KR102528633B1 - 워크 가공용 점착 테이프 - Google Patents

워크 가공용 점착 테이프 Download PDF

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Publication number
KR102528633B1
KR102528633B1 KR1020177030737A KR20177030737A KR102528633B1 KR 102528633 B1 KR102528633 B1 KR 102528633B1 KR 1020177030737 A KR1020177030737 A KR 1020177030737A KR 20177030737 A KR20177030737 A KR 20177030737A KR 102528633 B1 KR102528633 B1 KR 102528633B1
Authority
KR
South Korea
Prior art keywords
meth
urethane
adhesive tape
acrylate
pressure
Prior art date
Application number
KR1020177030737A
Other languages
English (en)
Korean (ko)
Other versions
KR20170140221A (ko
Inventor
유이치로 고마스
히로노부 후지모토
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20170140221A publication Critical patent/KR20170140221A/ko
Application granted granted Critical
Publication of KR102528633B1 publication Critical patent/KR102528633B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
KR1020177030737A 2015-04-30 2016-04-21 워크 가공용 점착 테이프 KR102528633B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015093141 2015-04-30
JPJP-P-2015-093141 2015-04-30
PCT/JP2016/062581 WO2016175112A1 (ja) 2015-04-30 2016-04-21 ワーク加工用粘着テープ

Publications (2)

Publication Number Publication Date
KR20170140221A KR20170140221A (ko) 2017-12-20
KR102528633B1 true KR102528633B1 (ko) 2023-05-03

Family

ID=57198397

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177030737A KR102528633B1 (ko) 2015-04-30 2016-04-21 워크 가공용 점착 테이프

Country Status (6)

Country Link
JP (1) JP6541775B2 (zh)
KR (1) KR102528633B1 (zh)
CN (1) CN108307635B (zh)
SG (1) SG11201708797YA (zh)
TW (1) TWI778939B (zh)
WO (1) WO2016175112A1 (zh)

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JP6618038B2 (ja) * 2016-06-29 2019-12-11 荒川化学工業株式会社 粘着剤組成物
KR102126046B1 (ko) * 2017-08-31 2020-06-24 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
KR20190078510A (ko) * 2017-12-26 2019-07-04 닛토덴코 가부시키가이샤 광학 부재용 표면 보호 시트
JP2019116609A (ja) * 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
WO2019130741A1 (ja) * 2017-12-26 2019-07-04 日東電工株式会社 光学部材用表面保護シート
KR102104714B1 (ko) * 2018-05-02 2020-04-24 (재)한국건설생활환경시험연구원 3ｄ 프린터 빌드 시트용 점착제 조성물
KR102210259B1 (ko) * 2018-07-11 2021-02-01 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7191586B2 (ja) * 2018-08-17 2022-12-19 株式会社ディスコ ウエーハの一体化方法
KR102306588B1 (ko) * 2018-10-02 2021-09-29 삼성에스디아이 주식회사 점착성 보호 필름 및 이를 포함하는 광학 부재
JP7241538B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7285072B2 (ja) * 2018-12-28 2023-06-01 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241537B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム
KR102581044B1 (ko) * 2019-01-25 2023-09-20 주식회사 엘지화학 표면 보호 필름 및 유기 발광 전자 장치 제조 방법
JP6769503B2 (ja) * 2019-02-22 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着剤、および粘着シートとその使用方法
CN113993663B (zh) * 2019-09-05 2024-05-31 株式会社力森诺科 背面研磨带
KR102565398B1 (ko) * 2019-12-17 2023-08-08 가부시끼가이샤 레조낙 반도체 가공용 테이프
GB2593754B (en) 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
JP6769574B1 (ja) * 2020-06-01 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着シート、粘着シート付き被着体、および粘着シートの使用方法
WO2024106390A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート
WO2024106387A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート
WO2024106386A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート

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JP2000212530A (ja) * 1998-11-20 2000-08-02 Lintec Corp 粘着シ―トおよびその使用方法
JP2005015544A (ja) * 2003-06-24 2005-01-20 Denki Kagaku Kogyo Kk 半導体ウエハ裏面研削用粘着シート
JP2014022476A (ja) * 2012-07-13 2014-02-03 Lintec Corp ダイシングシート

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JP5101111B2 (ja) * 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
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JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
JP4851613B2 (ja) * 2009-12-22 2012-01-11 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
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WO2012043550A1 (ja) * 2010-10-01 2012-04-05 昭和電工株式会社 光硬化性透明粘着シート用組成物
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JP2000212530A (ja) * 1998-11-20 2000-08-02 Lintec Corp 粘着シ―トおよびその使用方法
JP2005015544A (ja) * 2003-06-24 2005-01-20 Denki Kagaku Kogyo Kk 半導体ウエハ裏面研削用粘着シート
JP2014022476A (ja) * 2012-07-13 2014-02-03 Lintec Corp ダイシングシート

Also Published As

Publication number Publication date
CN108307635B (zh) 2021-04-02
JPWO2016175112A1 (ja) 2018-02-22
SG11201708797YA (en) 2017-11-29
WO2016175112A1 (ja) 2016-11-03
CN108307635A (zh) 2018-07-20
TWI778939B (zh) 2022-10-01
KR20170140221A (ko) 2017-12-20
JP6541775B2 (ja) 2019-07-10
TW201710428A (zh) 2017-03-16

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