JPWO2010018759A1 - フレキシブル基板および電気回路構造体 - Google Patents
フレキシブル基板および電気回路構造体 Download PDFInfo
- Publication number
- JPWO2010018759A1 JPWO2010018759A1 JP2010524704A JP2010524704A JPWO2010018759A1 JP WO2010018759 A1 JPWO2010018759 A1 JP WO2010018759A1 JP 2010524704 A JP2010524704 A JP 2010524704A JP 2010524704 A JP2010524704 A JP 2010524704A JP WO2010018759 A1 JPWO2010018759 A1 JP WO2010018759A1
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- flexible substrate
- substrate
- terminal
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (5)
- 可撓性のベースフィルム上に配線パターンが形成され、
前記配線パターンの端部に、他の電気回路基板の電極端子と電気的に接続される接続端子を有し、
前記接続端子には、前記配線パターンの複数の配線に跨る端子幅の幅広接続端子が含まれることを特徴とするフレキシブル基板。 - 前記幅広接続端子は、前記配線パターンの配線間に相当する位置に、開口部を有している請求項1記載のフレキシブル基板。
- 前記開口部が識別マークである請求項2に記載のフレキシブル基板。
- 請求項1から3のいずれか1項に記載のフレキシブル基板と、
電気回路素子と、前記電気回路素子と引き出し線によって接続された電極端子とが表面に形成された電気回路基板とを有し、
前記フレキシブル基板と前記電気回路基板とが、異方性導電膜で接続され、
前記電気回路基板上の1本の前記引き出し線に接続された複数本の前記電極端子に、前記幅広接続端子が接続されていることを特徴とする電気回路構造体。 - 前記電気回路構造体が液晶表示装置であり、
前記電気回路基板が、前記液晶表示装置において液晶層を挟んで対向する一対の基板の少なくともいずれか一方である請求項4記載の電気回路構造体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010524704A JP5274564B2 (ja) | 2008-08-11 | 2009-08-03 | フレキシブル基板および電気回路構造体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008207186 | 2008-08-11 | ||
JP2008207186 | 2008-08-11 | ||
PCT/JP2009/063726 WO2010018759A1 (ja) | 2008-08-11 | 2009-08-03 | フレキシブル基板および電気回路構造体 |
JP2010524704A JP5274564B2 (ja) | 2008-08-11 | 2009-08-03 | フレキシブル基板および電気回路構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010018759A1 true JPWO2010018759A1 (ja) | 2012-01-26 |
JP5274564B2 JP5274564B2 (ja) | 2013-08-28 |
Family
ID=41668904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010524704A Expired - Fee Related JP5274564B2 (ja) | 2008-08-11 | 2009-08-03 | フレキシブル基板および電気回路構造体 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8754332B2 (ja) |
EP (1) | EP2323466A1 (ja) |
JP (1) | JP5274564B2 (ja) |
KR (1) | KR101195688B1 (ja) |
CN (1) | CN102113421B (ja) |
BR (1) | BRPI0914554A2 (ja) |
RU (1) | RU2458491C1 (ja) |
WO (1) | WO2010018759A1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
WO2013021597A1 (ja) * | 2011-08-05 | 2013-02-14 | パナソニック株式会社 | 超音波探触子及び超音波探触子に用いるフレキシブル基板 |
CN105094447B (zh) * | 2011-11-27 | 2018-01-16 | 宸鸿科技(厦门)有限公司 | 触控感测装置及其制造方法 |
EP2796968A4 (en) * | 2011-12-23 | 2015-08-05 | Lg Chemical Ltd | TOUCH PANEL AND DISPLAY DEVICE COMPRISING SAME |
US9282633B2 (en) * | 2012-05-30 | 2016-03-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Routing structure and display panel |
KR101904730B1 (ko) | 2012-07-31 | 2018-10-08 | 삼성디스플레이 주식회사 | 테이프 패키지 및 이를 포함하는 표시 장치 |
CN103269563B (zh) * | 2013-04-27 | 2016-03-16 | 合肥京东方光电科技有限公司 | 覆晶薄膜柔性电路板及显示装置 |
