KR102636309B1 - 결함 검사 장치 - Google Patents

결함 검사 장치 Download PDF

Info

Publication number: KR102636309B1
Authority: KR; South Korea
Prior art keywords: defect; device chip; area; image; chip
Prior art date: 2016-03-07

Application number

KR1020187028451A

Other languages

English (en)

Korean (ko)

Other versions

KR20180118754A (ko

Inventor

히사시 야마모토

Original Assignee

토레이 엔지니어링 컴퍼니, 리미티드

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-03-07

Filing date

2017-01-04

Publication date

2024-02-15

2017-01-04 Application filed by 토레이 엔지니어링 컴퍼니, 리미티드 filed Critical 토레이 엔지니어링 컴퍼니, 리미티드

2018-10-31 Publication of KR20180118754A publication Critical patent/KR20180118754A/ko

2024-02-15 Application granted granted Critical

2024-02-15 Publication of KR102636309B1 publication Critical patent/KR102636309B1/ko

Links

230000007547 defect Effects 0.000 title claims abstract description 154
238000007689 inspection Methods 0.000 title claims abstract description 103
230000002093 peripheral effect Effects 0.000 claims abstract description 88
238000003384 imaging method Methods 0.000 claims abstract description 25
230000002950 deficient Effects 0.000 claims description 63
238000005520 cutting process Methods 0.000 claims description 45
238000000034 method Methods 0.000 claims description 19
238000001514 detection method Methods 0.000 claims description 17
238000003708 edge detection Methods 0.000 claims description 6
238000003860 storage Methods 0.000 description 6
239000000758 substrate Substances 0.000 description 6
238000010586 diagram Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
230000000694 effects Effects 0.000 description 2
230000004048 modification Effects 0.000 description 2
238000012986 modification Methods 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
239000011159 matrix material Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1

Images

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
General Physics & Mathematics (AREA)
Immunology (AREA)
Pathology (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

KR1020187028451A 2016-03-07 2017-01-04 결함 검사 장치 KR102636309B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2016-043273		2016-03-07
JP2016043273A JP6752593B2 (ja)	2016-03-07	2016-03-07	欠陥検査装置
PCT/JP2017/000016 WO2017154319A1 (ja)	2016-03-07	2017-01-04	欠陥検査装置

Publications (2)

Publication Number	Publication Date
KR20180118754A KR20180118754A (ko)	2018-10-31
KR102636309B1 true KR102636309B1 (ko)	2024-02-15

Family

ID=59789179

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020187028451A KR102636309B1 (ko)	2016-03-07	2017-01-04	결함 검사 장치

Country Status (5)

Country	Link
JP (1)	JP6752593B2 (ja)
KR (1)	KR102636309B1 (ja)
CN (1)	CN108700531B (ja)
TW (1)	TWI726977B (ja)
WO (1)	WO2017154319A1 (ja)

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JP7007993B2 (ja) *	2018-07-06	2022-01-25	東レエンジニアリング株式会社	ダイシングチップ検査装置
JP7157580B2 (ja) *	2018-07-19	2022-10-20	東京エレクトロン株式会社	基板検査方法及び基板検査装置
CN109596639A (zh) *	2018-11-30	2019-04-09	德淮半导体有限公司	缺陷检测***及缺陷检测方法
EP3971948A4 (en) *	2019-05-31	2022-06-08	Huawei Technologies Co., Ltd.	DEVICE FOR DETECTING CHIP CRACKS
JP7324116B2 (ja)	2019-10-15	2023-08-09	キヤノン株式会社	異物検査装置および異物検査方法
JP2022061127A (ja) *	2020-10-06	2022-04-18	東レエンジニアリング株式会社	外観検査装置および方法

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2016
- 2016-03-07 JP JP2016043273A patent/JP6752593B2/ja active Active
2017
- 2017-01-04 KR KR1020187028451A patent/KR102636309B1/ko active IP Right Grant
- 2017-01-04 WO PCT/JP2017/000016 patent/WO2017154319A1/ja active Application Filing
- 2017-01-04 CN CN201780014814.2A patent/CN108700531B/zh active Active
- 2017-01-18 TW TW106101637A patent/TWI726977B/zh active

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JP2009506339A (ja)	2005-08-30	2009-02-12	カムテックエルティーディー．	検査システム、及び基準フレームに基づいて欠陥を検査する方法
JP2007324241A (ja) *	2006-05-30	2007-12-13	Toshiba Corp	半導体素子の外観検査方法
CN102053093A (zh) *	2010-11-08	2011-05-11	北京大学深圳研究生院	一种晶圆表面切割芯片的表面缺陷检测方法
CN202676612U (zh)	2012-07-19	2013-01-16	华南师范大学	一种用于测试led电路芯片的装置

Also Published As

Publication number	Publication date
TW201805620A (zh)	2018-02-16
CN108700531B (zh)	2021-03-16
JP6752593B2 (ja)	2020-09-09
CN108700531A (zh)	2018-10-23
JP2017161236A (ja)	2017-09-14
TWI726977B (zh)	2021-05-11
KR20180118754A (ko)	2018-10-31
WO2017154319A1 (ja)	2017-09-14

Legal Events

Date	Code	Title
2021-09-28	A201	Request for examination
2023-10-22	E902	Notification of reason for refusal
2024-01-14	E701	Decision to grant or registration of patent right

Publication	Publication Date	Title
KR102636309B1 (ko)	2024-02-15	결함 검사 장치
US10417757B2 (en)	2019-09-17	Image inspection apparatus and image inspection method
JP4946668B2 (ja)	2012-06-06	基板位置検出装置及び基板位置検出方法
JP2003215060A (ja)	2003-07-30	パターン検査方法及び検査装置
JP2006252563A (ja)	2006-09-21	画像内の欠陥を検出する方法
CN115428125A (zh)	2022-12-02	检查装置以及检查方法
JP5460023B2 (ja)	2014-04-02	ウェハのパターン検査方法及び装置
US20090080762A1 (en)	2009-03-26	Appearance for inspection method
JP2007093330A (ja)	2007-04-12	欠陥抽出装置及び欠陥抽出方法
KR102350548B1 (ko)	2022-01-14	웨이퍼 검사 방법
JPH10288585A (ja)	1998-10-27	切断部を分析するための方法と装置
WO2020105368A1 (ja)	2020-05-28	ガラス板の製造方法、及びガラス板の製造装置
JP2002243655A (ja)	2002-08-28	電子部品の外観検査方法および外観検査装置
JP2006234554A (ja)	2006-09-07	パターン検査方法およびパターン検査装置
JP2561193B2 (ja)	1996-12-04	印刷パターン検査装置
JP5559508B2 (ja)	2014-07-23	外観検査システムおよび外観検査方法
JP3417178B2 (ja)	2003-06-16	回路パターンの検査方法及びその検査装置
CN114509446A (zh)	2022-05-17	晶片缺角自动检测方法与晶片缺角自动检测***
JP4613090B2 (ja)	2011-01-12	検査装置
KR102583036B1 (ko)	2023-09-27	기판 검사 방법
JP2014038425A (ja)	2014-02-27	印刷物の検査方法
JP5044953B2 (ja)	2012-10-10	半導体装置の検査装置及び検査方法
JP2009145161A (ja)	2009-07-02	欠陥検出方法および欠陥検出装置
CN113466235A (zh)	2021-10-01	视觉检测模组、缺陷检测工作站及缺陷检测方法
JP2007278975A (ja)	2007-10-25	外観検査方法および外観検査装置