KR850005160A - 적층형 반도체 기억장치 - Google Patents
적층형 반도체 기억장치 Download PDFInfo
- Publication number
- KR850005160A KR850005160A KR1019840007999A KR840007999A KR850005160A KR 850005160 A KR850005160 A KR 850005160A KR 1019840007999 A KR1019840007999 A KR 1019840007999A KR 840007999 A KR840007999 A KR 840007999A KR 850005160 A KR850005160 A KR 850005160A
- Authority
- KR
- South Korea
- Prior art keywords
- transistor
- drain
- source
- semiconductor memory
- stacked semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 7
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/405—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8221—Three dimensional integrated circuits stacked in different levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 실시예의 단면도.
제4도는 본 발명의 실시예의 회로도.
제5도A와 제5도B는 본 발명의 실시예의 제조공정을 도시한 단면도.
Claims (5)
- 기억용의 제1의 트랜지스터와, 정보 판정용의 제2의 트랜지스터와, 호출용의 제3의 트랜지스터를 가진 반도체 장치에 있어서, 제1의 트랜지스터의 드레인 또는 소오스를 제2의 트랜지스터의 게이트 전극에 접속하고, 제2의 트랜지스터의 드레인 또는 소오스를 제3의 트랜지스터의 소오스 또는 드레인에 접속하며, 상기 제1의 트랜지스터의 적어도 일부가 상기 제3의 트랜지스터의 상부에 마련되어 있는 것을 특징으로 하는 적층형 반도체 기억장치.
- 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속하고, 상기 제1의 트랜지스터의 드레인 또는 소오스를 제2의 트랜지스터의 게이트 전극에 접속하는 것은, 해당 게이트 전극과, 상기 드레인 또는 소오스 영역이 같은 공정으로 마련된 반도체층에 의해서 형성되어 있는 것을 특징으로 하는 특허청구의 범위 제1항에 기재의 적층형 반도체 기억장치.
- 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속하고, 상기 제2, 제3의 게이트 전극은 같은 공정으로 되는 것을 특징으로 하는 특허청구의 범위 제1항 기재의 적층형 반도체 기억장치.
- 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속한 영역을 정보의 출력, 입력부로 하고, 상기 제2의 트랜지스터의 소오스 또는 드레인을 기준전위로 하는 것을 특징으로 하는 특허청구의 범위 제2항 기재의 적층형 반도체 기억장치.
- 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속한 영역을 정보의 출력, 입력부로 하고, 상기 제2의 트랜지스터의 소오스 또는 드레인을 기준전위로 하는 것을 특징으로 하는 특허청구의 범위 제3항 기재의 적층형 반도체 기억장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58-237776 | 1983-12-19 | ||
JP58237776A JPS60130160A (ja) | 1983-12-19 | 1983-12-19 | 半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR850005160A true KR850005160A (ko) | 1985-08-21 |
KR920010821B1 KR920010821B1 (ko) | 1992-12-17 |
Family
ID=17020258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840007999A KR920010821B1 (ko) | 1983-12-19 | 1984-12-15 | 적층형 반도체 기억장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4633438A (ko) |
EP (1) | EP0147151B1 (ko) |
JP (1) | JPS60130160A (ko) |
KR (1) | KR920010821B1 (ko) |
CA (1) | CA1222821A (ko) |
DE (1) | DE3484955D1 (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6177359A (ja) * | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | 半導体記憶装置 |
JPH0812905B2 (ja) * | 1986-07-11 | 1996-02-07 | キヤノン株式会社 | 光電変換装置及びその製造方法 |
JPS6319847A (ja) * | 1986-07-14 | 1988-01-27 | Oki Electric Ind Co Ltd | 半導体記憶装置 |
US4679299A (en) * | 1986-08-11 | 1987-07-14 | Ncr Corporation | Formation of self-aligned stacked CMOS structures by lift-off |
JP2653095B2 (ja) * | 1988-04-22 | 1997-09-10 | 富士電機株式会社 | 伝導度変調型mosfet |
US4910709A (en) * | 1988-08-10 | 1990-03-20 | International Business Machines Corporation | Complementary metal-oxide-semiconductor transistor and one-capacitor dynamic-random-access memory cell |
US5801396A (en) * | 1989-01-18 | 1998-09-01 | Stmicroelectronics, Inc. | Inverted field-effect device with polycrystalline silicon/germanium channel |
US5770892A (en) * | 1989-01-18 | 1998-06-23 | Sgs-Thomson Microelectronics, Inc. | Field effect device with polycrystalline silicon channel |
JP2825520B2 (ja) * | 1989-03-24 | 1998-11-18 | 株式会社日立製作所 | 半導体装置 |
JP3011416B2 (ja) * | 1989-04-14 | 2000-02-21 | 株式会社東芝 | スタティック型メモリ |
KR950008385B1 (ko) * | 1990-05-24 | 1995-07-28 | 삼성전자주식회사 | 반도체 소자의 워드라인 형성방법 |
JP2959066B2 (ja) * | 1990-07-11 | 1999-10-06 | 日本電気株式会社 | 不揮発性半導体記憶装置およびその駆動方法 |
US5291440A (en) * | 1990-07-30 | 1994-03-01 | Nec Corporation | Non-volatile programmable read only memory device having a plurality of memory cells each implemented by a memory transistor and a switching transistor stacked thereon |
JPH0799251A (ja) * | 1992-12-10 | 1995-04-11 | Sony Corp | 半導体メモリセル |
US5898619A (en) * | 1993-03-01 | 1999-04-27 | Chang; Ko-Min | Memory cell having a plural transistor transmission gate and method of formation |