US9723725B2 (en) * | 2013-05-29 | 2017-08-01 | Finisar Corporation | Rigid-flexible circuit interconnects |
KR102257119B1 (ko) * | 2013-06-17 | 2021-05-31 | 삼성디스플레이 주식회사 | 어레이 기판 및 이를 포함하는 유기 발광 표시 장치 |
US9472507B2 (en) | 2013-06-17 | 2016-10-18 | Samsung Display Co., Ltd. | Array substrate and organic light-emitting display including the same |
JP6286911B2 (ja) * | 2013-07-26 | 2018-03-07 | セイコーエプソン株式会社 | 実装構造、電気光学装置及び電子機器 |
KR20150037198A (ko) | 2013-09-30 | 2015-04-08 | 삼성디스플레이 주식회사 | 표시패널 및 이를 갖는 표시장치 |
JP2015075559A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ジャパンディスプレイ | 電子装置 |
KR102260060B1 (ko) | 2013-11-22 | 2021-06-04 | 삼성디스플레이 주식회사 | 표시 기판 및 이를 포함하는 표시 장치 |
KR102107456B1 (ko) * | 2013-12-10 | 2020-05-08 | 삼성디스플레이 주식회사 | 플렉시블 표시 장치 및 이의 제조 방법 |
KR102330882B1 (ko) | 2014-10-13 | 2021-11-25 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102357489B1 (ko) * | 2015-08-26 | 2022-02-03 | 삼성전자주식회사 | 전자 방해 잡음을 감소하기 위한 칩 온 필름 회로 기판과 이를 포함하는 디스플레이 장치 |
CN105578754B (zh) * | 2016-02-25 | 2018-07-06 | 广东欧珀移动通信有限公司 | 软硬结合板及终端 |
CN107515497B (zh) * | 2016-06-16 | 2020-07-17 | 群创光电股份有限公司 | 显示装置 |
JP2018170398A (ja) * | 2017-03-30 | 2018-11-01 | Smk株式会社 | 複合ケーブル |
EP3422827B1 (en) * | 2017-06-30 | 2024-04-24 | LG Display Co., Ltd. | Display device and method for fabricating the same |
JP7039995B2 (ja) * | 2017-12-25 | 2022-03-23 | 株式会社デンソー | 監視装置 |
JP6958396B2 (ja) * | 2018-01-31 | 2021-11-02 | 住友大阪セメント株式会社 | フレキシブル基板及び光デバイス |
GB2576524B (en) * | 2018-08-22 | 2022-08-03 | Pragmatic Printing Ltd | Profiled Thermode |
JP7145707B2 (ja) * | 2018-09-19 | 2022-10-03 | 株式会社東芝 | 電子機器 |
KR20200091060A (ko) * | 2019-01-21 | 2020-07-30 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20210018724A (ko) * | 2019-08-09 | 2021-02-18 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치 |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3040834B2 (ja) * | 1991-01-23 | 2000-05-15 | ローム株式会社 | サーマルプリントヘッド |
JPH0685341B2 (ja) * | 1991-09-27 | 1994-10-26 | 帝国通信工業株式会社 | フレキシブル基板の端子構造 |
US5343616B1 (en) | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
US5592199A (en) * | 1993-01-27 | 1997-01-07 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
TW293093B (ja) * | 1994-09-08 | 1996-12-11 | Hitachi Ltd | |
JP3013801B2 (ja) * | 1997-02-06 | 2000-02-28 | セイコーエプソン株式会社 | 液晶表示装置の組立方法 |
JP3102392B2 (ja) * | 1997-10-28 | 2000-10-23 | 日本電気株式会社 | 半導体デバイスおよびその製造方法 |
JPH11305254A (ja) * | 1998-04-24 | 1999-11-05 | Hitachi Ltd | 液晶表示装置 |
JP3462135B2 (ja) * | 1999-01-14 | 2003-11-05 | シャープ株式会社 | 二次元画像検出器およびアクティブマトリクス基板並びに表示装置 |
US6619785B1 (en) * | 1999-03-31 | 2003-09-16 | Seiko Epson Corporation | Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, ink-jet head, ink-jet printer, liquid crystal device, and electronic device |
JP2002032031A (ja) * | 2000-05-12 | 2002-01-31 | Seiko Epson Corp | 電気光学装置の製造方法、端子の接続方法、電気光学装置および電子機器 |
JP3630116B2 (ja) * | 2000-08-10 | 2005-03-16 | セイコーエプソン株式会社 | 電気光学ユニットおよび電子機器 |
JP3721999B2 (ja) * | 2001-03-14 | 2005-11-30 | セイコーエプソン株式会社 | 液晶装置及び電子機器 |
JP3608614B2 (ja) * | 2001-03-28 | 2005-01-12 | 株式会社日立製作所 | 表示装置 |
JP2002344097A (ja) | 2001-05-14 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 実装用基板及びこの基板を有する表示装置 |
JP2003031916A (ja) * | 2001-07-19 | 2003-01-31 | Alps Electric Co Ltd | 印刷配線基板 |
JP2003107513A (ja) * | 2001-09-27 | 2003-04-09 | Citizen Watch Co Ltd | 液晶表示装置 |
JP2004095756A (ja) * | 2002-08-30 | 2004-03-25 | Seiko Instruments Inc | 半導体パッケージおよびその製造方法、並びに電子装置 |
JP2005062582A (ja) * | 2003-08-18 | 2005-03-10 | Hitachi Displays Ltd | 表示装置 |
JP4060806B2 (ja) * | 2004-01-09 | 2008-03-12 | 日本オプネクスト株式会社 | 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール |
US7176889B2 (en) * | 2004-05-21 | 2007-02-13 | Interlink Electronics, Inc. | Force sensing pointing device with click function |
JP2006030630A (ja) | 2004-07-16 | 2006-02-02 | Optrex Corp | 表示装置 |
JP4277777B2 (ja) * | 2004-09-28 | 2009-06-10 | セイコーエプソン株式会社 | 実装構造体、実装用基板、電気光学装置及び電子機器 |
JP2006119321A (ja) | 2004-10-21 | 2006-05-11 | Kofu Casio Co Ltd | 電気回路間の導通接続構造 |
JP4607612B2 (ja) * | 2005-02-09 | 2011-01-05 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
US7710739B2 (en) * | 2005-04-28 | 2010-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
WO2007039960A1 (ja) * | 2005-10-05 | 2007-04-12 | Sharp Kabushiki Kaisha | 配線基板及びそれを備えた表示装置 |
WO2007039959A1 (ja) * | 2005-10-05 | 2007-04-12 | Sharp Kabushiki Kaisha | 配線基板及びそれを備えた表示装置 |
JP4600263B2 (ja) * | 2005-12-06 | 2010-12-15 | エプソンイメージングデバイス株式会社 | 電気光学装置および電子機器 |
US7964800B2 (en) * | 2006-05-25 | 2011-06-21 | Fujikura Ltd. | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
JP2008078628A (ja) * | 2006-08-25 | 2008-04-03 | Canon Inc | 電子モジュールおよびその製造方法 |
JP4560026B2 (ja) * | 2006-10-04 | 2010-10-13 | セイコーエプソン株式会社 | フレキシブル基板及びこれを備えた電気光学装置、並びに電子機器 |
JP4934394B2 (ja) * | 2006-10-12 | 2012-05-16 | 株式会社 日立ディスプレイズ | 表示装置 |
JP5068067B2 (ja) * | 2006-11-22 | 2012-11-07 | 株式会社ジャパンディスプレイイースト | 表示装置および平面型表示装置 |
KR20080070420A (ko) * | 2007-01-26 | 2008-07-30 | 삼성전자주식회사 | 인쇄회로기판 및 이를 갖는 표시 패널 어셈블리 |
US7952548B2 (en) * | 2007-03-09 | 2011-05-31 | Samsung Mobile Display Co., Ltd. | Electronic display device |
CN101287329B (zh) * | 2007-04-13 | 2011-04-20 | 群康科技(深圳)有限公司 | 显示装置 |
JP5260912B2 (ja) * | 2007-07-31 | 2013-08-14 | パナソニック液晶ディスプレイ株式会社 | 表示装置 |
WO2009040967A1 (ja) * | 2007-09-28 | 2009-04-02 | Sharp Kabushiki Kaisha | 表示セル |
JP4980960B2 (ja) * | 2008-03-14 | 2012-07-18 | ラピスセミコンダクタ株式会社 | テープ配線基板及び半導体チップパッケージ |
-
2009
- 2009-08-03 WO PCT/JP2009/063726 patent/WO2010018759A1/ja active Application Filing
- 2009-08-03 RU RU2011109034/07A patent/RU2458491C1/ru not_active IP Right Cessation
- 2009-08-03 BR BRPI0914554A patent/BRPI0914554A2/pt not_active IP Right Cessation
- 2009-08-03 EP EP09806652A patent/EP2323466A1/en not_active Withdrawn
- 2009-08-03 KR KR1020117003364A patent/KR101195688B1/ko not_active IP Right Cessation
- 2009-08-03 JP JP2010524704A patent/JP5274564B2/ja not_active Expired - Fee Related
- 2009-08-03 CN CN200980129954XA patent/CN102113421B/zh not_active Expired - Fee Related
- 2009-08-03 US US13/058,268 patent/US8754332B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5274564B2 (ja) | 2013-08-28 |
EP2323466A1 (en) | 2011-05-18 |
KR20110030685A (ko) | 2011-03-23 |
KR101195688B1 (ko) | 2012-10-30 |
BRPI0914554A2 (pt) | 2015-12-15 |
US20110139493A1 (en) | 2011-06-16 |
US8754332B2 (en) | 2014-06-17 |
WO2010018759A1 (ja) | 2010-02-18 |
CN102113421A (zh) | 2011-06-29 |
CN102113421B (zh) | 2013-12-25 |
RU2458491C1 (ru) | 2012-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5274564B2 (ja) | フレキシブル基板および電気回路構造体 | |
US8446556B2 (en) | Flexible printed circuit and electric circuit structure | |
JP3025257B1 (ja) | 表示パネル | |
JP5315747B2 (ja) | 表示装置 | |
KR20170125187A (ko) | 표시장치 | |
JP2009031362A (ja) | 配線基板、その製造方法、及び表示装置 | |
US20020118332A1 (en) | Liquid crystal display device | |
KR100531590B1 (ko) | 액정표시장치 및 액정표시장치의 제조방법 | |
JP2000250031A (ja) | 電気光学装置 | |
US8975756B2 (en) | Electric terminal device and method of connecting the same | |
JP3365305B2 (ja) | 半導体チップ、その実装構造および液晶表示装置 | |
JPH04313731A (ja) | 液晶表示装置 | |
JP3897484B2 (ja) | 配線基板のリード端子構造 | |
JPH0643473A (ja) | 液晶表示装置 | |
JP2004118089A (ja) | 液晶表示装置 | |
JP2002344097A (ja) | 実装用基板及びこの基板を有する表示装置 | |
KR20070106261A (ko) | 액정표시장치 | |
KR20060125326A (ko) | 액정 표시 장치 | |
JP4521205B2 (ja) | 液晶表示パネル | |
JP4779399B2 (ja) | 電気光学装置、電気光学装置の製造方法、実装構造体及び電子機器 | |
KR20140143605A (ko) | 유기발광 디스플레이 장치 | |
JP2007163847A (ja) | 平面表示装置 | |
JP2004012762A (ja) | 液晶表示装置及び液晶表示装置の製造方法 | |
JPH0954329A (ja) | 液晶表示装置 | |
JPH08136945A (ja) | 液晶表示パネルに駆動素子を接続する方法及び駆動素子を備える液晶表示素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120830 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121025 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130418 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130514 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5274564 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |