JP5859193B2 - 多層粘着シート及び電子部品の製造方法 - Google Patents
多層粘着シート及び電子部品の製造方法 Download PDFInfo
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- JP5859193B2 JP5859193B2 JP2010227361A JP2010227361A JP5859193B2 JP 5859193 B2 JP5859193 B2 JP 5859193B2 JP 2010227361 A JP2010227361 A JP 2010227361A JP 2010227361 A JP2010227361 A JP 2010227361A JP 5859193 B2 JP5859193 B2 JP 5859193B2
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- Prior art keywords
- meth
- acrylate
- adhesive sheet
- pressure
- sensitive adhesive
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- 239000000853 adhesive Substances 0.000 title claims description 56
- 230000001070 adhesive effect Effects 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 98
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 69
- -1 vinyl compound Chemical class 0.000 claims description 48
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 37
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 32
- 239000000178 monomer Substances 0.000 claims description 32
- 229920001577 copolymer Polymers 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000012948 isocyanate Substances 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 150000002513 isocyanates Chemical class 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 19
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 17
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 claims description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 15
- 239000003999 initiator Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 229920002554 vinyl polymer Polymers 0.000 claims description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004386 Erythritol Substances 0.000 claims description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 claims description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 claims description 2
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 6
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 6
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
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- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
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- 150000002009 diols Chemical class 0.000 description 4
- 238000007720 emulsion polymerization reaction Methods 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
