KR870017634U KR 870017634 U KR870017634 U KR 870017634U KR 2019860005647 U KR2019860005647 U KR 2019860005647U KR 860005647 U KR860005647 U KR 860005647U KR 870017634 U KR870017634 U KR 870017634U
Authority
KR
South Korea
Prior art keywords
electrical
electronic equipment
cooling device
cooling
electronic
Prior art date
Application number
KR2019860005647U
Other languages
English (en)
Other versions
KR890004085Y1 (ko
Inventor
변기영
Original Assignee
변기영
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 변기영 filed Critical 변기영
Priority to KR2019860005647U priority Critical patent/KR890004085Y1/ko
Publication of KR870017634U publication Critical patent/KR870017634U/ko
Application granted granted Critical
Publication of KR890004085Y1 publication Critical patent/KR890004085Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019860005647U 1986-04-25 1986-04-25 전기 전자기기용 냉각장치 KR890004085Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019860005647U KR890004085Y1 (ko) 1986-04-25 1986-04-25 전기 전자기기용 냉각장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019860005647U KR890004085Y1 (ko) 1986-04-25 1986-04-25 전기 전자기기용 냉각장치

Publications (2)

Publication Number Publication Date
KR870017634U true KR870017634U (ko) 1987-11-30
KR890004085Y1 KR890004085Y1 (ko) 1989-06-17

Family

ID=19251075

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860005647U KR890004085Y1 (ko) 1986-04-25 1986-04-25 전기 전자기기용 냉각장치

Country Status (1)

Country Link
KR (1) KR890004085Y1 (ko)

Also Published As

Publication number Publication date
KR890004085Y1 (ko) 1989-06-17

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19960611

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee