JPWO2019093188A1 - 光電変換素子および撮像装置 - Google Patents
光電変換素子および撮像装置 Download PDFInfo
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- JPWO2019093188A1 JPWO2019093188A1 JP2019552731A JP2019552731A JPWO2019093188A1 JP WO2019093188 A1 JPWO2019093188 A1 JP WO2019093188A1 JP 2019552731 A JP2019552731 A JP 2019552731A JP 2019552731 A JP2019552731 A JP 2019552731A JP WO2019093188 A1 JPWO2019093188 A1 JP WO2019093188A1
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- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
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- 150000003230 pyrimidines Chemical class 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 150000003252 quinoxalines Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229910003451 terbium oxide Inorganic materials 0.000 description 1
- SCRZPWWVSXWCMC-UHFFFAOYSA-N terbium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Tb+3].[Tb+3] SCRZPWWVSXWCMC-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 150000007979 thiazole derivatives Chemical class 0.000 description 1
- 125000004001 thioalkyl group Chemical group 0.000 description 1
- 125000005000 thioaryl group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical class C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- 125000005259 triarylamine group Chemical group 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910003454 ytterbium oxide Inorganic materials 0.000 description 1
- 229940075624 ytterbium oxide Drugs 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
1.実施の形態(一般式(1)で表されるBBBT誘導体を含む有機光電変換層を備えた光電変換素子)
1−1.光電変換素子の構成
1−2.光電変換素子の製造方法
1−3.作用・効果
2.変形例
2−1.変形例1(複数の有機光電変換部が積層された光電変換素子)
2−2.変形例2(太陽電池)
3.適用例
4.実施例