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- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 3
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- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
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- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- HPSYODCCXIRLGI-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO.OCC(CO)(CO)CO HPSYODCCXIRLGI-UHFFFAOYSA-N 0.000 description 2
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
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- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
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- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C08G18/8029—Masked aromatic polyisocyanates
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Description
(1).基材フィルムと、基材フィルムの一方の面に積層された粘着層と、粘着層の露出面に積層されたダイアタッチフィルムとを有し、
粘着層を構成する粘着剤が(メタ)アクリル酸エステル共重合体(A)と紫外線重合性化合物(B)と多官能イソシアネート硬化剤(C)と光重合開始剤(D)とシリコーン重合体(E)とを有し、
(メタ)アクリル酸エステル共重合体(A)が、(メタ)アクリル酸エステル単量体の共重合体、又は、(メタ)アクリル酸エステル単量体とビニル化合物単量体との共重合体のいずれか一方であり、(メタ)アクリル酸エステル単量体とビニル化合物単量体のいずれもが水酸基を有さないものであり、紫外線重合性化合物(B)がウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなり、ウレタンアクリレートオリゴマ(B1)はビニル基を10個以上有し、重量平均分子量Mwが50000以上、かつ、前記重量平均分子量Mwと数平均分子量Mnの比である分散度Mw/Mnが5以上であり、光重合開始剤(D)が水酸基を有し、シリコーン重合体(E)が水酸基を有し、
粘着層を構成する粘着剤において(メタ)アクリル酸エステル共重合体(A)が100質量部、紫外線重合性化合物(B)が5〜200質量部、多官能イソシアネート硬化剤(C)が0.5〜20質量部、光重合開始剤(D)が0.1〜20質量部並びにシリコーン重合体(E)が0.1〜20質量部である多層粘着シート。
(2).ウレタンアクリレートオリゴマ(B1)がイソホロンジイソシアネートの三量体のイソシアネートにジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものであり、多官能(メタ)アクリレート(B2)がジペンタエリスリトールヘキサアクリレートである(1)記載の多層粘着シート。
(3).ダイアタッチフィルムを構成する組成物がアクリル酸エステル共重合体を有する(1)又は(2)記載の多層粘着シート。
(4).(1)乃至(3)のいずれか一項記載の多層粘着シートを用いて、多層粘着シートをシリコンウエハとリングフレームに貼り付けて固定する貼付工程、ダイシングブレードでシリコンウエハをダイシングして半導体チップにするダイシング工程、少なくとも紫外線又は放射線を照射し、チップとダイアタッチフィルムを粘着層からピックアップするピックアップ工程、を含む、電子部品の製造方法。
単量体単位とは単量体に由来する構造単位を意味する。「部」及び「%」は質量基準である。(メタ)アクリレートとはアクリレート及びメタアクリレートの総称である。(メタ)アクリル酸等の(メタ)を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。
多層粘着シートは、基材フィルムと、基材フィルムの一方の面に積層された粘着層と、粘着層の露出面に積層されたダイアタッチフィルムとを有する。すなわち、多層粘着シートは、基材フィルム、粘着層、ダイアタッチフィルムがこの順に積層された多層構造体である。本明細書中、基材フィルムと粘着層のみを積層一体化させたものを単に「粘着シート」と称し、粘着シートにダイアタッチフィルムをさらに積層一体化させたものを「多層粘着シート」と称する。
基材フィルムは、特に限定されるものではなく公知の樹脂材料を用いることができる。具体的には、ポリ塩化ビニル、ポリエチレンテレフタレート、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸−アクリル酸エステルフィルム、エチレン−エチルアクリレート共重合体、ポリエチレン、ポリプロピレン、プロピレン系共重合体、エチレン−アクリル酸共重合体、及び、エチレン−(メタ)アクリル酸共重合体やエチレン−(メタ)アクリル酸−(メタ)アクリル酸エステル共重合体等を金属イオンで架橋したアイオノマ樹脂を挙げることができる。基材フィルムは、これら樹脂の混合物、共重合体又はこれらの積層物であっても良い。
