KR850005160A - 적층형 반도체 기억장치 - Google Patents

적층형 반도체 기억장치 Download PDF

Info

Publication number
KR850005160A
KR850005160A KR1019840007999A KR840007999A KR850005160A KR 850005160 A KR850005160 A KR 850005160A KR 1019840007999 A KR1019840007999 A KR 1019840007999A KR 840007999 A KR840007999 A KR 840007999A KR 850005160 A KR850005160 A KR 850005160A
Authority
KR
South Korea
Prior art keywords
transistor
drain
source
semiconductor memory
stacked semiconductor
Prior art date
Application number
KR1019840007999A
Other languages
English (en)
Other versions
KR920010821B1 (ko
Inventor
히도시 구메 (외 5)
Original Assignee
미쓰다 가쓰시게
가부시기가이샤 히다찌 세이사꾸쇼 (외 1)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰다 가쓰시게, 가부시기가이샤 히다찌 세이사꾸쇼 (외 1) filed Critical 미쓰다 가쓰시게
Publication of KR850005160A publication Critical patent/KR850005160A/ko
Application granted granted Critical
Publication of KR920010821B1 publication Critical patent/KR920010821B1/ko

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/405Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8221Three dimensional integrated circuits stacked in different levels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

내용 없음

Description

적층형 반도체 기억장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 실시예의 단면도.
제4도는 본 발명의 실시예의 회로도.
제5도A와 제5도B는 본 발명의 실시예의 제조공정을 도시한 단면도.

Claims (5)

  1. 기억용의 제1의 트랜지스터와, 정보 판정용의 제2의 트랜지스터와, 호출용의 제3의 트랜지스터를 가진 반도체 장치에 있어서, 제1의 트랜지스터의 드레인 또는 소오스를 제2의 트랜지스터의 게이트 전극에 접속하고, 제2의 트랜지스터의 드레인 또는 소오스를 제3의 트랜지스터의 소오스 또는 드레인에 접속하며, 상기 제1의 트랜지스터의 적어도 일부가 상기 제3의 트랜지스터의 상부에 마련되어 있는 것을 특징으로 하는 적층형 반도체 기억장치.
  2. 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속하고, 상기 제1의 트랜지스터의 드레인 또는 소오스를 제2의 트랜지스터의 게이트 전극에 접속하는 것은, 해당 게이트 전극과, 상기 드레인 또는 소오스 영역이 같은 공정으로 마련된 반도체층에 의해서 형성되어 있는 것을 특징으로 하는 특허청구의 범위 제1항에 기재의 적층형 반도체 기억장치.
  3. 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속하고, 상기 제2, 제3의 게이트 전극은 같은 공정으로 되는 것을 특징으로 하는 특허청구의 범위 제1항 기재의 적층형 반도체 기억장치.
  4. 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속한 영역을 정보의 출력, 입력부로 하고, 상기 제2의 트랜지스터의 소오스 또는 드레인을 기준전위로 하는 것을 특징으로 하는 특허청구의 범위 제2항 기재의 적층형 반도체 기억장치.
  5. 상기 제1의 트랜지스터의 소오스 또는 드레인을 상기 제3의 트랜지스터의 소오스 또는 드레인과 접속한 영역을 정보의 출력, 입력부로 하고, 상기 제2의 트랜지스터의 소오스 또는 드레인을 기준전위로 하는 것을 특징으로 하는 특허청구의 범위 제3항 기재의 적층형 반도체 기억장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840007999A 1983-12-19 1984-12-15 적층형 반도체 기억장치 KR920010821B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58-237776 1983-12-19
JP58237776A JPS60130160A (ja) 1983-12-19 1983-12-19 半導体記憶装置

Publications (2)

Publication Number Publication Date
KR850005160A true KR850005160A (ko) 1985-08-21
KR920010821B1 KR920010821B1 (ko) 1992-12-17

Family

ID=17020258

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007999A KR920010821B1 (ko) 1983-12-19 1984-12-15 적층형 반도체 기억장치

Country Status (6)