図1は、本開示の一実施の形態の光電変換素子(光電変換素子10)の断面構成を表したものである。光電変換素子10は、例えば、裏面照射型(裏面受光型)のCCD(Charge Coupled Device)イメージセンサまたはCMOS(Complementary Metal Oxide Semiconductor)イメージセンサ等の撮像装置(撮像装置1)において1つの画素(単位画素P)を構成する撮像素子として用いられるものである(図8参照)。光電変換素子10は、それぞれ異なる波長域の光を選択的に検出して光電変換を行う1つの有機光電変換部11Gと、2つの無機光電変換部11B,11Rとが縦方向に積層された、いわゆる縦方向分光型のものである。本実施の形態では、有機光電変換部11Gを構成する有機光電変換層16が、一般式(1)(後出)で表される有機半導体材料(例えば、ベンゾビスベンゾチオフェン(BBBT)誘導体)を少なくとも1種含んで形成された構成を有する。
光電変換素子10は、単位画素P毎に、1つの有機光電変換部11Gと、2つの無機光電変換部11B,11Rとが縦方向に積層されたものである。有機光電変換部11Gは、半導体基板11の裏面(第1面11S1)側に設けられている。無機光電変換部11B,11Rは、半導体基板11内に埋め込み形成されており、半導体基板11の厚み方向に積層されている。有機光電変換部11Gは、p型半導体およびn型半導体を含んで構成され、層内にバルクヘテロ接合構造を有する有機光電変換層16を含む。バルクヘテロ接合構造は、p型半導体およびn型半導体が混ざり合うことで形成されたp/n接合面である。
本実施の形態の光電変換素子10は、例えば、次のようにして製造することができる。
光電変換素子10へ入射した光のうち、まず、緑色光が、有機光電変換部11Gにおいて選択的に検出(吸収)され、光電変換される。
続いて、有機光電変換部11Gを透過した光のうち、青色光は無機光電変換部11B、赤色光は無機光電変換部11Rにおいて、それぞれ順に吸収され、光電変換される。無機光電変換部11Bでは、入射した青色光に対応した電子が無機光電変換部11Bのn領域に蓄積され、蓄積された電子は、縦型トランジスタTr1によりフローティングディフュージョンFD1へと転送される。同様に、無機光電変換部11Rでは、入射した赤色光に対応した電子が無機光電変換部11Rのn領域に蓄積され、蓄積された電子は、転送トランジスタTr2によりフローティングディフュージョンFD2へと転送される。
前述したように、近年、有機薄膜を用いた様々なデバイスの開発が行われている。有機光電変換素子はその一つであり、これを用いた有機薄膜太陽電池や撮像素子が提案されている。特に撮像素子は、デジタルカメラ、ビデオカムコーダの他に、スマートフォン用カメラ、監視向けカメラ、自動車用のバックモニター、衝突防止用センサとしても応用が拡がり、注目されている。このため、撮像素子を構成する有機光電変換素子には、何れの用途にも対応できるように、性能の向上が求められている。具体的には、光電変換効率に加えて、優れた暗電流特性および残像特性が求められている。
(2−1.変形例1)
図6は、本開示の変形例(変形例1)に係る光電変換素子(光電変換素子20)の断面構成を表したものである。光電変換素子20は、上記実施の形態等の光電変換素子10と同様に、例えば、裏面照射型のCCDイメージセンサまたはCMOSイメージセンサ等の撮像装置(撮像装置1)において1つの単位画素Pを構成する撮像素子である。本変形例の光電変換素子20は、シリコン基板81上に絶縁層82を介して赤色光電変換部40R、緑色光電変換部40Gおよび青色光電変換部40Bがこの順に積層された構成を有する、所謂縦分光方式の撮像素子である。
図7は、本開示の変形例(変形例2)に係る光電変換素子30A,30Bを備えた有機太陽電池モジュール(太陽電池30)の断面構成の一例を表したものである。本変形例の光電変換素子30A,30Bは、それぞれ、基板91上に、透明電極92、正孔輸送層93、有機光電変換層94、電子輸送層95および対向電極96がこの順に積層された構成を有する。本変形例の光電変換素子30A,30Bは、有機光電変換層94が、上記一般式(1)で表される有機半導体材料(例えば、BBBT誘導体)を含んで形成された構成を有する。
(適用例1)
図8は、例えば、上記実施の形態において説明した光電変換素子10を各画素に用いた撮像装置1の全体構成を表したものである。この撮像装置1は、CMOSイメージセンサであり、半導体基板11上に、撮像エリアとしての画素部1aを有すると共に、この画素部1aの周辺領域に、例えば、行走査部131、水平選択部133、列走査部134およびシステム制御部132からなる周辺回路部130を有している。
