JPS62273895A - Card type electronic circuit unit - Google Patents
Card type electronic circuit unitInfo
- Publication number
- JPS62273895A JPS62273895A JP61118884A JP11888486A JPS62273895A JP S62273895 A JPS62273895 A JP S62273895A JP 61118884 A JP61118884 A JP 61118884A JP 11888486 A JP11888486 A JP 11888486A JP S62273895 A JPS62273895 A JP S62273895A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- type electronic
- circuit unit
- wiring board
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
［発明の目的］
（産業上の利用分野）
本発明は、ＩＣなどの各種回路素子が高密度に実装され
たカード型電子回路ユニットに関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Object of the Invention] (Field of Industrial Application) The present invention relates to a card-type electronic circuit unit in which various circuit elements such as ICs are densely mounted.
（従来の技術）
従来から薄型の電子回路ユニットとして、第４図に示す
ように、配線板１上にフラットパッケージタイプのＩＣ
２を搭載したものを、表裏両面からプラスチックなどの
絶縁性カバー３で覆い、さらにその両面に薄い金属板４
を重ね合せた構造のものが使用されている。(Prior Art) Conventionally, as a thin electronic circuit unit, a flat package type IC is mounted on a wiring board 1, as shown in FIG.
2 is covered with an insulating cover 3 made of plastic or the like from both the front and back sides, and a thin metal plate 4 is placed on both sides.
A structure in which the two are superimposed is used.
また近年、薄い配線板上に多数のＩＣチップ等の各種回
路素子を実装し、その表裏両面にプラスチックの絶縁性
カバーを貼り合せた構造のいわゆるＩＣカードと呼ばれ
るカード型電子回路ユニットが開発されている。In addition, in recent years, a card-type electronic circuit unit called an IC card has been developed, which has a structure in which various circuit elements such as a large number of IC chips are mounted on a thin wiring board, and plastic insulating covers are attached to both the front and back sides. There is.
（発明が解決しようとする問題点）
ところで第４図に示したカード型電子回路ユニットにお
いては、厚さ方向に各種回路素子が実装可能な領域が少
ないため、厚さを増大させることなく上記各種回路素子
を高密度に実装することが困難であった。(Problems to be Solved by the Invention) By the way, in the card-type electronic circuit unit shown in FIG. It has been difficult to package circuit elements with high density.
また、いわゆるＩＣカードにおいては、外部からの屈曲
に弱いため信頼性が充分でなかった。Furthermore, so-called IC cards have insufficient reliability because they are susceptible to external bending.
本発明はこれらの問題を解決するためになされたもので
、薄くて、外部からの曲げや引張りに強く、しかも実装
密度の高いカード型電子回路ユニットを提供することを
目的とする。The present invention has been made to solve these problems, and an object of the present invention is to provide a card-type electronic circuit unit that is thin, strong against external bending and tension, and has a high packaging density.
［発明の構成］
（問題点を解決するための手段）
すなわち本発明のカード型電子回路ユニットは、各種回
路素子が埋設され少なくとも２つの角部が除去された略
矩形状で板状の配線基体の側周部を、前記角部の除去部
分に向けて肉厚部分を有する絶縁性枠体で包囲し、前記
配線基体の表裏両面に前記枠体にかけてそれぞれ薄い金
属板を被覆してなる。[Structure of the Invention] (Means for Solving the Problems) That is, the card-type electronic circuit unit of the present invention includes a substantially rectangular and plate-shaped wiring substrate in which various circuit elements are embedded and at least two corners are removed. is surrounded by an insulating frame body having a thick wall portion toward the removed corner portion, and thin metal plates are coated on both the front and back surfaces of the wiring base body over the frame body.
（作 用）
本発明のカード型電子回路ユニットにおいては、絶縁性
枠体が配線基板の側周部を包囲して設けられているので
、配線基板が外部からの曲げなどの力から守られ、配線
基板内部に実装された各種回路素子の特性が低下するこ
とがない。(Function) In the card-type electronic circuit unit of the present invention, since the insulating frame is provided surrounding the side circumference of the wiring board, the wiring board is protected from external forces such as bending. The characteristics of various circuit elements mounted inside the wiring board do not deteriorate.
また、矩形状の配線基板の少なくとも２つの角部が除去
され、かつこの角部の除去部分に向けて絶縁制枠体の肉
厚部分が配置されているので、配線基板と絶縁性枠体と
の接着が簡単であり、しかも引張り等の力により接着が
剥がれることがない。Furthermore, since at least two corners of the rectangular wiring board are removed and the thick part of the insulating frame body is placed toward the removed corner parts, the wiring board and the insulating frame body are separated. It is easy to adhere, and the adhesive does not peel off due to tension or other forces.
さらに、配線基体の表裏両面に枠体にかけて薄い金属板
が被覆されているので、配線基板を外部の電気的な影響
から保護することができる。Furthermore, since both the front and back surfaces of the wiring substrate are covered with thin metal plates over the frame, the wiring substrate can be protected from external electrical influences.
（実施例） 以下、本発明を図面に示す実施例について説明する。(Example) Embodiments of the present invention shown in the drawings will be described below.
第１図は本発明のカード型電子回路ユニットの一実施例
を示す斜視図、第２図はその要部拡大断面図である。FIG. 1 is a perspective view showing an embodiment of a card-type electronic circuit unit of the present invention, and FIG. 2 is an enlarged sectional view of a main part thereof.
第１図および第２図において符号５は、ガラスエポキシ
、紙フェノール、トリアジン、ポリイミドのような有機
絶縁基材をベースとする矩形状の配線板を示し、この表
面には、ＩＣチップのような能動素子を搭載するための
段付き非貫通孔６と、抵抗やコンデンナのような受動素
子を搭載するための段なし非貫通孔７と、電池を搭載す
るための大径の貫通孔８とがそれぞれ形成されている。In FIGS. 1 and 2, the reference numeral 5 indicates a rectangular wiring board based on an organic insulating substrate such as glass epoxy, paper phenol, triazine, or polyimide. A stepped non-through hole 6 for mounting an active element, a stepless non-through hole 7 for mounting a passive element such as a resistor or a capacitor, and a large diameter through hole 8 for mounting a battery. each formed.
これらの段付き非貫通孔６、段なし非貫通孔７および貫
通孔８内には、それぞれ能動素子９、受動素子１０およ
び電池１１が１個ずつ実装されている。In each of the stepped non-through hole 6, the non-step non-through hole 7, and the through hole 8, one active element 9, one passive element 10, and one battery 11 are mounted.
段付き非貫通孔６と段なし非貫通孔７の内部には、能動
素子９および受動素子１０の上からエポキシ樹脂やシリ
コーン樹脂のような絶縁性樹脂１２が・充填され、これ
で封止されている。The stepped non-through hole 6 and the stepless non-through hole 7 are filled with an insulating resin 12 such as epoxy resin or silicone resin from above the active element 9 and the passive element 10, and are sealed with this. ing.
そして、このように各種回路素子がそれぞれ実装された
薄い板状の配線基板１３は、隣接した２つのコーナ部分
が配線密度および各種回路素子の実装密度を低下させな
い程度に斜めに面取りされた形状を有している。The thin plate-shaped wiring board 13 on which various circuit elements are mounted in this manner has two adjacent corners that are chamfered diagonally to the extent that the wiring density and the mounting density of the various circuit elements are not reduced. have.