粘着層は粘着剤から構成され、粘着剤は、(メタ)アクリル酸エステル共重合体(A)と紫外線重合性化合物(B)と多官能イソシアネート硬化剤(C)と光重合開始剤(D)とシリコーン重合体(E)とを有する。
(メタ)アクリル酸エステル共重合体は、(メタ)アクリル酸エステルの単量体のみの共重合体、又は、(メタ)アクリル酸エステルの単量体とビニル化合物単量体との共重合体であり、これらの単量体が水酸基を持たないものである。
紫外線重合性化合物(B)は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)との混合物である。ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)との配合比は、B1:B2が50:50以上95:5以下であることが好ましく、65:35以上85:15以下であることがさらに好ましい。
ウレタンアクリレートオリゴマ(B1)は、ビニル基を10個以上有し、重量平均分子量Mwが50000以上であり、且つ前記重量平均分子量Mwと数平均分子量Mnの比である分散度Mw/Mnが5以上のものである。
多官能(メタ)アクリレート(B2)としては、例えばトリメチロールプロパントリアクリレート、ヒドロキシプロピル化トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールエトキシテトラアクリレート、ジペンタエリスリトールヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、ビス(ペンタエリスリトール)テトラアクリレート、テトラメチロールメタン−トリアクリレート、グリシドール−ジアクリレートや、これらのアクリレート基の一部又は全部をメタアクリレート基とした化合物がある。
多官能イソシアネート硬化剤(C)は、イソシアネート基を2個以上有するものであり、例えば芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環族ポリイソシアネートがある。
光重合開始剤(D)は、少なくとも1個の水酸基を有するものである。1個の水酸基を有する光重合開始剤としては、2−ヒドロキシ−メチル−1−フェニル−プロパン−1−オン(チバ・ジャパン社製、製品名Darocur1173)、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン(チバ・ジャパン社製、製品名Irgacure184)、等が挙げられ、2個以上の水酸基を有する光重合開始剤としては、1−[4−(ヒドロキシエトキシ)−フェニル]−2−ヒドロキシ−2メチル−1−プロパン−1−オン(チバ・ジャパン社製、製品名Irgacure2959)、2−ヒドロキシ−1−{4−[4−(2−ヒドロキシ−2−メチル−プロピオニル)−ベンジル]−フェニル}−2−メチル−プロパン−1−オン(チバ・ジャパン社製、製品名Irgacure127)等が挙げられる。水酸基を有する光重合開始剤(B)の水酸基の数は、2個以上が好ましい。2個以上有することで、放射線照射後に開裂した光重合開始剤が(メタ)アクリル酸エステル単量体(A)のアクリロイル基の反応系に取り込まれるため、ダイアタッチフィルムへのマイグレーションを抑制できる。なお、水酸基の数の上限については特に限定するものではない。
粘着剤に配合するのに好ましいシリコーン重合体(E)は、ポリジメチルシロキサン結合の末端にビニル基を有する単量体(以下、「シリコーン系マクロモノマ」という)に由来する単量体単位を有するものである。具体的には、シリコーン系マクロモノマのホモポリマー、シリコーン系マクロモノマと他のビニル化合物とを重合したビニル重合体がある。シリコーン系マクロモノマは、ポリジメチルシロキサン結合の末端が(メタ)アクリロイル基又はスチリル基等のビニル基である化合物が好ましい。
多層粘着シートに用いられるダイアタッチフィルムは、接着剤をフィルム状に成形したものである。ダイアタッチフィルムを構成する具体的な組成物としては、アクリル酸エステル共重合体、ポリアミド、ポリエチレン、ポリスルホン、エポキシ樹脂、ポリイミド、ポリアミド酸、シリコーン樹脂、フェノール樹脂、ゴム、フッ素ゴム及びフッ素樹脂の単体又はこれらの混合物、共重合体及び積層体がある。ダイアタッチフィルムを構成する組成物は、チップとの接着信頼性の面からアクリル酸エステル共重合体を含むことが好ましい。この組成物には、光重合開始剤、帯電防止剤、架橋剤、架橋促進剤、フィラーなどを添加してもよい。
多層粘着シートは、基材フィルム上に粘着剤を塗布して粘着シートを作成した後、粘着シートの粘着剤塗布面にダイアタッチフィルムを貼り付けることによって製造できる。また、粘着剤を、ポリエチレンテレフタレート等からなるセパレータフィルム上に塗工し、任意に乾燥させた後に、基材フィルムに積層して粘着シートを作成し、次いでセパレータフィルムを取り外した露出面にダイアタッチフィルムを貼り付けることによっても製造できる。
上述の多層粘着シートを用いて電子部品を製造する方法は、次の工程を含む。
(1)多層粘着シートをシリコンウエハとリングフレームに貼り付けて固定する貼付工程、