上述の撮像装置1は、例えば、デジタルスチルカメラやビデオカメラ等のカメラシステムや、撮像機能を有する携帯電話等、撮像機能を備えたあらゆるタイプの電子機器(撮像装置)に適用することができる。図9に、その一例として、カメラ2の概略構成を示す。このカメラ2は、例えば、静止画または動画を撮影可能なビデオカメラであり、撮像装置1と、光学系(光学レンズ)310と、シャッタ装置311と、撮像装置1およびシャッタ装置311を駆動する駆動部313と、信号処理部312とを有する。
<体内情報取得システムへの応用例>
更に、本開示に係る技術(本技術)は、様々な製品へ応用することができる。例えば、本開示に係る技術は、内視鏡手術システムに適用されてもよい。
<4.内視鏡手術システムへの応用例>
本開示に係る技術(本技術)は、様々な製品へ応用することができる。例えば、本開示に係る技術は、内視鏡手術システムに適用されてもよい。
<移動体への応用例>
本開示に係る技術は、様々な製品へ応用することができる。例えば、本開示に係る技術は、自動車、電気自動車、ハイブリッド電気自動車、自動二輪車、自転車、パーソナルモビリティ、飛行機、ドローン、船舶、ロボット、建設機械、農業機械(トラクター)などのいずれかの種類の移動体に搭載される装置として実現されてもよい。
次に、本開示の実施例について詳細に説明する。
(評価用素子の作製)
まず、有機光電変換層に用いる材料として、下記に示した合成スキーム(化7)にて式(5)で表されるBBBT誘導体(BBBT−1)を合成した。また、有機光電変換層に用いる材料として、下記に示した合成スキーム(化8)にて上記式(1−1)に示したBBBT誘導体(BBBT−2)を合成した。得られた化合物BBBT−1,BBBT−2の粗体をそれぞれ昇華精製した。
続いて、化合物BBBT−1を用いて、図15に示した断面構成を有する光電変換素子を以下の方法を用いて作製した。まず、スパッタ装置にて、石英基板111上にITO膜を120nmの厚さに成膜したのち、フォトマスクを用いたリソグラフィー技術を用いてパターニングして下部電極112を形成した。続いて、石英基板111および下部電極112上に絶縁層113を形成し、リソグラフィー技術を用いて1mm角の下部電極112が露出する開口を形成したのち、中性洗剤、アセトンおよびエタノールを用いて順次、超音波洗浄した。この石英基板111を乾燥後、10分間のUV/オゾン(O3)処理を行った。次いで、シャドーマスクを用いた真空蒸着成膜にて、化合物BBBT−1、下記式(4−1)に示したフッ素化サブフタロシアニンクロライド(F6−SubPc−OC6F5)および下記式(2−1)に示したC60フラーレンを蒸着速度比4:4:2で共蒸着し、厚さ230nmの有機光電変換層114を成膜した。続いて、バッファ層115として、下記式(6)に示したB4PyMPMを5nmの厚みとなるように成膜した。次いで、バッファ層115上に、上部電極116としてAl−Si−Cu合金を厚み100nmとなるように蒸着成膜したのち、窒素雰囲気中で、160℃5分のアニールを行い、光電変換素子(実験例1)を作製した。
次に、化合物BBBT−1に代えて化合物BBBT−2を用いた以外は、実験例1と同様の方法を用いて光電変換素子(実験例2)を作製した。
有機光電変換層に用いた材料(化合物BBBT−1および化合物BBBT−2)のエネルギー評価は、以下の方法を用いて行った。まず、HOMO準位(イオン化ポテンシャル)は、Si基板上に化合物BBBT−1および化合物BBBT−2の厚さ20nmの薄膜をそれぞれ成膜し、その表面を紫外線光電子分光法(UPS)によって測定して求めた。LUMO(Lowest Unoccupied Molecular Orbital:最低空軌道)準位は、BBBT−1および化合物BBBT−2の各薄膜の吸収スペクトルの吸収端から光学的なエネルギーギャップを算出し、HOMO準位とのエネルギーギャップの差分から算出した(LUMO=−1*||HOMO|−エネルギーギャップ|)。
(評価用素子の作製)
まず、有機光電変換層に用いる材料として、下記に示した合成スキーム(化10)にて式(7)で表される化合物BP−rBDTを合成した。得られた化合物BP−rBDTの粗体を昇華精製した。
化合物BP−rBDTを用いて、光電変換素子を以下の方法を用いて作製した。まず、スパッタ装置にて、シリコン基板上にITO膜を120nmの厚さに成膜したのち、フォトマスクを用いたリソグラフィー技術を用いてパターニングして下部電極を形成した。続いて、シリコン基板および下部電極上に絶縁層を形成し、リソグラフィー技術を用いて1mm角の下部電極が露出する開口を形成したのち、中性洗剤、アセトンおよびエタノールを用いて順次、超音波洗浄した。このシリコン基板を乾燥後、10分間のUV/オゾン(O3)処理を行ったのち、シリコン基板を蒸着装置の基板ホルダに固定した後、蒸着層を5.5×10-5Paに減圧した。次いで、シャドーマスクを用いた真空蒸着成膜にて、バッファ層として、下記式(8)に示したインドロカルバゾール誘導体を10nmの厚みとなるように成膜した。続いて、化合物BP−rBDT、下記式(4−1)に示したフッ素化サブフタロシアニンクロライド(F6−SubPc−OC6F5)および下記式(2−1)に示したC60フラーレンを蒸着速度比4:4:2で共蒸着し、厚さ230nmの有機光電変換層を成膜した。続いて、バッファ層として、上記式(6)に示したB4PyMPMを5nmの厚みとなるように成膜した。次いで、不活性雰囲気中で搬送できる容器に入れ、スパッタ装置へ運び、バッファ層上に、上部電極としてITOを50nm成膜した。その後、窒素雰囲気中で、素子のハンダ付け等の加熱工程を想定した150℃3.5hアニールを行い、光電変換素子(実験例3)を作製した。
次に、化合物BP−rBDTに代えて化合物BBBT−2を用いた以外は、実験例3と同様の方法を用いて光電変換素子(実験例4)を作製した。
有機光電変換層に用いた材料(化合物BP−rBDTおよび化合物BBBT−2)のエネルギー評価を上記実験1と同様の方法を用いて行った。
[1]
第1電極と、
前記第1電極と対向配置された第2電極と、
前記第1電極と前記第2電極との間に設けられると共に、有機光電変換層を含む有機層とを備え、
前記有機層を構成する少なくとも1層は、下記一般式(1)で表される有機半導体材料を少なくとも1種含んで形成されている
光電変換素子。
[2]
前記アリール基およびアリールアミノ基のアリール置換基は、フェニル基、ビフェニル基、ナフチル基、ナフチルフェニル基、ナフチルビフェニル基、フェニルナフチル基、トリル基、キシリル基、ターフェニル基、アントラセニル基、フェナントリル基、ピレニル基、テトラセニル基、フルオランテニル基のいずれかである、前記[1]に記載の光電変換素子。
[3]
前記ヘテロアリール基およびヘテロアリールアミノ基のヘテロアリール置換基は、チエニル基、チエニルフェニル基、チエニルビフェニル基、チアゾリル基、チアゾリルフェニル基、チアゾリルビフェニル基、イソチアゾリル基、イソチアゾリルフェニル基、イソチアゾリルビフェニル基、フラニル基、フラニルフェニル基、フラニルビフェニル基、オキサゾリル基、オキサゾリルフェニル基、オキサゾリルビフェニル基、オキサジアゾリル基、オキサジアゾリルフェニル基、オキサジアゾリルビフェニル基、イソオキサゾリル基、ベンゾチエニル基、ベンゾチエニルフェニル基、ベンゾチエニルビフェニル基、ベンゾフラニル基、ピリジニル基、ピリジニルフェニル基、ピリジニルビフェニル基、キノリニル基、キノリルフェニル基、キノリルビフェニル基、イソキノリル基、イソキノリルフェニル基、イソキノリルビフェニル基、アクリジニル基、インドール基、インドールフェニル基、インドールビフェニル基、イミダゾール基、イミダゾールフェニル基、イミダゾールビフェニル基、ベンズイミダゾール基、ベンズイミダゾールフェニル基、ベンズイミダゾールビフェニル基、カルバゾリル基のうちのいずれかである、前記[1]に記載の光電変換素子。
[4]
前記有機光電変換層は、前記一般式(1)で表される有機半導体材料を含んで形成されている、前記[1]乃至[3]のうちのいずれかに記載の光電変換素子。
[5]
前記一般式(1)で表される有機半導体材料は、ベンゾビスベンゾチオフェン誘導体である、前記[1]乃至[4]のうちのいずれかに記載の光電変換素子。
[6]
前記ベンゾビスベンゾチオフェン誘導体は、下記式(1−1)で表される化合物である、前記[5]に記載の光電変換素子。
前記ベンゾビスベンゾチオフェン誘導体は、下記式(1−2)で表される化合物である、前記[5]に記載の光電変換素子。
更に、前記有機光電変換層は、フラーレン C60またはその誘導体およびフラーレンC70またはその誘導体の少なくとも1種を含む、前記[1]乃至[7]のうちのいずれかに記載の光電変換素子。
