WO2016175112A1 - ワーク加工用粘着テープ - Google Patents
ワーク加工用粘着テープ Download PDFInfo
- Publication number
- WO2016175112A1 WO2016175112A1 PCT/JP2016/062581 JP2016062581W WO2016175112A1 WO 2016175112 A1 WO2016175112 A1 WO 2016175112A1 JP 2016062581 W JP2016062581 W JP 2016062581W WO 2016175112 A1 WO2016175112 A1 WO 2016175112A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure
- sensitive adhesive
- meth
- adhesive tape
- acrylate
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 67
- 238000012545 processing Methods 0.000 title claims abstract description 42
- 150000001875 compounds Chemical class 0.000 claims abstract description 153
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 179
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 167
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 159
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 115
- 239000003431 cross linking reagent Substances 0.000 claims description 69
- -1 acrylic ester Chemical class 0.000 claims description 56
- 229920000642 polymer Polymers 0.000 claims description 56
- 239000000853 adhesive Substances 0.000 claims description 54
- 230000001070 adhesive effect Effects 0.000 claims description 54
- 239000000203 mixture Substances 0.000 claims description 49
- 239000000178 monomer Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 39
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 27
- 125000000524 functional group Chemical group 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 12
- 150000002148 esters Chemical class 0.000 claims description 9
- 150000005846 sugar alcohols Polymers 0.000 claims description 8
- 238000004132 cross linking Methods 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 abstract description 25
- 235000012431 wafers Nutrition 0.000 description 47
- 229920005862 polyol Polymers 0.000 description 42
- 239000000047 product Substances 0.000 description 39
- 239000011347 resin Substances 0.000 description 35
- 229920005989 resin Polymers 0.000 description 35
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 34
- 150000003077 polyols Chemical class 0.000 description 31
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 30
- 239000005056 polyisocyanate Substances 0.000 description 30
- 229920001228 polyisocyanate Polymers 0.000 description 30
- 239000011342 resin composition Substances 0.000 description 28
- 238000002156 mixing Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 description 16
- 239000005020 polyethylene terephthalate Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000004721 Polyphenylene oxide Substances 0.000 description 12
- 239000003999 initiator Substances 0.000 description 12
- 229920000570 polyether Polymers 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 11
- 125000002723 alicyclic group Chemical group 0.000 description 10
- 125000003396 thiol group Chemical group [H]S* 0.000 description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 8
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 8
- 229920000768 polyamine Polymers 0.000 description 8
- 239000004711 α-olefin Substances 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- 150000002009 diols Chemical class 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- 230000000379 polymerizing effect Effects 0.000 description 7
- 150000007519 polyprotic acids Polymers 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 238000006845 Michael addition reaction Methods 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 229920006243 acrylic copolymer Polymers 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 230000001588 bifunctional effect Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920005906 polyester polyol Polymers 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 235000013772 propylene glycol Nutrition 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- QEGNUYASOUJEHD-UHFFFAOYSA-N 1,1-dimethylcyclohexane Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- HBOSQVFEPQCBNL-UHFFFAOYSA-N 4-propyloctane-3,3-diol Chemical compound CCCCC(CCC)C(O)(O)CC HBOSQVFEPQCBNL-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- YPQKTLPPOXNDMC-UHFFFAOYSA-N isocyanic acid;methylcyclohexane Chemical compound N=C=O.CC1CCCCC1 YPQKTLPPOXNDMC-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229940105570 ornex Drugs 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- AYWSZYFQXSLSFY-UHFFFAOYSA-N 1,2-dihydrotriazine-5,6-dithione Chemical compound SC1=CN=NN=C1S AYWSZYFQXSLSFY-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HAZJTCQWIDBCCE-UHFFFAOYSA-N 1h-triazine-6-thione Chemical compound SC1=CC=NN=N1 HAZJTCQWIDBCCE-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- AUYRUAVCWOAHQN-UHFFFAOYSA-N 2,3,3-trimethylbut-1-ene Chemical compound CC(=C)C(C)(C)C AUYRUAVCWOAHQN-UHFFFAOYSA-N 0.000 description 1
- LHNAURKRXGPVDW-UHFFFAOYSA-N 2,3-diisocyanatobutane Chemical compound O=C=NC(C)C(C)N=C=O LHNAURKRXGPVDW-UHFFFAOYSA-N 0.000 description 1
- LIMAEKMEXJTSNI-UHFFFAOYSA-N 2,3-dimethylpent-1-ene Chemical compound CCC(C)C(C)=C LIMAEKMEXJTSNI-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- XALTWITXELVMHP-UHFFFAOYSA-N 2-(2-aminopropylamino)ethanol Chemical compound CC(N)CNCCO XALTWITXELVMHP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- IRUDSQHLKGNCGF-UHFFFAOYSA-N 2-methylhex-1-ene Chemical compound CCCCC(C)=C IRUDSQHLKGNCGF-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- TXBZITDWMURSEF-UHFFFAOYSA-N 3,3-dimethylpent-1-ene Chemical compound CCC(C)(C)C=C TXBZITDWMURSEF-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- RITONZMLZWYPHW-UHFFFAOYSA-N 3-methylhex-1-ene Chemical compound CCCC(C)C=C RITONZMLZWYPHW-UHFFFAOYSA-N 0.000 description 1
- PXIPZIPSDBXFQR-UHFFFAOYSA-N 4,5-dimethyloxolan-2-one Chemical compound CC1CC(=O)OC1C PXIPZIPSDBXFQR-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000412 dendrimer Substances 0.000 description 1
- 229920000736 dendritic polymer Polymers 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- HTXVEEVTGGCUNC-UHFFFAOYSA-N heptane-1,3-diol Chemical compound CCCCC(O)CCO HTXVEEVTGGCUNC-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- ZVEZMVFBMOOHAT-UHFFFAOYSA-N nonane-1-thiol Chemical compound CCCCCCCCCS ZVEZMVFBMOOHAT-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PRAARDGLAWZXML-UHFFFAOYSA-N o-propylhydroxylamine Chemical compound CCCON PRAARDGLAWZXML-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- FSUXYWPILZJGCC-UHFFFAOYSA-N pent-3-en-1-ol Chemical group CC=CCCO FSUXYWPILZJGCC-UHFFFAOYSA-N 0.000 description 1
- ZHZCYWWNFQUZOR-UHFFFAOYSA-N pent-4-en-2-ol Chemical group CC(O)CC=C ZHZCYWWNFQUZOR-UHFFFAOYSA-N 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical compound C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Chemical group 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 229950006800 prenderol Drugs 0.000 description 1
- UWHMFGKZAYHMDJ-UHFFFAOYSA-N propane-1,2,3-trithiol Chemical compound SCC(S)CS UWHMFGKZAYHMDJ-UHFFFAOYSA-N 0.000 description 1
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- CDMIYIVDILNBIJ-UHFFFAOYSA-N triazinane-4,5,6-trithione Chemical compound SC1=NN=NC(S)=C1S CDMIYIVDILNBIJ-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to a workpiece processing adhesive tape, and more particularly to a semiconductor wafer surface protecting adhesive tape used for protecting the surface of a bumped semiconductor wafer.
- a sheet including a resin layer in which the storage elastic modulus at 25 ° C. and 60 ° C. is adjusted to be in a specific range is known (for example, see Patent Document 1).
- This surface protective sheet is formed by attaching a resin layer having a drop in storage elastic modulus at room temperature (25 ° C.) and storage elastic modulus at high temperature (60 ° C.) to attach it to a wafer surface having an uneven portion at high temperature.
- the resin layer is softened, the unevenness of the wafer surface is absorbed, and the height difference of the wafer surface is reduced.
- the side resin layer is formed of a thermoplastic elastomer such as a polystyrene-based elastomer, a polyolefin-based elastomer, a polyurethane-based elastomer, and a polyester-based elastomer (see Patent Document 2).
- an adhesive tape in which an intermediate layer and an adhesive layer are provided on one surface of a substrate is also known.
- this pressure-sensitive adhesive tape it is known that the storage elastic modulus at 25 ° C. of the intermediate layer is set to about 30 to 1000 kPa and the pressure-sensitive adhesive layer is formed of an energy ray curable pressure-sensitive adhesive in order to increase unevenness absorbability.
- Patent Document 3 When an energy ray curable pressure sensitive adhesive is used for the surface protection sheet as in Patent Document 3, it becomes easy to improve the sticking property to the semiconductor wafer and the peelability.
- the energy ray-curable pressure-sensitive adhesive used in the surface protective sheet is mainly used in the acrylic type because the adhesiveness is easily adjusted and the embedding property of the bumps is easily secured.
- the present invention has been made in view of the above circumstances, and an object of the present invention is to a surface shape of a work represented by adhesion to a work such as a semiconductor wafer, releasability, and embedding of bumps. It is to provide a work processing pressure-sensitive adhesive tape with less adhesive residue on the surface of the work, even if the work to be applied has a non-flat surface shape while improving the followability of the pressure-sensitive adhesive layer.
- the present invention provides the following adhesive tapes for processing workpieces (1) to (16).
- An adhesive tape for work processing comprising (B).
- the energy ray curable compound (B) is at least one selected from a (meth) acrylate monomer (B1) and a urethane (meth) acrylate (B2). Adhesive tape.
- the energy ray curable compound (B) contains at least a (meth) acrylate monomer (B1), and the (meth) acrylate monomer (B1) is a polyhydric alcohol and a complete (meth) acrylic acid.
- the pressure-sensitive adhesive tape for workpiece processing according to the above (2) which is a polyfunctional (meth) acrylic acid ester which is an ester.
- the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing at least a urethane polymer (A ′), the energy ray-curable compound (B), and a crosslinking agent (C). 6.
- the crosslinking agent (C) includes a crosslinking agent (C1) containing a photopolymerizable unsaturated bond.
- the pressure-sensitive adhesive composition further comprises a compound (D) having a photopolymerizable unsaturated bond and a reactive functional group capable of reacting with the crosslinking agent (C).
- the adhesive tape for workpiece processing according to any one of the above.
- the pressure-sensitive adhesive layer has a breaking stress after irradiation with energy rays of 2.5 MPa or more.
- weight average molecular weight (Mw) is a value in terms of polystyrene measured by gel permeation chromatography (GPC), and specifically measured based on the method described in the examples. Value.
- GPC gel permeation chromatography
- (meth) acrylate is used as a word indicating both “acrylate” and “methacrylate”, and the same applies to other similar terms.
- the pressure-sensitive adhesive tape for workpiece processing of the present invention (hereinafter also simply referred to as “pressure-sensitive adhesive tape”) includes a base material and a pressure-sensitive adhesive layer provided on one surface side of the base material. Moreover, the adhesive tape may have an intermediate
- the adhesive tape may be composed of two or three layers as described above, and may be further provided with other layers. For example, a release material may be further provided on the pressure-sensitive adhesive layer.
- each member which comprises an adhesive tape is demonstrated in detail.
- the base material used for an adhesive tape is not specifically limited, It is preferable that it is a resin film. Resin films are preferable because they are less likely to generate dust than paper and non-woven fabrics, are suitable for processed parts of electronic parts, and are easily available.
- the substrate may be a single layer film made of one resin film or a multilayer film in which a plurality of resin films are laminated.
- the resin film used as the base material include polyolefin film, vinyl halide polymer film, acrylic resin film, rubber film, cellulose film, polyester film, polycarbonate film, polystyrene film, and polyphenylene sulfide. Examples thereof include a system film and a cycloolefin polymer film.
- a polyester film is preferable, and among the polyester films, From the viewpoint of easy availability and high thickness accuracy, a polyethylene terephthalate film is preferred.
- the thickness of the substrate is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 25 to 150 ⁇ m.
- stacked the easily bonding layer or the adhesive layer further on the surface of the resin film may contain a filler, a colorant, an antistatic agent, an antioxidant, an organic lubricant, a catalyst and the like as long as the effects of the present invention are not impaired.
- the substrate may be transparent or may be colored as desired, but is preferably one that transmits energy rays to a degree sufficient to cure the pressure-sensitive adhesive layer.
- an intermediate layer may be provided on one surface of the substrate.
- the pressure-sensitive adhesive tape of the present invention has an intermediate layer, so that the bumps are provided in the pressure-sensitive adhesive layer and the intermediate layer even when the bumps are provided on the work and the unevenness of the surface of the work is large. Thereby, it becomes easy to keep the surface on the opposite side to the surface affixed to the workpiece
- the intermediate layer used in the present invention preferably has a loss tangent (tan ⁇ ) (hereinafter also simply referred to as “loss tangent”) at 50 ° C. measured at a frequency of 1 Hz of 1.0 or more.
- the loss tangent of the intermediate layer is such a value, when the work processing pressure-sensitive adhesive tape is attached to an uneven work such as a wafer with bumps, the intermediate layer is sufficiently deformed and can easily follow the unevenness.
- the loss tangent of the intermediate layer is more preferably 1.5 or more, and still more preferably 1. 65 or more, more preferably 1.8 or more.
- the loss tangent of the intermediate layer is preferably 5.0 or less, more preferably 4.0 or less.
- the above-mentioned loss tangent of the intermediate layer is more specifically a value measured based on the method described in Examples described later.
- the thickness of the intermediate layer can be appropriately adjusted according to the state of the adherend surface to which the adhesive tape is affixed, but it is preferable from the viewpoint of being able to absorb relatively high bumps. Is 10 to 600 ⁇ m, more preferably 25 to 550 ⁇ m, still more preferably 35 to 500 ⁇ m.
- middle layer is formed from the resin composition for intermediate
- middle layers contains urethane (meth) acrylate.
- Urethane (meth) acrylate (X) Urethane (meth) acrylate (X) is a compound having at least a (meth) acryloyl group and a urethane bond, and has a property of being polymerized by irradiation with energy rays.
- an energy ray has an energy quantum in electromagnetic waves or a charged particle beam, and points out active light, such as an ultraviolet-ray, or an electron beam.
- the number of (meth) acryloyl groups in the urethane (meth) acrylate (X) may be monofunctional, bifunctional, or trifunctional or higher, but in order to make the loss tangent 1.0 or higher, the resin composition for the intermediate layer Preferably contains a monofunctional urethane (meth) acrylate. This is because the monofunctional urethane (meth) acrylate does not participate in the formation of the three-dimensional network structure in the polymerization structure, and therefore, the three-dimensional network structure is hardly formed in the intermediate layer, and the loss tangent is easily increased.
- urethane (meth) acrylate (X) used for the resin composition for intermediate layers for example, a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound and a polyisocyanate compound has a (meth) acryloyl group. It can be obtained by reacting a compound.
- Urethane (meth) acrylate (X) may be used alone or in combination of two or more.
- the polyol compound is not particularly limited as long as it is a compound having two or more hydroxy groups.
- Specific examples of the polyol compound include alkylene diol, polyether type polyol, polyester type polyol, and polycarbonate type polyol. Among these, polyether type polyols are preferable.
- the polyol compound may be a bifunctional diol, a trifunctional triol, or a tetrafunctional or higher polyol, but from the viewpoint of availability, versatility, reactivity, etc., a bifunctional diol Are preferred, and polyether type diols are more preferred.
- the polyether type diol is preferably a compound represented by the following formula (1).
- R is a divalent hydrocarbon group, preferably an alkylene group, more preferably an alkylene group having 1 to 6 carbon atoms.
- alkylene groups having 1 to 6 carbon atoms an ethylene group, a propylene group, and a tetramethylene group are preferable, and a propylene group and a tetramethylene group are more preferable.
- N is the number of repeating units of alkylene oxide, preferably 10 to 250, more preferably 25 to 205, and still more preferably 40 to 185.
- n is the said range, it will become easy to prepare an intermediate
- polyethylene glycol, polypropylene glycol, and polytetramethylene glycol are preferable, and polypropylene glycol and polytetramethylene glycol are more preferable.
- a terminal isocyanate urethane prepolymer having an ether bond [-(-RO-) n-] introduced therein is produced.
- the urethane (meth) acrylate contains a structural unit derived from the polyether type diol.
- the polyester type polyol is obtained by polycondensation of a polyol component and a polybasic acid component.
- the polyol component include ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, pentanediol, 3-methyl-1,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, hexanediol, octanediol, 2,2-diethyl-1,3-propanediol, 2-ethyl-2 -Known various glycols such as butyl-1,3-propanediol, 1,4-cyclohexanedimethanol, ethylene glycol or propylene glycol adduct of bisphenol A, and the like.
- polybasic acid component used for the production of the polyester type polyol a compound generally known as a polybasic acid component of polyester can be used.
- the polybasic acid component include dibasic acids such as adipic acid, maleic acid, succinic acid, oxalic acid, fumaric acid, malonic acid, glutaric acid, pimelic acid, azelaic acid, sebacic acid, and suberic acid; Dibasic acids such as phthalic acid, isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, aromatic polybasic acids such as polybasic acids such as trimellitic acid and pyromellitic acid, anhydrides corresponding to these, The derivative
- the polyester-type polyol is not particularly limited, and examples thereof include a reaction product of the above-described glycols and alkylene carbonate.
- the number average molecular weight calculated from the hydroxyl value of the polyol compound is preferably 1,000 to 10,000, more preferably 2,000 to 9,000, and still more preferably 3,000 to 7,000. If the number average molecular weight is 1,000 or more, a situation in which it becomes difficult to control the viscoelastic properties of the intermediate layer due to the generation of an excessive amount of urethane bonds is preferable. On the other hand, if the number average molecular weight is 10,000 or less, it is preferable because the obtained intermediate layer can be prevented from being excessively softened.
- the number average molecular weight calculated from the hydroxyl value of the polyol compound is a value calculated from [number of polyol functional groups] ⁇ 56.11 ⁇ 1000 / [hydroxyl value (unit: mgKOH / g)].
- polyisocyanate compound examples include aliphatic polyisocyanates such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate; isophorone diisocyanate, norbornane diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4 ′.
- -Cycloaliphatic diisocyanates such as diisocyanate, ⁇ , ⁇ '-diisocyanate dimethylcyclohexane; 4,4'-diphenylmethane diisocyanate, tolylene diisocyanate, xylylene diisocyanate, tolidine diisocyanate, tetramethylene xylylene diisocyanate, naphthalene-1,5- And aromatic diisocyanates such as diisocyanate.
- isophorone diisocyanate, hexamethylene diisocyanate, and xylylene diisocyanate are preferable from the viewpoint of handleability.
- Examples of the compound having a (meth) acryloyl group include a (meth) acrylate having a hydroxy group.
- the (meth) acrylate having a hydroxy group is not particularly limited as long as it is a compound having a hydroxy group and a (meth) acryloyl group in at least one molecule.
- Specific examples of the (meth) acrylate having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 4-hydroxycyclohexyl (meth).
- the weight average molecular weight of the urethane (meth) acrylate (X) for the intermediate layer resin composition thus obtained is preferably 1,000 to 100,000, more preferably 3,000 to 80,000, Preferably, it is 5,000 to 65,000. If the weight average molecular weight is 1,000 or more, in the polymer of urethane (meth) acrylate and a polymerizable monomer described later, due to the intermolecular force between the structures derived from urethane (meth) acrylate, This is preferable because moderate hardness is imparted to the intermediate layer.
- the blending amount of urethane (meth) acrylate (X) in the resin composition for an intermediate layer is preferably 20 to 70% by mass, more preferably 25 to 60% by mass, and further preferably 30 to 50% based on the total amount of the composition.
- the mass is more preferably 33 to 47% by mass. If the blending amount of urethane (meth) acrylate is within such a range, an intermediate layer having a high loss tangent can be easily formed.
- the intermediate layer resin composition further contains, for example, a thiol group-containing compound (Y) or a polymerizable monomer (Z). It is preferable to do.
- a thiol group-containing compound (Y) is not particularly limited as long as it is a compound having at least one thiol group in the molecule, but from the viewpoint of easily increasing the loss tangent, a polyfunctional thiol group-containing compound is preferable. A tetrafunctional thiol group-containing compound is more preferred.
- thiol group-containing compound (Y) examples include nonyl mercaptan, 1-dodecanethiol, 1,2-ethanedithiol, 1,3-propanedithiol, triazinethiol, triazinedithiol, triazinetrithiol, 1,2 , 3-propanetrithiol, tetraethylene glycol-bis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakisthio Glucolate, dipentaerythritol hexakis (3-mercaptopropionate), tris [(3-mercaptopropionyloxy) -ethyl] -isocyanurate, 1,4-bis (3-mercaptobutyryloxy) Butane, pentaerythri
- the molecular weight of the thiol group-containing compound (Y) is preferably 200 to 3,000, more preferably 300 to 2,000. If the said molecular weight is the said range, compatibility with urethane (meth) acrylate (X) will become favorable and film forming property can be made favorable.
- the amount of the thiol group-containing compound (Y) is preferably 1.0 to 4.9 masses per 100 mass parts in total of the urethane (meth) acrylate (X) and the polymerizable monomer (Z) described later. Parts, more preferably 1.5 to 4.8 parts by mass. When the blending amount is 1.0 part by mass or more, an intermediate layer having a high loss tangent can be easily formed, and the pump absorbability can be improved. On the other hand, if the said compounding quantity is 4.9 mass parts or less, the seepage of the intermediate
- the resin composition for intermediate layers used in the present invention further contains a polymerizable monomer (Z) from the viewpoint of improving the film forming property.
- the polymerizable monomer (Z) is a polymerizable compound other than the urethane (meth) acrylate (X), and is a compound that can be polymerized with other components by irradiation with energy rays.
- the polymerizable monomer (Z) means one excluding the resin component.
- the polymerizable monomer (Z) is preferably a compound having at least one (meth) acryloyl group.
- the “resin component” refers to an oligomer or high molecular weight body having a repeating structure in the structure, and refers to a compound having a weight average molecular weight of 1,000 or more.
- Examples of the polymerizable monomer (Z) include an alkyl (meth) acrylate having an alkyl group having 1 to 30 carbon atoms, a (meth) acrylate having a functional group such as a hydroxyl group, an amide group, an amino group, and an epoxy group, (Meth) acrylate having alicyclic structure, (meth) acrylate having aromatic structure, (meth) acrylate having heterocyclic structure, styrene, hydroxyethyl vinyl ether, hydroxybutyl vinyl ether, N-vinylformamide, N-vinyl Examples include vinyl compounds such as pyrrolidone, N-vinylcaprolactam, and allyl glycidyl ether.
- alkyl (meth) acrylate having an alkyl group having 1 to 30 carbon atoms examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl ( (Meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-pentyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, Nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth)
- Examples of the (meth) acrylate having a functional group include hydroxyl group-containing (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate; (meth) acrylamide, N, N -Dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, etc.
- hydroxyl group-containing (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate
- Amide group-containing compounds primary amino group-containing (meth) acrylates, secondary amino group-containing (meth) acrylates, tertiary amino group-containing (meth) acrylates and other amino group-containing (meth) acrylates; glycidyl ( Meta) Acrylate, and epoxy groups such as methyl glycidyl (meth) acrylate (meth) acrylate.
- Examples of the (meth) acrylate having an alicyclic structure include isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, and cyclohexyl (meth) ) Acrylate, adamantane (meth) acrylate and the like.
- Examples of the (meth) acrylate having an aromatic structure include phenylhydroxypropyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, and the like.
- Examples of the (meth) acrylate having a heterocyclic structure include tetrahydrofurfuryl (meth) acrylate and morpholine (meth) acrylate.
- the polymerizable monomer preferably includes a (meth) acrylate having a functional group and a (meth) acrylate having an alicyclic structure. More preferably, it includes (meth) acrylate and isobornyl (meth) acrylate.
- the blending amount of the (meth) acrylate having an alicyclic structure in the intermediate layer resin composition is preferably 32 to 53% by mass, more preferably 35 to 51% by mass, based on the total amount of the composition. More preferably, it is 37 to 48% by mass, and still more preferably 40 to 47% by mass. Further, the blending amount of the (meth) acrylate having an alicyclic structure with respect to the total amount of the polymerizable monomer (Z) contained in the intermediate layer resin composition is preferably 52 to 87% by mass from the above viewpoint. More preferably, it is 55 to 85% by mass, still more preferably 60 to 80% by mass, and still more preferably 65 to 77% by mass. When the blending amount of the (meth) acrylate having an alicyclic structure is in such a range, the loss tangent is easily set to 1.0 or more.
- the blending amount of the polymerizable monomer (Z) in the intermediate layer resin composition is preferably 30 to 80% by mass, more preferably 40 to 75% by mass, still more preferably 50 to 70% by mass, and more. More preferably, it is 53 to 67% by mass. If the blending amount of the polymerizable monomer (Z) is within such a range, the intermediate layer is flexible because the portion formed by polymerization of the polymerizable monomer (Z) in the intermediate layer has high mobility. It becomes easier to form an intermediate layer whose loss tangent satisfies the above requirements.
- the mass ratio of urethane (meth) acrylate (X) and polymerizable monomer (Z) in the intermediate layer resin composition [urethane (meth) acrylate / polymerizable monomer] is The ratio is preferably 20/80 to 60/40, more preferably 30/70 to 50/50, and still more preferably 35/65 to 45/55.
- middle layers contains an energy beam polymerization initiator (R) further.
- the intermediate layer resin composition can be easily cured by energy rays such as ultraviolet rays. Since the energy ray polymerization initiator (R) is generally also referred to as “photopolymerization initiator”, in the present specification, it is also simply referred to as “photopolymerization initiator”.
- photopolymerization initiator examples include photopolymerization initiators such as benzoin compounds, acetophenone compounds, acylphosphinoxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones. More specifically, for example, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, 2 , 2-dimethoxy-1,2-diphenylethane-1-one and the like.
- photopolymerization initiators such as benzoin compounds, acetophenone compounds, acylphosphinoxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds
- photosensitizers such as amines and quinones. More specifically, for example,
- photopolymerization initiators may be used alone or in combination of two or more.
- the blending amount of the photopolymerization initiator is preferably 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the urethane (meth) acrylate and the polymerizable monomer. More preferably, it is 0.3 to 5 parts by mass.
- the resin composition for intermediate layers may contain other additives as long as the effects of the present invention are not impaired.
- additives include cross-linking agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, pigments, and dyes.
- the amount of other additives is preferably 0.01 to 6 parts by mass, more preferably 100 parts by mass in total of urethane (meth) acrylate and polymerizable monomer. Is 0.1 to 3 parts by mass.
- middle layers may contain resin components other than urethane (meth) acrylate, but urethane as a resin component It is preferable to contain only (meth) acrylate.
- the content of the resin component other than the urethane (meth) acrylate contained in the intermediate layer resin composition is preferably 5% by mass or less, more preferably 1% by mass or less, and still more preferably 0.1% by mass or less. More preferably, it is 0 mass%.
- the intermediate layer may be formed of an intermediate layer resin composition containing other resin components instead of urethane (meth) acrylate (X).
- the intermediate layer may be formed using a curable composition containing a non-reactive urethane polymer or oligomer and a polymerizable monomer, or a composition containing an ethylene- ⁇ -olefin copolymer.
- a curable composition may contain the energy beam polymerization initiator mentioned above.
- the ethylene- ⁇ -olefin copolymer is obtained by polymerizing ethylene and an ⁇ -olefin monomer.
- ⁇ -olefin monomers include propylene, 1-butene, 2-methyl-1-butene, 2-methyl-1-pentene, 1-hexene, 2,2-dimethyl-1-butene, and 2-methyl-1-hexene.
- ⁇ -olefin monomers can be used alone or in combination of two or more.
- the ethylene- ⁇ -olefin copolymer may be one obtained by polymerizing ethylene, an ⁇ -olefin monomer, and another monomer.
- Examples of other monomer components include vinyl compounds such as vinyl acetate, styrene, acrylonitrile, methacrylonitrile, and vinyl ketone; unsaturated carboxylic acids such as acrylic acid and methacrylic acid; methyl acrylate, ethyl acrylate, acrylic acid-n -Unsaturated carboxylic acid esters such as propyl, methyl methacrylate, ethyl methacrylate, methacrylic acid-n-propyl; unsaturated carboxylic acid amides such as acrylamide and methacrylamide. These monomers can be used alone or in combination of two or more.
- An adhesive layer is provided on a base material, and when an intermediate layer is provided, it is provided on the intermediate layer.
- the pressure-sensitive adhesive layer of the present invention contains at least a urethane resin (A) and an energy ray-curable compound (B) that is non-reactive with the urethane resin (A) and has a molecular weight of 35,000 or less.
- the pressure-sensitive adhesive layer contains the urethane-based resin (A)
- the cohesive force and mechanical strength of the pressure-sensitive adhesive layer are increased. It is difficult for adhesive residue to occur on the workpiece surface.
- an adhesive layer will have energy-beam sclerosis
- work becomes favorable. Furthermore, since the energy ray curable compound (B) is non-reactive, as will be described later, the storage elastic modulus of the pressure-sensitive adhesive layer becomes low, and it becomes easy to ensure followability to the unevenness of the work surface.
- the pressure-sensitive adhesive layer preferably has a breaking stress after irradiation with energy rays of 2.5 MPa or more.
- the breaking stress is 2.5 MPa or more, the mechanical strength becomes a sufficient value, and it becomes easy to reduce the above adhesive residue.
- the breaking stress is preferably 2.8 to 30 MPa, more preferably 3.0 to 25 MPa from the viewpoint of easily improving the embedding property of the protrusion, the adhesiveness of the pressure-sensitive adhesive layer, and the peelability while suppressing adhesive residue. is there.
- the breaking stress is measured by the method described in Examples described later.
- the breaking stress can be adjusted by changing the type of the urethane resin (A). It can also be adjusted by the amount of the photopolymerizable unsaturated bond described later.
- Increasing the amount of the photopolymerizable unsaturated bond contained in the pressure-sensitive adhesive layer increases the breaking stress, and decreasing it decreases the breaking stress. There is a tendency. Similarly, it can also be adjusted by the amount of the cross-linking agent component described later. When the amount of the cross-linking agent component is increased, the breaking stress tends to increase, and when it is decreased, the breaking stress tends to decrease.
- the pressure-sensitive adhesive layer is energy ray curable, it can be made relatively soft before energy beam irradiation, and the pressure-sensitive adhesive layer can easily follow the unevenness formed on the workpiece surface.
- the adhesive tape is cured by being irradiated with an energy ray, so that the adhesive force is reduced and the adhesive tape is easily peeled off from the workpiece.
- the adhesive strength of the adhesive tape after irradiation with energy rays is preferably 2000 mN / 25 mm or less.
- the adhesive tape of the present invention having an intermediate layer is applied to a workpiece having bumps or other large protrusions (for example, a height of 200 ⁇ m or more) on the surface, the adhesive tape in which the protrusions are usually attached to the surface of the workpiece. This is a state absorbed by the intermediate layer. For this reason, when the adhesive tape is peeled from the adhesive tape, adhesive residue is likely to be generated. However, by setting the adhesive force to 2000 mN / 25 mm or less, it becomes easy to prevent such adhesive residue from occurring.
- the adhesive strength of the adhesive tape after irradiation with energy rays is preferably 50 to 1750 mN / 25 mm, more preferably 100 to 1500 nN / 25 mm.