(2)ダイシングブレードでシリコンウエハをダイアタッチフィルムごとダイシングして半導体チップにするダイシング工程、
(3)少なくとも紫外線又は放射線を照射し、ダイアタッチフィルムが付着した半導体チップを粘着層からピックアップするピックアップ工程。
基材フィルムは、実施例及び比較例の全てにおいて、サンアロマー社製プロピレン系共重合体(品番:X500F)を用いた。このフィルムのMFR(メルトフローレート)値は7.5g/10分、密度は0.89g/cm3、厚さは80μmである。
粘着層は、以下に記載する(メタ)アクリル酸エステル共重合体(A)、紫外線重合性化合物(B)、多官能イソシアネート硬化剤(C)、光重合開始剤(D)及びシリコーン重合体(E)を含有する粘着剤を用いて形成した。
〔(メタ)アクリル酸エステル共重合体(A)〕
A−1:日本ゼオン社製アクリルゴムAR53L;エチルアクリレート40%、ブチルアクリレート23%、メトキシエチルアクリレート37%の共重合体であり、乳化重合により得られる。いずれの化合物にも水酸基なし。
A−2:自社重合品;エチルアクリレート40%、ブチルアクリレート22%、メトキシエチルアクリレート37%、アクリル酸1%の共重合体であり、乳化重合により得られる。いずれの化合物にも水酸基なし。
A−3:綜研化学社製SKダイン1435;ブチルアクリレート67%、メチルアクリレート28%、2−ヒドロキシエチルアクリレート5%の共重合体であり、溶液重合により得られる。2−ヒドロキシエチルアクリレートに水酸基あり。
〔紫外線重合性化合物(B)〕
B−1:根上工業社製UN−905;B-1は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなる。ウレタンアクリレートオリゴマ(B1)は、イソホロンジイソシアネートの三量体のイソシアネートに、ジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものである。多官能(メタ)アクリレート(B2)は、ジペンタエリスリトールヘキサアクリレートを主成分とするものである。両成分の配合比は、ウレタンアクリレートオリゴマ(B1)が75%、多官能(メタ)アクリレート(B2)が25%である。
ウレタンアクリレートオリゴマ(B1)は、重量平均分子量100000、分散度10.7でビニル基の数が15個である。
B−2:根上工業社製UN−3320HS;B-2は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなる。ウレタンアクリレートオリゴマ(B1)は、イソホロンジイソシアネートの三量体のイソシアネートに、ジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものである。多官能(メタ)アクリレート(B2)は、ジペンタエリスリトールヘキサアクリレートを主成分とするものである。両成分の配合比は、ウレタンアクリレートオリゴマ(B1)が45%、多官能(メタ)アクリレート(B2)が55%である。
ウレタンアクリレートオリゴマ(B1)は、重量平均分子量11000、分散度1.2でビニル基の数が15個である。
B−3:自社重合品A;B-3は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなる。ウレタンアクリレートオリゴマ(B1)は、ヘキサメチレンジイソシアネートの三量体のイソシアネートに、ジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものである。多官能(メタ)アクリレート(B2)は、ジペンタエリスリトールヘキサアクリレートを主成分とするものである。両成分の配合比は、ウレタンアクリレートオリゴマ(B1)が45%、多官能(メタ)アクリレート(B2)が55%である。
ウレタンアクリレートオリゴマ(B1)は、重量平均分子量70000、分散度1.2でビニル基の数が15個である。
B−4:自社重合品B;B-4は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなる。ウレタンアクリレートオリゴマ(B1)は、ヘキサメチレンジイソシアネートの三量体のイソシアネートに、ジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものである。多官能(メタ)アクリレート(B2)は、ジペンタエリスリトールヘキサアクリレートを主成分とするものである。両成分の配合比は、ウレタンアクリレートオリゴマ(B1)が45%、多官能(メタ)アクリレート(B2)が55%である。
ウレタンアクリレートオリゴマ(B1)は、重量平均分子量30000、分散度7.5でビニル基の数が15個である。
B−5:自社重合品C;B-5は、ウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなる。ウレタンアクリレートオリゴマ(B1)は、ヘキサメチレンジイソシアネートの三量体のイソシアネートに、ペンタエリスリトールトリアクリレートを主成分とする水酸基含有アクリレートを反応させたものである。多官能(メタ)アクリレート(B2)は、ペンタエリスリトールテトラアクリレートを主成分とするものである。両成分の配合比は、ウレタンアクリレートオリゴマ(B1)が45%、多官能(メタ)アクリレート(B2)が55%である。
ウレタンアクリレートオリゴマ(B1)は、重量平均分子量70000、分散度8.2でビニル基の数が6個である。