Country Link
US (1) US4633438A (ko)
EP (1) EP0147151B1 (ko)
JP (1) JPS60130160A (ko)
KR (1) KR920010821B1 (ko)
CA (1) CA1222821A (ko)
DE (1) DE3484955D1 (ko)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177359A (ja) * 1984-09-21 1986-04-19 Fujitsu Ltd 半導体記憶装置
JPH0812905B2 (ja) * 1986-07-11 1996-02-07 キヤノン株式会社 光電変換装置及びその製造方法
JPS6319847A (ja) * 1986-07-14 1988-01-27 Oki Electric Ind Co Ltd 半導体記憶装置
US4679299A (en) * 1986-08-11 1987-07-14 Ncr Corporation Formation of self-aligned stacked CMOS structures by lift-off
JP2653095B2 (ja) * 1988-04-22 1997-09-10 富士電機株式会社 伝導度変調型mosfet
US4910709A (en) * 1988-08-10 1990-03-20 International Business Machines Corporation Complementary metal-oxide-semiconductor transistor and one-capacitor dynamic-random-access memory cell
US5801396A (en) * 1989-01-18 1998-09-01 Stmicroelectronics, Inc. Inverted field-effect device with polycrystalline silicon/germanium channel
US5770892A (en) * 1989-01-18 1998-06-23 Sgs-Thomson Microelectronics, Inc. Field effect device with polycrystalline silicon channel
JP2825520B2 (ja) * 1989-03-24 1998-11-18 株式会社日立製作所 半導体装置
JP3011416B2 (ja) * 1989-04-14 2000-02-21 株式会社東芝 スタティック型メモリ
KR950008385B1 (ko) * 1990-05-24 1995-07-28 삼성전자주식회사 반도체 소자의 워드라인 형성방법
JP2959066B2 (ja) * 1990-07-11 1999-10-06 日本電気株式会社 不揮発性半導体記憶装置およびその駆動方法
US5291440A (en) * 1990-07-30 1994-03-01 Nec Corporation Non-volatile programmable read only memory device having a plurality of memory cells each implemented by a memory transistor and a switching transistor stacked thereon
JPH0799251A (ja) * 1992-12-10 1995-04-11 Sony Corp 半導体メモリセル
US5898619A (en) * 1993-03-01 1999-04-27 Chang; Ko-Min Memory cell having a plural transistor transmission gate and method of formation
US5784328A (en) * 1996-12-23 1998-07-21 Lsi Logic Corporation Memory system including an on-chip temperature sensor for regulating the refresh rate of a DRAM array
US5771187A (en) * 1996-12-23 1998-06-23 Lsi Logic Corporation Multiple level storage DRAM cell
US5847990A (en) * 1996-12-23 1998-12-08 Lsi Logic Corporation Ram cell capable of storing 3 logic states
US5982659A (en) * 1996-12-23 1999-11-09 Lsi Logic Corporation Memory cell capable of storing more than two logic states by using different via resistances
US5808932A (en) * 1996-12-23 1998-09-15 Lsi Logic Corporation Memory system which enables storage and retrieval of more than two states in a memory cell
US5761110A (en) * 1996-12-23 1998-06-02 Lsi Logic Corporation Memory cell capable of storing more than two logic states by using programmable resistances
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US6140684A (en) * 1997-06-24 2000-10-31 Stmicroelectronic, Inc. SRAM cell structure with dielectric sidewall spacers and drain and channel regions defined along sidewall spacers
US5956350A (en) * 1997-10-27 1999-09-21 Lsi Logic Corporation Built in self repair for DRAMs using on-chip temperature sensing and heating
US5909404A (en) * 1998-03-27 1999-06-01 Lsi Logic Corporation Refresh sampling built-in self test and repair circuit
US6420746B1 (en) 1998-10-29 2002-07-16 International Business Machines Corporation Three device DRAM cell with integrated capacitor and local interconnect
DE10057665A1 (de) * 2000-11-21 2002-06-06 Siemens Ag Integrierte Schaltung und Herstellungsverfahren dazu
CN104600074A (zh) * 2009-11-06 2015-05-06 株式会社半导体能源研究所 半导体装置
WO2011058934A1 (en) * 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
KR101822962B1 (ko) 2010-02-05 2018-01-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011114905A1 (en) * 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
CN102812547B (zh) * 2010-03-19 2015-09-09 株式会社半导体能源研究所 半导体装置
WO2011125432A1 (en) * 2010-04-07 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
WO2012002236A1 (en) 2010-06-29 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Wiring board, semiconductor device, and manufacturing methods thereof
US8634228B2 (en) * 2010-09-02 2014-01-21 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
US9443984B2 (en) 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8975680B2 (en) * 2011-02-17 2015-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and method manufacturing semiconductor memory device
JP6088253B2 (ja) * 2012-01-23 2017-03-01 株式会社半導体エネルギー研究所 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154789A (ko) * 1974-11-09 1976-05-14 Nippon Electric Co
NL8006339A (nl) * 1979-11-21 1981-06-16 Hitachi Ltd Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan.
JPS5683075A (en) * 1979-12-10 1981-07-07 Nippon Telegr & Teleph Corp <Ntt> Insulating gate type field-effect transistor circuit device
JPS5853859A (ja) * 1981-09-26 1983-03-30 Matsushita Electric Ind Co Ltd 集積型薄膜素子の製造方法
JPS6051272B2 (ja) * 1982-05-31 1985-11-13 株式会社東芝 積層型cmosインバ−タ装置

Also Published As

Publication number Publication date
EP0147151A2 (en) 1985-07-03
EP0147151A3 (en) 1987-07-01
EP0147151B1 (en) 1991-08-21
DE3484955D1 (de) 1991-09-26
JPS60130160A (ja) 1985-07-11
CA1222821A (en) 1987-06-09
KR920010821B1 (ko) 1992-12-17
US4633438A (en) 1986-12-30

Similar Documents

Publication Publication Date Title
KR850005160A (ko) 적층형 반도체 기억장치
KR910020904A (ko) 반도체기억장치 및 그 제조 방법
KR840006873A (ko) 반도체 메모리
KR860006840A (ko) 반도체 집적회로장치 및 그 제조방법
KR900003896A (ko) 반도체 메모리와 그 제조방법
KR880011809A (ko) 불휘발성 반도체기억장치
KR960036075A (ko) 반도체 장치
KR900004022A (ko) 불휘발성 반도체 기억장치
KR920000145A (ko) 반도체 메모리
KR920010902A (ko) 반도체장치
KR910001979A (ko) 반도체 집적 회로 장치
KR890004444A (ko) Mos트랜지스터
KR920001533A (ko) 반도체 집적회로
KR880014379A (ko) 전압 검지 회로
KR900005463A (ko) 반도체 기억장치 및 그 제조방법
KR940006270A (ko) 박막트랜지스터 부하를 가지는 반도체 메모리장치
KR910003755A (ko) 박막 트랜지스터를 이용한 메모리소자 및 메모리 회로
KR920003552A (ko) 반도체 장치
KR850005734A (ko) 반도체 기억장치
KR850004881A (ko) 반도체 기억장치
KR910016005A (ko) 반도체 집적회로
KR880009448A (ko) 반도체 집적회로 장치
KR850004878A (ko) 반도체 기억장치
KR880004484A (ko) 메모리 셀회로
KR910003815A (ko) 불휘발성 반도체 메모리장치

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee