KR100801401B1 - 접착제 및 접착 필름 - Google Patents
접착제 및 접착 필름 Download PDFInfo
- Publication number
- KR100801401B1 KR100801401B1 KR1020050068240A KR20050068240A KR100801401B1 KR 100801401 B1 KR100801401 B1 KR 100801401B1 KR 1020050068240 A KR1020050068240 A KR 1020050068240A KR 20050068240 A KR20050068240 A KR 20050068240A KR 100801401 B1 KR100801401 B1 KR 100801401B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- conductive particles
- semiconductor element
- film
- wiring board
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 108
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 106
- 239000002313 adhesive film Substances 0.000 title abstract description 31
- 239000002245 particle Substances 0.000 claims abstract description 118
- 239000004065 semiconductor Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract description 22
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- 239000006185 dispersion Substances 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000013034 phenoxy resin Substances 0.000 description 3
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- -1 polyethylene terephthalate Polymers 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
평균 입 경 (nm) | 입자 함 유량 (vol%) | 비표면적 (㎡/g) | 점도(Pa·s) | 입자 분산 | 도통저항 | 단락시험 | 종합 평가 | ||
고온고습시험전 | 고온고습시험후 | ||||||||
실시예1 | 10 | 2.0 | 69.4 | 150 | ○ | ○ | ○ | ○ | ○ |
실시예2 | 35 | 2.0 | 18.9 | 85 | ○ | ○ | ○ | ○ | ○ |
실시예3 | 50 | 2.0 | 13.2 | 60 | ○ | ○ | ○ | ○ | ○ |
실시예4 | 90 | 2.0 | 7.3 | 48 | ○ | ○ | ○ | ○ | ○ |
실시예5 | 50 | 0.2 | 13.2 | 15 | ○ | ○ | ○ | ○ | ○ |
실시예6 | 50 | 10 | 13.2 | 520 | ○ | ○ | ○ | ○ | ○ |
비교예1 | 5 | 2.0 | 85.2 | 360 | ○ | △ | × | ○ | × |
비교예2 | 100 | 2.0 | 4.0 | 13 | × | ○ | ○ | × | × |
비교예3 | 2000 | 2.0 | 0.68 | 11 | × | ○ | ○ | × | × |
비교예4 | 50 | 0.1 | 13.2 | 14 | ○ | ○ | × | ○ | × |
비교예5 | 50 | 12 | 13.2 | 1100 | ○ | ○ | ○ | × | × |
금속 종류 | 평균 입경 (nm) | 입자 함유량 (vol%) | 비표면적 (㎡/g) | 도통저항 | 단락 시험 | 종합평가 | ||
고온고습시험전 | 고온고습시험후 | |||||||
실시예7 | Pd | 60 | 4.0 | 9.5 | ○ | ○ | ○ | ○ |
실시예8 | Cu | 65 | 4.0 | 10.3 | ○ | ○ | ○ | ○ |
실시예9 | Fe | 70 | 4.0 | 10.8 | ○ | ○ | ○ | ○ |
실시예10 | Ag | 90 | 4.0 | 6.4 | ○ | ○ | ○ | ○ |
Claims (5)
- 절연성 접착 성분과 이 절연성 접착 성분 중에 분산된 도전성 입자를 갖는 접착제로서,상기 도전성 입자의 평균 입경은 10 nm 이상 90 nm 이하이고,상기 절연성 접착 성분과 상기 도전성 입자를 합계한 체적을 100으로 한 경우에, 상기 접착제에 포함되는 상기 도전성 입자의 합계 체적은 0.1을 초과하고 12 미만이며,25 ℃에서의 점도가 15 Paㆍs 이상 1000 Paㆍs 이하인 접착제.
- 제1항에 있어서, 상기 도전성 입자는 니켈, 팔라듐, 구리, 철, 은으로 이루어지는 군에서 선택된 1 종 이상의 금속을 주성분으로 하는 것인 접착제.
- 제1항에 있어서, 상기 절연성 접착 성분은 에폭시 수지와 이미다졸계 잠재성 경화제를 함유하는 것인 접착제.
- 절연성 접착 성분과 이 절연성 접착 성분 중에 분산된 도전성 입자를 가지며,상기 도전성 입자의 평균 직경은 10 nm 이상 90 nm 이하이고,상기 절연성 접착 성분과 상기 도전성 입자를 합계한 체적을 100으로 한 경우에, 상기 접착제에 포함되는 상기 도전성 입자의 합계 체적은 0.1을 초과하고 12 미만인 접착제가 필름상으로 성형되어 이루어지는 접착 필름.
- 반도체 소자와 배선판을 갖고,상기 반도체 소자는 접착제 경화물에 의해 상기 배선판에 접속되고,상기 접착제 경화물은 절연성 접착 성분과 이 절연성 접착 성분 중에 분산된 도전성 입자를 갖는 접착제가 경화하여 형성된 전자 장치로서,상기 도전성 입자의 평균 직경은 10 nm 이상 90 nm 이하이고,상기 절연성 접착 성분과 상기 도전성 입자를 합계한 체적을 100으로 한 경우에, 상기 접착제에 포함되는 상기 도전성 입자의 합계 체적은 0.1을 초과하고 12 미만이고, 상기 접착제의 25 ℃에서의 점도가 15 Paㆍs 이상 1000 Paㆍs 이하인 전자 장치.