[9]
更に、前記有機光電変換層は、サブフタロシアニンまたはその誘導体を含む、前記[1]乃至[8]のうちのいずれかに記載の光電変換素子。
[10]
前記一般式(1)で表される有機半導体材料は、膜厚5nm以上100nm以下の単層膜において波長450nm以上で0%以上3%以下、波長425nmで0%以上30%以下、波長400nmで0%以上80%以下の光吸収率を有する、前記[1]乃至[9]のうちのいずれかに記載の光電変換素子。
[11]
前記有機光電変換層中における前記一般式(1)で表される有機半導体材料のみかけのHOMO準位と、前記有機光電変換層中における前記一般式(1)で表される有機半導体材料以外の材料のLUMO準位とのエネルギー差は1.1eV以上より大きい、前記[4]乃至[10]のうちのいずれかに記載の光電変換素子。
[12]
前記第1電極および前記第2電極は、透明導電性材料からなる、前記[1]乃至[11]のうちのいずれかに記載の光電変換素子。
[13]
前記第1電極および前記第2電極は、一方が透明導電性材料からなり、他方が金属材料からなる、前記[1]乃至[12]のうちのいずれかに記載の光電変換素子。
[14]
前記金属材料は、アルミニウム(Al)、Al−Si−Cu合金およびMg−Ag合金のうちのいずれかである、前記[13]に記載の光電変換素子。
[15]
前記有機層は、前記有機光電変換層の他に他の層を含み、
前記一般式(1)で表される有機半導体材料は、前記他の層に含まれている、前記[1]乃至[14]のうちのいずれかに記載の光電変換素子。
[16]
各画素が1または複数の有機光電変換部を含み、
前記有機光電変換部は、
第1電極と、
前記第1電極と対向配置された第2電極と、
前記第1電極と前記第2電極との間に設けられると共に、有機光電変換層を含む有機層とを備え、
前記有機層を構成する少なくとも1層は、下記一般式(1)で表される有機半導体材料を少なくとも1種含んで形成されている
撮像装置。
[17]
各画素では、1または複数の前記有機光電変換部と、前記有機光電変換部とは異なる波長域の光電変換を行う1または複数の無機光電変換部とが積層されている、前記[16]に記載の撮像装置。
[18]
各画素では、互いに異なる波長域の光電変換を行う複数の前記有機光電変換部が積層されている、前記[16]または[17]に記載の撮像装置。
Claims (18)
- 第1電極と、
前記第1電極と対向配置された第2電極と、
前記第1電極と前記第2電極との間に設けられると共に、有機光電変換層を含む有機層とを備え、
前記有機層を構成する少なくとも1層は、下記一般式(1)で表される有機半導体材料を少なくとも1種含んで形成されている
光電変換素子。
- 前記アリール基およびアリールアミノ基のアリール置換基は、フェニル基、ビフェニル基、ナフチル基、ナフチルフェニル基、ナフチルビフェニル基、フェニルナフチル基、トリル基、キシリル基、ターフェニル基、アントラセニル基、フェナントリル基、ピレニル基、テトラセニル基、フルオランテニル基のいずれかである、請求項1に記載の光電変換素子。
- 前記ヘテロアリール基およびヘテロアリールアミノ基のヘテロアリール置換基は、チエニル基、チエニルフェニル基、チエニルビフェニル基、チアゾリル基、チアゾリルフェニル基、チアゾリルビフェニル基、イソチアゾリル基、イソチアゾリルフェニル基、イソチアゾリルビフェニル基、フラニル基、フラニルフェニル基、フラニルビフェニル基、オキサゾリル基、オキサゾリルフェニル基、オキサゾリルビフェニル基、オキサジアゾリル基、オキサジアゾリルフェニル基、オキサジアゾリルビフェニル基、イソオキサゾリル基、ベンゾチエニル基、ベンゾチエニルフェニル基、ベンゾチエニルビフェニル基、ベンゾフラニル基、ピリジニル基、ピリジニルフェニル基、ピリジニルビフェニル基、キノリニル基、キノリルフェニル基、キノリルビフェニル基、イソキノリル基、イソキノリルフェニル基、イソキノリルビフェニル基、アクリジニル基、インドール基、インドールフェニル基、インドールビフェニル基、イミダゾール基、イミダゾールフェニル基、イミダゾールビフェニル基、ベンズイミダゾール基、ベンズイミダゾールフェニル基、ベンズイミダゾールビフェニル基、カルバゾリル基のうちのいずれかである、請求項1に記載の光電変換素子。
