KR101419147B1 - 구리합금 판재 및 그 제조방법 - Google Patents
구리합금 판재 및 그 제조방법 Download PDFInfo
- Publication number
- KR101419147B1 KR101419147B1 KR1020127012528A KR20127012528A KR101419147B1 KR 101419147 B1 KR101419147 B1 KR 101419147B1 KR 1020127012528 A KR1020127012528 A KR 1020127012528A KR 20127012528 A KR20127012528 A KR 20127012528A KR 101419147 B1 KR101419147 B1 KR 101419147B1
- Authority
- KR
- South Korea
- Prior art keywords
- orientation
- copper alloy
- heat treatment
- temperature
- alloy sheet
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009274994 | 2009-12-02 | ||
JPJP-P-2009-274994 | 2009-12-02 | ||
PCT/JP2010/071518 WO2011068135A1 (ja) | 2009-12-02 | 2010-12-01 | 銅合金板材およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120104544A KR20120104544A (ko) | 2012-09-21 |
KR101419147B1 true KR101419147B1 (ko) | 2014-07-11 |
Family
ID=44114981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127012528A KR101419147B1 (ko) | 2009-12-02 | 2010-12-01 | 구리합금 판재 및 그 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120267013A1 (zh) |
EP (1) | EP2508635B1 (zh) |
JP (1) | JP4885332B2 (zh) |
KR (1) | KR101419147B1 (zh) |
CN (1) | CN102695811B (zh) |
WO (1) | WO2011068135A1 (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120104553A (ko) * | 2009-12-02 | 2012-09-21 | 후루카와 덴키 고교 가부시키가이샤 | 저영율을 갖는 구리합금판재 및 그 제조법 |
TWI441931B (zh) | 2010-05-14 | 2014-06-21 | Mitsubishi Materials Corp | 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材 |
JP4987155B1 (ja) * | 2011-03-09 | 2012-07-25 | Jx日鉱日石金属株式会社 | Cu−Ni−Si系合金及びその製造方法 |
CN103732767B (zh) * | 2011-08-05 | 2016-08-31 | 古河电气工业株式会社 | 二次电池集电体用压延铜箔及其制造方法 |
JP5117604B1 (ja) * | 2011-08-29 | 2013-01-16 | Jx日鉱日石金属株式会社 | Cu−Ni−Si系合金及びその製造方法 |
JP5995421B2 (ja) * | 2011-10-11 | 2016-09-21 | 古河電気工業株式会社 | 銅合金条およびその製造方法 |
JP6246454B2 (ja) * | 2011-11-02 | 2017-12-13 | Jx金属株式会社 | Cu−Ni−Si系合金及びその製造方法 |
JP5903838B2 (ja) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
JP5903842B2 (ja) * | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
JP5916418B2 (ja) * | 2012-02-13 | 2016-05-11 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
JP5610643B2 (ja) * | 2012-03-28 | 2014-10-22 | Jx日鉱日石金属株式会社 | Cu−Ni−Si系銅合金条及びその製造方法 |
JP6126791B2 (ja) * | 2012-04-24 | 2017-05-10 | Jx金属株式会社 | Cu−Ni−Si系銅合金 |
ES2593624T3 (es) * | 2012-10-10 | 2016-12-12 | Kme Germany Gmbh & Co. Kg | Material para componentes de contacto eléctrico |
KR101274063B1 (ko) * | 2013-01-22 | 2013-06-12 | 한국기계연구원 | 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법 |
WO2015146981A1 (ja) * | 2014-03-25 | 2015-10-01 | 古河電気工業株式会社 | 銅合金板材、コネクタ、および銅合金板材の製造方法 |
JP6317967B2 (ja) * | 2014-03-25 | 2018-04-25 | Dowaメタルテック株式会社 | Cu−Ni−Co−Si系銅合金板材およびその製造方法並びに通電部品 |
KR20160117210A (ko) | 2015-03-30 | 2016-10-10 | 제이엑스금속주식회사 | Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법 |
CN107406915B (zh) * | 2015-05-20 | 2019-07-05 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
CN105088010B (zh) * | 2015-08-31 | 2017-08-25 | 河南科技大学 | 一种高强高导稀土铜锆合金及其制备方法 |
JP2017089003A (ja) * | 2015-11-03 | 2017-05-25 | 株式会社神戸製鋼所 | 放熱部品用銅合金板 |
JP6618945B2 (ja) * | 2017-03-24 | 2019-12-11 | Jx金属株式会社 | 電子材料用銅合金 |
JP7145847B2 (ja) * | 2017-04-26 | 2022-10-03 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
CN107794406B (zh) * | 2017-10-16 | 2019-05-17 | 北京科技大学 | 一种高强高导铜镍硅合金的生产工艺 |
JP2019077889A (ja) * | 2017-10-19 | 2019-05-23 | Jx金属株式会社 | 電子材料用銅合金 |
KR101875806B1 (ko) * | 2017-11-28 | 2018-08-02 | 주식회사 풍산 | 자동차 및 전자부품용 구리-티타늄계 동합금재의 제조 방법 및 이로부터 제조된 동합금재 |