〔多官能イソシアネート硬化剤(C)〕
C−1:日本ポリウレタン社製コロネートL−45E;2,4−トリレンジイソシアネートのトリメチロールプロパンアダクト体。
〔光重合開始剤(D)〕
D−1:チバ・ジャパン社製、製品名Irgacure127;2−ヒドロキシ−1−{4−[4−(2−ヒドロキシ−2−メチル−プロピオニル)−ベンジル]−フェニル}−2−メチル−プロパン−1−オン。水酸基あり。
D−2:チバ・ジャパン社製、製品名Irgacure184;1−ヒドロキシ−シクロヘキシル−フェニル−ケトン。水酸基あり。
D−3:チバ・ジャパン社製、製品名Irgacure651;ベンジルジメチルケタール。水酸基なし。
〔シリコーン重合体(E)〕
E−1:綜研化学社製UTMM−LS2;シリコーン分子鎖の末端に(メタ)アクリロイル基を有するシリコーン系オリゴマ系単位を含有し、メチルメタアクリレート等からなるアクリルビニル単位を重合したシリコーン系グラフト共重合体。水酸基あり。
E−2:シリコーン油、市販品。水酸基なし。
装置名:HLC−8120GPC(東ソー社製)
カラム:TSK Guard HZ−L1本とHZM−N3本を直列
温度:40℃
検出:示差屈折率
溶媒:テトラヒドロフラン
濃度:0.2質量/体積%
検量線:標準ポリスチレン(PS)(Varian社製)を用いて作成し、分子量はPS換算値で表した。
ダイアタッチフィルムは、以下のいずれかを用いた。
1:アクリル酸エステル共重合体を主体とし、厚さ30μm。
2:エポキシ系接着剤を主体とし、厚さ30μm。
粘着剤を、ポリエチレンテレフタレート製のセパレータフィルム上に、乾燥後の粘着層の厚みが10μmとなるように塗工した。この粘着層を基材フィルムに積層し、40℃で7日間熟成させ、セパレータフィルム付き粘着シートを得た。次いでセパレータフィルムを取り外し、露出した粘着層上に直径8.2インチの円形に切断したダイアタッチフィルムをラミネートして、多層粘着シートを得た。
得られた多層粘着シートを用いて、以下の工程(1)〜(3)により、シリコンウエハを固定し、ダイシングし、半導体チップをピックアップして、チップ保持性、ピックアップ性及び汚染防止性について評価を行った。
(2)ダイシング工程:ダイシングブレードを用いて、シリコンウエハを多層粘着シートのダイアタッチフィルムごと9mm×9mmのサイズの半導体チップに切断した。ダイシング工程は以下の装置及び条件で行った。
ダイシング装置:DISCO社製DAD341
ダイシングブレード:DISCO社製NBC−ZH205O−27HEEE
ダイシングブレード形状:外径55.56mm、刃幅35μm、内径19.05mm
ダイシングブレード回転数:40,000rpm
ダイシングブレード送り速度:50mm/秒
粘着シートへの切り込み量:15μm
切削水温度:25℃
切削水量 :1.0L/分
(3)ピックアップ工程:紫外線を照射して粘着層の粘着力を低下させた後に、ダイアタッチフィルムが付着した半導体チップを接着層から剥離させてピックアップした。ピックアップ工程は以下の装置及び条件で行った。
ピックアップ装置:キヤノンマシナリー社製CAP−300II
ニードルピン形状:250μmR
ニードルピン突き上げ高さ:0.5mm
エキスパンド量:8mm
チップ保持性は、ダイシング工程後において、粘着シートに保持されている半導体チップの残存率で評価した。
◎(優):チップ飛びが5%未満。
○(良):チップ飛びが5%以上10%未満。
×(不可):チップ飛びが10%以上。
ピックアップ性は、ピックアップ工程においてピックアップできたチップの比率で評価した。
◎(優):95%以上のチップがピックアップできた。
○(良):80%以上95%未満のチップがピックアップできた。
×(不可):80%未満のチップがピックアップできた。
汚染防止性は、粘着シートの粘着層とダイアタッチフィルムとを貼り合わせて、1週間保管した後に高圧水銀灯で紫外線を500mJ/cm2照射し、照射からさらに1週間保管後又は4週間保管後に粘着シートからダイアタッチフィルムを剥離し、ダイアタッチフィルムについてGC−MS分析を行い、粘着剤成分由来のピークを確認して評価した。
◎(優):紫外線を照射して1週間保管後及び4週間保管後に粘着シートから剥離したいずれのダイアタッチフィルムからも粘着剤成分由来のピークは認められなかった。
○(良):紫外線を照射して1週間保管後に粘着シートから剥離したダイアタッチフィルムからは粘着剤成分由来のピークは認められなかったが、紫外線を照射して4週間保管後に粘着シートから剥離したダイアタッチフィルムからは粘着剤成分由来のピークが認められた。
×(不可):紫外線を照射して1週間保管後及び4週間保管後に粘着シートから剥離したいずれのダイアタッチフィルムからも粘着剤成分由来のピークが認められた。
Claims (4)
- 基材フィルムと、基材フィルムの一方の面に積層された粘着層と、粘着層の露出面に積層されたダイアタッチフィルムとを有し、
粘着層を構成する粘着剤が(メタ)アクリル酸エステル共重合体(A)と紫外線重合性化合物(B)と多官能イソシアネート硬化剤(C)と光重合開始剤(D)とシリコーン重合体(E)とを有し、