- the adhesive strength of the adhesive tape before irradiation with energy rays is, for example, greater than 2000 mN / 25 mm, preferably 3000 to 30000 mN / 25 mm, more preferably 3500 to 9000 mN / m.
- the adhesive strength of the adhesive tape is measured when the adhesive layer surface of the adhesive tape is affixed to a silicon mirror wafer and peeled at a peeling angle of 180 ° and a peeling speed of 300 mm / min in an environment of 23 ° C.
- the adhesive force can be adjusted by changing the type of the urethane-based resin (A) or the energy beam curable compound (B).
- the adhesive strength after irradiation with energy rays can be adjusted by the amount of photopolymerizable unsaturated bonds described later, and decreases when the amount of photopolymerizable unsaturated bonds contained in the adhesive composition is increased. When it is less, it tends to be higher. Furthermore, it becomes easy to make the adhesive force after energy ray irradiation low also by mix
- the urethane resin (A) is a polymer containing at least one of a urethane bond and a urea bond.
- the pressure-sensitive adhesive layer of the present invention is composed of a urethane-based pressure-sensitive adhesive composition (hereinafter also simply referred to as “pressure-sensitive adhesive composition”) containing at least a urethane polymer (A ′) and an energy ray-curable compound (B).
- the urethane-based resin (A) is formed from at least a urethane polymer (A ′) as a main agent.
- a crosslinking agent (C), a compound (D), etc. are further contained in a urethane type adhesive composition as needed.
- the urethane resin (A) may be crosslinked with a crosslinking agent (C). Further, as described above, the urethane-based pressure-sensitive adhesive composition is bonded directly or indirectly to the urethane polymer (A ′), such as the compound (D), in addition to the crosslinking agent (C).
- the layer may contain a compound constituting the urethane resin (A) as a unit.
- a crosslinking agent (C) and a compound (D) it couple
- the blending amount of the urethane polymer (A ′) is the total amount of the pressure-sensitive adhesive composition in order to blend components (B) to (E) described later in appropriate amounts while ensuring the tackiness of the pressure-sensitive adhesive layer. Is preferably 30 to 85% by mass, more preferably 35 to 80% by mass, and still more preferably 37 to 77% by mass.
- the total amount of the main component reactive compound and the urethane polymer (A ′) is preferably 40 to 95% by mass, more preferably 45 to 94% by mass, and further preferably 50 to 50% by mass with respect to the total amount of the pressure-sensitive adhesive composition. 93% by mass.
- the urethane resin (A) preferably has a photopolymerizable unsaturated bond.
- both the urethane resin (A) and the energy ray curable compound (B) are light in the pressure-sensitive adhesive layer of the work processing pressure-sensitive adhesive tape. It will have a polymerizable unsaturated bond. Therefore, by irradiating the adhesive layer with energy rays, a bond is formed between the urethane resin (A) and the energy ray curable compound (B) by the polymerization reaction, and adhesion of the adhesive tape after energy ray irradiation is achieved.
- the method for introducing a photopolymerizable unsaturated bond into the urethane resin (A) is not particularly limited.
- the urethane polymer (A ′) before introduction of the photopolymerizable unsaturated bond has a hydroxyl group
- a functional group capable of reacting with the hydroxyl group and a function containing a photopolymerizable unsaturated bond such as a (meth) acryloyl group. It is possible to introduce a photopolymerizable unsaturated bond by reacting a compound having a group with the hydroxyl group.
- Examples of the compound having a functional group capable of reacting with a hydroxyl group and a functional group containing a photopolymerizable unsaturated bond include methacryloyloxyethyl isocyanate. Such a compound may be reacted in advance with the urethane polymer (A ′), or may be contained in the pressure-sensitive adhesive layer and reacted with the urethane polymer (A ′) at the time of forming the pressure-sensitive adhesive layer. . Further, as will be described later, the urethane resin (A) is crosslinked with the urethane polymer (A ′) by using the crosslinking agent (C1) having a photopolymerizable unsaturated bond as the crosslinking agent (C). A polymerizable unsaturated bond may be introduced. Furthermore, you may introduce
- urethane polymer (A ′) examples include those containing at least one of a urethane bond and a urea bond, and specific examples include a polyurethane polyol having a hydroxyl group at the terminal obtained by reacting a polyol and a polyisocyanate compound. . Further, the urethane polymer (A ′) may be obtained by reacting a polyol and a polyisocyanate compound, and a urethane polymer having a terminal isocyanate may be used.
- polyester polyols and polyether polyols examples include polyester polyols and polyether polyols.
- a known polyester polyol is used as the polyester polyol.
- Polyester polyol is an ester of an acid component and at least one of a glycol component and a polyol component.
- the acid component include terephthalic acid, adipic acid, azelaic acid, sebacic acid, phthalic anhydride, isophthalic acid, trimellitic acid, and the like. Can be mentioned.
- glycol components ethylene glycol, propylene glycol, diethylene glycol, butylene glycol, 1,6-hexane glycol, 3-methyl-1,5-pentanediol, 3,3′-dimethylol heptane, polyoxyethylene glycol, polyoxy
- examples include propylene glycol, 1,4-butanediol, neopentyl glycol, and butylethylpentanediol.
- the polyol component include glycerin, trimethylolpropane, and pentaerythritol.
- polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone, poly ( ⁇ -methyl- ⁇ -valerolactone), and polyvalerolactone may be used.
- polyether polyol obtained by polymerizing oxirane compounds such as ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran using low molecular weight polyols such as water, propylene glycol, ethylene glycol, glycerin and trimethylolpropane as initiators Specifically, those having 2 or more functional groups such as polypropylene glycol, polyethylene glycol, and polytetramethylene glycol are used.
- polyisocyanate compound examples include known aromatic polyisocyanates, aliphatic polyisocyanates, araliphatic polyisocyanates, and alicyclic polyisocyanates.
- Aromatic polyisocyanates include 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate Isocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "- And triphenylmethane triisocyanate.
- Aliphatic polyisocyanates include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4 , 4-trimethylhexamethylene diisocyanate and the like.
- Examples of the araliphatic polyisocyanate include ⁇ , ⁇ ′-diisocyanate-1,3-dimethylbenzene, ⁇ , ⁇ ′-diisocyanate-1,4-dimethylbenzene, ⁇ , ⁇ ′-diisocyanate-1,4-diethylbenzene, 1, Examples thereof include 4-tetramethylxylylene diisocyanate and 1,3-tetramethylxylylene diisocyanate.
- the alicyclic polyisocyanates include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4- And cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanate methyl) cyclohexane, 1,4-bis (isocyanate methyl) cyclohexane, and the like. .
- the polyisocyanate compound can be used in combination with a trimethylolpropane adduct of the polyisocyanate compound, a burette reacted with water, a trimer having an isocyanurate ring, or the like.
- a trimethylolpropane adduct of the polyisocyanate compound a burette reacted with water, a trimer having an isocyanurate ring, or the like.
- the polyisocyanate compound 4,4′-diphenylmethane diisocyanate, hexamethylene diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (isophorone diisocyanate) and the like are preferable.
- the polyurethane polyol may be obtained by further reacting a diamine such as ethylenediamine, N-aminoethylethanolamine, isophoronediamine, xylylenediamine in addition to the polyol and the polyfunctional isocyanate.
- a diamine such as ethylenediamine, N-aminoethylethanolamine, isophoronediamine, xylylenediamine
- ethylene glycol, 1,4-butanediol, neopentyl glycol, butylethylpentanediol, glycerin, trimethylolpropane, pentaerythritol and the like are used. Also good.
- reaction with a polyol and a polyisocyanate compound is normally performed in presence of catalysts, such as a tertiary amine type compound and an organometallic compound.
- the urethane polymer (A ′) is not limited to those described above, and may be, for example, a Michael addition type urethane polymer.
- Examples of the Michael addition type urethane polymer include the following (1) and (2).
- (1) A urethane prepolymer having an isocyanate group (—NCO) at the terminal obtained by reacting the polyol with a polyisocyanate compound is reacted with an amino compound obtained by Michael addition reaction of a polyamine and an unsaturated compound.
- What (2) A product obtained by reacting a polyamine in addition to the above polyol and polyisocyanate compound, and reacting a polyurethane urea having a primary or secondary amino group at the terminal with a Michael addition reaction of an unsaturated compound.
- polyamine used in the Michael addition type urethane polymer known ones can be used. Specifically, ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, Aliphatic polyamines such as ethylenetetramine, diethylenetriamine, triaminopropane, 2,2,4-trimethylhexamethylenediamine, tolylenediamine, hydrazine, piperazine, isophoronediamine, dicyclohexylmethane-4,4'-diamine, etc. Examples include polyamines and aromatic polyamines such as phenylenediamine and xylylenediamine.
- polyoxyalkylene glycol diamine represented by the following general formula (2) can also be used.
- n represents an arbitrary integer of 2 to 4
- m represents an arbitrary integer of 2 to 50.
- a dendrimer having a primary or secondary amino group at the terminal can also be used as a polyamine.
- isophorone diamine, 2,2,4-trimethylhexamethylene diamine, and hexamethylene diamine are preferable from the viewpoint of easy control of the reaction.
- the unsaturated compound used in the Michael addition type urethane polymer is used for the purpose of modifying the urethane polymer. Therefore, the type of unsaturated compound to be used can be arbitrarily selected according to the purpose of modification.
- unsaturated compounds include (meth) acrylic unsaturated compounds, amide unsaturated compounds, fatty acid vinyl unsaturated compounds, vinyl ether unsaturated compounds, ⁇ -olefin unsaturated compounds, allyl unsaturated compounds, acetic acid Examples include allylic unsaturated compounds, vinyl cyanide unsaturated compounds, styrene or vinylbenzene unsaturated compounds.
- the functional groups possessed by such unsaturated compounds include alkyl groups, polyalkylene glycol groups, alkoxy groups, phenoxy groups, hydroxyl groups, carboxyl groups, perfluoroalkyl groups, alkoxysilyl groups, epoxy groups, as well as amide groups and dialkyls.
- Nitrogen-containing groups such as amino groups and quaternary ammonium bases can be exemplified, but it is preferable to have a hydroxyl group so that the urethane polymer (A ′) contains a hydroxyl group as described above.
- the unsaturated compound those described in, for example, JP-A No. 2002-121256 (European Publication No. EP1146061A1) are used.
- the urethane polymer (A ′) used in the present invention preferably has a weight average molecular weight of 10,000 to 300,000, more preferably 30,000 to 150,000.