US5784328A (en) * | 1996-12-23 | 1998-07-21 | Lsi Logic Corporation | Memory system including an on-chip temperature sensor for regulating the refresh rate of a DRAM array |
US5771187A (en) * | 1996-12-23 | 1998-06-23 | Lsi Logic Corporation | Multiple level storage DRAM cell |
US5847990A (en) * | 1996-12-23 | 1998-12-08 | Lsi Logic Corporation | Ram cell capable of storing 3 logic states |
US5982659A (en) * | 1996-12-23 | 1999-11-09 | Lsi Logic Corporation | Memory cell capable of storing more than two logic states by using different via resistances |
US5808932A (en) * | 1996-12-23 | 1998-09-15 | Lsi Logic Corporation | Memory system which enables storage and retrieval of more than two states in a memory cell |
US5761110A (en) * | 1996-12-23 | 1998-06-02 | Lsi Logic Corporation | Memory cell capable of storing more than two logic states by using programmable resistances |
US6551857B2 (en) | 1997-04-04 | 2003-04-22 | Elm Technology Corporation | Three dimensional structure integrated circuits |
US6140684A (en) * | 1997-06-24 | 2000-10-31 | Stmicroelectronic, Inc. | SRAM cell structure with dielectric sidewall spacers and drain and channel regions defined along sidewall spacers |
US5956350A (en) * | 1997-10-27 | 1999-09-21 | Lsi Logic Corporation | Built in self repair for DRAMs using on-chip temperature sensing and heating |
US5909404A (en) * | 1998-03-27 | 1999-06-01 | Lsi Logic Corporation | Refresh sampling built-in self test and repair circuit |
US6420746B1 (en) | 1998-10-29 | 2002-07-16 | International Business Machines Corporation | Three device DRAM cell with integrated capacitor and local interconnect |
DE10057665A1 (de) * | 2000-11-21 | 2002-06-06 | Siemens Ag | Integrierte Schaltung und Herstellungsverfahren dazu |
CN104600074A (zh) * | 2009-11-06 | 2015-05-06 | 株式会社半导体能源研究所 | 半导体装置 |
WO2011058934A1 (en) * | 2009-11-13 | 2011-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
KR101822962B1 (ko) | 2010-02-05 | 2018-01-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2011114905A1 (en) * | 2010-03-19 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
CN102812547B (zh) * | 2010-03-19 | 2015-09-09 | 株式会社半导体能源研究所 | 半导体装置 |
WO2011125432A1 (en) * | 2010-04-07 | 2011-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
WO2012002236A1 (en) | 2010-06-29 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Wiring board, semiconductor device, and manufacturing methods thereof |
US8634228B2 (en) * | 2010-09-02 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of semiconductor device |
US9443984B2 (en) | 2010-12-28 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8975680B2 (en) * | 2011-02-17 | 2015-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device and method manufacturing semiconductor memory device |
JP6088253B2 (ja) * | 2012-01-23 | 2017-03-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5154789A (ko) * | 1974-11-09 | 1976-05-14 | Nippon Electric Co | |
NL8006339A (nl) * | 1979-11-21 | 1981-06-16 | Hitachi Ltd | Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan. |
JPS5683075A (en) * | 1979-12-10 | 1981-07-07 | Nippon Telegr & Teleph Corp <Ntt> | Insulating gate type field-effect transistor circuit device |
JPS5853859A (ja) * | 1981-09-26 | 1983-03-30 | Matsushita Electric Ind Co Ltd | 集積型薄膜素子の製造方法 |
JPS6051272B2 (ja) * | 1982-05-31 | 1985-11-13 | 株式会社東芝 | 積層型cmosインバ−タ装置 |
-
1983
- 1983-12-19 JP JP58237776A patent/JPS60130160A/ja active Pending
-
1984
- 1984-12-13 CA CA000470021A patent/CA1222821A/en not_active Expired
- 1984-12-13 US US06/681,027 patent/US4633438A/en not_active Expired - Fee Related
- 1984-12-15 KR KR1019840007999A patent/KR920010821B1/ko not_active IP Right Cessation
- 1984-12-17 EP EP84308803A patent/EP0147151B1/en not_active Expired
- 1984-12-17 DE DE8484308803T patent/DE3484955D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0147151A2 (en) | 1985-07-03 |
EP0147151A3 (en) | 1987-07-01 |
EP0147151B1 (en) | 1991-08-21 |
DE3484955D1 (de) | 1991-09-26 |
JPS60130160A (ja) | 1985-07-11 |
CA1222821A (en) | 1987-06-09 |
KR920010821B1 (ko) | 1992-12-17 |
US4633438A (en) | 1986-12-30 |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |