KR100638379B1 - 집적회로의 컨택 제조 및 하우징 공정 - Google Patents

집적회로의 컨택 제조 및 하우징 공정 Download PDF

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KR100638379B1
KR100638379B1 KR1020047002747A KR20047002747A KR100638379B1 KR 100638379 B1 KR100638379 B1 KR 100638379B1 KR 1020047002747 A KR1020047002747 A KR 1020047002747A KR 20047002747 A KR20047002747 A KR 20047002747A KR 100638379 B1 KR100638379 B1 KR 100638379B1
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contact
chip
covering
wafer
substrate material
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KR1020047002747A
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English (en)
Korean (ko)
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KR20040036735A (ko
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비익플로리안
레이브유르겐
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쇼오트 아게
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Priority claimed from DE2001141571 external-priority patent/DE10141571B8/de
Priority claimed from DE10225373A external-priority patent/DE10225373A1/de
Application filed by 쇼오트 아게 filed Critical 쇼오트 아게
Publication of KR20040036735A publication Critical patent/KR20040036735A/ko
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    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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