- a weight average molecular weight 10,000 to 300,000, more preferably 30,000 to 150,000.
- the energy ray-curable compound (B) used in the present invention is non-reactive with the urethane resin (A) and has a photopolymerizable unsaturated bond.
- non-reactive means that it contains not only the “photopolymerizable unsaturated bond” but also contains not only the urethane polymer (A ′) but also a functional group that reacts with the main compound reactive compound, and the compound (B) Is a compound which has not reacted with the urethane resin (A) in the pressure-sensitive adhesive layer.
- the energy ray curable compound (B) is obtained by reacting the urethane polymer (A ′), the crosslinking agent (C), and other components (for example, the component (D)) used as necessary. It is a compound that does not react with the components (A ′), (C), and (D) when the pressure-sensitive adhesive layer is formed.
- energy-beam curable compound (B) will exist as a component which does not comprise urethane type resin (A) in an adhesive layer.
- Urethane polymers generally have a high cohesive force and a high storage elastic modulus, so it is difficult to embed protrusions such as bumps on the surface of the work alone, but in the present invention, the energy ray curable compound (B) does not constitute a urethane polymer chain.
- the storage elastic modulus of the pressure-sensitive adhesive layer is lowered, and it becomes easy to ensure the embedding property to the bump.
- the photopolymerizable unsaturated bond means an unsaturated bond that reacts upon irradiation with energy rays, and is usually an ethylenic double bond, preferably a carbon-carbon contained in a (meth) acryloyl group. It is a double bond.
- the molecular weight of the energy ray curable compound (B) is 35,000 or less. When the molecular weight is larger than 35,000, it becomes difficult to lower the storage elastic modulus of the pressure-sensitive adhesive layer, and it becomes difficult to ensure the embedding property to the bump. Moreover, there exists a possibility that compatibility with a urethane type resin (A) may deteriorate.
- the molecular weight of the energy ray curable compound (B) is preferably 150 to 35,000, and more preferably 200 to 34,000.
- the molecular weight is the formula weight when the formula weight can be specified, and the weight average molecular weight when the formula weight cannot be specified.
- the compounding amount of the energy ray curable compound (B) varies depending on the compound used, but 100 parts by mass of the urethane resin (A) (that is, 100 parts by mass of the urethane polymer (A ′) and the main component reactive compound). In the following, the same is true): usually 1 to 120 parts by mass, preferably 2 to 100 parts by mass, more preferably 4 to 90 parts by mass.
- the energy ray curable compound (B) include compounds having a (meth) acryloyl group.
- the (meth) acryloyl group (photopolymerizable unsaturated bond) in one molecule of the energy ray curable compound (B) may be one or more functional groups, preferably two functional groups or more, and 2 to 12 functional groups. Is more preferable.
- at least 1 sort (s) selected from the (meth) acrylate monomer (B1) and urethane (meth) acrylate (B2) as a specific example of the energy-beam curable compound (B) used by this invention is mentioned. .
- the (meth) acrylate monomer (B1) is a compound having a (meth) acryloyl group in the molecule, and the number of the (meth) acryloyl group is preferably bifunctional or more, more preferably 3 to 6.
- a (meth) acryloyl group is used so that the adhesive strength of the adhesive tape can be easily reduced after energy ray irradiation to the adhesive layer.
- the pressure-sensitive adhesive layer contains a (meth) acrylate monomer (B1) having a number of 4 or more.
- Examples of the (meth) acrylate monomer (B1) include polyfunctional (meth) acrylic acid esters in which all the hydroxyl groups of the polyhydric alcohol are complete esters formed with (meth) acrylic acid and esters.
- the carbon number of the polyhydric alcohol is preferably 4 to 10.
- the (meth) acrylate monomer (B1) preferably has a molecular weight of 150 to 1000, more preferably 200 to 800.
- Specific compounds of the polyfunctional (meth) acrylic acid ester include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butylene glycol di ( Examples include meth) acrylate and 1,6-hexanediol di (meth) acrylate. Among these, pentaerythritol tetra (meth) acrylate is preferable.
- the structure of the (meth) acrylate monomer (B1) can be specified, and the molecular weight means a formula weight.
- the (meth) acrylate monomer (B1) is preferable because even with a small blending amount, adhesive residue can be prevented and the adhesive force can be appropriately reduced by energy ray curing.
- the blending amount of the (meth) acrylate monomer (B1) is specifically preferably 1 to 20 parts by weight, more preferably 2 to 15 parts by weight with respect to 100 parts by weight of the urethane resin (A). More preferably, it is 3 to 10 parts by mass.
- the energy ray-curable compound (B) can appropriately prevent adhesive residue from the pressure-sensitive adhesive layer and reduce the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer appropriately by irradiation with energy rays by setting the blending amount as described above. Is possible.
- Urethane (meth) acrylate (B2) is a polymer having a urethane bond and having a (meth) acryloyl group at the terminal.
- the urethane (meth) acrylate (B2) is obtained by reacting a polyol compound with a polyisocyanate compound to produce a terminal isocyanate urethane polymer and reacting a compound having a (meth) acryloyl group with the terminal functional group. Compound etc. are mentioned.
- Such urethane (meth) acrylate (B2) has energy ray curability by the action of the (meth) acryloyl group.
- the polyol compound, polyisocyanate compound, and compound having a (meth) acryloyl group used to obtain the urethane (meth) acrylate (B2) are added to the urethane (meth) acrylate (X) of the intermediate layer described above.
- the polyol compound, the polyisocyanate compound, and the compound having a (meth) acryloyl group that are used are appropriately selected and used, and a specific description thereof is omitted.
- the urethane (meth) acrylate (B2) has a (meth) acryloyl group, and the (meth) acryloyl group in one molecule is preferably bifunctional or more, more preferably 2 to 12, and even more preferably. 2 to 10 functional. Thus, it becomes easy to reduce adhesive force by energy ray hardening by setting it as polyfunctionality.
- the molecular weight of the urethane (meth) acrylate (B2) is 35000 or less, preferably 2000 to 35000, more preferably 5000 to 34000.
- the molecular weight of urethane (meth) acrylate (B2) means a weight average molecular weight.
- the molecular weight of the urethane (meth) acrylate in such a range, the storage elastic modulus of the pressure-sensitive adhesive layer is lowered, and it becomes easy to ensure followability to the unevenness of the workpiece surface. Moreover, the movement of the urethane (meth) acrylate (B2) in the pressure-sensitive adhesive layer is suppressed, and the stability over time of the pressure-sensitive adhesive tape is improved.
- the blending amount of the urethane (meth) acrylate (B2) is 30 to 120 with respect to 100 parts by mass of the urethane resin (A). Mass parts are preferred, 40 to 100 parts by mass are preferred, and 50 to 90 parts by mass are more preferred.
- the pressure-sensitive adhesive composition of the present invention preferably further contains a crosslinking agent (C).
- the crosslinking agent (C) reacts with the urethane polymer (A ′) to crosslink the urethane polymer (A ′).
- the pressure-sensitive adhesive composition has a high crosslink density and can easily form a pressure-sensitive adhesive layer having high mechanical strength. Moreover, it becomes easy to prevent the adhesive residue etc. at the time of peeling an adhesive tape.
- the crosslinking agent (C) is preferably a crosslinking agent having two or more isocyanate groups so that it can react with the hydroxyl group.
- the pressure-sensitive adhesive composition contains a crosslinking agent, it is usually crosslinked by being applied and then heated.
- the urethane polymer (A ′) may have an isocyanate group and the crosslinking agent (C) may have a hydroxyl group. Since the urethane polymer (A ′) generally has a hydroxyl group or an isocyanate group because of its production method, the urethane polymer (A ′) and the crosslinking agent (C) are thus bonded by a urethane bond. Bonding is preferred.
- crosslinking agent (C) usable in the present invention it is preferable to use a crosslinking agent (C1) containing a photopolymerizable unsaturated bond.
- the crosslinking agent (C1) containing a photopolymerizable unsaturated bond is preferably a compound having two or more isocyanate groups and a (meth) acryloyl group, and more preferably a urethane having at least two isocyanate groups.
- (Meth) acrylate is used.
- the urethane (meth) acrylate has a weight average molecular weight of preferably 500 to 2,000, more preferably 700 to 1,000.
- the photopolymerizable unsaturated bonds in the same molecule of the crosslinking agent (C1) are polymerized. It tends to be easy. Therefore, the reaction between the photopolymerizable unsaturated bond of the cross-linking agent (C1) and the photopolymerizable unsaturated bond of other molecules is unlikely to occur, and the adhesive force of the adhesive tape is reduced by the energy ray irradiation to the adhesive layer. May be less effective. Therefore, what has a preferable photopolymerizable unsaturated bond in 1 molecule as a crosslinking agent (C1) is preferable.
- Examples of the urethane (meth) acrylate used as the cross-linking agent (C1) include “EBECRYL 4150” manufactured by Daicel Ornex.
- the crosslinking agent (C1) having a photopolymerizable unsaturated bond by using the crosslinking agent (C1) having a photopolymerizable unsaturated bond, the urethane resin (A) has a photopolymerizable unsaturated bond in the pressure-sensitive adhesive layer.
- the crosslinking agent containing a hydroxyl group and a photopolymerizable unsaturated bond examples include an acrylic polymer having a hydroxyl group and a (meth) acryloyl group in the side chain.
- the urethane resin (A) crosslinked with the crosslinking agent (C1) is a so-called acrylic urethane resin, but the urethane resin (A) of the present invention includes such an acrylic urethane resin.
- the amount of the crosslinking agent (C1) containing a photopolymerizable unsaturated bond is preferably 5 to 60 parts by mass, more preferably 10 to 50 parts by mass with respect to 100 parts by mass of the urethane resin (A). More preferred is ⁇ 45 parts by mass.
- the pressure-sensitive adhesive composition may contain a crosslinking agent (C2) that does not contain a photopolymerizable unsaturated bond as the crosslinking agent (C).
- a crosslinking agent (C2) when the urethane polymer (A ′) has a hydroxyl group, it can be appropriately selected from the polyisocyanate compounds used for synthesizing the urethane polymer (A ′) listed above. It is.
- a known polyol can be used as the crosslinking agent (C2).
- the pressure-sensitive adhesive composition can sufficiently increase the cross-linking density of the pressure-sensitive adhesive layer by containing the cross-linking agent (C2).
- All of the crosslinking agents (C) may be crosslinking agents (C1) having a photopolymerizable unsaturated bond, or all may be crosslinking agents (C2) having no photopolymerizable unsaturated bond.