KR101875807B1 (ko) * | 2018-03-14 | 2018-07-06 | 주식회사 풍산 | 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법 |
CN111918746B (zh) * | 2018-03-29 | 2022-06-17 | 古河电气工业株式会社 | 包层材料及其制造方法 |
JP6629400B1 (ja) * | 2018-08-30 | 2020-01-15 | Jx金属株式会社 | 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法 |
KR102021442B1 (ko) * | 2019-07-26 | 2019-09-16 | 주식회사 풍산 | 강도와 도전율이 우수한 동합금 판재의 제조 방법 및 이로부터 제조된 동합금 판재 |
CN112030030B (zh) * | 2020-08-06 | 2021-09-10 | 国网江西省电力有限公司电力科学研究院 | 一种高强高导铜合金线材及其制备方法 |
CN112410611A (zh) * | 2020-11-10 | 2021-02-26 | 北京中超伟业信息安全技术股份有限公司 | 一种用于安全加密芯片引线框架的铜合金板材及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006152392A (ja) | 2004-11-30 | 2006-06-15 | Kobe Steel Ltd | 曲げ加工性に優れた高強度銅合金板およびその製造方法 |
JP2006283059A (ja) | 2005-03-31 | 2006-10-19 | Kobe Steel Ltd | 曲げ加工性に優れた高強度銅合金板及びその製造方法 |
JP2008075172A (ja) | 2006-09-25 | 2008-04-03 | Nikko Kinzoku Kk | Cu−Ni−Si系合金 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6187838A (ja) * | 1984-10-03 | 1986-05-06 | Kobe Steel Ltd | 熱間加工性の優れた銅合金 |
US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
JP3739214B2 (ja) | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | 電子部品用銅合金板 |
JP4809602B2 (ja) | 2004-05-27 | 2011-11-09 | 古河電気工業株式会社 | 銅合金 |
JP4166197B2 (ja) | 2004-06-30 | 2008-10-15 | 日鉱金属株式会社 | BadWayの曲げ加工性が優れたCu−Ni−Si系銅合金条 |
JP4408275B2 (ja) | 2005-09-29 | 2010-02-03 | 日鉱金属株式会社 | 強度と曲げ加工性に優れたCu−Ni−Si系合金 |
JP5028657B2 (ja) | 2006-07-10 | 2012-09-19 | Dowaメタルテック株式会社 | 異方性の少ない高強度銅合金板材およびその製造法 |
CN100584975C (zh) * | 2006-11-23 | 2010-01-27 | 北京有色金属研究总院 | 一种铜基合金及其制备方法 |
EP1967596B1 (en) * | 2007-02-13 | 2010-06-16 | Dowa Metaltech Co., Ltd. | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
US20080190523A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
JP4981748B2 (ja) | 2007-05-31 | 2012-07-25 | 古河電気工業株式会社 | 電気・電子機器用銅合金 |
JP5050753B2 (ja) * | 2007-09-20 | 2012-10-17 | 日立電線株式会社 | めっき性に優れた電気・電子部品用銅合金の製造方法 |
US8444779B2 (en) * | 2007-09-28 | 2013-05-21 | JX Nippon Mining & Metals Co., Ltd. | Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing same |
JP4968533B2 (ja) * | 2007-11-30 | 2012-07-04 | 日立電線株式会社 | 電気・電子部品用銅合金材 |
EP2298945B1 (en) * | 2008-06-03 | 2014-08-20 | The Furukawa Electric Co., Ltd. | Copper alloy sheet material and manufacturing method thereof |
KR20120104553A (ko) * | 2009-12-02 | 2012-09-21 | 후루카와 덴키 고교 가부시키가이샤 | 저영율을 갖는 구리합금판재 및 그 제조법 |
-
2010
- 2010-12-01 KR KR1020127012528A patent/KR101419147B1/ko active IP Right Grant
- 2010-12-01 WO PCT/JP2010/071518 patent/WO2011068135A1/ja active Application Filing
- 2010-12-01 JP JP2011513178A patent/JP4885332B2/ja active Active
- 2010-12-01 EP EP10834585.1A patent/EP2508635B1/en active Active
- 2010-12-01 CN CN201080051567.1A patent/CN102695811B/zh active Active
-
2012
- 2012-06-01 US US13/486,903 patent/US20120267013A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006152392A (ja) | 2004-11-30 | 2006-06-15 | Kobe Steel Ltd | 曲げ加工性に優れた高強度銅合金板およびその製造方法 |
JP2006283059A (ja) | 2005-03-31 | 2006-10-19 | Kobe Steel Ltd | 曲げ加工性に優れた高強度銅合金板及びその製造方法 |
JP2008075172A (ja) | 2006-09-25 | 2008-04-03 | Nikko Kinzoku Kk | Cu−Ni−Si系合金 |
Also Published As
Publication number | Publication date |
---|---|
EP2508635A1 (en) | 2012-10-10 |
JP4885332B2 (ja) | 2012-02-29 |
CN102695811B (zh) | 2014-04-02 |
KR20120104544A (ko) | 2012-09-21 |
WO2011068135A1 (ja) | 2011-06-09 |
JPWO2011068135A1 (ja) | 2013-04-18 |
CN102695811A (zh) | 2012-09-26 |
EP2508635A4 (en) | 2015-11-25 |
US20120267013A1 (en) | 2012-10-25 |
EP2508635B1 (en) | 2017-08-23 |
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