KR102006090B1 - 이방성 도전 필름 및 접속 방법 - Google Patents

이방성 도전 필름 및 접속 방법 Download PDF

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Publication number
KR102006090B1
KR102006090B1 KR1020177015870A KR20177015870A KR102006090B1 KR 102006090 B1 KR102006090 B1 KR 102006090B1 KR 1020177015870 A KR1020177015870 A KR 1020177015870A KR 20177015870 A KR20177015870 A KR 20177015870A KR 102006090 B1 KR102006090 B1 KR 102006090B1
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KR
South Korea
Prior art keywords
circuit member
layer
anisotropic conductive
terminal
conductive film
Prior art date
Application number
KR1020177015870A
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English (en)
Korean (ko)
Other versions
KR20170083113A (ko
Inventor
히로키 오제키
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20170083113A publication Critical patent/KR20170083113A/ko
Application granted granted Critical
Publication of KR102006090B1 publication Critical patent/KR102006090B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020177015870A 2015-01-22 2016-01-06 이방성 도전 필름 및 접속 방법 KR102006090B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015010310A JP6474620B2 (ja) 2015-01-22 2015-01-22 異方性導電フィルム、及び接続方法
JPJP-P-2015-010310 2015-01-22
PCT/JP2016/050191 WO2016117350A1 (ja) 2015-01-22 2016-01-06 異方性導電フィルム、及び接続方法

Publications (2)

Publication Number Publication Date
KR20170083113A KR20170083113A (ko) 2017-07-17
KR102006090B1 true KR102006090B1 (ko) 2019-07-31

Family

ID=56416899

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177015870A KR102006090B1 (ko) 2015-01-22 2016-01-06 이방성 도전 필름 및 접속 방법

Country Status (5)

Country Link
JP (1) JP6474620B2 (zh)
KR (1) KR102006090B1 (zh)
CN (1) CN107112658B (zh)
TW (1) TWI681694B (zh)
WO (1) WO2016117350A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6798165B2 (ja) 2016-07-06 2020-12-09 スズキ株式会社 車両用排気管のマウント装置
KR102351843B1 (ko) * 2017-06-07 2022-01-18 쇼와덴코머티리얼즈가부시끼가이샤 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
WO2019050012A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JPWO2019050006A1 (ja) * 2017-09-11 2020-08-20 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP6939542B2 (ja) * 2017-12-28 2021-09-22 株式会社オートネットワーク技術研究所 電気接続装置
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
JPWO2023276792A1 (zh) * 2021-07-01 2023-01-05

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103819A (ja) * 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3622792B2 (ja) * 1994-11-25 2005-02-23 日立化成工業株式会社 接続部材及び該接続部材を用いた電極の接続構造・接続方法
WO2005121266A1 (ja) * 2004-06-09 2005-12-22 Hitachi Chemical Co., Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4844003B2 (ja) * 2005-05-10 2011-12-21 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
US20100243303A1 (en) * 2006-08-22 2010-09-30 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
US20100221533A1 (en) * 2007-10-15 2010-09-02 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
JP2009277769A (ja) 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP5650611B2 (ja) * 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
JP2014192486A (ja) * 2013-03-28 2014-10-06 Dexerials Corp 回路部材の接続方法、及び接合体

Also Published As

Publication number Publication date
JP2016134366A (ja) 2016-07-25
CN107112658B (zh) 2019-07-12
JP6474620B2 (ja) 2019-02-27
CN107112658A (zh) 2017-08-29
TWI681694B (zh) 2020-01-01
WO2016117350A1 (ja) 2016-07-28
KR20170083113A (ko) 2017-07-17
TW201633863A (zh) 2016-09-16

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