- the blending amount of the crosslinking agent (C2) containing no photopolymerizable unsaturated bond is preferably 0.2 to 15 parts by mass, and 0.5 to 10 parts by mass with respect to 100 parts by mass of the urethane resin (A). More preferred. Further, as described above, when used in combination with the crosslinking agent (C1), the blending amount of the crosslinking agent (C2) containing no photopolymerizable unsaturated bond may be relatively small, and the urethane resin (A ) It is preferably 0.2 to 5 parts by mass, more preferably 0.5 to 2 parts by mass with respect to 100 parts by mass.
- the pressure-sensitive adhesive composition may further contain a compound (D) having a photopolymerizable unsaturated bond and a reactive functional group capable of reacting with the crosslinking agent (C). preferable.
- the compound (D) having a reactive functional group reacts with the crosslinking agent (C) when the urethane polymer (A ′) reacts with the crosslinking agent (C) to form a urethane polymer chain.
- a photopolymerizable unsaturated bond is introduced into the urethane resin (A) by the compound (D).
- Examples of the reactive functional group contained in the compound (D) include an isocyanate group and a hydroxyl group.
- the (meth) acrylate monomer which has a hydroxyl group and a (meth) acryloyl group is mentioned.
- the number of (meth) acryloyl groups (that is, photopolymerizable unsaturated bonds) in one molecule of compound (D) is preferably 2 or more, more preferably 2 to 5 in one molecule.
- the (meth) acrylate monomer used as component (D) preferably has a molecular weight of 150 to 3,000, more preferably 200 to 2,000.
- Examples of the (meth) acrylate monomer used as the component (D) include polyhydric alcohols and polyfunctional (meth) acrylic acid esters that are partial esters of (meth) acrylic acid.
- the carbon number of the polyhydric alcohol is preferably 4 to 10.
- Specific examples of the compound include pentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, and dipentaerythritol penta (meth) acrylate.
- pentaerythritol tri (meth) acrylate is exemplified. Is preferred.
- the compounding amount of the compound (D) is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, and further preferably 3 to 15 parts by mass with respect to 100 parts by mass of the urethane resin (A). .
- blending a compound (D) in such a range without having a bad influence on the adhesive performance of an adhesive layer, it becomes easy to reduce adhesive force by hardening of an energy ray, and it becomes easy to prevent adhesive residue.
- a compound (D) is normally used when an energy-beam curable compound (B) contains a (meth) acrylate monomer (B1).
- the compound (D) and the (meth) acrylate monomer (B1) are used in combination, the effects of the present invention are more easily exhibited.
- the pressure-sensitive adhesive composition preferably further contains an energy ray polymerization initiator (E).
- the pressure-sensitive adhesive layer can be easily cured by irradiation with energy rays by containing the energy ray polymerization initiator (E).
- the energy ray polymerization initiator (E) can be appropriately selected from photopolymerization initiators that can be used in the resin compositions for intermediate layers listed above.
- the compounding amount of the energy ray polymerization initiator (E) is a urethane polymer (A ′) having a photopolymerizable unsaturated bond, a crosslinking agent (C1), an energy ray curable compound (B), and a compound (D).
- the total amount of the compounds having a photopolymerizable unsaturated bond such as 100 parts by mass is preferably 0.05 to 25 parts by mass, more preferably 0.1 to 20 parts by mass, still more preferably 0.3 to 15 parts by mass. Part.
- the pressure-sensitive adhesive composition may contain other additives conventionally used for urethane-based pressure-sensitive adhesives, such as fillers such as calcium carbonate and titanium oxide, colorants, antioxidants, antifoaming agents, It may contain a light stabilizer or the like.
- the thickness of the pressure-sensitive adhesive layer can be appropriately adjusted according to the surface state of the adherend surface to which the pressure-sensitive adhesive tape is applied, such as the bump height on the wafer surface, but is preferably 2 to 150 ⁇ m, more preferably 5 to The thickness is 100 ⁇ m, more preferably 8 to 50 ⁇ m.
- the release material provided on the pressure-sensitive adhesive layer and the release material used in the process of the production method described below are a release sheet that has been subjected to a single-sided release process, a release sheet that has been subjected to a double-sided release process, etc.
- coated the release agent on the base material of this are mentioned.
- the release material substrate include polyester film such as polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, and plastic film such as polyolefin resin film such as polypropylene resin and polyethylene resin.
- the release agent examples include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long chain alkyl resins, alkyd resins, and fluorine resins.
- the thickness of the release material is not particularly limited, but is preferably 5 to 200 ⁇ m, more preferably 10 to 120 ⁇ m.
- the production method of the pressure-sensitive adhesive tape of the present invention is not particularly limited, and can be produced by a known method.
- the intermediate layer may be formed, for example, by directly applying a solution of the resin composition for the intermediate layer on one surface of the substrate to form a coating film, and then drying and curing treatment as necessary. it can.
- the intermediate layer is formed on the release material by applying a solution of the resin composition for the intermediate layer to the release treatment surface of the release material to form a coating film, and then drying and semi-curing as necessary.
- a semi-cured layer may be formed, this semi-cured layer may be bonded to a substrate, and the semi-cured layer may be completely cured.
- the intermediate layer is preferably cured by polymerizing by irradiating the coating film with energy rays.
- the energy ray is preferably ultraviolet light.
- the pressure-sensitive adhesive layer is preferably formed by applying the pressure-sensitive adhesive composition, heating and cross-linking the pressure-sensitive adhesive composition, and drying as necessary. At this time, the pressure-sensitive adhesive composition may be applied directly to the intermediate layer or the base material, or may be applied to the release treatment surface of the release material to form a pressure-sensitive adhesive layer, and then the intermediate layer or the base material. You may form by sticking an adhesive layer together. The release material disposed on the pressure-sensitive adhesive layer may be peeled off as necessary.
- an organic solvent may be further added to the resin composition for the intermediate layer or the pressure-sensitive adhesive composition, so that the intermediate layer resin composition or the pressure-sensitive adhesive composition may be diluted.
- the organic solvent to be used include methyl ethyl ketone, acetone, ethyl acetate, tetrahydrofuran, dioxane, cyclohexane, n-hexane, toluene, xylene, n-propanol, isopropanol and the like.
- middle layers or an adhesive composition may be used as it is, and 1 or more types of other organic solvents other than that may be used. May be added.
- the intermediate layer resin composition or the pressure-sensitive adhesive composition can be applied by a known application method. Examples of the coating method include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating.
- the pressure-sensitive adhesive tape of the present invention is used when affixing to various workpieces and processing the workpiece, and is preferably affixed to a workpiece surface having irregularities and protrusions. Moreover, it is more preferable to affix to the semiconductor wafer surface, especially the wafer surface in which the bump was formed, and to use as a semiconductor wafer surface protection adhesive tape. Further, the adhesive tape is more preferably used as a bag grind tape that is attached to the surface of a semiconductor wafer and protects a circuit formed on the wafer surface during subsequent grinding of the wafer back surface.
- the temperature of the adhesive tape when the adhesive tape is applied to the surface of the semiconductor wafer is, for example, about 40 to 80 ° C., and preferably 50 to 70 ° C.
- the pressure-sensitive adhesive layer is energy-ray curable, and the pressure-sensitive adhesive tape attached to the work surface of a semiconductor wafer or the like is peeled off from the work surface after being irradiated with energy rays and cured with energy rays. is there. Therefore, since the adhesive tape is peeled after the adhesive force is lowered, the peelability is improved. Further, as described above, the adhesive tape after curing is less likely to have adhesive residue when peeled off.
- the adhesive tape is not limited to a back grind sheet when used for a semiconductor wafer, and can be used for other purposes.
- the adhesive tape may be attached to the back surface of the wafer and used as a dicing sheet that holds the wafer when the wafer is diced.
- the wafer may be a wafer in which protrusions such as bumps or irregularities are formed on the back surface of the wafer, such as a wafer in which through electrodes are formed.
- the measurement method and evaluation method in the present invention are as follows. [Weight average molecular weight (Mw), number average molecular weight (Mn)] Using a gel permeation chromatograph (product name “HLC-8220”, manufactured by Tosoh Corporation), measurement was performed under the following conditions, and values measured in terms of standard polystyrene were used. (Measurement condition) Column: “TSK guard column HXL-H” “TSK gel GMHXL ( ⁇ 2)” “TSK gel G2000HXL” (both manufactured by Tosoh Corporation) Column temperature: 40 ° C. Developing solvent: Tetrahydrofuran Flow rate: 1.0 mL / min
- a belt conveyor type ultraviolet irradiation device (product name “ECS-4011GX”) is used as an ultraviolet irradiation device, and a high-pressure mercury lamp (product name “Igraphics”, product name “ H04-L41 "), and the irradiation conditions are as follows: illuminance of 112 mW / cm 2 with a light wavelength of 365 nm, light amount of 177 mJ / cm 2 (measured with an ultraviolet light meter“ UVPF-A1 ”manufactured by I-Graphics) went.
- a polyethylene terephthalate film-based release film (product name “SP-PET 381031”, thickness 38 ⁇ m, manufactured by Lintec Co., Ltd.) is laminated, and further irradiated with ultraviolet rays (using the above-described ultraviolet irradiation device and ultraviolet source).
- ultraviolet rays using the above-described ultraviolet irradiation device and ultraviolet source.
- an illuminance of 271 mW / cm 2 and a light amount of 1,200 mJ / cm 2 were performed and cured completely to form an intermediate layer having a thickness of 200 ⁇ m with a release film attached to both sides.
- an intermediate layer laminate (thickness: 1,000 ⁇ m) was prepared by peeling the PET-based release film and aligning the release surfaces and sequentially laminating them.
- the obtained intermediate layer laminate was punched into a circle with a diameter of 10 mm to obtain a sample for measuring viscoelasticity.
- a viscoelasticity measuring device manufactured by TA Instruments Inc., product name “ARES”
- the above sample was strained at a frequency of 1 Hz and stored at ⁇ 50 to 150 ° C. at a heating rate of 4 ° C./min.
- the elastic modulus (G ′) was measured, and the loss tangent (tan ⁇ ) at 50 ° C. was obtained.
- a pressure-sensitive adhesive layer (thickness: 200 ⁇ m) having a polyethylene terephthalate release film (product name: “SP-PET381031” manufactured by Lintec Corporation) attached to both surfaces was prepared.
- the pressure-sensitive adhesive layer was formed on one release film by changing the thickness to 40 ⁇ m, and then the other release film was attached to the pressure-sensitive adhesive layer.
- Five pressure-sensitive adhesive layers sandwiched between such release films were prepared, and the surfaces of the pressure-sensitive adhesive layers exposed by peeling one release film were opposed to each other and laminated. By repeating this procedure, a pressure-sensitive adhesive layer having a thickness of 200 ⁇ m in which five pressure-sensitive adhesive layers were laminated was obtained.
- the laminate of the pressure-sensitive adhesive layer sandwiched between two release films was irradiated with ultraviolet rays at an illuminance of 220 mW / cm and an irradiation speed of 15 mm / sec using a UV irradiation apparatus “RAD-2000 m / 12” manufactured by Lintec Corporation. Then, the hardened
- UV light was irradiated from the adhesive tape side at an illumination intensity of 220 mW / cm and an irradiation speed of 15 mm / sec with a UV irradiation apparatus “RAD-2000 m / 12” manufactured by Lintec Corporation.
- the evaluation wafer with the adhesive tape obtained in this way was measured for the diameter of the circular void generated around the bump from the base material side using a digital microscope (manufactured by Keyence Corporation, product name “VHX-1000”).
- the embedding property was calculated by the following formula.
- Embeddability void diameter / bump diameter ⁇ 100 [%]
- the calculated embedding property was evaluated according to the following evaluation criteria, with the best embedding having an appropriate void of 110% or more and less than 130%.
- A: Embedding property 110% or more and less than 130%
- B: Embedment property 130% or more and less than 140%
- C: Embedment property 110% or less, or 140% or more
- An intermediate layer resin composition was prepared by blending 1.0 part by weight of phenyl-propan-1-one (manufactured by BASF, product name “Darocur 1173”, solid content concentration: 100 parts by weight).
- This intermediate layer resin composition was coated on a polyethylene terephthalate film-based release film (manufactured by Lintec Corporation, product name “SP-PET 381031”, thickness 38 ⁇ m) by a fountain die method to form a coating film. And the ultraviolet-ray was irradiated from the coating-film side, and the semi-hardened layer was formed.
- a belt conveyor type ultraviolet irradiation device product name “ECS-401GGX”
- a high-pressure mercury lamp product name “H04” manufactured by Eye Graphics Co., Ltd.
- a base material made of polyethylene terephthalate (PET) film (product name “Cosmo Shine A4100”, thickness 50 ⁇ m, manufactured by Toyobo Co., Ltd.) was laminated, and further irradiated with ultraviolet rays from the PET film side (above) Irradiance of 271 mW / cm 2 and light intensity of 1200 mJ / cm 2 ) is used, and cured completely to form an intermediate layer having a thickness of 300 ⁇ m on the base PET film.
- the loss tangent (tan ⁇ ) of the intermediate layer at 50 ° C. measured at a frequency of 1 Hz was 1.92.
- each mass part is shown in terms of solid content when diluted with a diluent.
- Example 1 As the urethane polymer (A ′), a polyurethane polyol having a urethane skeleton and having a plurality of hydroxyl groups (product name “SH-101” manufactured by Toyochem Co., Ltd., weight average molecular weight: 100,000) is prepared.
- (A ′) 32 parts by mass of 100 parts by mass of urethane acrylate having a plurality of isocyanate groups as a crosslinking agent (C1) (manufactured by Daicel Ornex, product name “EBECRYL4150”, weight average molecular weight: 1,040)
- Crosslinking agent (C1) manufactured by Daicel Ornex, product name “EBECRYL4150”, weight average molecular weight: 1,040
- Mixture of pentaerythritol tetraacrylate (formula weight: 352) as the curable compound (B) and pentaerythritol triacrylate (formula weight: 298) as the compound (D) (mass ratio (C: D) 40: 60)
- Product name “A-TMM-3LM-N” manufactured by Shin-Nakamura Chemical Co., Ltd.) 7 parts by mass, 5 parts by mass of 2,2-dimethoxy-1,2-diphenylethane-1-one (manufacture
- the prepared pressure-sensitive adhesive composition was applied to a polyethylene terephthalate release film (manufactured by Lintec Corporation, product name “SP-PET 381031”, thickness 38 ⁇ m), heated at 100 ° C. for 2 minutes, dried and then released onto the release film. An adhesive layer having a thickness of 10 ⁇ m was formed. Then, after removing the release film on the base material with the intermediate layer previously prepared, and pasting the adhesive layer on the release film to the exposed intermediate layer, the unnecessary part at the end in the width direction is cut and removed. And the adhesive tape with which the base material, the intermediate
- Example 2 The procedure was the same as in Example 1 except that the pressure-sensitive adhesive composition was adjusted by changing the urethane polymer (A ′) to Toyochem Co., Ltd., product name “SP-205”, weight average molecular weight: 98,000). An adhesive tape was prepared.
- Example 3 17 parts by mass of “A-TMM-3LM-N” was added to urethane acrylate as an energy ray curable compound (B) (manufactured by Negami Kogyo Co., Ltd., product name “UN-6200”, bifunctional, weight average molecular weight 6,270). ) A pressure-sensitive adhesive tape was prepared in the same procedure as in Example 1 except that the pressure-sensitive adhesive composition was adjusted by changing to 100 parts by mass.
- Example 4 A pressure-sensitive adhesive tape was prepared in the same procedure as in Example 3 except that the pressure-sensitive adhesive composition was prepared by changing the urethane polymer (A ′) to the product name “SP-205” manufactured by Toyochem Co., Ltd.
- Example 5 Example 1 except that 17 parts by mass of “A-TMM-3LM-N” was changed to 100 parts by mass of urethane acrylate (hexafunctional, weight average molecular weight 33,000) as the energy ray-curable compound (B). An adhesive tape was prepared in the same procedure.
- the obtained acrylic pressure-sensitive adhesive composition was applied to a polyethylene terephthalate-based release film (manufactured by Lintec Corporation, product name “SP-PET 381031”, thickness 38 ⁇ m) and dried to form a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m. .
- SP-PET 381031 thickness 38 ⁇ m
- the adhesive tape in which the base material, the intermediate layer, the adhesive layer, and the release film were provided in this order was obtained. The evaluation results of this adhesive tape are shown in Table 1.
- the pressure-sensitive adhesive composition is urethane-based, and the urethane-based resin (A) contains the non-reactive energy ray-curable compound (B), so that the embedding property of the bump (
- the followability of the pressure-sensitive adhesive layer to the surface shape of the workpiece was improved, and the breaking stress was high, and adhesive residue at the time of peeling could be prevented.
- the adhesive force before energy ray curing was increased and the adhesive force after curing was sufficiently low, the peelability and adhesiveness were excellent.
- Comparative Examples 1 to 3 since the pressure-sensitive adhesive composition was acrylic, the rupture stress was low and adhesive residue could not be prevented.
- it was urethane type in the comparative example 4 since it did not contain an energy-beam curable compound (B), it was inferior to the softness
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201680023562.5A CN108307635B (zh) | 2015-04-30 | 2016-04-21 | 工件加工用胶粘带 |
KR1020177030737A KR102528633B1 (ko) | 2015-04-30 | 2016-04-21 | 워크 가공용 점착 테이프 |
JP2017515510A JP6541775B2 (ja) | 2015-04-30 | 2016-04-21 | ワーク加工用粘着テープ |
SG11201708797YA SG11201708797YA (en) | 2015-04-30 | 2016-04-21 | Adhesive tape for work processing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015093141 | 2015-04-30 | ||
JP2015-093141 | 2015-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016175112A1 true WO2016175112A1 (ja) | 2016-11-03 |
Family
ID=57198397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/062581 WO2016175112A1 (ja) | 2015-04-30 | 2016-04-21 | ワーク加工用粘着テープ |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6541775B2 (zh) |
KR (1) | KR102528633B1 (zh) |
CN (1) | CN108307635B (zh) |
SG (1) | SG11201708797YA (zh) |
TW (1) | TWI778939B (zh) |
WO (1) | WO2016175112A1 (zh) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190071558A (ko) * | 2017-12-14 | 2019-06-24 | 삼성에스디아이 주식회사 | 점착제 조성물, 그의 용액, 점착제층 및 표면 보호 필름 |
WO2019130741A1 (ja) * | 2017-12-26 | 2019-07-04 | 日東電工株式会社 | 光学部材用表面保護シート |
CN109971377A (zh) * | 2017-12-26 | 2019-07-05 | 日东电工株式会社 | 光学构件用表面保护片 |
JP2019116609A (ja) * | 2017-12-26 | 2019-07-18 | 日東電工株式会社 | 光学部材用表面保護シート |
JP2020027916A (ja) * | 2018-08-17 | 2020-02-20 | 株式会社ディスコ | ウエーハの一体化方法 |
JP2020105454A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 粘着剤組成物、硬化物および表面保護フィルム |
JP2020105452A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 粘着剤組成物、硬化物および表面保護フィルム |
JP2020105453A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム |
WO2020170827A1 (ja) * | 2019-02-22 | 2020-08-27 | 東洋インキScホールディングス株式会社 | 粘着剤、および粘着シートとその使用方法 |
WO2021125152A1 (ja) * | 2019-12-17 | 2021-06-24 | 昭和電工株式会社 | 半導体加工用テープ |
GB2593754A (en) * | 2020-04-01 | 2021-10-06 | Henkel IP & Holding GmbH | Redox curable compositions and methods of manufacture thereof |
JP2021187968A (ja) * | 2020-06-01 | 2021-12-13 | 東洋インキScホールディングス株式会社 | 粘着シート、粘着シート付き被着体、および粘着シートの使用方法 |
WO2024106386A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
WO2024106390A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
WO2024106387A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6618038B2 (ja) * | 2016-06-29 | 2019-12-11 | 荒川化学工業株式会社 | 粘着剤組成物 |
KR102126046B1 (ko) * | 2017-08-31 | 2020-06-24 | 삼성에스디아이 주식회사 | 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재 |
KR102104714B1 (ko) * | 2018-05-02 | 2020-04-24 | (재)한국건설생활환경시험연구원 | 3d 프린터 빌드 시트용 점착제 조성물 |
KR102210259B1 (ko) * | 2018-07-11 | 2021-02-01 | 삼성에스디아이 주식회사 | 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재 |
KR102306588B1 (ko) * | 2018-10-02 | 2021-09-29 | 삼성에스디아이 주식회사 | 점착성 보호 필름 및 이를 포함하는 광학 부재 |
KR102581044B1 (ko) * | 2019-01-25 | 2023-09-20 | 주식회사 엘지화학 | 표면 보호 필름 및 유기 발광 전자 장치 제조 방법 |
CN113993663B (zh) * | 2019-09-05 | 2024-05-31 | 株式会社力森诺科 | 背面研磨带 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212530A (ja) * | 1998-11-20 | 2000-08-02 | Lintec Corp | 粘着シ―トおよびその使用方法 |
WO2008044561A1 (fr) * | 2006-10-03 | 2008-04-17 | Emulsion Technology Co., Ltd. | COMPOSITION ADHéSIVE et feuille ADHéSIVE |
JP2012039053A (ja) * | 2010-07-14 | 2012-02-23 | Denki Kagaku Kogyo Kk | 多層粘着シート及び電子部品の製造方法 |
JP2014019715A (ja) * | 2012-07-12 | 2014-02-03 | 3M Innovative Properties Co | 透明粘着シート |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918181B1 (zh) | 1967-05-31 | 1974-05-08 | ||
JPH10310748A (ja) * | 1997-05-12 | 1998-11-24 | Sumitomo Bakelite Co Ltd | 半導体ウエハ加工用粘着シート |
CN1137028C (zh) * | 1998-11-20 | 2004-02-04 | 琳得科株式会社 | 压敏粘合片及其使用方法 |
JP3764133B2 (ja) * | 2002-08-22 | 2006-04-05 | 電気化学工業株式会社 | 電子部材用粘着テープ |
JP3894908B2 (ja) * | 2003-06-24 | 2007-03-22 | 電気化学工業株式会社 | 半導体ウエハ裏面研削用粘着シート |
JP4367769B2 (ja) | 2004-04-13 | 2009-11-18 | 日東電工株式会社 | 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法 |
EP1850375B9 (en) | 2005-02-18 | 2012-03-14 | Mitsui Chemicals Tohcello, Inc. | Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet |
JP5101111B2 (ja) * | 2007-01-05 | 2012-12-19 | 日東電工株式会社 | 半導体基板加工用粘着シート |
US7986698B2 (en) * | 2008-03-13 | 2011-07-26 | Qualcomm Incorporated | Methods and apparatus for using connection identifiers having different priorities at different times |
JP5501060B2 (ja) * | 2009-04-02 | 2014-05-21 | 日東電工株式会社 | 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート |
JP4851613B2 (ja) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープ |
WO2012043550A1 (ja) * | 2010-10-01 | 2012-04-05 | 昭和電工株式会社 | 光硬化性透明粘着シート用組成物 |
US9443750B2 (en) * | 2011-12-26 | 2016-09-13 | Lintec Corporation | Dicing sheet with protective film-forming layer, and method for producing chip |
CN102732159B (zh) * | 2012-06-25 | 2014-04-09 | 烟台开发区泰盛精化新材料有限公司 | 一种可剥性防焊紫外固化胶及其制备和使用方法 |
JP6081094B2 (ja) * | 2012-07-13 | 2017-02-15 | リンテック株式会社 | ダイシングシート |
JP6135243B2 (ja) * | 2013-03-29 | 2017-05-31 | 東洋インキScホールディングス株式会社 | 粘着剤およびそれを用いた粘着シート |
TWI476260B (zh) * | 2013-05-13 | 2015-03-11 | Chi Mei Corp | 光硬化可剝離型黏著劑組成物及其應用 |
-
2016
- 2016-04-21 SG SG11201708797YA patent/SG11201708797YA/en unknown
- 2016-04-21 CN CN201680023562.5A patent/CN108307635B/zh active Active
- 2016-04-21 JP JP2017515510A patent/JP6541775B2/ja active Active
- 2016-04-21 WO PCT/JP2016/062581 patent/WO2016175112A1/ja active Application Filing
- 2016-04-21 KR KR1020177030737A patent/KR102528633B1/ko active IP Right Grant
- 2016-04-26 TW TW105112954A patent/TWI778939B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212530A (ja) * | 1998-11-20 | 2000-08-02 | Lintec Corp | 粘着シ―トおよびその使用方法 |
WO2008044561A1 (fr) * | 2006-10-03 | 2008-04-17 | Emulsion Technology Co., Ltd. | COMPOSITION ADHéSIVE et feuille ADHéSIVE |
JP2012039053A (ja) * | 2010-07-14 | 2012-02-23 | Denki Kagaku Kogyo Kk | 多層粘着シート及び電子部品の製造方法 |
JP2014019715A (ja) * | 2012-07-12 | 2014-02-03 | 3M Innovative Properties Co | 透明粘着シート |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102210257B1 (ko) * | 2017-12-14 | 2021-02-01 | 삼성에스디아이 주식회사 | 점착제 조성물, 그의 용액, 점착제층 및 표면 보호 필름 |
JP2019104870A (ja) * | 2017-12-14 | 2019-06-27 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム |
KR20190071558A (ko) * | 2017-12-14 | 2019-06-24 | 삼성에스디아이 주식회사 | 점착제 조성물, 그의 용액, 점착제층 및 표면 보호 필름 |
JP7064857B2 (ja) | 2017-12-14 | 2022-05-11 | 三星エスディアイ株式会社 | 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム |
WO2019130741A1 (ja) * | 2017-12-26 | 2019-07-04 | 日東電工株式会社 | 光学部材用表面保護シート |
CN109971377A (zh) * | 2017-12-26 | 2019-07-05 | 日东电工株式会社 | 光学构件用表面保护片 |
JP2019116609A (ja) * | 2017-12-26 | 2019-07-18 | 日東電工株式会社 | 光学部材用表面保護シート |
CN111527167A (zh) * | 2017-12-26 | 2020-08-11 | 日东电工株式会社 | 光学构件用表面保护片 |
JP2020027916A (ja) * | 2018-08-17 | 2020-02-20 | 株式会社ディスコ | ウエーハの一体化方法 |
JP7191586B2 (ja) | 2018-08-17 | 2022-12-19 | 株式会社ディスコ | ウエーハの一体化方法 |
JP7241537B2 (ja) | 2018-12-28 | 2023-03-17 | 三星エスディアイ株式会社 | 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム |
JP2020105454A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 粘着剤組成物、硬化物および表面保護フィルム |
JP7285072B2 (ja) | 2018-12-28 | 2023-06-01 | 三星エスディアイ株式会社 | 粘着剤組成物、硬化物および表面保護フィルム |
JP2020105453A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム |
JP2020105452A (ja) * | 2018-12-28 | 2020-07-09 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 粘着剤組成物、硬化物および表面保護フィルム |
JP7241538B2 (ja) | 2018-12-28 | 2023-03-17 | 三星エスディアイ株式会社 | 粘着剤組成物、硬化物および表面保護フィルム |
WO2020170827A1 (ja) * | 2019-02-22 | 2020-08-27 | 東洋インキScホールディングス株式会社 | 粘着剤、および粘着シートとその使用方法 |
CN113474428A (zh) * | 2019-02-22 | 2021-10-01 | 东洋油墨Sc控股株式会社 | 粘合剂和粘合片及其使用方法 |
JP2020132799A (ja) * | 2019-02-22 | 2020-08-31 | 東洋インキScホールディングス株式会社 | 粘着剤、および粘着シートとその使用方法 |
CN113474428B (zh) * | 2019-02-22 | 2023-03-28 | 东洋油墨Sc控股株式会社 | 粘合剂和粘合片及其使用方法 |
WO2021125152A1 (ja) * | 2019-12-17 | 2021-06-24 | 昭和電工株式会社 | 半導体加工用テープ |
GB2593754A (en) * | 2020-04-01 | 2021-10-06 | Henkel IP & Holding GmbH | Redox curable compositions and methods of manufacture thereof |
GB2593754B (en) * | 2020-04-01 | 2022-12-28 | Henkel Ag & Co Kgaa | Redox curable compositions and methods of manufacture thereof |
US11891512B2 (en) | 2020-04-01 | 2024-02-06 | Henkel Ag & Co. Kgaa | Redox curable compositions and methods of manufacture thereof |
JP2021187968A (ja) * | 2020-06-01 | 2021-12-13 | 東洋インキScホールディングス株式会社 | 粘着シート、粘着シート付き被着体、および粘着シートの使用方法 |
WO2024106386A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
WO2024106390A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
WO2024106387A1 (ja) * | 2022-11-18 | 2024-05-23 | 日東電工株式会社 | 粘着シート |
Also Published As
Publication number | Publication date |
---|---|
CN108307635B (zh) | 2021-04-02 |
JPWO2016175112A1 (ja) | 2018-02-22 |
SG11201708797YA (en) | 2017-11-29 |
KR102528633B1 (ko) | 2023-05-03 |
CN108307635A (zh) | 2018-07-20 |
TWI778939B (zh) | 2022-10-01 |
KR20170140221A (ko) | 2017-12-20 |
JP6541775B2 (ja) | 2019-07-10 |
TW201710428A (zh) | 2017-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102528633B1 (ko) | 워크 가공용 점착 테이프 | |
JP6566365B2 (ja) | 半導体加工用粘着シート | |
KR102314242B1 (ko) | 점착 시트 | |
WO2017061132A1 (ja) | 半導体加工用シート | |
JP6235893B2 (ja) | バックグラインドシート | |
WO2012128311A1 (ja) | 基材フィルムおよび該基材フィルムを備えた粘着シート | |
JP6528259B2 (ja) | 表面保護フィルム | |
TWI591704B (zh) | Back grinding tablets | |
KR101784191B1 (ko) | 전자부품의 제조방법 | |
JP2016192488A (ja) | 半導体加工用粘着シート | |
KR102085533B1 (ko) | 필름, 워크 가공용 시트 기재 및 워크 가공용 시트 | |
TWI732895B (zh) | 半導體加工用黏著薄片 | |
WO2012128312A1 (ja) | 基材フィルムおよび該基材フィルムを備えた粘着シート | |
TW202016234A (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
JPWO2019181730A1 (ja) | 粘着テープおよび半導体装置の製造方法 | |
WO2018092446A1 (ja) | 半導体加工用粘着シート | |
JP6717484B2 (ja) | 粘着シート | |
CN113453893A (zh) | 半导体加工用保护片及半导体装置的制造方法 | |
WO2023188272A1 (ja) | 半導体加工用粘着テープ | |
WO2019188817A1 (ja) | ワーク加工用シート | |
JP2019070123A (ja) | 表面保護フィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16786389 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017515510 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20177030737 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11201708797Y Country of ref document: SG |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16786389 Country of ref document: EP Kind code of ref document: A1 |