さらにこの配線基板１３の側周部の外側には、上記した
面取りされたコーナ部分に対応するコーナ部が内側に向
かって肉厚に形成された絶縁性枠体１４が密着して周設
されている。またこの絶縁性枠体１４の１つの側周部に
は、外側の入出力端子を挿入し内側の配線基板１３と電
気的に接続させるための複数のピン孔１５が、この面に
対してほぼ垂直に穿設されている。Furthermore, an insulating frame 14 is disposed around the outside of the side circumferential portion of the wiring board 13 in close contact with the corner portion corresponding to the chamfered corner portion described above, which is formed thicker toward the inside. There is. Further, in one side circumference of the insulating frame 14, a plurality of pin holes 15 for inserting outer input/output terminals and electrically connecting with the inner wiring board 13 are provided approximately with respect to this surface. It is perforated vertically.
またざらにこのように絶縁性枠体１４で包囲された配線
基板１３の表裏両面には絶縁枠体１４にかけてそれぞれ
薄い金属板１６が貼着されている。Furthermore, thin metal plates 16 are adhered to both the front and back surfaces of the wiring board 13, which is roughly surrounded by the insulating frame 14 in this way, respectively.
このように構成されたカード型電子回路ユニットにおい
ては、配線板５に形成された段付きあるいは段なし非貫
通孔６．７や貫通孔８に、それぞれ能動素子９や受動素
子１０あるいは電池１１などの各種回路素子が実装され
て配線基板１３が構成されているので、配線板５の厚さ
方向の実装可能な領域が最大限に利用され、従来のカー
ド型電子回路ユニットに比べて実装密度が向上する。In the card-type electronic circuit unit configured in this way, active elements 9, passive elements 10, batteries 11, etc. are placed in stepped or unstepped non-through holes 6.7 and through holes 8 formed in wiring board 5, respectively. Since the wiring board 13 is configured by mounting various circuit elements, the mounting area in the thickness direction of the wiring board 5 is utilized to the maximum, and the packaging density is higher than that of conventional card-type electronic circuit units. improves.
またこのような配線基板１３の外側に絶縁性枠体１４が
配置されており、側周部がその絶縁性枠体１４で包囲さ
れているので、曲げなどの外力に強く、断線や配線基板
１３内に実装された各種回路素子の特性低下が生じるこ
とがない。In addition, an insulating frame 14 is disposed on the outside of such a wiring board 13, and the side circumference is surrounded by the insulating frame 14, so it is strong against external forces such as bending, and prevents wire breakage and wiring board 13. The characteristics of the various circuit elements mounted inside the device do not deteriorate.
ざらに配線基板１３の隣接する２つのコーナ部分が面取
りされており、かつ仝休として矩形を呈するように、こ
れらのコーナ部分に当接する絶縁性枠体１４のコーナ部
が肉厚に形成されているので、絶縁性枠体１４にそり、
曲がり等の変形が生じることがほとんどなく、配線基板
１３と絶縁性枠体１４との接着がしやすく、しかも一旦
接着し組み立てた後、引張り等の力によりこれらが剥が
れにくい。Two adjacent corner portions of the wiring board 13 are roughly chamfered, and the corner portions of the insulating frame 14 that abut these corner portions are formed thick so as to have a rectangular shape. Therefore, the insulating frame 14 is warped,
Deformation such as bending hardly occurs, the wiring board 13 and the insulating frame 14 can be easily bonded together, and moreover, once they are bonded and assembled, they are difficult to peel off due to tension or other forces.
なお、以上の実施例では配線基板１３として隣接する２
つのコーナ部分がほぼ垂直的に面取りされたものを用い
た例について説明したが、本発明のカード型電子回路ユ
ニットはこのような構造に限定されない。Note that in the above embodiment, two adjacent wiring boards 13
Although an example in which the two corner portions are chamfered substantially vertically has been described, the card-type electronic circuit unit of the present invention is not limited to such a structure.
すなわち、第３図に示すように、隣接するコーナ部分が
適当な曲率半径を有する円弧上に面取りされた形状の配
線基板１３を用い、その側周面を対応する形状の絶縁性
枠体１４で包囲した構造としても同様な効果を挙げるこ
とができる。That is, as shown in FIG. 3, a wiring board 13 having a shape in which adjacent corner portions are chamfered into circular arcs having an appropriate radius of curvature is used, and its side peripheral surface is covered with an insulating frame 14 having a corresponding shape. A similar effect can also be achieved with an enclosed structure.
