JPS6255196A - Integrated circuit card - Google Patents
Integrated circuit cardInfo
- Publication number
- JPS6255196A JPS6255196A JP60196194A JP19619485A JPS6255196A JP S6255196 A JPS6255196 A JP S6255196A JP 60196194 A JP60196194 A JP 60196194A JP 19619485 A JP19619485 A JP 19619485A JP S6255196 A JPS6255196 A JP S6255196A
- Authority
- JP
- Japan
- Prior art keywords
- module
- card body
- card
- deformation prevention
- deformation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
く技術分野〉
本発明は、例えば内蔵のＩＣモジュールに識別データ等
を記録して使用されるＩＣカードに関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an IC card that is used by recording identification data and the like in a built-in IC module, for example.
〈従来技術〉
従来、この種のＩＣカードとしては、例えば第５図に示
すように、矩形状に形成されたカード本体２１の一部に
ＩＣモジュール２２を挿入するための孔２４を形成し、
この挿入孔２４内にＩＣモジュール２２を挿入固定した
後、カード本体２１の表裏両面から薄膜状のフィルム２
８．２９（またはテープ）を貼着して、ＩＣモジュール
２２を両フィルム２８．２９（またはテープ）で決着固
定したものが知られている。<Prior Art> Conventionally, as shown in FIG. 5, for example, as shown in FIG. 5, this type of IC card has a hole 24 formed in a part of a rectangular card body 21 into which an IC module 22 is inserted.
After inserting and fixing the IC module 22 into this insertion hole 24, a thin film 2 is applied from both the front and back sides of the card body 21.
It is known that the IC module 22 is fixed with both films 28 and 29 (or tape).
ところで、このようなＩＣカードは取扱い時などに、屡
々、曲げられることがある。このような場合、カード本
体２１は曲げ変形によって歪みが生じ、この曲げ歪みが
ＩＣモジュール２２に及んで、該ＩＣモジュール２２に
悪影響を与えるという問題点があった。すなわち、ＩＣ
モジュール２２に曲げ歪みが加わると、該ＩＣモジュー
ル２２のプリント回路基板２５とＩＣチップ２６とのボ
ンディングによる接続部分が曲げ歪みによる外力によっ
て疲労したり、極端な場合は断線することにもなる。By the way, such IC cards are often bent during handling. In such a case, there is a problem in that the card body 21 is distorted due to bending deformation, and this bending distortion extends to the IC module 22, thereby adversely affecting the IC module 22. That is, I.C.
When bending strain is applied to the module 22, the bonding connection between the printed circuit board 25 and the IC chip 26 of the IC module 22 may become fatigued by the external force caused by the bending strain, or in extreme cases, the connection may become disconnected.
〈発明の目的〉
本発明は、このような問題点を解決するためになされた
ものであって、カード本体が曲げにより変形した場合に
、その変形が該カード本体内のＩＣモジュールの装着部
に伝わらないようにして、ＩＣカードの耐久性並びに信
頼性の向上を図ることを目的とする。<Purpose of the Invention> The present invention has been made to solve these problems, and the purpose of the present invention is to prevent the deformation from occurring when the card body is deformed due to bending. The purpose is to improve the durability and reliability of IC cards by preventing the transmission of information.
〈発明の構成〉
本発明は、このような目的を達成するために、カード本
体におけるＩＣモジュールの装着部の周囲に、該装着部
を取り囲む変形防止用孔を形成したことに特徴を有する
ものである。<Structure of the Invention> In order to achieve the above object, the present invention is characterized in that a deformation prevention hole is formed around the IC module mounting part in the card body to surround the mounting part. be.
〈実施例〉
以下、本発明を図面に示す実施例に基づき詳細に説明す
る。<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.
第１図はこの実施例の分解斜視図であり、第２図はその
縦断側面図であり、第３図は″第２図における■部の拡
大図である。これらの図において、符号ｌはカード本体
であって、このカード本体ｌは矩形状に形成された樹脂
シートで構成されており、その−隅寄りにＩＣモジュー
ル２が装着固定される装着部３が設けられている。この
装着部３にはＩＣモジュール２の外形に沿う形状、例え
ば矩形状の挿入孔４が打抜き形成されている。Fig. 1 is an exploded perspective view of this embodiment, Fig. 2 is a longitudinal sectional side view thereof, and Fig. 3 is an enlarged view of the section ■ in Fig. 2. In these figures, the symbol l is The card body L is made of a resin sheet formed into a rectangular shape, and is provided with a mounting part 3 near the corner thereof, into which an IC module 2 is mounted and fixed. 3 is punched with an insertion hole 4 having a shape that follows the outer shape of the IC module 2, for example, a rectangular shape.
ＩＣモジュール２はプリント回路基板５の一面側にＩＣ
チップ６を取付けると共に、プリント回路基板５上のパ
ターン電極（図示せず）とＩＣチップ６の各接続電極（
図示仕ず）とをそれぞれ電気的に接続して構成されてお
り、プリント回路基板５の他面側には端子７群か設けら
れている。The IC module 2 has an IC on one side of the printed circuit board 5.
At the same time as attaching the chip 6, connect the pattern electrode (not shown) on the printed circuit board 5 and each connection electrode (not shown) of the IC chip 6.
(not shown) are electrically connected to each other, and a group of terminals 7 is provided on the other side of the printed circuit board 5.
８．９はそれぞれカード本体１の表裏各面に貼着される
樹脂製のフィルムであって、各フィルム８．９はそれぞ
れカード本体１と同形状に形成されており、このうち、
一方のフィルム８は前記装着部３と対応する部位にＩＣ
チップ６の各端子７が臨む複数の端子用孔ＩＯが形成さ
れている。8.9 are resin films attached to the front and back surfaces of the card body 1, respectively. Each film 8.9 is formed in the same shape as the card body 1, and among these,
One film 8 has an IC installed in a portion corresponding to the mounting portion 3.
A plurality of terminal holes IO are formed into which each terminal 7 of the chip 6 faces.
前記カード本体１の装着部３の周囲および、これの表裏
両面に貼着される２枚のフィルム８．９の該装着部３の
周囲に対応する部位とには、それぞれ装着部３を四方か
ら取り囲む複数の変形防止用孔ｉｔが透設されている。The mounting portion 3 is attached from all sides to the periphery of the mounting portion 3 of the card body 1 and to the portions corresponding to the periphery of the mounting portion 3 of the two films 8.9 attached to both the front and back surfaces of the card body 1. A plurality of surrounding deformation prevention holes it are transparently provided.
この変形防止用孔１１は１対ずつが装着部３を挟んで対
向形成され、各対の変形防止用孔１１はそれぞれカード
本体ｌまたは各フィルム８．９の直交する両辺と平行に
配置されている。また、各変形防止用孔１１と隣合う変
形防止用孔１１との間には装着部３とカード本体ｌまた
は各フィルム８．９の他の部分とを連結する梁状の連結
部１２が斜め方向に形成されている。したがって、各変
形防止用孔１１は台形状となっている。The deformation prevention holes 11 are formed in pairs opposite to each other with the mounting portion 3 interposed therebetween, and each pair of deformation prevention holes 11 is arranged parallel to both orthogonal sides of the card body l or each film 8.9. There is. Also, between each deformation prevention hole 11 and the adjacent deformation prevention hole 11, a beam-shaped connecting part 12 connecting the mounting part 3 and the card body l or other parts of each film 8.9 is provided diagonally. It is formed in the direction. Therefore, each deformation prevention hole 11 has a trapezoidal shape.
上記構成のＩＣカードは、例えば次のようにして作成さ
れる。まず、カード本体ｌの挿入孔４内にＩＣモジュー
ル２が組込み装着され、次いで、表裏両面に両フィルム
８．９がそれぞれ位置合わせした状態で貼着され、これ
によって、ＩＣモジュール２が両フィルム８．９に挟持
された状態で装着部３に固定される。このようにしてカ
ード本体１と両フィルム８．９を重ね合わせて貼着した
後、装着部３の周囲に前記各変形防止用孔１１を打ち抜
き形成し、所望のＩＣカードを得ることになる。The IC card having the above configuration is produced, for example, as follows. First, the IC module 2 is assembled and installed in the insertion hole 4 of the card body l, and then both the films 8 and 9 are pasted on both the front and back surfaces in a state where they are aligned, so that the IC module 2 is attached to both the films 8 and 9. It is fixed to the mounting part 3 in a state where it is clamped by .9. After the card body 1 and both films 8 and 9 are laminated and adhered in this manner, the deformation prevention holes 11 are punched out around the mounting portion 3 to obtain a desired IC card.
いま、この実施例のＩＣカードが外力により曲げられた
場合に、これによる曲げ変形は変形防止用孔１１の形成
部位まで及ぶが、その変形は連結部１２と装着部３との
接合部分ａで切り離されて装着部３には殆ど及ばない。Now, when the IC card of this embodiment is bent by an external force, the bending deformation caused by this extends to the area where the deformation prevention hole 11 is formed, but the deformation occurs at the joint part a between the connecting part 12 and the mounting part 3. It is separated and hardly reaches the attachment part 3.
したがって、ＩＣモジュール２はカード本体ｌからの曲
げ力に上る変形を極端に少なくすることができる。Therefore, the IC module 2 can extremely reduce deformation due to bending force from the card body 1.
なお、前記実施例では、カード本体ｌを覆う両フィルム
８．９にも変形防止用孔１１が形成されているため、外
部から該変形防止用孔１１が見え、意匠感を損なう虞が
ある。これの改善策としては、例えば第４図に示すよう
に、変形防止用孔１１をカード本体ｌたけに形成すると
共に、これを覆う両フィルム８．９には変形防止用孔１
１を設けずに、カード本体１の表裏両面に貼着すること
により、外部から変形防止用孔１１が見えないようにす
ることも可能である。この場合も、両フィルム８．９と
して薄膜フィルムを使用することで、曲げ歪みを吸収さ
せるようにすれば、前記実施例と違わぬ効果を奏する。In the above embodiment, since the deformation prevention holes 11 are also formed in both films 8.9 that cover the card body 1, the deformation prevention holes 11 are visible from the outside, which may impair the design. As a countermeasure for this problem, for example, as shown in FIG.
It is also possible to make the deformation prevention hole 11 invisible from the outside by attaching it to both the front and back sides of the card body 1 without providing the hole 1. In this case as well, if thin films are used as both films 8 and 9 to absorb bending distortion, the same effect as in the embodiment described above can be achieved.
また、各変形防止用孔１１間の連結部１２の寸法を小さ
くする程、変形防止作用は顕著になるが、反面、連結部
１２の強度が弱くなる。このため、実際には、ＩＣモジ
ュール２の周囲の７０％〜９０％程度の部分がカード本
体１の池の部分から切り離されることで、実用上の強度
を確保することができる。Further, as the dimensions of the connecting portions 12 between the respective deformation prevention holes 11 are made smaller, the deformation prevention effect becomes more pronounced, but on the other hand, the strength of the connecting portions 12 becomes weaker. Therefore, in practice, approximately 70% to 90% of the periphery of the IC module 2 is separated from the central portion of the card body 1, thereby ensuring practical strength.
更に、変形防止用孔１１としては、前記各実施例のよう
な台形状の孔のほか、小孔を装着部３の周囲に配列した
ものなど、諸種の実施態様が考えられる。Furthermore, as the deformation prevention hole 11, various embodiments are possible, such as a trapezoidal hole as in each of the above embodiments, and a hole in which small holes are arranged around the mounting portion 3.
〈発明の効果〉
以上のように本発明によれば、カード本体におけるＩＣ
モジュールの装着部の周囲に、該装着部を取り囲む変形
防止用孔を形成するものとしたので、カード本体が曲げ
により変形した場合に、その変形が該カード本体内のＩ
Ｃモジュールの装着部に伝わることを防止でき、ＩＣモ
ジュールは殆ど影響を受けない。したがって、使用時や
携帯時に曲げられることが多いこの種のＩＣカードとし
ての耐久性並びに信頼性の向上を図ることができる。ま
た、構造が比較的簡単なため、容易に作成でき、製造コ
ストダウンを図ることができる。<Effects of the Invention> As described above, according to the present invention, the IC in the card body
Since a deformation prevention hole is formed around the mounting part of the module to surround the mounting part, when the card body is deformed due to bending, the deformation is caused by the I/O inside the card body.
It is possible to prevent this from being transmitted to the mounting portion of the C module, and the IC module is hardly affected. Therefore, it is possible to improve the durability and reliability of this type of IC card, which is often bent during use or carrying. In addition, since the structure is relatively simple, it can be easily manufactured and manufacturing costs can be reduced.
第１図ないし第３図は本発明に係るＩＣカードの一実施
例を示し、第１図はこの実施例の分解斜視図、第２図は
その縦断側面図、第３図は第２図における■部の拡大図
、第４図は本発明に係るＩＣカードの他の実施例を示す
斜視図、第５図は従来例の縦断側面図である。
１・・・カード本体、
２・・ＩＣモジュール、
３・・・装着部、
１１・・変形防止用孔。1 to 3 show an embodiment of the IC card according to the present invention, FIG. 1 is an exploded perspective view of this embodiment, FIG. 2 is a vertical sectional side view thereof, and FIG. FIG. 4 is a perspective view showing another embodiment of the IC card according to the present invention, and FIG. 5 is a longitudinal sectional side view of the conventional example. 1... Card body, 2... IC module, 3... Mounting part, 11... Deformation prevention hole.
Claims (1)
え、このカード本体のＩＣモジュールの装着部の周囲に
、該装着部を取り囲む変形防止用孔を形成したことを特
徴とするＩＣカード。(1) An IC card comprising a card body to which an IC module is attached and fixed, and a deformation prevention hole is formed around the IC module attachment part of the card body to surround the attachment part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60196194A JPS6255196A (en) | 1985-09-05 | 1985-09-05 | Integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60196194A JPS6255196A (en) | 1985-09-05 | 1985-09-05 | Integrated circuit card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255196A true JPS6255196A (en) | 1987-03-10 |
Family
ID=16353755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60196194A Pending JPS6255196A (en) | 1985-09-05 | 1985-09-05 | Integrated circuit card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255196A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214998A (en) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | Thin-type semiconductor card |
| JPH0341937U (en) * | 1989-08-31 | 1991-04-22 | ||
| JP2003044813A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| JP2003044816A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| JP2003346109A (en) * | 2002-05-22 | 2003-12-05 | Toshiba Corp | Ic card and semiconductor integrated circuit device package |
-
1985
- 1985-09-05 JP JP60196194A patent/JPS6255196A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214998A (en) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | Thin-type semiconductor card |
| JPH0341937U (en) * | 1989-08-31 | 1991-04-22 | ||
| JP2003044813A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| JP2003044816A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Ic card |
| JP2003346109A (en) * | 2002-05-22 | 2003-12-05 | Toshiba Corp | Ic card and semiconductor integrated circuit device package |
| US7351920B2 (en) | 2002-05-22 | 2008-04-01 | Kabushiki Kaisha Toshiba | IC card and semiconductor integrated circuit device package |
| US7531757B2 (en) | 2002-05-22 | 2009-05-12 | Kabushiki Kaisha Toshiba | IC card and semiconductor integrated circuit device package |
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