Applications Claiming Priority (2)
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JP2000314595A JP3851767B2 (ja) | 2000-10-16 | 2000-10-16 | 接着フィルム、及び接着フィルムの製造方法 |
JPJP-P-2000-00314595 | 2000-10-16 |
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KR10-2001-0063314A Division KR100538503B1 (ko) | 2000-10-16 | 2001-10-15 | 접착제 및 접착 필름 |
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KR1020050068240A KR100801401B1 (ko) | 2000-10-16 | 2005-07-27 | 접착제 및 접착 필름 |
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US (1) | US6452111B1 (ko) |
JP (1) | JP3851767B2 (ko) |
KR (2) | KR100538503B1 (ko) |
CN (1) | CN1252206C (ko) |
TW (1) | TW518611B (ko) |
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US20040140122A1 (en) * | 2001-05-17 | 2004-07-22 | Rainer Moll | Product comprising a substrate and a chip attached to the substrate |
DE102004029589A1 (de) * | 2004-06-18 | 2005-12-29 | Tesa Ag | Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper |
JP2006169288A (ja) * | 2004-12-13 | 2006-06-29 | Tdk Corp | 接着剤、および、薄板の平板への接着方法 |
JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
JP5099289B2 (ja) * | 2006-02-03 | 2012-12-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱硬化型接着剤 |
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
TW200907003A (en) * | 2007-07-03 | 2009-02-16 | Hitachi Chemical Co Ltd | Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an |
JP4998732B2 (ja) * | 2007-10-22 | 2012-08-15 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接着剤 |
JP2009186707A (ja) * | 2008-02-06 | 2009-08-20 | Seiko Epson Corp | 電気光学装置の製造方法、電気光学装置 |
KR100880669B1 (ko) | 2008-07-08 | 2009-02-10 | 주식회사 제이미크론 | 플렉시블 평면 케이블의 제조방법 |
DE102008034952B4 (de) * | 2008-07-26 | 2016-05-19 | Semikron Elektronik Gmbh & Co. Kg | Edelmetallverbindungsmittel und Verwendungsverfahren hierzu |
KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
JP6061443B2 (ja) | 2010-12-24 | 2017-01-18 | デクセリアルズ株式会社 | 異方性導電接着フィルム、接続構造体及びその製造方法 |
JP5741809B2 (ja) * | 2011-02-22 | 2015-07-01 | 三菱マテリアル株式会社 | 接合用ペースト、および半導体素子と基板の接合方法 |
CN110190042A (zh) * | 2019-06-26 | 2019-08-30 | 云谷(固安)科技有限公司 | 绑定结构、绑定方法、显示面板及显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960012041A (ko) * | 1994-09-30 | 1996-04-20 | 이방성 도전 필름 | |
KR970074883A (ko) * | 1996-05-28 | 1997-12-10 | 이웅열 | 이방도전성 필름제조방법 |
KR19990011487A (ko) * | 1997-07-23 | 1999-02-18 | 손욱 | 투명도전성 조성물, 이로부터 형성된 투명도전막 및 그 제조방법 |
KR20000052888A (ko) * | 1996-11-01 | 2000-08-25 | 이사오 우치가사키 | 전자부품장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
US6223429B1 (en) * | 1995-06-13 | 2001-05-01 | Hitachi Chemical Company, Ltd. | Method of production of semiconductor device |
US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
JP3372511B2 (ja) * | 1999-08-09 | 2003-02-04 | ソニーケミカル株式会社 | 半導体素子の実装方法及び実装装置 |
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---|---|---|---|---|
KR960012041A (ko) * | 1994-09-30 | 1996-04-20 | 이방성 도전 필름 | |
KR970074883A (ko) * | 1996-05-28 | 1997-12-10 | 이웅열 | 이방도전성 필름제조방법 |
KR20000052888A (ko) * | 1996-11-01 | 2000-08-25 | 이사오 우치가사키 | 전자부품장치 |
KR19990011487A (ko) * | 1997-07-23 | 1999-02-18 | 손욱 | 투명도전성 조성물, 이로부터 형성된 투명도전막 및 그 제조방법 |
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KR20020034865A (ko) | 2002-05-09 |
JP2002124128A (ja) | 2002-04-26 |
KR100538503B1 (ko) | 2005-12-23 |
KR20050088946A (ko) | 2005-09-07 |
US6452111B1 (en) | 2002-09-17 |
TW518611B (en) | 2003-01-21 |
US20020070048A1 (en) | 2002-06-13 |
CN1252206C (zh) | 2006-04-19 |
JP3851767B2 (ja) | 2006-11-29 |
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