KR101419147B1 - 구리합금 판재 및 그 제조방법 - Google Patents

구리합금 판재 및 그 제조방법 Download PDF

Info

Publication number
KR101419147B1
KR101419147B1 KR1020127012528A KR20127012528A KR101419147B1 KR 101419147 B1 KR101419147 B1 KR 101419147B1 KR 1020127012528 A KR1020127012528 A KR 1020127012528A KR 20127012528 A KR20127012528 A KR 20127012528A KR 101419147 B1 KR101419147 B1 KR 101419147B1
Authority
KR
South Korea
Prior art keywords
orientation
copper alloy
heat treatment
temperature
alloy sheet
Prior art date
Application number
KR1020127012528A
Other languages
English (en)
Korean (ko)
Other versions
KR20120104544A (ko
Inventor
히로시 가네코
고지 사토
다쓰히코 에구치
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20120104544A publication Critical patent/KR20120104544A/ko
Application granted granted Critical
Publication of KR101419147B1 publication Critical patent/KR101419147B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020127012528A 2009-12-02 2010-12-01 구리합금 판재 및 그 제조방법 KR101419147B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009274994 2009-12-02
JPJP-P-2009-274994 2009-12-02
PCT/JP2010/071518 WO2011068135A1 (ja) 2009-12-02 2010-12-01 銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
KR20120104544A KR20120104544A (ko) 2012-09-21
KR101419147B1 true KR101419147B1 (ko) 2014-07-11

Family

ID=44114981

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127012528A KR101419147B1 (ko) 2009-12-02 2010-12-01 구리합금 판재 및 그 제조방법

Country Status (6)

Country Link
US (1) US20120267013A1 (zh)
EP (1) EP2508635B1 (zh)
JP (1) JP4885332B2 (zh)
KR (1) KR101419147B1 (zh)
CN (1) CN102695811B (zh)
WO (1) WO2011068135A1 (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120104553A (ko) * 2009-12-02 2012-09-21 후루카와 덴키 고교 가부시키가이샤 저영율을 갖는 구리합금판재 및 그 제조법
TWI441931B (zh) 2010-05-14 2014-06-21 Mitsubishi Materials Corp 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材
JP4987155B1 (ja) * 2011-03-09 2012-07-25 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
CN103732767B (zh) * 2011-08-05 2016-08-31 古河电气工业株式会社 二次电池集电体用压延铜箔及其制造方法
JP5117604B1 (ja) * 2011-08-29 2013-01-16 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5995421B2 (ja) * 2011-10-11 2016-09-21 古河電気工業株式会社 銅合金条およびその製造方法
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) * 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP5916418B2 (ja) * 2012-02-13 2016-05-11 古河電気工業株式会社 銅合金板材およびその製造方法
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
JP5610643B2 (ja) * 2012-03-28 2014-10-22 Jx日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条及びその製造方法
JP6126791B2 (ja) * 2012-04-24 2017-05-10 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金
ES2593624T3 (es) * 2012-10-10 2016-12-12 Kme Germany Gmbh & Co. Kg Material para componentes de contacto eléctrico
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
WO2015146981A1 (ja) * 2014-03-25 2015-10-01 古河電気工業株式会社 銅合金板材、コネクタ、および銅合金板材の製造方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
KR20160117210A (ko) 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법
CN107406915B (zh) * 2015-05-20 2019-07-05 古河电气工业株式会社 铜合金板材及其制造方法
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
JP2017089003A (ja) * 2015-11-03 2017-05-25 株式会社神戸製鋼所 放熱部品用銅合金板
JP6618945B2 (ja) * 2017-03-24 2019-12-11 Ｊｘ金属株式会社 電子材料用銅合金
JP7145847B2 (ja) * 2017-04-26 2022-10-03 古河電気工業株式会社 銅合金板材およびその製造方法
CN107794406B (zh) * 2017-10-16 2019-05-17 北京科技大学 一种高强高导铜镍硅合金的生产工艺
JP2019077889A (ja) * 2017-10-19 2019-05-23 Ｊｘ金属株式会社 電子材料用銅合金
KR101875806B1 (ko) * 2017-11-28 2018-08-02 주식회사 풍산 자동차 및 전자부품용 구리-티타늄계 동합금재의 제조 방법 및 이로부터 제조된 동합금재
KR101875807B1 (ko) * 2018-03-14 2018-07-06 주식회사 풍산 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법
CN111918746B (zh) * 2018-03-29 2022-06-17 古河电气工业株式会社 包层材料及其制造方法
JP6629400B1 (ja) * 2018-08-30 2020-01-15 Ｊｘ金属株式会社 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法
KR102021442B1 (ko) * 2019-07-26 2019-09-16 주식회사 풍산 강도와 도전율이 우수한 동합금 판재의 제조 방법 및 이로부터 제조된 동합금 판재
CN112030030B (zh) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 一种高强高导铜合金线材及其制备方法
CN112410611A (zh) * 2020-11-10 2021-02-26 北京中超伟业信息安全技术股份有限公司 一种用于安全加密芯片引线框架的铜合金板材及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152392A (ja) 2004-11-30 2006-06-15 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP2006283059A (ja) 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2008075172A (ja) 2006-09-25 2008-04-03 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ系合金

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187838A (ja) * 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
US5486244A (en) * 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP4809602B2 (ja) 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4166197B2 (ja) 2004-06-30 2008-10-15 日鉱金属株式会社 ＢａｄＷａｙの曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP4408275B2 (ja) 2005-09-29 2010-02-03 日鉱金属株式会社 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
JP5028657B2 (ja) 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 異方性の少ない高強度銅合金板材およびその製造法
CN100584975C (zh) * 2006-11-23 2010-01-27 北京有色金属研究总院 一种铜基合金及其制备方法
EP1967596B1 (en) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4981748B2 (ja) 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
JP5050753B2 (ja) * 2007-09-20 2012-10-17 日立電線株式会社 めっき性に優れた電気・電子部品用銅合金の製造方法
US8444779B2 (en) * 2007-09-28 2013-05-21 JX Nippon Mining & Metals Co., Ltd. Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing same
JP4968533B2 (ja) * 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
EP2298945B1 (en) * 2008-06-03 2014-08-20 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof
KR20120104553A (ko) * 2009-12-02 2012-09-21 후루카와 덴키 고교 가부시키가이샤 저영율을 갖는 구리합금판재 및 그 제조법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152392A (ja) 2004-11-30 2006-06-15 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP2006283059A (ja) 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2008075172A (ja) 2006-09-25 2008-04-03 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ系合金

Also Published As

Publication number Publication date
EP2508635A1 (en) 2012-10-10
JP4885332B2 (ja) 2012-02-29
CN102695811B (zh) 2014-04-02
KR20120104544A (ko) 2012-09-21
WO2011068135A1 (ja) 2011-06-09
JPWO2011068135A1 (ja) 2013-04-18
CN102695811A (zh) 2012-09-26
EP2508635A4 (en) 2015-11-25
US20120267013A1 (en) 2012-10-25
EP2508635B1 (en) 2017-08-23

Similar Documents

Publication Publication Date Title
KR101419147B1 (ko) 구리합금 판재 및 그 제조방법
KR101419145B1 (ko) 구리합금 판재, 이를 이용한 커넥터, 및 이를 제조하는 구리합금 판재의 제조방법
JP5170916B2 (ja) 銅合金板材及びその製造方法
JP4875768B2 (ja) 銅合金板材およびその製造方法
KR101577877B1 (ko) 구리합금 판재의 제조방법
KR101747475B1 (ko) 구리합금 판재 및 그 제조방법
KR101935987B1 (ko) 구리합금 판재, 구리합금 판재로 이루어지는 커넥터, 및 구리합금 판재의 제조방법
JP5773929B2 (ja) 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
TW201406971A (zh) 銅合金板材及其製造方法
KR20120104548A (ko) 구리합금판재
EP2333128A1 (en) Copper alloy material for electrical/electronic component
JP5261619B2 (ja) 銅合金板材およびその製造方法
JP5117602B1 (ja) たわみ係数が低く、曲げ加工性に優れる銅合金板材

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180618

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20190618

Year of fee payment: 6