JP6474620B2 - 異方性導電フィルム、及び接続方法 - Google Patents
異方性導電フィルム、及び接続方法 Download PDFInfo
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- JP6474620B2 JP6474620B2 JP2015010310A JP2015010310A JP6474620B2 JP 6474620 B2 JP6474620 B2 JP 6474620B2 JP 2015010310 A JP2015010310 A JP 2015010310A JP 2015010310 A JP2015010310 A JP 2015010310A JP 6474620 B2 JP6474620 B2 JP 6474620B2
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- Prior art keywords
- circuit member
- anisotropic conductive
- conductive film
- layer
- terminal
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
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| JP2015010310A JP6474620B2 (ja) | 2015-01-22 | 2015-01-22 | 異方性導電フィルム、及び接続方法 |
| CN201680005263.9A CN107112658B (zh) | 2015-01-22 | 2016-01-06 | 各向异性导电膜和连接方法 |
| KR1020177015870A KR102006090B1 (ko) | 2015-01-22 | 2016-01-06 | 이방성 도전 필름 및 접속 방법 |
| PCT/JP2016/050191 WO2016117350A1 (ja) | 2015-01-22 | 2016-01-06 | 異方性導電フィルム、及び接続方法 |
| TW105100817A TWI681694B (zh) | 2015-01-22 | 2016-01-12 | 各向異性導電薄膜、及其連接方法 |
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| JP2015010310A JP6474620B2 (ja) | 2015-01-22 | 2015-01-22 | 異方性導電フィルム、及び接続方法 |
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| JP2016134366A JP2016134366A (ja) | 2016-07-25 |
| JP2016134366A5 JP2016134366A5 (zh) | 2017-12-21 |
| JP6474620B2 true JP6474620B2 (ja) | 2019-02-27 |
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| JP (1) | JP6474620B2 (zh) |
| KR (1) | KR102006090B1 (zh) |
| CN (1) | CN107112658B (zh) |
| TW (1) | TWI681694B (zh) |
| WO (1) | WO2016117350A1 (zh) |
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| JP6798165B2 (ja) | 2016-07-06 | 2020-12-09 | スズキ株式会社 | 車両用排気管のマウント装置 |
| KR102351843B1 (ko) * | 2017-06-07 | 2022-01-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치 |
| WO2019050012A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
| JPWO2019050006A1 (ja) * | 2017-09-11 | 2020-08-20 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
| JP6939542B2 (ja) * | 2017-12-28 | 2021-09-22 | 株式会社オートネットワーク技術研究所 | 電気接続装置 |
| CN112210321A (zh) * | 2019-07-12 | 2021-01-12 | 臻鼎科技股份有限公司 | 导电粘着剂以及使用其的电磁波屏蔽膜和电路板 |
| JPWO2023276792A1 (zh) * | 2021-07-01 | 2023-01-05 |
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| JPH06103819A (ja) * | 1992-09-21 | 1994-04-15 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
| JP3622792B2 (ja) * | 1994-11-25 | 2005-02-23 | 日立化成工業株式会社 | 接続部材及び該接続部材を用いた電極の接続構造・接続方法 |
| WO2005121266A1 (ja) * | 2004-06-09 | 2005-12-22 | Hitachi Chemical Co., Ltd. | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
| JP4844003B2 (ja) * | 2005-05-10 | 2011-12-21 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
| US20100243303A1 (en) * | 2006-08-22 | 2010-09-30 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| US20100221533A1 (en) * | 2007-10-15 | 2010-09-02 | Hitachi Chemical Company, Ltd. | Circuit connecting adhesive film and circuit connecting structure |
| JP2009277769A (ja) | 2008-05-13 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
| JP5690648B2 (ja) * | 2011-04-28 | 2015-03-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法及び接続構造体 |
| JP5650611B2 (ja) * | 2011-08-23 | 2015-01-07 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体 |
| JP2014192486A (ja) * | 2013-03-28 | 2014-10-06 | Dexerials Corp | 回路部材の接続方法、及び接合体 |
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2016
- 2016-01-06 KR KR1020177015870A patent/KR102006090B1/ko active IP Right Grant
- 2016-01-06 WO PCT/JP2016/050191 patent/WO2016117350A1/ja active Application Filing
- 2016-01-06 CN CN201680005263.9A patent/CN107112658B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016134366A (ja) | 2016-07-25 |
| KR102006090B1 (ko) | 2019-07-31 |
| CN107112658B (zh) | 2019-07-12 |
| CN107112658A (zh) | 2017-08-29 |
| TWI681694B (zh) | 2020-01-01 |
| WO2016117350A1 (ja) | 2016-07-28 |
| KR20170083113A (ko) | 2017-07-17 |
| TW201633863A (zh) | 2016-09-16 |
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