JP6541775B2 - ワーク加工用粘着テープ - Google Patents

ワーク加工用粘着テープ Download PDF

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Publication number
JP6541775B2
JP6541775B2 JP2017515510A JP2017515510A JP6541775B2 JP 6541775 B2 JP6541775 B2 JP 6541775B2 JP 2017515510 A JP2017515510 A JP 2017515510A JP 2017515510 A JP2017515510 A JP 2017515510A JP 6541775 B2 JP6541775 B2 JP 6541775B2
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JP
Japan
Prior art keywords
meth
pressure
sensitive adhesive
adhesive tape
urethane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017515510A
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English (en)
Japanese (ja)
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JPWO2016175112A1 (ja
Inventor
雄一朗 小升
雄一朗 小升
泰史 藤本
泰史 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2016175112A1 publication Critical patent/JPWO2016175112A1/ja
Application granted granted Critical
Publication of JP6541775B2 publication Critical patent/JP6541775B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
JP2017515510A 2015-04-30 2016-04-21 ワーク加工用粘着テープ Active JP6541775B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015093141 2015-04-30
JP2015093141 2015-04-30
PCT/JP2016/062581 WO2016175112A1 (ja) 2015-04-30 2016-04-21 ワーク加工用粘着テープ

Publications (2)

Publication Number Publication Date
JPWO2016175112A1 JPWO2016175112A1 (ja) 2018-02-22
JP6541775B2 true JP6541775B2 (ja) 2019-07-10

Family

ID=57198397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017515510A Active JP6541775B2 (ja) 2015-04-30 2016-04-21 ワーク加工用粘着テープ

Country Status (6)

Country Link
JP (1) JP6541775B2 (zh)
KR (1) KR102528633B1 (zh)
CN (1) CN108307635B (zh)
SG (1) SG11201708797YA (zh)
TW (1) TWI778939B (zh)
WO (1) WO2016175112A1 (zh)

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* Cited by examiner, † Cited by third party
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JP6618038B2 (ja) * 2016-06-29 2019-12-11 荒川化学工業株式会社 粘着剤組成物
KR102126046B1 (ko) * 2017-08-31 2020-06-24 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
KR20190078510A (ko) * 2017-12-26 2019-07-04 닛토덴코 가부시키가이샤 광학 부재용 표면 보호 시트
JP2019116609A (ja) * 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
WO2019130741A1 (ja) * 2017-12-26 2019-07-04 日東電工株式会社 光学部材用表面保護シート
KR102104714B1 (ko) * 2018-05-02 2020-04-24 (재)한국건설생활환경시험연구원 3ｄ 프린터 빌드 시트용 점착제 조성물
KR102210259B1 (ko) * 2018-07-11 2021-02-01 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7191586B2 (ja) * 2018-08-17 2022-12-19 株式会社ディスコ ウエーハの一体化方法
KR102306588B1 (ko) * 2018-10-02 2021-09-29 삼성에스디아이 주식회사 점착성 보호 필름 및 이를 포함하는 광학 부재
JP7241538B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7285072B2 (ja) * 2018-12-28 2023-06-01 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241537B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム
KR102581044B1 (ko) * 2019-01-25 2023-09-20 주식회사 엘지화학 표면 보호 필름 및 유기 발광 전자 장치 제조 방법
JP6769503B2 (ja) * 2019-02-22 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着剤、および粘着シートとその使用方法
CN113993663B (zh) * 2019-09-05 2024-05-31 株式会社力森诺科 背面研磨带
KR102565398B1 (ko) * 2019-12-17 2023-08-08 가부시끼가이샤 레조낙 반도체 가공용 테이프
GB2593754B (en) 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
JP6769574B1 (ja) * 2020-06-01 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着シート、粘着シート付き被着体、および粘着シートの使用方法
WO2024106390A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート
WO2024106387A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート
WO2024106386A1 (ja) * 2022-11-18 2024-05-23 日東電工株式会社 粘着シート

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JPS4918181B1 (zh) 1967-05-31 1974-05-08
JPH10310748A (ja) * 1997-05-12 1998-11-24 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
CN1137028C (zh) * 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
JP4828009B2 (ja) * 1998-11-20 2011-11-30 リンテック株式会社 粘着シートおよびその使用方法
JP3764133B2 (ja) * 2002-08-22 2006-04-05 電気化学工業株式会社 電子部材用粘着テープ
JP3894908B2 (ja) * 2003-06-24 2007-03-22 電気化学工業株式会社 半導体ウエハ裏面研削用粘着シート
JP4367769B2 (ja) 2004-04-13 2009-11-18 日東電工株式会社 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法
EP1850375B9 (en) 2005-02-18 2012-03-14 Mitsui Chemicals Tohcello, Inc. Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
JP5244603B2 (ja) * 2006-10-03 2013-07-24 株式会社イーテック 粘着剤組成物及び粘着シート
JP5101111B2 (ja) * 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
US7986698B2 (en) * 2008-03-13 2011-07-26 Qualcomm Incorporated Methods and apparatus for using connection identifiers having different priorities at different times
JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
JP4851613B2 (ja) * 2009-12-22 2012-01-11 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP5859193B2 (ja) * 2010-07-14 2016-02-10 デンカ株式会社 多層粘着シート及び電子部品の製造方法
WO2012043550A1 (ja) * 2010-10-01 2012-04-05 昭和電工株式会社 光硬化性透明粘着シート用組成物
US9443750B2 (en) * 2011-12-26 2016-09-13 Lintec Corporation Dicing sheet with protective film-forming layer, and method for producing chip
CN102732159B (zh) * 2012-06-25 2014-04-09 烟台开发区泰盛精化新材料有限公司 一种可剥性防焊紫外固化胶及其制备和使用方法
JP6073081B2 (ja) * 2012-07-12 2017-02-01 スリーエム イノベイティブ プロパティズ カンパニー 透明粘着シート
JP6081094B2 (ja) * 2012-07-13 2017-02-15 リンテック株式会社 ダイシングシート
JP6135243B2 (ja) * 2013-03-29 2017-05-31 東洋インキＳｃホールディングス株式会社 粘着剤およびそれを用いた粘着シート
TWI476260B (zh) * 2013-05-13 2015-03-11 Chi Mei Corp 光硬化可剝離型黏著劑組成物及其應用

Also Published As

Publication number Publication date
CN108307635B (zh) 2021-04-02
JPWO2016175112A1 (ja) 2018-02-22
SG11201708797YA (en) 2017-11-29
WO2016175112A1 (ja) 2016-11-03
KR102528633B1 (ko) 2023-05-03
CN108307635A (zh) 2018-07-20
TWI778939B (zh) 2022-10-01
KR20170140221A (ko) 2017-12-20
TW201710428A (zh) 2017-03-16

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