- 前記有機光電変換層は、前記一般式(1)で表される有機半導体材料を含んで形成されている、請求項1に記載の光電変換素子。
- 前記一般式(1)で表される有機半導体材料は、ベンゾビスベンゾチオフェン誘導体である、請求項1に記載の光電変換素子。
- 更に、前記有機光電変換層は、フラーレン C60またはその誘導体およびフラーレン
C70またはその誘導体の少なくとも1種を含む、請求項1に記載の光電変換素子。 - 更に、前記有機光電変換層は、サブフタロシアニンまたはその誘導体を含む、請求項1に記載の光電変換素子。
- 前記一般式(1)で表される有機半導体材料は、膜厚5nm以上100nm以下の単層膜において波長450nm以上で0%以上3%以下、波長425nmで0%以上30%以下、波長400nmで0%以上80%以下の光吸収率を有する、請求項1に記載の光電変換素子。
- 前記有機光電変換層中における前記一般式(1)で表される有機半導体材料のみかけのHOMO準位と、前記有機光電変換層中における前記一般式(1)で表される有機半導体材料以外の材料のLUMO準位とのエネルギー差は1.1eV以上より大きい、請求項4に記載の光電変換素子。
- 前記第1電極および前記第2電極は、透明導電性材料からなる、請求項1に記載の光電変換素子。
- 前記第1電極および前記第2電極は、一方が透明導電性材料からなり、他方が金属材料からなる、請求項1に記載の光電変換素子。
- 前記金属材料は、アルミニウム(Al)、Al−Si−Cu合金およびMg−Ag合金のうちのいずれかである、請求項13に記載の光電変換素子。
- 前記有機層は、前記有機光電変換層の他に他の層を含み、
前記一般式(1)で表される有機半導体材料は、前記他の層に含まれている、請求項1に記載の光電変換素子。 - 各画素が1または複数の有機光電変換部を含み、
前記有機光電変換部は、
第1電極と、
前記第1電極と対向配置された第2電極と、
前記第1電極と前記第2電極との間に設けられると共に、有機光電変換層を含む有機層とを備え、
前記有機層を構成する少なくとも1層は、下記一般式(1)で表される有機半導体材料を少なくとも1種含んで形成されている
撮像装置。
- 各画素では、1または複数の前記有機光電変換部と、前記有機光電変換部とは異なる波長域の光電変換を行う1または複数の無機光電変換部とが積層されている、請求項16に記載の撮像装置。
- 各画素では、互いに異なる波長域の光電変換を行う複数の前記有機光電変換部が積層されている、請求項16に記載の撮像装置。
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JP2020155280A (ja) * | 2019-03-19 | 2020-09-24 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置及び電子機器 |
DE112020000885T5 (de) * | 2019-03-20 | 2021-11-11 | Japan Display Inc. | Detektionsvorrichtung |
WO2020261938A1 (ja) * | 2019-06-27 | 2020-12-30 | 富士フイルム株式会社 | 光電変換素子、撮像素子、光センサ、光電変換素子用材料 |
CN112745330B (zh) * | 2019-10-31 | 2022-04-19 | 北京绿人科技有限责任公司 | 一种含稠杂环结构的化合物及其应用和一种有机电致发光器件 |
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WO2021210445A1 (ja) * | 2020-04-15 | 2021-10-21 | パナソニックIpマネジメント株式会社 | 撮像装置 |
WO2021221108A1 (ja) | 2020-04-30 | 2021-11-04 | 富士フイルム株式会社 | 光電変換素子、撮像素子、光センサ、化合物 |
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WO2019093188A1 (ja) | 2019-05-16 |
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