さらに３つあるいは全てのコーナ部分が斜めにあるいは
円弧上に面取りされた配線基板１３を用いることもでき
る。Furthermore, it is also possible to use a wiring board 13 in which three or all corner portions are chamfered diagonally or arcuately.
［発明の効果］
以上の説明から明らかなように本発明のカード型電子回
路ユニットにおいては、厚さを増大させることなく各種
回路素子を高密度に実装することができる。[Effects of the Invention] As is clear from the above description, in the card-type electronic circuit unit of the present invention, various circuit elements can be mounted at high density without increasing the thickness.
また、外部からの衝撃や曲げに強く信頼性の高いものと
なる。In addition, it is highly reliable and resistant to external shocks and bending.
さらに接着の作業性が良く、しかも引張り等の外部の力
により接着が剥がれにくくなる。Furthermore, the workability of adhesion is good, and the adhesion is difficult to peel off due to external forces such as tension.
第１図は本発明のカード型電子回路ユニットの一実施例
を示す斜視図、第２図はその要部拡大断面図、第３図は
別の実施例を示す斜視図、第４図は従来のカード型電子
回路ユニットの断面図である。
５・・・・・・・・・配線板
６・・・・・・・・・段付き非貫通孔
７・・・・・・・・・段なし非貫通孔
８・・・・・・・・・貫通孔
９・・・・・・・・・能動素子
１０・・・・・・・・・受動素子
１１・・・・・・・・・電 池
１２・・・・・・・・・絶縁性樹脂
１３・・・・・・・・・配線基板
１４・・・・・・・・・絶縁性枠体
１５・・・・・・・・・ピン孔
１６・・・・・・・・・金属板
代理人 弁理士 須 山 佐 −
第１図
第２図FIG. 1 is a perspective view showing one embodiment of the card-type electronic circuit unit of the present invention, FIG. 2 is an enlarged sectional view of the main part thereof, FIG. 3 is a perspective view showing another embodiment, and FIG. 4 is a conventional one. FIG. 2 is a cross-sectional view of a card-type electronic circuit unit of FIG. 5...... Wiring board 6... Stepped non-through hole 7... Stepless non-through hole 8... ...Through hole 9... Active element 10... Passive element 11... Battery 12... Insulating resin 13...... Wiring board 14... Insulating frame 15... Pin hole 16...・Metal plate agent Patent attorney Sasa Suyama - Figure 1 Figure 2
Claims (1)
除去された略矩形状で板状の配線基体の側周部を、前記
角部の除去部分に向けて肉厚部分を有する絶縁性枠体で
包囲し、前記配線基体の表裏両面に前記枠体にかけてそ
れぞれ薄い金属板を被覆してなることを特徴とするカー
ド型電子回路ユニット。(1) An insulating frame having a thick portion facing the side periphery of a substantially rectangular plate-shaped wiring base in which various circuit elements are embedded and at least two corners have been removed, toward the portion where the corners have been removed. 1. A card-type electronic circuit unit, characterized in that the wiring base is surrounded by a body, and thin metal plates are coated on both the front and back sides of the wiring base by extending over the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118884A JPS62273895A (en) | 1986-05-23 | 1986-05-23 | Card type electronic circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61118884A JPS62273895A (en) | 1986-05-23 | 1986-05-23 | Card type electronic circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62273895A true JPS62273895A (en) | 1987-11-27 |
Family
ID=14747521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61118884A Pending JPS62273895A (en) | 1986-05-23 | 1986-05-23 | Card type electronic circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62273895A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357947U (en) * | 1989-10-11 | 1991-06-05 |
-
1986
- 1986-05-23 JP JP61118884A patent/JPS62273895A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357947U (en) * | 1989-10-11 | 1991-06-05 |
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