(メタ)アクリル酸エステル共重合体(A)が、(メタ)アクリル酸エステル単量体の共重合体、又は、(メタ)アクリル酸エステル単量体とビニル化合物単量体との共重合体のいずれか一方であり、(メタ)アクリル酸エステル単量体とビニル化合物単量体のいずれもが水酸基を有さないものであり、紫外線重合性化合物(B)がウレタンアクリレートオリゴマ(B1)と多官能(メタ)アクリレート(B2)からなり、ウレタンアクリレートオリゴマ(B1)はビニル基を10個以上有し、重量平均分子量Mwが50000以上、かつ、前記重量平均分子量Mwと数平均分子量Mnの比である分散度Mw/Mnが5以上であり、光重合開始剤(D)が水酸基を有し、シリコーン重合体(E)が水酸基を有し、
粘着層を構成する粘着剤において(メタ)アクリル酸エステル共重合体(A)が100質量部、紫外線重合性化合物(B)が5〜200質量部、多官能イソシアネート硬化剤(C)が0.5〜20質量部、光重合開始剤(D)が0.1〜20質量部並びにシリコーン重合体(E)が0.1〜20質量部である多層粘着シート。 - ウレタンアクリレートオリゴマ(B1)がイソホロンジイソシアネートの三量体のイソシアネートにジペンタエリスリトールヒドロキシペンタアクリレートを主成分とする水酸基含有アクリレートを反応させたものであり、多官能(メタ)アクリレート(B2)がジペンタエリスリトールヘキサアクリレートである請求項1記載の多層粘着シート。
- ダイアタッチフィルムを構成する組成物がアクリル酸エステル共重合体を有する請求項1又は2記載の多層粘着シート。
- 請求項1乃至3のいずれか一項記載の多層粘着シートを用いて、多層粘着シートをシリコンウエハとリングフレームに貼り付けて固定する貼付工程、ダイシングブレードでシリコンウエハをダイシングして半導体チップにするダイシング工程、少なくとも紫外線又は放射線を照射し、チップとダイアタッチフィルムを粘着層からピックアップするピックアップ工程、を含む、電子部品の製造方法。
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JP2010227361A JP5859193B2 (ja) | 2010-07-14 | 2010-10-07 | 多層粘着シート及び電子部品の製造方法 |
MYPI2013000064A MY156758A (en) | 2010-07-14 | 2011-07-01 | Multilayer adhesive sheet and method for manufacturing electronic component |
PCT/JP2011/065149 WO2012008316A1 (ja) | 2010-07-14 | 2011-07-01 | 多層粘着シート及び電子部品の製造方法 |
KR1020137000198A KR101820356B1 (ko) | 2010-07-14 | 2011-07-01 | 다층점착시트 및 전자부품의 제조방법 |
CN201180031760.3A CN102971839B (zh) | 2010-07-14 | 2011-07-01 | 多层粘合片及电子元件的制造方法 |
SG2012092219A SG186726A1 (en) | 2010-07-14 | 2011-07-01 | Multilayer adhesive sheet and method for manufacturing electronic component |
US13/805,749 US9028638B2 (en) | 2010-07-14 | 2011-07-01 | Multilayer adhesive sheet and method for manufacturing electronic component |
TW100124744A TWI496858B (zh) | 2010-07-14 | 2011-07-13 | 多層黏著片及電子零件之製造方法 |
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JP6066778B2 (ja) * | 2012-03-08 | 2017-01-25 | 積水化学工業株式会社 | 透明基板の処理方法及び透明基板処理用粘着剤 |
JP5997506B2 (ja) * | 2012-05-31 | 2016-09-28 | リンテック株式会社 | ダイシング・ダイボンディングシート |
WO2014015497A1 (en) * | 2012-07-26 | 2014-01-30 | Henkel Ag & Co. Kgaa | Uv-curing hot melt adhesive containing low content of oligomers |
CN103666362B (zh) * | 2012-09-19 | 2015-06-10 | 广东恒大新材料科技有限公司 | 一种液体组合物及其在印刷有油墨面板的粘接中的应用 |
JP6065098B2 (ja) * | 2013-02-21 | 2017-01-25 | 日本化成株式会社 | 架橋用樹脂組成物および封止材 |
KR101730054B1 (ko) * | 2013-12-13 | 2017-04-25 | 주식회사 엘지화학 | 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름 |
KR101709689B1 (ko) * | 2013-12-19 | 2017-02-23 | 주식회사 엘지화학 | 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름 |
WO2015093794A1 (ko) * | 2013-12-19 | 2015-06-25 | 주식회사 엘지화학 | 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름 |
JP6246020B2 (ja) * | 2014-02-27 | 2017-12-13 | 日本カーバイド工業株式会社 | 粘着剤組成物及び光学部材表面保護フィルム |
JP6541694B2 (ja) * | 2014-06-11 | 2019-07-10 | オラクル・インターナショナル・コーポレイション | 既存のサブスクリプションを用いたサービスのサブスクリプションの提供 |
KR102360607B1 (ko) * | 2014-07-14 | 2022-02-08 | 덴카 주식회사 | 점착 시트, 전자 부품의 제조 방법 |
KR102528633B1 (ko) * | 2015-04-30 | 2023-05-03 | 린텍 가부시키가이샤 | 워크 가공용 점착 테이프 |
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JP6829250B2 (ja) * | 2016-04-15 | 2021-02-10 | デンカ株式会社 | 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法 |
JP6618038B2 (ja) * | 2016-06-29 | 2019-12-11 | 荒川化学工業株式会社 | 粘着剤組成物 |
JP6832784B2 (ja) * | 2017-04-24 | 2021-02-24 | デンカ株式会社 | ステルスダイシング用粘着テープ及びそれを用いた半導体チップの製造方法 |
KR102203869B1 (ko) * | 2018-03-28 | 2021-01-18 | 주식회사 엘지화학 | 임시고정용 점착시트 및 이를 사용한 반도체 장치의 제조 방법 |
KR102643219B1 (ko) * | 2018-08-08 | 2024-03-05 | 주식회사 엘지에너지솔루션 | 발광물질을 포함하는 리드필름을 구비한 이차전지 및 이차전지의 불량 검사 방법 |
CN109627388B (zh) * | 2018-11-27 | 2022-03-08 | 苏州赛伍应用技术股份有限公司 | 一种切割保护膜用丙烯酸树脂及其制备方法 |
WO2021065515A1 (ja) * | 2019-10-01 | 2021-04-08 | 積水化学工業株式会社 | 粘着テープ |
KR102347872B1 (ko) * | 2019-11-21 | 2022-01-06 | 주식회사 엘지화학 | 표면 보호 필름 |
CN111440494B (zh) * | 2019-12-30 | 2022-01-25 | 宁波激智科技股份有限公司 | 一种涂层组合物及一种偏光片 |
CN112300708B (zh) * | 2020-11-04 | 2022-09-30 | 深圳广恒威科技有限公司 | 可uv固化的胶膜及其应用 |
KR102401234B1 (ko) * | 2020-11-25 | 2022-05-24 | 에이엠씨주식회사 | 에너지선 경화형 화합물을 함유하는 점착시트 및 반도체 칩의 제조방법 |
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JP4874011B2 (ja) * | 2006-06-23 | 2012-02-08 | 電気化学工業株式会社 | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
WO2009050785A1 (ja) * | 2007-10-16 | 2009-04-23 | Denki Kagaku Kogyo Kabushiki Kaisha | 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法 |
JP2011044444A (ja) * | 2007-12-19 | 2011-03-03 | Denki Kagaku Kogyo Kk | 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法。 |
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SG186726A1 (en) | 2013-02-28 |
KR101820356B1 (ko) | 2018-02-28 |
TWI496858B (zh) | 2015-08-21 |
JP2012039053A (ja) | 2012-02-23 |
CN102971839B (zh) | 2016-01-27 |
US9028638B2 (en) | 2015-05-12 |
KR20130096695A (ko) | 2013-08-30 |
WO2012008316A1 (ja) | 2012-01-19 |
US20130092318A1 (en) | 2013-04-18 |
CN102971839A (zh) | 2013-03-13 |
TW201207061A (en) | 2012-02-16 |
MY156758A (en) | 2016-03-31 |
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